Main Maker

Company-SemiStar

SemiStar Corp.

SemiStar Corp is a privately owned company that provides comprehensive technical and business development solutions in high-tech manufacturing and research, with applications in the semiconductor, MEMs, biomedical, nanotechnology, solar, LEDs sectors. More specifically, SemiStar Corp. specializes in providing high quality  reconditioned semiconductor equipments and express spare parts delivery worldwide.

Based in the heart of Silicon Valley, our experienced management and engineers are dedicated to ensuring optimal quality and customer satisfaction through a timely support system. Our team is committed to being your long term business partner to help you achieve your business goals.

Hot Products:

(1) STS ICP/RIE;  (2) AG Associates RTP;  (3) Temescal Evaporator Sputter;   (4) TES Evaporator Sputter;

(5) MRC Sputter;  (6) Perkin-Elmer Sputter;  (7) Lam Research Etcher;  (8) Oxford RIE;  (9) PlasmaTherm 

(10) Branson/IPC;  (11) EG Probe;  (12) HP Tester;  (13) Matrix;  (14) Tegal;  (15) Wafer Carriers / Susceptor

We supply many other semiconductor components, equipment, RF Generator, Chiller, Turbo, Cryo pumps, MFC, Vacuum pumps and controllers, step motors and drivers, etc. AMAT, Brooks, Equipe PRI Equipe Technologies ESA ESC Estek ETA ETEC Systems ETEL ETO Ehrhorn  ETP Eurotherm  Extreme Networks Extron Exynetics Electroglas  Festo Filter Filter Pump Fisba Optic Fisher Hamilton Flowline Fluke Digital Fluoroware Force Computers Inc.Fortrend Fostec Foxboro Frontier Tech FSI International FTI FTS Systems Fuji Electric Fuji Seiki Inc.Fujikin Fujimi Fujion Furon Fusion Semiconductor Fusion Systems  Futaba Futurestar Galil Motion GaSonics Gast GasTech Gaston Gates GC Valves GD Fanuc GE General Electric GE Industrial Services Gems Sensors GEMU General Monitors General Precision General Scanning Genie Industries Genmark Automation Georg Fischer Geotest Gespac GF Signet Glassman Glentek Global Laser Gluton West Go Gould GPI General Precision GPI General Precision Inc.Granville-Phillips Grayhill Greene Tweed Chemraz Griswold Grundfos Grundfus GSI Group Sciences Inc. GSI Lumonics GSNX Precision Instruments Hakko Ham-Let Hama Hamamatsu Hokuto Denko Heateflex Corp. Heidenhain Heiland Electronic Hepa Corp.Hermos Hine Design Hirakawa Hitachi HiTek Power Hitron HNL Inc.Hoerbiger Origa Hoke Honeywell Horiba STEC Horner Electronic Hoya Corp.Hoya-Schott HP Hewlett Packard HP Hewlett-Packard HP Versatest HPS Hubbell Huber Hubner Humphrey Huntington Mechanical Huttinger HVA High Vacuum Apparatus HyCal Sensing IAG Electtronica IAI Corp. IBM IC Electronics ICP Electronics Inc. ICS IDEC IDL Semiconductor IDX IEE IGC Polycold System Inc. IKO Nippon Thompson Co. Imtec Acculine IN USA INA InBus Engineering Industrial Computers Inficon Infranor Innova Electronics Integrated Circuit Dev. Corp. Integrated Dynamics Engineering Integrated Measurement Systems Integrated Power Designs Integrix Interface Interlink Internix InUSA Invax Technologies Invensys Ion Systems IRIE Koken Irvine Optical Corporation ISA Instruments ITT Standard ITW Rippey Texwipe Ivek Corp. Iwaki J.C. Schumacher JAE Electronics JAI Corp. Javelin JDS Uniphase Jennings Technology Infab Jenoptik Optical Systems Inc. Jensen JEOL Jikco JM Athena Jobin Yvon John Crane International Johnson Controls Johnson Matthey JRC Jumo Junkosha Leak learn K-Patents Process Instruments K-Tec Kachina Semiconductor Services Kaehlig Antriebstechnik GmbH Kaiji Kaijo Kaiser Kalex Kalrez Kanken Techno Kaparel Kashiyama Kawasaki Kaydon Keithley Kensington Labs Kenwood Kepco Kevex Semicron Key High Vacuum Products Keyence Kikusui Kimmon Quartz Co. Kinik KLA Instruments KLA-Tencor Kloehn Knie lKoch Koganei Kokusai Vertron Kollmorgen Komatsu Electronics KoMiCo Kondoh Kohsya Kooltronic Koyo KSI Kaiser Systems Kuhnke Kuroda KV Automation KV Ltd. Kyosan Electric Mfg. Kyoto Denkiki Co. Kyowa Instrumentation L-Com Lake Monitors Lakeland Lam Research Lambda Invensys Leeson Leica Levitronix Lexel Leybold Leybold Inficon Leybold Oerlikon MECS Corporation. Millipore Mitutoyo Corp. MKS MKS ASTeX MKS Instruments MKS Precision MMI Systems MMPIC Mnemonics Inc. Modus Instruments Inc. Moeller Molectron Molex Monarch Motech Motion Engineering Motorola Motortronics Motoyama Mott MOXA MRC Materials Research Corp. MRL ASM Technologies Neuner Elektrotechnik Neutronics Newport Newport Electronics NI National Instruments Nicolet Nicolet Instrument Corp. Nikon Nikuni Nippon Noah Precision Nor-Cal Noran Instruments Nordson Norgren Northeast Fluidics Norton Nova Nova Measuring Instruments Novascan Technologies, Inc. Novellus Systems NSK NT International NTRON Numatics NupronView Corp. Nyquist ODEM Scientific Oerlikon Oerlikon Leybold Ohaus Precision Olympus Omega Omron OneAC  OnTrak Systems Inc. Opal Optem International OPTO 22 Osram Oramir Oregon Micro Oren Elliott Products Oriel Oriental Motor Oriental Motor Co. Origin Electric Orion Orion Machinery Co. Osaka Vacuum Osicom  Pacific Scientific Pall Corp.Panasonic Panel-Tec Parker Parker-Hannifin Particle Measuring Systems Patlite PBI Dansensor Perkin-Elmer Pfeiffer Pfeiffer Vacuum Technology  Praxair Pre-Tech PRI Automation Price Pump Co. PRMS Inc. Pro-Face Process Technology Procon  Prolog Prometrix Corp. Proportion Air Proportion-Air Proteus Industries PTI Progressive Technologies Inc. Pulizzi Pulnix Qualidyne Quartz International Quartzfab Radian RadiSys RARA Raritan Rasco Research Inc. Recif Red Lion RF Services Inc. RFPP RF Power Products Rorze Automation Screen SCV SDI SDS Seiko Precision Seiko Seiki Sekidenko Semi Gas Systems SpeedFam  STS System  SUNX  SVG Silicon Valley Group  Tektronix  TEL Tokyo Electron UNIT Instruments  Varian VAT Yaskawa  Ziatech Zitel Zygo Quantum Design PPMS Dynacool B Magnetization Raith eLine electron Beam Lithography System Lithography Ramé-Hart Model 250 Contact Angle Goniometer Contact Angle Goniometry Rapid Thermal Annealing furnace (Custom) – max temperature 1000°C Diffusion / Annealing Furnaces Savannah S100 Atomic Layer Deposition Cambridge Nanotech Deposition Tools SCS Labcoter2 Parylene Coater Deposition Tools Shimadzu DTA-50 Differential Thermal Analyzer (DTA) Center for Excellence in Soft Materials Shimadzu EDX-7000 Energy-Dispersive X-Ray Fluorescence Spectrometer X-Ray Diffraction (XRD) and Scattering Siemens/Bruker D-5000 XRD System X-Ray Diffraction (XRD) and Scattering SLM/ISS Fluorometer Spectroscopy Sloan Dektak3ST Profilometer Surface Profilometry Small Angle X-Ray Scattering System with Pilatus 300 Detector X-Ray Diffraction (XRD) and Scattering Solvent Fume Hood or Developer Fume Hood Wet Processing Spin Coater Systems (Headway Research) Lithography Syntron vibratory polishers (two identical pieces) EM Support Instruments TA DHR-3 Rheometer Center for Excellence in Soft Materials TA Instruments Affinity ITC Center for Excellence in Soft Materials TechCut 4 Precision Low Speed Saw EM Support Instruments Temescal Ebeam Evaporator 2 Deposition Tools Temescal Ebeam Evaporator 4 Deposition Tools Temperature-Controlled Cryogenic Vacuum Probe Station Probe Stations Tergeo-EM Plasma Cleaner EM Support Instruments The Optics 11 Life Piuma system Nanoindentation Thermo Nicolet Nexus 670 FTIR Spectroscopy Thermo Scios2 Dual-Beam SEM/FIB Focused Ion Beam (FIB) FIB/SEM DualBeam Systems ThermoFisher Glacios Cryo-TEM Transmission and Scanning Transmission Electron Microscopy (TEM/STEM) Time-Domain Thermoreflectance Spectroscopy Time-Resolved Photoluminescence Spectroscopy Tosoh EcoSEC 8320 GPC System Center for Excellence in Soft Materials Two-Color Time Domain Thermoreflectance – TRMOKE Spectroscopy UV 365 nm Exposure System (Oriel) Lithography UV/Ozone Cleaner EM Support Instruments Varian Cary 5G and Agilent Cary 5000 Spectroscopy Wedge Bonder (25 um Aluminum wire, K&S 4523A) Bonding Stations Well 3241 Precision Diamond Wire Saw EM Support Instruments Westbond 4KE wire bonder Bonding Stations Yield Engineering HMDS Vapor Prime Oven Lithography Yield Engineering P-I Curing Ovens Lithography Yield Engineering Vacuum Curing Ovens Lithography Zeiss Axiovert Microscopy Zeiss LSM7 Live Microscopy Airco Temescal FC-1800 multi-pocket electron-beam evaporators (3) Denton Explorer electron-beam evaporator Emitech K675X 3-target, Peltier-cooled sputtering system First Nano 3-tube, low-pressure chemical vapor deposition (LPCVD) system General Air atmospheric-pressure CVD (APCVD) system Oerlikon Leybold 5-target UHV sputtering system Oerlikon Leybold 3-chamber, 16-target UHV sputtering system for magnetic materials Oerlikon Leybold 8-pocket electron-beam, dual thermal evaporation system Oxford FlexAL remote plasma and thermal ALD system Perkin-Elmer RF, DC magnetron, 8-inch, 3-target sputter deposition system Cambridge Nanotech Savannah atomic layer deposition (ALD) system Unaxis 790 plasma-enhanced chemical vapor deposition (PECVD) system Varian thermal deposition system Veeco evaporator Alcatel 601E inductively coupled plasma reactive ion etch (ICP-RIE) system Drytek RF plasma asher MemsStar BT001 xenon difluoride (XeF2) etch system Oerlikon Shuttleline ICP-RIE system with endpoint system Oxford PlasmaPro System 100 ICP-RIE system with endpoint system Plasmatherm 790 RIE PVA PS210 microwave plasma asher Tegal barrel asher UVO cleaner Allied Multiprep CMP system Allwin AccuThermo AW610 Rapid Thermal Processing (RTP) System Logitech Orbis chemical-mechanical polishing system (CMP), Type 1CM62 Six Thermco furnace tubes (oxidation diffusion) SSI Solaris 75/100 Rapid Thermal Processor Cobilt CA-800 wafer-to-mask alignment and exposure system RTS AutoStep 200 RTS Mann 3600F pattern generator Lindberg/BlueM resist baking oven OAI light source SUSS MJB 3 mask aligner (2) Tamarack Series 142 contact printer Vistec EBPG 5200 electron beam lithography system Agilent B1500 semiconductor parameter analyzer with I-V and capacitance-voltage modules Tencor Alphastep model 500 surface profilometer Cascade Microtech M150 test station Filmetrics film thickness measurement system (spectral reflectance) Four-point resistivity probe Veeco FPP-5000 automatic four-point probe Gaertner ellipsometer Hitachi S-4500 field emission scanning electron microscope KLA/Tencor P-6 profilometer Olympus LEXT OLS4100 confocal microscope Olympus optical microscopes (4) J. A. Woollam variable-angle spectroscopic ellipsometer (VASE) Disco DAG810 automatic surface grinder Disco DAD3240 automatic dicing saw Teledyne TAC probe WEST-BOND 7372W die bonder WEST-BOND 7400A wire bonder WEST-BOND 7476E wire bonder Other Equipment Ampoule sealing station Blue M furnace Critical point dryer MOS-clean bench MOS-clean spin rinse dryer Spin rinse dryer Molecular beam epitaxy Magellan 400 field-emission scanning electron microscope Helios NanoLab DualBeam 600 SEM/FIB Titan 80-300 300kV FEG scanning transmission electron microscope (TEM) 3D laser confocal optical microscopy In vivo imaging, including Albira PET/SPECT/CT and Multispectral FX.Acid Bench Acid Bench ACS 200 cluster tool ADT 7100 Dicing Saw AE Evaporator Agilent uFTIR Angstrom Engineering Annealing 4″ & 6″ Ball Bonder MPP iBond5000 Base Bench CEE 100CB Spinner CEE 200X PR Spinner CEE Developer CL200 Megasonic Cleaner CMP Strasbaugh 6EC Convection Oven Cooke Evaporator Deep UV SenLights PL16 Dektak 6M Surface Profilometer Dektak XT Surface Profilometer Dimatix InkJet E-Beam Solvent Bench E-Beam Spinner/Hot-Plate Bench EDP Bench EDS Endeavor M1 AlN Sputter EnerJet Evaporator EVG 510 EVG 520IS EVG620 Bond Aligner Flexus 2320-S Flip Chip Bonder GCA AS200 AutoStep Glen 1000P Plasma Cleaner Glove Box Gold Plating Station GSI PECVD Heidelberg Mask Maker ICON AFM Image Reversal Oven IR Microscope JEOL E-Beam JetFirst-100 Forming JetFirst-150 RTP LAM 9400 Lapper MA/BA-6 Mask/Bond Aligner MA6 Mask Aligner Mask Bench MJB 45S MJB3 NanoInk DPN 5000 Nanoquest II Ion Mill NanoSpec 6100 NanoSpec 6100 nP12 nanoPREP Olympus BX-51 Microscope Olympus LEXT Interferometer Oxford ALD Oxford ICP RIE P5000 PECVD P5000 RIE PDS 2035 PFC Bench Plasma Etch Plasmatherm 790 Probe Station Everbeing BD-6 PSC 122M Mask Cleaner PVD75 Rame-Hart Goniometer RCA Clean Bench Sample Mounting Station SSEC Wafer Cleaner STS Glass Etcher STS Pegasus 4 STS Pegasus 6 Tousimis Automegasamdri 915B (CPD)-1 Veeco Fiji ALD Wafer Bonding Wafer Clean Wafer Clean Wedge Bonder MPP iBond5000 Wet Benches Wet Benches Woollam M-2000 Ellipsometer Xactix XeF2 YES Plasma Stripper YES Vacuum Oven Zygo NewView 5000 Brewer Photoresist Spinners 1 & 2 CEE 100 Spinner NPGS Electron Beam Lithography Sky 335R6 Heated-Roller Laminator Solitec Photoresist Spinner 1 & 2 DPSS Laser Idonus HF Vapor Etch PlasmaTherm Apex SLR RIE PlasmaTherm Apex SLR RIE/ICP PlasmaTherm Versaline Deep Silicon Etcher PlasmaTherm Vision 320 RIE Xactix XeF2 Etcher Yield Engineering Systems G500 O2/Ar Plasma Etcher Picosun R-200 Plasma Enhanced ALD PlasmaTherm Versaline HDPCVD PlasmaTherm Vision 310 PECVD Quorum Tech Q150RES Gold/Carbon Sputter Coater 4 point probe Bruker Dektak XT Dektak 3ST HP 4155A Semiconductor Parameter Analyzer and Probe Station J.A. Woollam M-2000 Ellipsometer Nanometrics Nanospec Carl Zeiss Axiotron Microscope FEI Nova NanoSEM 430 FEI Scios Dual Beam FIB/SEM Nikon TMS Infrared Microscope Oxford EDS and EBSD Nitrogen Glove Box Semitool Spin Rinsers Ultra T SCSx124 Substrate Cleaning System Disco DAD 321 Dicing Saw EVG 501 Wafer Bonder EVG 810 Plasma Activation Nordson DAGE 4000 Bond Tester System Tousimis AutoSamdri 815 Critical Point Dryer West Bond 7700E Ball Bonder Allwin AW610 Rapid Thermal Processor Annealsys As-One RTP Programmable Oven EVG 620-mask aligner GCA 8500 i-line Stepper Karl Suss MA4-1 and MA4-2 Plasma Equip. Tech. Services (PETS) RIE CHA E-beam Evaporator Lesker Labline Sputter System AS-One 150 RTP rapid thermal processing Cambridge Savannah ALD Deposition Tool Thin film deposition CEE Spin Coater Lithography CHA E-Beam Evaporator Thin film deposition Edwards2 Thermal Evaporator Thin film deposition EVG 620 Aligner Lithography Filmetrics F20 and F40 Optical reflectometry GCA 8500 5X Stepper Lithography Heat Pulse RTP rapid thermal processing Hitachi S-4700 Field Emission Scanning Electron Microscope Characterization JEOL JBX-6000 FS/E Electron Beam Lithography Lithography Lesker Sputter Deposition Tool Thin film deposition Lesker Sputter Deposition Tool Thin film deposition Lesker E-Beam Evaporator Thin film deposition Lesker E-Beam Evaporator Thin film deposition Lesker Sputter Deposition Tool Thin film deposition OAI 808 Aligner Lithography Oxford PECVD Thin film deposition PlasmaLab M80 Plus – Chlorine Dry etch, reactive ion etching PlasmaLab M80 Plus – Fluorine Dry etch, reactive ion etching PlasmaTherm 790 RIE – Fluorine Dry etch, reactive ion etching PlasmaTherm Apex ICP Dry etch, Inductively coupled plasma etching SCS Spin Coater Lithography STS AGE ICP – Chlorine Dry etch, Inductively coupled plasma etching STS ASE ICP DRIE – Fluorine Dry etch, Inductively coupled plasma etching Tegal 421 Dry etch, reactive ion etching, barrel ashing Xactix XeF2 Si Etcher Dry etch, dry vapor phase etching Zygo ZeGage Characterization, 3D optical profiling 6 inch Solvent hood solvent cleaning 6 inch Wet Etch Hood Wafer cleaning AlWin21 RTP rapid thermal processing AMAT 8330 Etching Amerimade Acid Hood Wet Etching Angstrom #1 (Room 1504 South) Thermal evaporation, Filament evaporation, Nitrogen glovebox spin coating Applied Materials AKT1600 Reactive ion etching of various layers and thicknesses of dielectrics and metals, Plasma enhanced chemical vapor deposition Applied Materials P5000 Plasma enhanced chemical vapor deposition Azores 5200 Stepper Photolithography Bagging Station Parts Bagging Station Camera Equipped Microscope Optical Microscopy Canon MPA-600 FA Photolithography CEE Model 300 Spin Coater Spin coating CHA Metal Evaporator e-beam evaporation CHA TCO Evaporator SR-10 Evaporation deposition Cole-Parmer Hot Plate Heating CURTIS Laser Repair Metrology Despatch Oven Photolithography Diener Asher Oxygen plasma processing Dimatix DMP-2831 Materials Inkjet Printer Inkjet Printing DYMAX 2000 UV Curing Flood Lamp Bonding, Curing of photosensitive materials DYMAX 5000 UV Flood Lamp Bonding, Curing of photosensitive materials Ecopia Hall Effect Measurement System hall measurement EIT Ashing, Photoresist removal Electroglas 2001x Probe System Semiconductor wafer probing EVG 150 Developer – DI Rinse Cleaner Photolithography EVG 610 Mask Aligner UV Exposure/Mask Alignment EVG501 Bonder Wafer bonding Explorer Pro Scale mass measurement Filmetrics F50 Reflectometry Flex Tester Photolithography FP-10 Stylus Profilometer Accurate profile measuring Gasonics L3510 Ashing, Photoresist removal GEN II Acid and Base Hood Wafer cleaning GEN II Bow Warp Laser flatness measuring Gen II Custom Probe System Electrical testing GEN II Solvent Tool Wafer cleaning Hewlett-Packard 3457A Multimeter Benchtop measurement of resistance, voltage, and current, Resistance to 3 GOhm, Voltage to 300v, Current to 3A, GPIB-based automated data acquisition Hewlett-Packard 4284A LCR Meter Capacitance Testing, 20Hz – 1MHz, Capacitance-Frequency Sweeps, Capacitance-Voltage Sweeps, Inductance Measurement Imada PEEL Tester MV-110 Peel testing JEOL 6300F FESEM Field emission scanning electron microscopy Jinlong PEEL Tester Peel testing KDF-744 Batch-sputtering Keithley 237 High Voltage Source-Measure Unit (SMU) Current-Voltage (IV) Characterization to 1100v Keithley 2611A Sourcemeter Benchtop measurement of voltage, current, Voltage to 200v, Current to 1.5A, GPIB-based automated data acquisition Keithley 4200 Semiconductor Characterization System Benchtop measurement of voltage, current, Voltage to 200v, Current to 100mA, Graphical User Interface Setup and Operation, GPIB-based automated data acquisition – advanced programming skills required KLA Tencor Omnimapper 4 Point Probe 4 point probe Kruss DSA20E Easy Drop Goniometer/Contact Angle Measurement Goniometer/Contact Angle LanTec UV-ozone Cleaner Exposure Dry cleaning of organic contaminants from glass substrates Laurell WS400B Spin Coater Spin coating Micro Manipulator 4060 Manual analytical probing Mini Brute Tube Furnace – Model MB-80 Oxidation, Annealing, Alloying MRC-603A Thin film metal deposition MRC-603B Thin film metal deposition Nanometrics RPM 2000 Photoluminescence Mapper Photoluminescence Nomarski Contrast Microscope differential interference contrast microscopy, Nomarski microscopy nTact Advantage II Slot Die Coater photoresist coating, polyimide coating Olympus MHL110 Microscope Microscopy Orbotech FPI-7098 Metrology Park XE-150 Atomic Force Microscope atomic force microscopy Prism Ultra-Coat 300 Photolithography Rite Track (SVG) 8600 Coater and Developer Track Photolithography Rite Track (SVG) 8800 Coater and Developer Track Photolithography Sartorius Scale mass measurement Solvent hood Solvent Processing Sun-Tec Laminator Lamination, Bonding Sunic Sunicel 400 Metal deposition , Organic deposition Tamar WaferScan Wafer Flatness Tegal 901e plasma etching Tegal 903e plasma etching Tegal 965 Ashing Tencor 6200 SurfScan Defect Scanner wafter defect inspection Tencor FLX-2350FP Fim stress measurement Tencor P-16 Profilometer Surface topography measuring Tencor P2 Profilometer Profilometry Thermo Nicolet 6700 FTIR Fourier Transform Infrared Spectroscopy VWR Hot Plate Heating Western Magnum XRL180 Laminator Dry film lamination Woollam Ellipsometer M2000 Ellipsometry Yamato DP43 Vacuum Bake Oven Vacuum pressure curing and baking Yamato DP63 Vacuum Bake Oven Vacuum pressure curing and baking YES Vapor Prime Oven HMDS Vapor Prime Oven YES – FPO HMDS Vapor Prime Photolithography, Vacuum bake HMDS vapor priming AKT 1600 PECVD AMAT P5000 PECVD CEE Model 300 Spin Coater CHA E-Beam Metal Evaporator CHA E-Beam/Thermal Evaporator Dimatix DMP 2831 Inkjet Printer KDF-744 Sputter System Laurell WS400B Spin Coater MRC-603A, Mr T. Sputter System MRC-603B, King Kong Sputter System Prism Ultra Coat 300 spray coater Rite Track (SVG) 8600 Coater and Developer Track Rite Track (SVG) 8800 Coater and Developer Track YES Vapor Prime Oven CD Measurement Microscope Ecopia HMS-5000 Hall Measurement System Explorer Pro Scale Filmetrics F50 Reflectometer Imada PEEL Tester MV-110 Jinlong PEEL Tester JEOL 6300F FESEM KLA Tencor Omnimapper 4 Point Probe Kruss DSA20E Easy Drop Goniometer/Contact Angle Measurement Micro Manipulator 4060 Nanometrics RPM 2000 Photoluminescence Mapper Park XE-150 Atomic Force Microscope Tamar WaferScan Tencor 6200 SurfScan Defect Scanner Tencor FLX-2350FP Stress Measurement Tool Tencor P-16 Profilometer Thermo Nicolet 6700 FTIR Woollam M2000 Ellipsometer 6-inch Solvent Hood 6 inch Wet Etch Hood Amerimade Acid Hood Azores 5200 stepper CEE Model 300 Spin Coater Cole-Parmer Hot Plate DYMAX 2000 UV Curing Flood Lamp EVG 150 Developer EVG 610 Mask Aligner Laurell WS400B Spin Coater nTact Advantage II Slot Die Coater Prism Ultra Coat 300 spray coater Rite Track (SVG) 8600 Coater and Developer Track Rite Track (SVG) 8800 Coater and Developer Track YES Vapor Prime Oven AKT 1600 Etch 6-inch Solvent Hood 6 inch Wet Etch Hood Amerimade Acid Hood AMAT 8330 Diener Asher Gasonics L3510 Plasma Asher GEN II Acid and Base Hood Gen II Solvent Tool Tegal 901 Tegal 903 Tegal 965 110 C Oven Thin Film Processing Polymer Other 16 core Xeon High Perfomance Computing Metrology/Characterization Structure or Device Electrical 2010F (JEOL) Imaging All Imaging TEM 300 MHz NMR Mazama (Solids) Metrology/Characterization Chemical Analysis NMR 300mm hotplate Lithography All Lithography Resist Processing 300mm spinner Lithography All Lithography Resist Processing 3C Technical GCA AutoStep 200 5x Reduction Stepper Lithography All Lithography UV 3D Atom Probe Metrology/Characterization Chemical Analysis Other 3D Bio AFM Imaging All Imaging Probe 3D optical microscope Metrology/Characterization Structure or Device Profilometry 3D Optical Profiler Metrology/Characterization Structure or Device Profilometry 3D Optical Profiler Metrology/Characterization Structure or Device Optical 3D Systems 2500 CI High Temperature Research Platform Patterning All Patterning 3D Printing 3D Systems 2500plus Patterning All Patterning 3D Printing 3D Wax Printer Patterning All Patterning 3D Printing 3D X-ray Tomography System Imaging All Imaging Other 4-point Probe Metrology/Characterization Structure or Device Electrical 4.5 Tesla Magnetic Annealing Sysytem Thin Film Processing Metal Annealing 400 MHz NMR Karloff (Solids) Metrology/Characterization Chemical Analysis NMR 400 MHz solid state NMR Metrology/Characterization Chemical Analysis NMR 4156c Seminconductor Analyzer No 2 Metrology/Characterization Structure or Device Electrical 500 MHz NMR Shasta (Solids) Metrology/Characterization Chemical Analysis NMR 500 MHz NMR Spectrometer with Direct Cryoprobe Metrology/Characterization Chemical Analysis NMR 500 MHz NMR Spectrometer with Triple Resonance Cryoprobe Metrology/Characterization Chemical Analysis NMR 600 MHz NMR Baker (Liquids) Metrology/Characterization Chemical Analysis NMR 600 MHz NMR Hood (Metabolomics) Metrology/Characterization Chemical Analysis NMR 600 MHz NMR Nittany (Solids) Metrology/Characterization Chemical Analysis NMR 600 MHz NMR Spectrometer Metrology/Characterization Chemical Analysis NMR 62700 Eurotherm Furnace Thin Film Processing Metal Other 6700 SEM Imaging All Imaging SEM 750 MHz NMR Bokan (Metabolomics) Metrology/Characterization Chemical Analysis NMR 750 MHz NMR Rainier (Liquids) Metrology/Characterization Chemical Analysis NMR 790 Plasmatherm #1 PECVD Thin Film Processing Dielectric PECVD 790 Plasmatherm #1 RIE Etching Dry RIE 790 Plasmatherm #2 RIE Etching Dry RIE 80+ PECVD Thin Film Processing Dielectric PECVD 80+ RIE Etching Dry RIE 81600B Tunable Laser Source Metrology/Characterization Structure or Device Electrical 83453B High Resolution Spectrometer Metrology/Characterization Structure or Device Optical 850 MHz NMR Ellis (Solids) Metrology/Characterization Chemical Analysis NMR 86142B High Performance Optical Spectrum Analyzer Metrology/Characterization Structure or Device Optical 90 C Oven Thin Film Processing Polymer Other AB-M Contact Aligner Lithography All Lithography UV Aberration Corrected STEM Imaging All Imaging TEM Aberration Corrected TEM, Atomic Resolution Microscope with EELS (JEOL ARM) Imaging All Imaging TEM ABM 3000 Lithography All Lithography UV ABM Aligner II Lithography All Lithography UV ABM Aligner III Lithography All Lithography UV ABM Contact Aligner Lithography All Lithography UV ABM Contact Aligner Lithography All Lithography UV ABM-SemiAuto Aligner Lithography All Lithography UV ABM-SemiAuto Aligner Lithography All Lithography UV Abrasive Blast Cabinet Cleaning All Other Other Accurion EP3 Imaging Ellipsometer Metrology/Characterization Thin Film Other ACF Heat Sealer Packaging All Packaging Bonding Acid Bench – multiple wafer processing Etching Wet Wet Bench Acid Benches Etching Wet Wet Bench Acid Process Bench 1 Etching Wet Wet Bench Acid Process Wetbench Etching Wet Wet Bench Acid Wet Bench Etching Wet Wet Bench ACIDHOOD1 Etching Wet Wet Bench ACIDHOOD2 Etching Wet Wet Bench ACIDHOOD3 Etching Wet Wet Bench ADT 7100 Dicing Saw Packaging All Packaging Dicing ADT 7100 Dicing Saw Packaging All Packaging Dicing Advanced Coater Imaging All Imaging Sample Prep AET Atmospheric Rapid Thermal Processor Thin Film Processing Dielectric RTA/RTP AET RTP Thin Film Processing Dielectric RTA/RTP AET Vacuum Rapid Thermal Processor Thin Film Processing Dielectric RTA/RTP AFM Imaging All Imaging Probe AFM Imaging All Imaging Probe AFM Imaging All Imaging Probe AFM – Veeco Icon Imaging All Imaging Probe AFM Veeco/Bruker NanoMan Metrology/Characterization Structure or Device Profilometry AFM1 Imaging All Imaging Probe AFM2 Imaging All Imaging Probe AFMs Metrology/Characterization Thin Film Thickness Agilent 212-LC/500-MS Metrology/Characterization Chemical Analysis Mass Spec Agilent 34401A Multimeter Metrology/Characterization Structure or Device Electrical Agilent 400 MHz NMR Spectrometer Metrology/Characterization Chemical Analysis NMR Agilent 4294A Impedance Analyzer Metrology/Characterization Structure or Device Electrical Agilent 610 FT-IR Microscope Metrology/Characterization Chemical Analysis Spectroscopy Agilent 6520 Q-TOF with Agilent 1100 nano-HPLC Metrology/Characterization Chemical Analysis Mass Spec Agilent 6520 QTOF LCMS Metrology/Characterization Chemical Analysis Mass Spec Agilent 6520 QTOF LCMS Metrology/Characterization Chemical Analysis Mass Spec Agilent 6538 Q-TOF with Agilent 1290 UHPLC Metrology/Characterization Chemical Analysis Mass Spec Agilent 700 Mhz NMR Spectrometer Metrology/Characterization Chemical Analysis NMR Agilent 710-ES ICP-OES Metrology/Characterization Chemical Analysis Spectroscopy Agilent 920-Liquid Chromatograpy Metrology/Characterization Chemical Analysis Chromatography Agilent B1500 Semiconductor Analyzer Metrology/Characterization Structure or Device Electrical Agilent B1500A Semiconductor Device Analyzer Metrology/Characterization Structure or Device Electrical Agilent Cary 6000i UV-vis-NIR Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy Agilent Cary 670 FT-IR Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy Agilent Cary Eclipse Fluorescence Spectrophotometer Imaging All Imaging Optical Agilent E3620 Metrology/Characterization Structure or Device Electrical Agilent microwave vector network analyzer Metrology/Characterization Structure or Device Electrical Agilent PicoPlus atomic force microscope Imaging All Imaging Probe Agilent Technologies 54624A Oscilloscope Metrology/Characterization Structure or Device Electrical Air Control Wet Bench Cleaning All Cleaning Wet Bench Air Control Wet Bench Etching Wet Wet Bench Aixtron Black Magic graphene CVD furnace Thin Film Processing Dielectric Other Aixtron MOCVD – III-Nsystem Thin Film Processing Dielectric Other Aixtron MOCVD – III-Vsystem Thin Film Processing Dielectric Other AJA ATC 2200 UHV Sputtering System Thin Film Processing Metal Sputter AJA ATC Orion 8 UHV Sputtering System Thin Film Processing Metal Sputter AJA DC Sputter Deposition Tool Thin Film Processing Metal Sputter AJA Evaporator Thin Film Processing Metal Evaporation AJA International Sputtering System Thin Film Processing Metal Sputter AJA Ion Mill Etching Dry Ion Mill AJA Ion Mill with End Point Detector Etching Dry Ion Mill AJA Orion 8 Sputter System Thin Film Processing Metal Sputter AJA Phase II J Sputtering System Thin Film Processing Metal Sputter AJA RF Sputter Deposition Tool Thin Film Processing Dielectric Sputter AJA Sputter Deposition #1 Thin Film Processing Metal Sputter AJA Sputter Deposition #2 Thin Film Processing Metal Sputter AJA Sputtering System Thin Film Processing Metal Sputter AJA Sputtering System Thin Film Processing Metal Sputter AJA Sputtering System Thin Film Processing Metal Sputter ALD Thin Film Processing Dielectric ALD ALD Thin Film Processing Dielectric ALD ALD01 – Oxford Thin Film Processing Dielectric ALD ALD1 Thin Film Processing Dielectric ALD ALD2 Thin Film Processing Dielectric ALD ALDE1 Thin Film Processing Dielectric ALD Alessi Probe Station Metrology/Characterization Structure or Device Electrical Alisse REL 4800 Metrology/Characterization Structure or Device Electrical AllWin 610 Rapid Thermal Annealer Thin Film Processing Dielectric RTA/RTP AllWin 610 Rapid Thermal Annealer Alpha Step 200 Metrology/Characterization Structure or Device Profilometry Alphastep Metrology/Characterization Structure or Device Profilometry Alphastep 500 Profilometer Metrology/Characterization Structure or Device Profilometry Alveole PRIMO Lithography All Lithography UV AmaZon X Ion Trap Metrology/Characterization Chemical Analysis Mass Spec Ambios XP2 Metrology/Characterization Structure or Device Profilometry Americhem Eng Polypro Wet Bench Etching Wet Wet Bench AML Wafer bonder Packaging All Packaging Bonding Amod Evaporator Thin Film Processing Metal Evaporation Amorphous Silicon LPCVD System Thin Film Processing Dielectric CVD AMSCOPE IN300TB Inverted Microscope Imaging All Imaging Optical AMT Oxide Plasma Etcher Etching Dry RIE Analytical Balance Metrology/Characterization Chemical Analysis Other Anatech Barrel Plasma System Etching Dry RIE Anatech Resist Strip Cleaning All Cleaning Plasma/Stripper Anatech SCE 106 (DE-07) Etching Dry Other Angstrom EvoVac Electron Beam Evaporator Thin Film Processing Metal Evaporation Angstrom Nexdep Thermal E-Beam Evaporator Thin Film Processing Metal Evaporation Angstrom Nexdep Thermal E-Beam Evaporator Thin Film Processing Metal Evaporation Angstrom Sputter System Thin Film Processing Metal Sputter Anneal Furnace Thin Film Processing Dielectric Doping Annealsys Rapid Thermal Processor Thin Film Processing Dielectric RTA/RTP AP-XPS/AP-STM Metrology/Characterization Thin Film XPS AP-XPS/AP-STM Imaging All Imaging Probe Applied Biosystems 7500 Fast PCR System Biological All Biological Other Applied Mateiral’s P5000 Thin Film Processing Dielectric PECVD Applied Materials Centurion Epitaxial System Thin Film Processing Dielectric Other Applied Materials P5000 Etcher Etching Dry RIE Apreo S LoVac SEM Imaging All Imaging SEM Aqueous Cleaner Packaging All Packaging Other Arc Melter Arcam S400 Patterning All Patterning 3D Printing ARM 200CF Imaging All Imaging TEM ARM 300CF Imaging All Imaging TEM ARM200F (JEOL) Imaging All Imaging TEM Arradiance ALD Thin Film Processing Dielectric ALD ARRAY1 Lithography All Lithography Soft Lithography AS200 i-line Stepper Lithography All Lithography UV ASAP 2460 Surface Area and Porosity Analyzer Metrology/Characterization Chemical Analysis Other ASH1 Cleaning All Cleaning Plasma/Stripper Asher Cleaning All Cleaning Plasma/Stripper Ashers Etching Dry Other ASML 300C DUV Stepper Lithography All Lithography DUV ASML PAS 5500/60 i-line Stepper Lithography All Lithography UV AST 280 RTA Thin Film Processing Metal Annealing Asylum MFP-3D atomic force microscope Imaging All Imaging Probe Asylum MFP-3D Origin+ AFM Imaging All Imaging Probe Atmosphere Oxidation System (tube 21) Thin Film Processing Dielectric Oxidation Atmosphere Oxidation System (tube 22) Thin Film Processing Dielectric Oxidation Atmosphere Oxidation System (tube 23) Thin Film Processing Dielectric Oxidation Atmosphere Oxidation System (tube 24) Thin Film Processing Dielectric Oxidation Atom Probe Tomography Imaging All Imaging Other Atomic Force Microscope Imaging All Imaging Probe Atomic Force Microscope Imaging All Imaging Probe Atomic Force Microscope Metrology/Characterization Structure or Device Electrical Atomic Force Microscope Imaging All Imaging Other Atomic Force Microscope Imaging All Imaging Probe Atomic Force Microscope-Keller Imaging All Imaging Probe Atomic Force Microscope-PAN Imaging All Imaging Probe Atomic Layer Deposition Thin Film Processing Dielectric ALD Atomic Layer Deposition Thin Film Processing Dielectric ALD Atomic Layer Deposition Thin Film Processing Dielectric ALD Atomic Layer Deposition Thin Film Processing Dielectric ALD Atomic Layer Deposition System (ALD) Thin Film Processing Dielectric Oxidation Atomic Layer Deposition System (ALD) Thin Film Processing Dielectric ALD Atomic Layer Deposition System (ALD) Thin Film Processing Dielectric ALD Atomic Layer Deposition System (ALD) Thin Film Processing Dielectric ALD attocube MFM Metrology/Characterization Structure or Device Profilometry ATV PEO 603 Thin Film Processing Dielectric Oxidation Au Ball Bonder Packaging All Packaging Bonding Auger Metrology/Characterization Chemical Analysis Spectroscopy Auger: PHI 700 Metrology/Characterization Thin Film Other Aura 1000 Resist Strip Cleaning All Cleaning Plasma/Stripper Autoclave Packaging All Packaging Other Autodesk Ember Patterning All Patterning 3D Printing Automated Coater/Developer Lithography All Lithography Resist Processing Automatic Bottle Washer Cleaning All Cleaning Wet Bench Autostep i-line Stepper Lithography All Lithography UV AWB04 Wafer Bonder Packaging All Packaging Bonding Axio Imager Microscope Imaging All Imaging Optical Axiophot Photomicroscope Imaging All Imaging Optical Axioskope 2 MAT Imaging All Imaging Optical Axopatch 200B Amplifier- Patch Clamp Biological All Biological Other Bachur and Associates UV Flood Exposure System Lithography All Lithography Resist Processing Backside Wafer Scriber Packaging All Packaging Dicing Bal-Tec CPD 408 Critical Point Dryer Cleaning All Cleaning Critical Point Drying Ball Bonder Packaging All Packaging Other Ball Miller Ball Mixer Thin Film Processing Dielectric Other Ball Wire Bonder Packaging All Packaging Bonding Baltec Carbon Coater Imaging All Imaging Sample Prep Barrel Asher Cleaning All Cleaning Plasma/Stripper BarrelEtch Cleaning All Cleaning Plasma/Stripper Base Development Bench Etching Wet Wet Bench Base Process Bench Etching Wet Wet Bench Base Process Wetbench Etching Wet Wet Bench Base Wet Bench Etching Wet Wet Bench Batchtop RIE Etching Dry RIE BATH 5 Lithography All Lithography Resist Processing BATH 6 Lithography All Lithography Resist Processing BATH1 Cleaning All Cleaning Wet Bench BATH2 Cleaning All Cleaning Wet Bench BATH3 Etching Wet Wet Bench BATH4 Etching Wet Wet Bench Battery Tester Thin Film Processing Dielectric Other BD Biosciences FACSAria III Flow Cytometer System Biological All Biological Other Beckman Coulter Ultracentrifuge Particle All Particle Other Belt Furnace Thin Film Processing Metal Annealing Bench-top crystal orientation analyzer Metrology/Characterization Chemical Analysis Other Beneq TFS200 Atomic Layer Deposition Thin Film Processing Dielectric ALD BGA Rework Station Packaging All Packaging Other Biacore SPR Biological All Biological SPR Biacore T200 SPR Biological All Biological SPR BIO AFM Imaging All Imaging Probe Bioforce Nano eNabler Printer/Patterner Patterning All Patterning Other BIOHOOD1 Biological All Biological Other BIOHOOD2 Biological All Biological Other Biologic Potentiostat Metrology/Characterization Structure or Device Electrical Biological Atomic Force and Super Resolution Fluorescence Microscope Imaging All Imaging Optical Biosafety Hoods Biological All Biological Sample Prep Bioscope Resolve Imaging All Imaging Probe BioSoft Indenter Biological All Biological Other BioSoft Indenter Metrology/Characterization Thin Film Mechanical Biotage V10 Touch Solvent Evaporation System Biological All Biological Other BioTek MX/Mono-based MultiFunction Microplate Reader Biological All Biological Other BioTek PRC384 Microplate Sample Processor Biological All Biological Sample Prep BioTek Quant Spectrophotometer Biological All Biological Other BioTek Synergy HTX Microplate Reader Metrology/Characterization Chemical Analysis Spectroscopy Black Magic PECVD Thin Film Processing Dielectric PECVD BLE Spinner Lithography All Lithography Resist Processing Blue M Programmable Oven Thin Film Processing Polymer Other Bond Tester Metrology/Characterization Thin Film Mechanical Boron Disk Doping (Tylan Furnace D2) Thin Film Processing Dielectric Doping Boron Doping – Bank D-1 Thin Film Processing Dielectric Doping Boron Doping Furnace (BBr3) Thin Film Processing Dielectric Doping Bowoptic Stress Measurement Metrology/Characterization Thin Film Mechanical Brewer CEE 100 Spin Coat System Thin Film Processing Polymer Spin Coating Brewer Cee 100CB Lithography All Lithography Resist Processing Brewer CEE Spinner and Hotplate Lithography All Lithography Resist Processing Brewer Science Spinner Lithography All Lithography Resist Processing Bruker AFM Multimode Imaging All Imaging Probe Bruker Autoflex Metrology/Characterization Chemical Analysis Mass Spec Bruker AXS General Area Detector Diffraction System Metrology/Characterization Thin Film XRD Bruker D2 Phaser Benchtop XRD Metrology/Characterization Thin Film XRD Bruker D8 Discover Metrology/Characterization Thin Film XRD Bruker D8 Discover Metrology/Characterization Thin Film XRD Bruker Dimension Imaging All Imaging Probe Bruker Dimension Icon AFM Imaging All Imaging Probe Bruker Dimension Icon AFM Imaging All Imaging Probe Bruker Dimension Icon Atomic Force Microscope Imaging All Imaging Probe BRUKER Discovery D8 Metrology/Characterization Thin Film XRD Bruker Duo X-Ray Diffractomer Metrology/Characterization Thin Film XRD Bruker EDS Metrology/Characterization Thin Film EDS/WDS Bruker Fastscan Imaging All Imaging Probe Bruker FTIR/FTRaman Metrology/Characterization Chemical Analysis Spectroscopy Bruker Icon AFM Imaging All Imaging Probe Bruker ICON PT System Imaging All Imaging Probe Bruker maXis Impact with Dionex 3000 nano-uHPLC Metrology/Characterization Chemical Analysis Mass Spec Bruker micrOTOF with Agilent 1290 UHPLC Metrology/Characterization Chemical Analysis Mass Spec Bruker Multimode Imaging All Imaging Probe Bruker Photon 100 Metrology/Characterization Thin Film XRD BSL3 Laboratory Biological All Biological Other Buehler ISOMet 1000 Precision Saw Buehler MiniMet 1000 Grinder-polisher Bump Plating Machine Packaging All Packaging Other BX-51 Fluorescence Microscope Imaging All Imaging Optical C, H, N, S Analyzer Particle All Particle Other California Measurements MPS-3 Microanalysis Particle Sampler Particle All Particle Size Calorimeter Metrology/Characterization Chemical Analysis Other Cambridge NanoTech ALD Thin Film Processing Dielectric ALD Cambridge NanoTech Plasma ALD – Metal (left) Thin Film Processing Metal ALD Cambridge NanoTech Plasma ALD – Oxide (right) Thin Film Processing Dielectric ALD Cambridge NanoTech S200 Thin Film Processing Dielectric ALD Cambridge Nanotech/Ultratech Savannah Thin Film Processing Dielectric ALD Camera Metrology/Characterization Thin Film XRD Canon I-line stepper Lithography All Lithography UV Canon Stepper Lithography All Lithography UV Carbolite Cleanroom Oven Other All Other Other Carbolite Tube Furnace Thin Film Processing Metal Other Carbon Nanotube/Graphene Furnace Thin Film Processing Dielectric CVD Carver Hot Embossing System Patterning All Patterning Other Cary 5000, UV-Vis-NIR Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy Cary 5000UV-VIS NIR Metrology/Characterization Thin Film Spectroscopy Cascade Micromanipulator 6000 Metrology/Characterization Structure or Device Electrical Cascade REL-4800 Manual Probe Station Metrology/Characterization Structure or Device Electrical CAVE – 3D visualization suite CCI HD Optical Profiler Metrology/Characterization Structure or Device Profilometry CDE ResMap Resistivity 4-pt Probe Metrology/Characterization Structure or Device Electrical CDE ResMap-178 Metrology/Characterization Structure or Device Electrical CEE-100 Spinner Lithography All Lithography Resist Processing CEI-XANES Metrology/Characterization Chemical Analysis Other Cell Incubators Biological All Biological Sample Prep CEM Liberty Blue Microwave assisted Peptide Synthesizer Biological All Biological Other CEM Liberty Blue Microwave assisted Peptide Synthesizer Biological All Biological Other CEM Liberty Microwave assisted Peptide Synthesizer Biological All Biological Other CEM Liberty Microwave assisted Peptide Synthesizer Biological All Biological Other Centrifuge Biological All Biological Sample Prep Centrifuge Biological All Biological Sample Prep CHA E-beam evaporator Thin Film Processing Metal Evaporation CHA E-beam evaporator Thin Film Processing Metal Evaporation CHA E-beam Evaporator Thin Film Processing Metal Evaporation CHA E-beam Evaporator 1 (dielectrics) Thin Film Processing Dielectric Evaporation CHA E-beam Evaporator 2 (metals) Thin Film Processing Metal Evaporation CHA Evaporator Thin Film Processing Metal Evaporation CHA Mark 50 Evaporator Thin Film Processing Metal Evaporation Characterization Electronics Metrology/Characterization Structure or Device Electrical Chemical Hoods/Wet Benches Cleaning All Cleaning Wet Bench Chemiluminescent Gel Imager Biological All Biological Other Chlorine & Flourine Metal Etching System Etching Dry RIE Circuit Tester Metrology/Characterization Structure or Device Electrical Clean Bench & Tanks-class 3 materials Cleaning All Cleaning Wet Bench Clean-1 and 2 Wetbench Cleaning All Cleaning Wet Bench CM200-FEG (Philips) Imaging All Imaging TEM CMOS Cleaning Station (Marcus) Cleaning All Cleaning Wet Bench CMOS Cleaning Station (Pettit) Cleaning All Cleaning Wet Bench CMOS Spin Rinse Dryer (Inorganic) Cleaning All Cleaning Spin Rinse Drying CMOS Spin Rinse Dryer (SRD) – Pettit Cleaning All Cleaning Spin Rinse Drying CMOS Wet Oxide -Bank E-2 Thin Film Processing Dielectric Oxidation CMP System Packaging All Packaging CMP CNC Micro Milling System Other All Other Other COATHOOD1 Lithography All Lithography Resist Processing COATHOOD2 Lithography All Lithography Resist Processing Cambridge NanoTech S200 Thin Film Processing Dielectric ALD Cambridge Nanotech/Ultratech Savannah Thin Film Processing Dielectric ALD Camera Metrology/Characterization Thin Film XRD Canon I-line stepper Lithography All Lithography UV Canon Stepper Lithography All Lithography UV Carbolite Cleanroom Oven Other All Other Other Carbolite Tube Furnace Thin Film Processing Metal Other Carbon Nanotube/Graphene Furnace Thin Film Processing Dielectric CVD Carver Hot Embossing System Patterning All Patterning Other Cary 5000, UV-Vis-NIR Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy Cary 5000UV-VIS NIR Metrology/Characterization Thin Film Spectroscopy Cascade Micromanipulator 6000 Metrology/Characterization Structure or Device Electrical Cascade REL-4800 Manual Probe Station Metrology/Characterization Structure or Device Electrical CAVE – 3D visualization suite CCI HD Optical Profiler Metrology/Characterization Structure or Device Profilometry CDE ResMap Resistivity 4-pt Probe Metrology/Characterization Structure or Device Electrical CDE ResMap-178 Metrology/Characterization Structure or Device Electrical CEE-100 Spinner Lithography All Lithography Resist Processing CEI-XANES Metrology/Characterization Chemical Analysis Other Cell Incubators Biological All Biological Sample Prep CEM Liberty Blue Microwave assisted Peptide Synthesizer Biological All Biological Other CEM Liberty Blue Microwave assisted Peptide Synthesizer Biological All Biological Other CEM Liberty Microwave assisted Peptide Synthesizer Biological All Biological Other CEM Liberty Microwave assisted Peptide Synthesizer Biological All Biological Other Centrifuge Biological All Biological Sample Prep Centrifuge Biological All Biological Sample Prep CHA E-beam evaporator Thin Film Processing Metal Evaporation CHA E-beam evaporator Thin Film Processing Metal Evaporation CHA E-beam Evaporator Thin Film Processing Metal Evaporation CHA E-beam Evaporator 1 (dielectrics) Thin Film Processing Dielectric Evaporation CHA E-beam Evaporator 2 (metals) Thin Film Processing Metal Evaporation CHA Evaporator Thin Film Processing Metal Evaporation CHA Mark 50 Evaporator Thin Film Processing Metal Evaporation Characterization Electronics Metrology/Characterization Structure or Device Electrical Chemical Hoods/Wet Benches Cleaning All Cleaning Wet Bench Chemiluminescent Gel Imager Biological All Biological Other Chlorine & Flourine Metal Etching System Etching Dry RIE Circuit Tester Metrology/Characterization Structure or Device Electrical Clean Bench & Tanks-class 3 materials Cleaning All Cleaning Wet Bench Clean-1 and 2 Wetbench Cleaning All Cleaning Wet Bench CM200-FEG (Philips) Imaging All Imaging TEM CMOS Cleaning Station (Marcus) Cleaning All Cleaning Wet Bench CMOS Cleaning Station (Pettit) Cleaning All Cleaning Wet Bench CMOS Spin Rinse Dryer (Inorganic) Cleaning All Cleaning Spin Rinse Drying CMOS Spin Rinse Dryer (SRD) – Pettit Cleaning All Cleaning Spin Rinse Drying CMOS Wet Oxide -Bank E-2 Thin Film Processing Dielectric Oxidation CMP System Packaging All Packaging CMP CNC Micro Milling System Other All Other Other COATHOOD1 Lithography All Lithography Resist Processing COATHOOD2 Lithography All Lithography Resist Processing Cryo-EM High Pressure Freezer Imaging All Imaging Sample Prep Cryo-EM Trimmer Imaging All Imaging Sample Prep Cryo-EM Ultramicrotome Imaging All Imaging Sample Prep Cryoplunge Imaging All Imaging Sample Prep CryoTEM (Tecnai) Imaging All Imaging TEM Cs-TEM Aberration Corrected MC Zeiss 200-80 Imaging All Imaging TEM CTRLayer Anti-Reflective Coater Thin Film Processing Dielectric Evaporation CtrLayer SDS Thin Film Processing Metal Sputter CV Testing Station Metrology/Characterization Structure or Device Electrical CV-IV Metrology/Characterization Structure or Device Electrical CVC DC Sputterer Thin Film Processing Metal Sputter CVC E-Beam Evaporator 1 Thin Film Processing Metal Evaporation CVC E-Beam Evaporator 2 — Instructional Center Thin Film Processing Metal Evaporation CVD FirstNano Graphene Furnace 1 Thin Film Processing Dielectric CVD CVD FirstNano Graphene Furnace 2 Thin Film Processing Dielectric CVD CVD FirstNano SiGe Nanowire Furnace Thin Film Processing Dielectric CVD CVD Reactor Thin Film Processing Dielectric CVD Cypher AFM Imaging All Imaging Probe Cypher AFM Imaging All Imaging Probe Cyro Probe Station Metrology/Characterization Structure or Device Electrical Cytation3 Automated Microscope Plate Reader Biological All Biological Other CyTOF – Mass Cytometer Metrology/Characterization Chemical Analysis Mass Spec Cytoviva Metrology/Characterization Structure or Device Other Cytoviva Hyperspectral Darkfield Microscope Imaging All Imaging Optical D-5000 Metrology/Characterization Thin Film XRD Dage Shear Tester Packaging All Packaging Other Dage X-Ray XD7600NT Metrology/Characterization Structure or Device Other DC Sputter System Thin Film Processing Metal Sputter DC Sputtering System Thin Film Processing Metal Sputter Decapsulation System Packaging All Packaging Other Decon and Clean-3 Wetbench Cleaning All Cleaning Wet Bench Deep Reactive Ion Etcher (DRIE) Etching Dry Deep Silicon (Bosch) Deep Reactive Ion Etching System – Alcatel AMS 100 Etching Dry Deep Silicon (Bosch) Deep Reactive Ion Etching System – STS MESC Multiplex ICP Etching Dry Deep Silicon (Bosch) Deep RIE Etching Dry Deep Silicon (Bosch) Deep Trench Etcher Etching Dry ICP Dehydration Oven Lithography All Lithography Resist Processing Dektak Metrology/Characterization Structure or Device Profilometry Dektak 150 Metrology/Characterization Structure or Device Profilometry Dektak 150 Profilometer Metrology/Characterization Structure or Device Profilometry Dektak 150 Profilometer — Instructional Center Metrology/Characterization Structure or Device Profilometry Dektak 6M Profilometer Metrology/Characterization Structure or Device Profilometry Dektak Profilometer Metrology/Characterization Structure or Device Profilometry Dektak Stylus Profilometer Metrology/Characterization Structure or Device Profilometry DektakXT Metrology/Characterization Structure or Device Profilometry DektakXT Metrology/Characterization Structure or Device Profilometry DektakXT Stylus Profilometer Metrology/Characterization Structure or Device Profilometry Denton 502A Thermal Evaporator Thin Film Processing Metal Evaporation Denton Discovery – RF/DC Sputterer Thin Film Processing Metal Sputter Denton Discovery 18 Sputter System Thin Film Processing Metal Sputter Denton Discovery 2 Thin Film Processing Metal Sputter Denton Discovery 635 Sputter System Thin Film Processing Metal Sputter Denton E-Beam Evaporator Thin Film Processing Metal Evaporation Denton Explorer – E-beam Evaporator Thin Film Processing Metal Evaporation Denton Explorer 14 Thin Film Processing Metal Sputter Denton Infinity Thin Film Processing Metal Evaporation Denton Thermal Evaporator Thin Film Processing Metal Evaporation deposition: Oerlikon Univex Sputter Thin Film Processing All Thin Film Processing Sputter Desktop SEM Imaging All Imaging SEM Despatch LCC1-16-5 Resist Oven (3) Lithography All Lithography Resist Processing Develop Bench Lithography All Lithography Resist Processing Developer Wet Bench Etching Wet Wet Bench DEVHOOD1 Lithography All Lithography Resist Processing Dicing Saw Packaging All Packaging Dicing Dicing Saw Packaging All Packaging Dicing Dicing Saw-DISCO Packaging All Packaging Dicing Die Bonder Packaging All Packaging Bonding Dielectric Etcher Etching Dry RIE Diener/Femto Plasma Cleaner Imaging All Imaging Sample Prep Differential Scanning Calorimeter Metrology/Characterization Chemical Analysis TGA Differential Scanning Calorimeter Metrology/Characterization Chemical Analysis DSC Digital Instruments Nanoscope 3000 AFM Metrology/Characterization Thin Film Other Dimatix DMP-2831 Patterning All Patterning Inkjet Dimatix Materials Printer Patterning All Patterning Inkjet Dimatix Nano Inkjetter Patterning All Patterning Inkjet Dimatix Printer Patterning All Patterning Inkjet Dimension 3100 SPM Imaging All Imaging Probe Dimpler Imaging All Imaging Sample Prep Dimpler Grinder Imaging All Imaging Sample Prep Dimpler/Grinder Imaging All Imaging Sample Prep Dimpling Grinder Imaging All Imaging Sample Prep Disc Cutter Imaging All Imaging Sample Prep Disc Cutter Imaging All Imaging Sample Prep Disco 552 Saw Packaging All Packaging Dicing Disco Automatic Dicing Saw 3220 Packaging All Packaging Dicing Disco Backgrind Packaging All Packaging Other Disco DAD3240 Automatic Dicing Saw Packaging All Packaging Dicing Disco Dicing Saw Packaging All Packaging Dicing Disco wafer dicing saw Packaging All Packaging Dicing DISCO Wafer Saw Packaging All Packaging Dicing Disco-Saw Packaging All Packaging Dicing Dispenser Packaging All Packaging Other Dispensing Tool Packaging All Packaging Bonding DLS: Brookhaven Instrument 90 & ZetaPALS Particle All Particle Size DMA: TA Instrument Q800 Metrology/Characterization Chemical Analysis Other DNR MF ChemiBIS Image Analysis System Biological All Biological Other DNR MiniLumi Bio Imaging System Biological All Biological Other DRIE Etching Dry Deep Silicon (Bosch) DRIE Etching Dry Deep Silicon (Bosch) Drive-In Anneal / Re-Oxidation (Tylan Furnace D4) Thin Film Processing Dielectric Annealing Dry Oxidation (Tylan Furnace D3) Thin Film Processing Dielectric Oxidation Dry Oxide-CMOS-CVD – Bank E-1 Thin Film Processing Dielectric Oxidation Drytek 100 Plasma Etcher Etching Dry RIE DSA91304A Infiniium High Performance Oscilloscope: 13 GHz Metrology/Characterization Structure or Device Electrical DSC Metrology/Characterization Chemical Analysis Other DSC Biological All Biological Other DSC: TA Instrument Q100 Metrology/Characterization Chemical Analysis DSC DSC: TA Instrument Q2000 Metrology/Characterization Chemical Analysis DSC Dualbeam FIB/SEM Imaging All Imaging FIB DWL66 Laser Wrier Lithography All Lithography Other DWL66fs Mask Writer Patterning All Patterning Laser Dynamic Force AFM (Asylum) Imaging All Imaging Probe Dynamic Light Scattering Particle Size Analyzer Particle All Particle Size Dynamic Light Scattering Zetasizer Nano ZS Particle All Particle Size Dynisco D4003 Melt Index Tester Metrology/Characterization Chemical Analysis Other E-beam Evaporator Thin Film Processing Metal Evaporation E-beam evaporator Thin Film Processing Metal Evaporation E-beam Evaporator Thin Film Processing Metal Evaporation E-beam evaporator Thin Film Processing Metal Evaporation E-beam Litho Lithography All Lithography EBL E-Beam Lithography Hot Plates Lithography All Lithography Resist Processing E-beam Lithography Spinners Lithography All Lithography Resist Processing E-Beam Resist Hot Plate Tower Lithography All Lithography Resist Processing E-Beam Thermal Evaporator Lesker PVD 75 (PVD-02) Thin Film Processing Metal Evaporation e-beam/SEM: FEI Nova Imaging All Imaging SEM e-beam: JEOL 6300-FS Lithography All Lithography EBL E8361C PNA Microwave Network Analyzer Metrology/Characterization Structure or Device Electrical EBE Thin Film Processing Metal Evaporation Ebeam evaporator Thin Film Processing Dielectric Evaporation Ebeam Resist Hood – Left Lithography All Lithography Resist Processing Ebeam Resist Hood – Right Lithography All Lithography Resist Processing Ebeam/Sputter Deposition System Thin Film Processing Metal Sputter EBL Lithography All Lithography EBL EBL CEE Spinner Thin Film Processing Polymer Spin Coating EBL1 Lithography All Lithography EBL ECE418 Aligner Lithography All Lithography UV EcoChem Analytics DC 2000 CE Diffusion Charger Particle All Particle Other EcoChem Analytics PAS 2000 Particle All Particle Other Ecomet Imaging All Imaging Sample Prep ED-XRF Metrology/Characterization Thin Film XRF Eddy Current Measurement System Metrology/Characterization Structure or Device Electrical EDP Wet Bench Etching Wet Wet Bench EDS Metrology/Characterization Thin Film EDS/WDS EDS on FIB Metrology/Characterization Thin Film EDS/WDS EDS on SEM Metrology/Characterization Thin Film EDS/WDS EDS on TEM Metrology/Characterization Thin Film EDS/WDS Edwards thermal evaporator Thin Film Processing Metal Other Electrical Test Station Metrology/Characterization Structure or Device Electrical Electrode Fabricator Thin Film Processing Dielectric Annealing Electroless Plating Line Thin Film Processing Metal Plating Electroluminescence Imaging All Imaging Other Electrolytic Plating Line Thin Film Processing Metal Plating Electron and Photon Stimulated Desorption (BES 2) Other All Other Other Electron Beam Evaporator Thin Film Processing Dielectric Evaporation Electron Beam Evaporator Thin Film Processing Metal Evaporation Electron Beam Evaporator Thin Film Processing Metal Evaporation Electron Beam Lithography Spinner Lithography All Lithography Resist Processing Electron Beam Resist Developing Station Lithography All Lithography Resist Processing Electron Beam Resist Oven Lithography All Lithography Resist Processing Electron Beam Resist Spin Coating Station Lithography All Lithography Resist Processing Electron Microprobe Imaging All Imaging Other Electron Spectrometer: XPS with Laser Interface Metrology/Characterization Thin Film XPS Electroplating Bench Thin Film Processing Metal Plating Electroplating Hood – Au Thin Film Processing Metal Plating Electroplating Hood – Cu Thin Film Processing Metal Plating Electroplating Hood – Ni Thin Film Processing Metal Plating Electroplating Process Bench Thin Film Processing Metal Other Elemental Analysis Other All Other Other Elionix ELS-7000 Lithography All Lithography EBL Elionix ELS-7500EX Lithography All Lithography EBL Elionix ELS-F125 Lithography All Lithography EBL ELL1 Metrology/Characterization Thin Film Thickness Ellipsometer Metrology/Characterization Structure or Device Optical Ellipsometer Metrology/Characterization Thin Film Thickness Ellipsometer Metrology/Characterization Thin Film Thickness Ellipsometer Metrology/Characterization Thin Film Spectroscopy Ellipsometer Metrology/Characterization Thin Film Other Ellipsometer Metrology/Characterization Thin Film Thickness Ellipsometer Metrology/Characterization Thin Film Thickness Ellipsometer Metrology/Characterization Thin Film Thickness Ellipsometer (VASE) Metrology/Characterization Thin Film Thickness Ellipsometer: Horiba Smart SE Metrology/Characterization Thin Film Other ELS-G100 EBL System Lithography All Lithography EBL Emitech Au/Pd and Ir sputter coater Imaging All Imaging Sample Prep Emitech K575X Sputter Coater Thin Film Processing All Thin Film Processing Sputter EMS Hotplate Lithography All Lithography Resist Processing Environmental FIB/SEM (Quanta) Imaging All Imaging SEM Environmental TEM Imaging All Imaging TEM EnviroScope Atomic Force Microscope (ESCOPE) Imaging All Imaging Probe EOS M270 Patterning All Patterning 3D Printing Epifluorescence Optical Microscope Imaging All Imaging Optical ESEM Imaging All Imaging SEM ESEM Imaging All Imaging SEM Eukaryotic Cell Culture Other All Other Other EV Group 620 Contact Aligner Lithography All Lithography UV EV Group 620 Contact Aligner Lithography All Lithography UV EV Group Contact Aligner Lithography All Lithography UV EV Group Wafer Bonder Packaging All Packaging Bonding EVAP1 Thin Film Processing Metal Evaporation EVAP1 Thin Film Processing Metal Evaporation EVAP2 Thin Film Processing Metal Evaporation EVAP2 Thin Film Processing Metal Evaporation EVAP3 Thin Film Processing Metal Evaporation EVAP3 Thin Film Processing Metal Evaporation Evatec Vision Sputterer Thin Film Processing Dielectric Sputter Everbeing 4-point Probe Station-Manual Metrology/Characterization Structure or Device Electrical Everbeing EB-6 DC Probe Station Metrology/Characterization Structure or Device Electrical EVG 101 Resist Spray Coater Thin Film Processing Polymer Spray Coating EVG 101 Spin Coater Thin Film Processing Polymer Spin Coating EVG 150 Automated Wafer Coater/Developer Lithography All Lithography Resist Processing EVG 501 Wafer Bonder Packaging All Packaging Bonding EVG 510 Wafer Bonder Packaging All Packaging Bonding EVG 620 Mask Aligner Lithography All Lithography UV EVG 620 Mask Aligner Lithography All Lithography UV EVG 620 UV-NIL Patterning All Patterning NIL EVG 620 Wafer Bond Aligner Packaging All Packaging Bonding EVG Contact Aligner Lithography All Lithography UV EVG620 Lithography System Lithography All Lithography UV EVO 220 UV/vis Biological All Biological Other Excimer Laser Packaging All Packaging Other Exfoliation Glove Box Other All Other Other ExOne Digital Part Materialization Patterning All Patterning 3D Printing FEI Apreo Imaging All Imaging SEM FEI Helios 600 NanoLab, Focused Ion Beam (FIB) Imaging All Imaging FIB FEI Helios 660 Imaging All Imaging FIB FEI Helios Nanolab Imaging All Imaging FIB FEI Nova 600 Imaging All Imaging SEM FEI Nova Nano450 Imaging All Imaging SEM FEI Nova Nanolab 200 FIB/SEM Imaging All Imaging FIB FEI Nova Nanolab 200 FIB/SEM Metrology/Characterization Thin Film EDS/WDS FEI Quanta 200 3D FIB/SEM Imaging All Imaging FIB FEI Quanta 600 FEG Environmental SEM Imaging All Imaging SEM FEI Quanta 650 FEG Imaging All Imaging SEM FEI Quanta 650 FEG SEM with Nabity Pattern Generator Imaging All Imaging SEM FEI Sirion Imaging All Imaging SEM FEI Tecnai Imaging All Imaging TEM FEI Tecnai Imaging All Imaging TEM FEI Tecnai Imaging All Imaging TEM FEI Tecnai Arctica CryoTEM with Autoloader Imaging All Imaging TEM FEI Tecnai Cryo-Bio 200kV FEG TEM Imaging All Imaging TEM FEI Tecnai F30 TEM Imaging All Imaging TEM FEI Tecnai F30 TEM Metrology/Characterization Thin Film EDS/WDS FEI Tecnia Osiris Imaging All Imaging TEM FEI Titan 300 Imaging All Imaging TEM Femtosecond Laser System Patterning All Patterning Laser FESEM Supra 55VP Imaging All Imaging SEM FESEM Ultra Plus Imaging All Imaging SEM FESEM Ultra55 Imaging All Imaging SEM FIB Etching Dry FIB FIB Imaging All Imaging FIB FIB/SEM: FEI DB235 Imaging All Imaging FIB FIB/SEM: FEI Helios 600i Imaging All Imaging FIB Field Emission Scanning Electron Microscope Imaging All Imaging SEM Field Emission Scanning Electron Microscope Imaging All Imaging SEM Fiji Atomic Layer Deposition Thin Film Processing Dielectric ALD Fiji Atomic Layer Deposition Thin Film Processing Dielectric ALD Filmetrics Metrology/Characterization Structure or Device Optical Filmetrics Metrology/Characterization Structure or Device Profilometry Filmetrics Metrology/Characterization Thin Film Thickness FilMetrics F20 Metrology/Characterization Thin Film Other Filmetrics F20 Metrology/Characterization Thin Film Thickness Filmetrics F20 (2) Metrology/Characterization Thin Film Thickness FilMetrics F40 Metrology/Characterization Thin Film Other Filmetrics F40 Metrology/Characterization Structure or Device Optical Filmetrics F40-UV Metrology/Characterization Thin Film Other Filmetrics F50 Metrology/Characterization Structure or Device Optical FilMetrics F50-EXR Metrology/Characterization Thin Film Other Filmetrics Film Thickness F3 Metrology/Characterization Thin Film Thickness FilmSense Metrology/Characterization Thin Film Thickness Finetech Flip Chip Bonder Packaging All Packaging Bonding Finetech Sub-micron Flip-chip Bonder Packaging All Packaging Bonding First Nano carbon nanotube CVD furnace Thin Film Processing Dielectric Other Fischione Ion Mill Etching Dry Ion Mill Flash Solar Cell Tester Metrology/Characterization Structure or Device Electrical Flexible Corrosive Wetbench and GaAs Etching Wet Wet Bench Flexus 2320 Metrology/Characterization Thin Film Other FleXus Film Stress Measurement Metrology/Characterization Thin Film Other Flip Chip Bonder Packaging All Packaging Bonding Flip Chip Bonder Packaging All Packaging Bonding Flip-Chip Bonder Packaging All Packaging Bonding Flipchip Bonder Packaging All Packaging Bonding Flow Mach2-1313b Waterjet Cutting Machine Packaging All Packaging Dicing Fluorimeter Metrology/Characterization Chemical Analysis Other Fluorimeter Metrology/Characterization Chemical Analysis Spectroscopy FLX-2320-S Thin Film Stress Measurement Metrology/Characterization Thin Film Mechanical FMS Thin Film Stress Measurement System Metrology/Characterization Thin Film Mechanical Focused Ion Beam & Scanning Electron Microscope Imaging All Imaging FIB Focused Ion Beam – Helios G4 UX (FEI) Imaging All Imaging FIB Focused Ion Beam – Nova 200 NanoLab (FEI) Imaging All Imaging FIB Form2 3D SLA Printer Patterning All Patterning 3D Printing Forming Gas Anneal (Tylan Furnace C4) Thin Film Processing Dielectric Annealing Forming gas Anneal Furnace Forming gas Anneal Furnace Forming Gas Anneal of High-K Dielectrics (Tylan Furnace C1) Thin Film Processing Dielectric Annealing Forming Gas Furnace Thin Film Processing Metal Annealing FormLabs Form2 Patterning All Patterning 3D Printing Four Point Probe Metrology/Characterization Structure or Device Electrical Four Point Probe Metrology/Characterization Structure or Device Electrical Four point probe Metrology/Characterization Structure or Device Electrical Four point probe Metrology/Characterization Structure or Device Electrical Free Fall Shock Machine Metrology/Characterization Structure or Device Other Freeze Dry Systems Biological All Biological Sample Prep Freeze Fracture Imaging All Imaging Sample Prep Freeze Substitutor Biological All Biological Sample Prep FT-IR Metrology/Characterization Thin Film Spectroscopy FTIR Metrology/Characterization Thin Film Spectroscopy FTIR Microscope Metrology/Characterization Chemical Analysis Other FTIR Spectrometer Metrology/Characterization Chemical Analysis Other Fume Hoods 1-4 Fumehood 1 Left Cleaning All Cleaning Wet Bench Fumehood 1 Right Cleaning All Cleaning Wet Bench Fumehood 2 Left Cleaning All Cleaning Wet Bench Fumehood 2 Right Cleaning All Cleaning Wet Bench Fumehood 3 Left Cleaning All Cleaning Wet Bench Fumehood 3 Right Cleaning All Cleaning Wet Bench FURN2-Tube1 Thin Film Processing Dielectric Annealing FURN2-Tube2 Thin Film Processing Dielectric Oxidation FURN2-Tube3 Thin Film Processing Dielectric Annealing Furnace Thin Film Processing Dielectric Oxidation Furnaces and Controllers Lindberg Thin Film Processing Dielectric Oxidation Fusion 3D printer Patterning All Patterning 3D Printing Fusion Splicer Packaging All Packaging Other Gaertner L116C ellipsometer Metrology/Characterization Structure or Device Optical Gaertner LSE-WS Ellipsometer Metrology/Characterization Thin Film Thickness Gamma Automatic Coat-Develop Tool Lithography All Lithography Resist Processing Gas Chromatographer Metrology/Characterization Chemical Analysis Chromatography Gas Chromatographer Metrology/Characterization Chemical Analysis Chromatography Gas sorption: Quantachrome Autosorb iQ3 Metrology/Characterization Chemical Analysis Other Gasonics Asher Etching Dry Other Gasonics Asher (Inorganic) Etching Dry Other Gasonics Aura Asher Etching Dry RIE GC-MS Agilent Metrology/Characterization Chemical Analysis Chromatography GC-TOF MS Metrology/Characterization Chemical Analysis Mass Spec GCA 5x Stepper Lithography All Lithography UV GCA 8500 Stepper Lithography All Lithography UV GDOES Metrology/Characterization Chemical Analysis Other Gel electrophoresis setup and accessories Biological All Biological Other GEMStar ALD and Pulsed CVD Thin Film Processing Dielectric ALD General Chemistry Hoods Cleaning All Cleaning Wet Bench General Furnace Thin Film Processing Dielectric Oxidation General Material Anneal 1 – Bank A-1 Thin Film Processing Metal Other General Wet Process Station Etching Wet Wet Bench Geochemistry AFM (Icon) Imaging All Imaging Probe Germanium wbgen-2 Cleaning All Cleaning Wet Bench Glen 1000 Resist Strip Cleaning All Cleaning Plasma/Stripper Glenn Downstream RIE Etching Dry RIE Glove Box Thin Film Processing Dielectric Other Glove Box Imaging All Imaging Sample Prep GLOVE1 Other All Other Other Glovebox Other All Other Other Glovebox 1-2 GLOW1 Cleaning All Cleaning Other GnP Poli-400L Packaging All Packaging CMP Gold Plating Thin Film Processing Metal Plating Graphene Deposition Thin Film Processing Dielectric CVD Graphitization Furnace Grinder/Polisher Imaging All Imaging Sample Prep GSI PECVD Thin Film Processing Dielectric PECVD Haas ST-10Turning Center Other All Other Other HAAS VMC VF-2 Other All Other Other Hall Effect Measurement System Metrology/Characterization Structure or Device Electrical Hamatech Hot Piranha Cleaning All Cleaning Other Hamatech Hot SC1/SC2 Cleaning All Cleaning Wet Bench Hamatech Mask Chrome Etch Etching Wet Other Hamatech Post CMP Brushcleaner Cleaning All Cleaning Other Hamatech Wafer Processor Develop 1 Etching Wet Other Hamatech Wafer Processor Develop 2 Etching Wet Other Hardness Tester HAST Chamber Metrology/Characterization Structure or Device Other HD-PCVD Thin Film Processing Dielectric PECVD Headway Manual Resist Spinner Thin Film Processing Polymer Spin Coating Headway Spinner hood J21/J23 Lithography All Lithography Resist Processing Headway Spinner I Thin Film Processing Polymer Spin Coating Heatpulse 610 Thin Film Processing Dielectric Annealing Heidelberg Laser Writer Lithography All Lithography Mask Making Heidelberg laserwriter Lithography All Lithography Mask Making Heidelberg Mask Writer Lithography All Lithography Mask Making Heidelberg Mask Writer – DWL2000 Lithography All Lithography Mask Making Heidelberg Mask Writer – DWL66 Lithography All Lithography Mask Making Heidelberg MLA150 Lithography All Lithography UV Heidelberg MLA150 Direct Write Lithographer Lithography All Lithography Mask Making Heidelberg MLA150 Maskless Aligner Lithography All Lithography UV Heidelberg MLA150 No.1 (375/405) Patterning All Patterning Laser Heidelberg MLA150 No.2 (375) Patterning All Patterning Laser Heidelberg uPG501 Lithography All Lithography UV Heidelberg µP-101 Direct Write Lithography Lithography All Lithography Mask Making Heildelberg MLA 150 – 1 Lithography All Lithography UV Heildelberg MLA 150 – 2 Lithography All Lithography UV Helios Dual Beam FIB Imaging All Imaging SEM Helios FIB/SEM Imaging All Imaging SEM Helios Nanolab 660/G3 Imaging All Imaging FIB Helium Ion Microscope Imaging All Imaging Other Heraeus Vacuum Oven (Marcus) Heraeus Vacuum Oven (Pettit) Other All Other Other Hermes LS500XL CO2 laser Patterning All Patterning Laser HEX Deposition system Thin Film Processing Metal Other HF Process Bench Etching Wet Wet Bench HF Vapor Etch Tool Etching Dry Other Hi-Speed Camera Imaging All Imaging Other High Pressure Freezer Biological All Biological Sample Prep High Resolution Microprobe XPS Metrology/Characterization Thin Film XPS High Resolution, Ultrafast SFG Vibrational Spectroscopy Metrology/Characterization Thin Film Other High Speed Optical Signal Testing Metrology/Characterization Structure or Device Optical High Temperature SiC Dry Oxidation Furnace (D1) Thin Film Processing Dielectric Oxidation High Vacuum Coater Biological All Biological Sample Prep HIROX KH-7700 3D Digital Video Microscope Imaging All Imaging Optical HITACHI 4100 Spectrophotometer Imaging All Imaging Optical Hitachi 4160 Scanning Electron Microscope Imaging All Imaging SEM Hitachi FESEM Imaging All Imaging SEM Hitachi H-8100 TEM Imaging All Imaging TEM Hitachi HD-2300 STEM Imaging All Imaging TEM Hitachi HD-2700 Imaging All Imaging TEM Hitachi HD-2700 Metrology/Characterization Thin Film EDS/WDS Hitachi HT-7700 S/TEM Imaging All Imaging TEM Hitachi HT7700 TEM Imaging All Imaging TEM Hitachi S-3400 Imaging All Imaging SEM Hitachi S-3500H SEM Imaging All Imaging SEM Hitachi S-3700N VP-SEM Imaging All Imaging SEM Hitachi S-4700 FE-SEM Imaging All Imaging SEM Hitachi S-4800 Imaging All Imaging SEM Hitachi S-4800 FESEM Imaging All Imaging SEM Hitachi s4300 Imaging All Imaging SEM Hitachi SU8010 SEM Imaging All Imaging SEM Hitachi SU8030 Imaging All Imaging SEM Hitachi SU8230 Imaging All Imaging SEM Hitachi SU8230 Imaging All Imaging SEM Hitachi SU8230 Metrology/Characterization Thin Film EDS/WDS Hitachi UH4150 UV-Visible/NIR Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy HMDS oven Lithography All Lithography Resist Processing HOOD1 Etching Wet Wet Bench HOOD2 Etching Wet Wet Bench HOOD3 Etching Wet Wet Bench Horiba FluoroMax 4 Imaging All Imaging Optical Horiba Raman/AFM Metrology/Characterization Thin Film Spectroscopy Horiba Raman/AFM Imaging All Imaging Probe Horiba SPRi-LAB+ Surface Plasma Resonance System Biological All Biological SPR Horiba UVISEL 2 Spectroscopic Ellipsometer Metrology/Characterization Thin Film Other Horiba XACTII Arrayer System Patterning All Patterning Other Horiba XploRA ONE Raman Confocal Microscope Metrology/Characterization Chemical Analysis Spectroscopy Hot Embosser Patterning All Patterning Other Hot Laminator – GBC Catena 35 Other All Other Other Hot Phosphoric Tank Etching Wet Other Hot Press Patterning All Patterning NIL Hotplates and Ovens Lithography All Lithography Resist Processing HPLC System Metrology/Characterization Chemical Analysis Other HT-GPC: Tosho High-temperature EcoSEC with MALS: Wyatt Dawn Heleos Metrology/Characterization Chemical Analysis Other Huber 2-circle Cu Metrology/Characterization Thin Film XRD Huber 2-circle XSW Mo Metrology/Characterization Thin Film XRD Huber 4-circle Metrology/Characterization Thin Film XRD Hummer 5 Gold/Palladium Sputterer Imaging All Imaging Sample Prep Hummer 6 Gold/Palladium Sputterer Imaging All Imaging Sample Prep Hummer V Sputter Coater Thin Film Processing Metal Evaporation Hummer XP Gold Sputterer Imaging All Imaging Sample Prep Hydrofluoric (HF) Vapor Etcher Etching Dry Other Hydrophilic Treatment System Imaging All Imaging Sample Prep Hydroponics Laboratory Hysitron TI 950 TriboIndenter Metrology/Characterization Thin Film Mechanical Hysitron TI950 Triboindenter Metrology/Characterization Thin Film Mechanical Hysitron TriboIndenter Metrology/Characterization Thin Film Mechanical Hysitron TriboIndenter Metrology/Characterization Thin Film Mechanical I-Line Lithography – GCA 8500DSW Stepper Lithography All Lithography Other IBM Etching Dry Ion Mill IBS/e Thin Film Processing Metal Sputter IBS/e Thin Film Processing Dielectric Sputter IBT Imaging All Imaging Sample Prep Ice Nucleation Chamber Other All Other Other Icon AFM Imaging All Imaging Other ICP – Chlorine Etching Dry ICP ICP – Fluorine Etching Dry ICP ICP 2300 Versys LAM Etching Dry ICP ICP STS Etching Dry ICP ICP-MS (Quadrupole) Metrology/Characterization Chemical Analysis Mass Spec ICP100 Etching Dry Deep Silicon (Bosch) ID Quantique ID220 Single Photon Detector (one pair) Metrology/Characterization Structure or Device Optical Illumina MiSeq DNA Sequencer Biological All Biological Other Image Reversal Oven Lithography All Lithography Resist Processing Image Reversal Oven Patterning All Patterning Other Imaging Ellipsometer Accurion EP3 Metrology/Characterization Thin Film Thickness Imaging Photoluminescence Imaging All Imaging Other Imaging XPS Imaging All Imaging Other IMILL1 Imaging All Imaging Sample Prep IncuCyte Live Cells Analysis System Biological All Biological Other Influx – Flow Cytometer Cell Sorter Other All Other Other Infrared Spectrometer Infinity Gold FTIR Metrology/Characterization Thin Film Spectroscopy Innotec ES26C E-Gun Evaporator Thin Film Processing Metal Evaporation Instron 3384 Materials Test Frame Metrology/Characterization Thin Film Mechanical Instron 5569 Mechnical Tester Metrology/Characterization Structure or Device Other Instron 5900R Material Test Frame Metrology/Characterization Thin Film Mechanical Instron 8802 Dynamic Test Frame Metrology/Characterization Thin Film Mechanical Instron 9250G Impact Test Frame Metrology/Characterization Thin Film Mechanical Instron E10000 Fatigue Test Equipment Metrology/Characterization Structure or Device Other Instron Impact Tester 8250 Metrology/Characterization Structure or Device Other Interferometer Metrology/Characterization Structure or Device Profilometry Intermediate Coating Platform Thin Film Processing Polymer Other Intermediate Flow Cells Other All Other Other IntlVac Nanochrome I Evaporator System Thin Film Processing Metal Evaporation IntlVac Nanochrome I Sputter System Thin Film Processing Metal Sputter Inverted Microscope Imaging All Imaging Optical inVia Raman/PL Microscope Metrology/Characterization Thin Film Spectroscopy Ion assist E-beam Evaporator Thin Film Processing Dielectric Evaporation Ion Beam Etcher Etching Dry Ion Mill Ion Chromatograph Metrology/Characterization Chemical Analysis Chromatography Ion Mill Imaging All Imaging Sample Prep Ion Mill Etching Dry Ion Mill Ion Mill Imaging All Imaging Sample Prep Ion miller Etching Dry Ion Mill Ion Polisher Imaging All Imaging Sample Prep IoN Wave 10 Plasma Asher Cleaning All Cleaning Plasma/Stripper ION-TOF Metrology/Characterization Chemical Analysis Mass Spec IONTOF Time-of-Flight SIMS Metrology/Characterization Thin Film SIMS IPCE Metrology/Characterization Structure or Device Other IPE Plasma enhanced chemical vapor deposition system Thin Film Processing Dielectric PECVD IPG Photonics IX-255 Patterning All Patterning Laser IPG Photonics IX200F Patterning All Patterning Laser IR Image Furnace Thin Film Processing Dielectric Other Isomet Imaging All Imaging Sample Prep ITC Biological All Biological Other J.A. Woollam M-2000D Spectroscopic Ellipsometer Metrology/Characterization Thin Film Thickness J.A. Woollam M-2000D Spectroscopic Ellipsometer Metrology/Characterization Structure or Device Optical J.A. Woollam M2000 Spectroscopic Ellipsometer Metrology/Characterization Thin Film Thickness J.A. Woollam V VASE Spectroscopic Ellipsometer Metrology/Characterization Structure or Device Optical Jandel 4-point probe Metrology/Characterization Structure or Device Electrical Jandel 4-point probe RM3000 Metrology/Characterization Structure or Device Electrical Jandel Four Point Probe with RM3000 Test Unit Metrology/Characterization Structure or Device Electrical Jasco UV/Vis/IR Spectrometer Metrology/Characterization Thin Film Spectroscopy JBA 1000 DUV Resist Cure Lamp Lithography All Lithography Resist Processing Jelight UVO-Cleaner UV Cleaning Machine Cleaning All Cleaning Spin Rinse Drying JEOL 100 CX-II TEM Imaging All Imaging TEM JEOL 2010 FED – TEM/STEM Imaging All Imaging TEM JEOL 2100 Imaging All Imaging TEM JEOL 2100 TEM Imaging All Imaging TEM JEOL 2100F S/TEM Imaging All Imaging TEM JEOL 6300 Lithography All Lithography EBL JEOL 7500F HRSEM Imaging All Imaging SEM JEOL 9500 Lithography All Lithography EBL JEOL ARM 200F STEM Imaging All Imaging TEM JEOL Cross Section Polisher Imaging All Imaging Sample Prep JEOL e-beam lithography Lithography All Lithography EBL JEOL Electron Beam Lithography Lithography All Lithography EBL JEOL F200 TEM Imaging All Imaging TEM JEOL JEM 7900-FLV Imaging All Imaging SEM JEOL JEM1230 TEM Imaging All Imaging TEM JEOL JEM2010 Imaging All Imaging TEM JEOL JSM-7000F Lithography All Lithography EBL JEOL JSM-7400F Field Emission Scanning Electron Microscope Imaging All Imaging SEM JEOL NeoARM 200CF TEM Imaging All Imaging TEM JEOL Scanning Electron Microscope SEM Imaging All Imaging SEM JEOL-SEM Imaging All Imaging SEM JetFirst RTP Thin Film Processing Dielectric RTA/RTP JetLabII Ink-jet Printer Patterning All Patterning Inkjet JXA-8530F Electron Probe Microanalyzer (EPMA) Metrology/Characterization Chemical Analysis Spectroscopy K&S 1472 Wire Bonder 1 Packaging All Packaging Bonding K&S 1472 Wire Bonder 2 Packaging All Packaging Bonding K&S 4124 Wire Bonder Packaging All Packaging Bonding K&S 4522 Ball Bonder Packaging All Packaging Bonding K&S 4523 Ball Wire Bonder Packaging All Packaging Bonding K&S 4523A Wedge Wire Bonder Packaging All Packaging Bonding K&S 4523AD Wire Bonder Packaging All Packaging Bonding Karl Suss MA 6 Mask Aligner Lithography All Lithography UV Karl Suss MA-6 Contact Aligner 1&2 Lithography All Lithography UV Karl Suss MA-6 Mask Aligner – Pettit Lithography All Lithography UV Karl Suss MA6 — Instructional Center Lithography All Lithography UV Karl Suss MA6 Mask Aligner Lithography All Lithography UV Karl Suss MJB-3 Aligners Lithography All Lithography UV Karl Suss MJB3 Mask Aligner Lithography All Lithography UV Karl Suss probe Metrology/Characterization Structure or Device Electrical Karl Suss RC8 Spinner (Marcus) Lithography All Lithography Resist Processing Karl Suss RC8 Spinner (Pettit) Lithography All Lithography Resist Processing Karl Suss SB6 Bonder Packaging All Packaging Bonding Karl Suss SB8E Bonder Packaging All Packaging Bonding Karl Suss TSA MA-6 Mask Aligner Lithography All Lithography UV Keithley 2602A Dual Channel Source Meter Metrology/Characterization Structure or Device Electrical Keithley 3600 Metrology/Characterization Structure or Device Electrical Keithley SCS Metrology/Characterization Structure or Device Electrical Key High Thermal Evaporator Thin Film Processing Metal Evaporation Keyence Metrology/Characterization Structure or Device Optical Keyence Imaging All Imaging Optical Keyence microscope Imaging All Imaging Other Keyence VHX-600 Digital Microscope Imaging All Imaging Optical Keyence VHX1000 Imaging All Imaging Optical Keyence VK-X series 3D Laser Scanning Confocal Microscope Metrology/Characterization Thin Film Other Keysight 5600 LS AFM Imaging All Imaging Probe Keysight B1500A Semiconductor Device Analyzer Metrology/Characterization Structure or Device Electrical Kinetic Laser Metrology/Characterization Chemical Analysis Other KJL Evaporator Thin Film Processing All Thin Film Processing Evaporation KJL_south cleanroom Thin Film Processing Metal Sputter KLA 2D Profilometer (MET-01) Metrology/Characterization Structure or Device Profilometry KLA 3D Profilometer (MET-02) Metrology/Characterization Structure or Device Profilometry KLA Tencor Surfscan 6100 Metrology/Characterization Structure or Device Optical KLA-Tencor P-10 Profilometer Metrology/Characterization Structure or Device Profilometry KLA-Tencor P-16 Stylus Profilometer Metrology/Characterization Structure or Device Profilometry KLA-Tencor P-7 Stylus Profilometer Metrology/Characterization Structure or Device Profilometry KLA-Tencor P-7 Surface Profilometer Metrology/Characterization Structure or Device Profilometry Knife Maker Imaging All Imaging Sample Prep Kobelco Photocurrent Measurement System Metrology/Characterization Structure or Device Electrical KOH baths for wafer Polishing and Texturing Etching Wet Wet Bench KOH Hood and Bath Etching Wet Wet Bench Kratos Metrology/Characterization Thin Film XPS Kratos Axis Ultra Metrology/Characterization Thin Film XPS Kratos Axis Ultra Metrology/Characterization Thin Film SIMS Kratos XPS Metrology/Characterization Thin Film XPS Kruss Tensiometer Metrology/Characterization Thin Film Contact Angle KS Ball Bonder Packaging All Packaging Bonding KSV Langmuir-Blodgett Assembly and Deposition Trough Kulicke 4523 Wire Bonder Packaging All Packaging Bonding Kurt J. Lesker PVD E-beam Evaporator Thin Film Processing Metal Evaporation Kurt Lesker Electron Beam Evaporation System Thin Film Processing Metal Evaporation Labconco FreeZone 6 Lyophilizer Biological All Biological Sample Prep Labram HR Evolution Raman Spectrometer Metrology/Characterization Thin Film Spectroscopy LabSpin8 Spin Coater Lithography All Lithography Resist Processing Lake Shore 8400 Series Hall Effect Measurement System Metrology/Characterization Structure or Device Electrical Lakeshore 1.5K Probe Station Metrology/Characterization Structure or Device Electrical Lakeshore probe station Imaging All Imaging Probe Lam IPEC 472 CMP Packaging All Packaging CMP Lam OnTrak DSS200 Series II Brush Cleaner Cleaning All Cleaning Other Lam Rainbow 4400 RIE Etching Dry RIE Lam Research TCP 9400 Poly Etcher Etching Dry ICP Laminator Packaging All Packaging Other Large Sonicator Cleaning All Cleaning Other Laser Ablation Patterning All Patterning Laser Laser Capture Microdissection (LCM) Imaging All Imaging Other Laser Cutter Patterning All Patterning Laser Laser Cutting System Patterning All Patterning Laser Laser Desorption Analysis Other All Other Other Laser Diffraction Particle Size Analyzer Particle All Particle Size Laser Flash Apparatus (LFA) Laser Microscope Imaging All Imaging Confocal Laser Scanning Microscope Imaging All Imaging Optical Laser Writer Lithography All Lithography UV Lasercutter Lithography All Lithography UV Laurell Develop-Etch Etching Wet Wet Bench Laurell Manual Resist Spinner Thin Film Processing Polymer Spin Coating Laurell Spin Processor with Wet Station Thin Film Processing Polymer Spin Coating Laurell Spinner Thin Film Processing Polymer Spin Coating Laurell Spinner Thin Film Processing Polymer Spin Coating Layout BEAMER/LAB software Lithography All Lithography Other LB Trough: Biolin Scientific KSV 5000 Biological All Biological Other LC-TOF MS Metrology/Characterization Chemical Analysis Mass Spec LEAP 5000 XS Metrology/Characterization Chemical Analysis Other LED Measurement System and Integrating Sphere Metrology/Characterization Structure or Device Optical Leica CM1800 Biological All Biological Sample Prep Leica Critical Point Dryer Cleaning All Cleaning Critical Point Drying Leica EM ACE200 Sample Coater Imaging All Imaging Sample Prep Leica Microtome Imaging All Imaging Sample Prep Leica UC7/FC7 Ultramicrotome Biological All Biological Sample Prep Leitz ergolux Imaging All Imaging Optical Leitz Ergolux Microscope Imaging All Imaging Optical Leitz MVP-SP Interferometer Metrology/Characterization Thin Film Other LEO (Zeiss) 1550 Field Emission SEM Imaging All Imaging SEM Leo 1525 Imaging All Imaging SEM LEO 1530 FE-SEM Imaging All Imaging SEM LEO 1530 SEM Imaging All Imaging SEM LEO 1530 SEM Metrology/Characterization Thin Film EDS/WDS Lesker E-beam Evaporator – Soft-Lithography Thin Film Processing Metal Evaporation Lesker Nano 36 (PVD01) Thin Film Processing Metal Evaporation Lesker PVD 75 (PVD-03) Thin Film Processing Metal Sputter Lesker PVD 75 (PVD-04) Thin Film Processing Metal Evaporation Lesker PVD 75 Evaporator Thin Film Processing Metal Evaporation Lesker PVD 75 Sputterer Thin Film Processing Metal Sputter Lesker PVD75 #1 Sputter Deposition Thin Film Processing Metal Sputter Lesker PVD75 #2 ZnO Sputter deposition Thin Film Processing Metal Sputter Lesker PVD75 #3 E-beam evaporator Thin Film Processing Metal Evaporation Lesker PVD75 #4 E-beam evaporator Thin Film Processing Metal Evaporation Lesker PVD75 #5 Sputter Tool Thin Film Processing Metal Sputter Lesker PVD75 #5 Sputter Tool Thin Film Processing Dielectric Sputter Lesker Sputter Thin Film Processing Metal Evaporation LFE Barrel Etcher-Soft Lithography Cleaning All Cleaning Plasma/Stripper Lindberg 55322 Lindberg Furnace Thin Film Processing Dielectric Annealing Lindberg Furnace 1 (CMOS Sintering Tube) Thin Film Processing Polymer Other Lindberg Furnace 2 (Polymer Curing Tube) Thin Film Processing Polymer Other Lindberg Furnace 3 (Oxidation Tube) Thin Film Processing Dielectric Other Lindberg Furnace 4 (Polymer Curing Tube) Thin Film Processing Polymer Other Lindburg Blue M Ovens Thin Film Processing Dielectric Annealing Linkam THMS600 Thermal Stage Metrology/Characterization Chemical Analysis Spectroscopy Liquid He CryoTEM Imaging All Imaging TEM Lithography Solvent Bench Cleaning All Cleaning Wet Bench Live Cell Single Molecule Fluorescence Microscope Other All Other Other Lock-in Thermography Imaging All Imaging Other Logitech CMP Packaging All Packaging CMP Logitech LP50 Lapper Packaging All Packaging Other Logitech PM5 Polisher 1 Packaging All Packaging Other Logitech SS Bonder Packaging All Packaging Bonding Low angle Ion Milling and Polishing System Imaging All Imaging Sample Prep Low Temperature Photoelectron Spectroscopy Metrology/Characterization Chemical Analysis Spectroscopy Low Temperature UHV STM/AFM Imaging All Imaging Probe Low-speed Diamond Saw Imaging All Imaging Sample Prep LPCVD Thin Film Processing Dielectric Oxidation LPCVD BPSG Thin Film Processing Dielectric CVD LPCVD CMOS N+ Polysilicon – Bank D-3 Thin Film Processing Dielectric CVD LPCVD CMOS Nitride – Bank E-4 Thin Film Processing Dielectric CVD LPCVD Low Temperature Oxide (LTO) – Bank B-3 Thin Film Processing Dielectric CVD LPCVD MRL furnaces Thin Film Processing Dielectric CVD LPCVD N+/P+ Polysilicon – Bank C-4 Thin Film Processing Dielectric CVD LPCVD Nitride – B4 Thin Film Processing Dielectric CVD LPCVD P+polysilicon CVD- Bank D-4 Thin Film Processing Dielectric CVD LPCVD TEOS Oxide- Bank C-3 Thin Film Processing Dielectric CVD LPCVD Undoped Polysilicon – Bank E-3 Thin Film Processing Dielectric CVD LR Tech Walk-in Oven LSD-100 Scriber/Cleaver Packaging All Packaging Other Lucas Labs 4PP Metrology/Characterization Structure or Device Electrical Magnetron Sputtering Coating Thin Film Processing Metal Sputter MakerBot Replicator 3D Printer Patterning All Patterning 3D Printing MALDI-TOF MS Metrology/Characterization Chemical Analysis Mass Spec Malvern Nano ZS Zetasizer Particle All Particle Zeta Potential Malvern NanoSight LM10 Particle All Particle Size Malvern NS300 NanoSight Particle All Particle Zeta Potential Malvern Zetasizer Particle All Particle Zeta Potential Malvern Zetasizer Metrology/Characterization Structure or Device Other Malvern Zetasizer NanoZS Particle All Particle Size Malvern Zetasizer ZS Particle All Particle Size Manual Flip Chip Bonder Packaging All Packaging Bonding Manual Probe Station Metrology/Characterization Structure or Device Electrical Manual Spin Coater Thin Film Processing Polymer Spin Coating Manual Wire Bonder Packaging All Packaging Bonding March 1703 Etching Dry RIE March Asher Etching Dry Other Mask Aligner Lithography All Lithography UV Mask Aligner Lithography All Lithography UV Mask Aligner Lithography All Lithography UV Mask Aligner Lithography All Lithography UV Mask Aligner Lithography All Lithography UV Mask Aligner Lithography All Lithography UV Mask Writer 1 Lithography All Lithography Mask Making Mask Writer 2 Lithography All Lithography Mask Making Maskless Aligner Lithography All Lithography Mask Making Mass Spectrometer Metrology/Characterization Chemical Analysis Spectroscopy Mass Spectrometer: 21T FTICR Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Aerosol, time-of-flight, high resolution Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: FT-ICR, 6T (Ion Surface Collisions) Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Inductively Coupled Plasma (ICP-MS), High Resolution (Element XR) Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Ion Mobility Spectrometry, Time of Flight Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Linear Ion Trap Quadrupole (LTQ) Orbitrap MS – for environmental research (nanoDESI) Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Orbitrap Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Proton Transfer Reaction (PTRMS) Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Single Particle (SPLAT II) Metrology/Characterization Chemical Analysis Mass Spec Mass Spectrometer: Time of Flight Secondary Ion (ToF SIMS) – 1997 Metrology/Characterization Chemical Analysis Mass Spec Mass-Selected Ion Deposition System – Electrospray Source Thin Film Processing Polymer Other Materials Microscope Imaging All Imaging Optical Matrix Plasma Asher Etching Dry RIE Matrix Plasma Resist Strip Etching Dry RIE Mechanical Testing, Instron 5565 Metrology/Characterization Structure or Device Other Melt Spinner SC MEMS Spin Rinse Dryer (SRD) Cleaning All Cleaning Spin Rinse Drying MEMS Wet Bench Cleaning All Cleaning Wet Bench Memsstar Orbis Alpha Oxide Etch System Etching Dry Deep Oxide Metal Lift-Off Processing Station Lithography All Lithography Resist Processing Metal Wetbench Etching Wet Wet Bench Metallica Sputter System Thin Film Processing Metal Sputter Metalorganic Vapor Deposition System Thin Film Processing Dielectric CVD MetOne Laser Particle Counter Particle All Particle Size Metricon Metrology/Characterization Thin Film Other Mettler Thermogravimetric Analyzer Metrology/Characterization Chemical Analysis TGA Micro FT-IR Metrology/Characterization Thin Film Spectroscopy Micro Mill Micro-CT Imaging All Imaging Other Micro-hardness Tester Metrology/Characterization Structure or Device Other Micro-Raman spectrometer Metrology/Characterization Chemical Analysis Spectroscopy Micro-Raman Spectrometer Alpha 300 Metrology/Characterization Chemical Analysis Spectroscopy Microbalance Microbeam XRD Metrology/Characterization Thin Film XRD MICROCT1 Imaging All Imaging Other Microdrill Packaging All Packaging Drilling MicroFab Jetlab 4 Ink Printer System Patterning All Patterning Inkjet Microfluidics and Microfabrication Other All Other Other Microfluidics Workstation – Valves Controller Metrology/Characterization Structure or Device Other Microfluidics/PDMS processing setup Lithography All Lithography Soft Lithography Microfuge 18 Micro-centrifuge Biological All Biological Sample Prep Micromist Coater Thin Film Processing Polymer Spray Coating Microscope Imaging All Imaging Optical Microscope 1 Imaging All Imaging Optical Microscope 1 – Instructional Center Imaging All Imaging Optical Microscope 2 Imaging All Imaging Optical Microscope 2 – Instructional Center Imaging All Imaging Optical Microscope 3 Imaging All Imaging Optical Microscope 4 Imaging All Imaging Optical Microscope 4 – IR (infrared) Imaging All Imaging Optical Microscope M1 (Olympus MX61) Imaging All Imaging Optical Microscope M2 (Olympus MX61) Imaging All Imaging Optical Microscope M3 – Soft-lithography Imaging All Imaging Optical Microscope M4 Imaging All Imaging Optical Microscope M5 (Nikon L200) Imaging All Imaging Optical Microscope P1 Imaging All Imaging Optical Microscope P2 Imaging All Imaging Optical Microscope P3 Imaging All Imaging Optical Microscope P4 Imaging All Imaging Optical Microscope P5 Imaging All Imaging Optical Microscope Zeiss Axiotron Imaging All Imaging Optical Microscopes Imaging All Imaging Optical Microspectrophotometer Metrology/Characterization Thin Film Spectroscopy Microtech Laserwriter LW405 Lithography All Lithography Mask Making Microtome RMC MR3 Imaging All Imaging Sample Prep Microtrac S3000 Particle Size Analyzer Particle All Particle Size Microtrac Zetatrac Particle All Particle Zeta Potential Microwave plasma asher Etching Dry Other Microwave induced plasma etcher Etching Dry Other Microwave Processor Biological All Biological Sample Prep Mid-Wave Thermal Imaging System Imaging All Imaging Other Millimeter-Wave Test-Bed Metrology/Characterization Structure or Device Other milling: Intlvac Ion Mill Etching Dry Ion Mill Mini Tystar Tube 1 Thin Film Processing Dielectric Oxidation Mini Tystar Tube 2 Thin Film Processing Dielectric Oxidation Mini Tystar Tube 3 Thin Film Processing Dielectric Oxidation Mini-Brute Furnace Thin Film Processing Dielectric Annealing Minimet Imaging All Imaging Sample Prep Miscellaneous Photoresist Wetbench Cleaning All Cleaning Wet Bench MJB4 Mask Aligner Lithography All Lithography UV ML3 MicroWriter Lithography All Lithography UV MLA150 Lithography All Lithography Mask Making MOCVD Reactor Thin Film Processing Dielectric CVD Modulab Evaporator Thin Film Processing Metal Evaporation Modular Compact Rheometer Metrology/Characterization Structure or Device Other Molding Press Packaging All Packaging Other Molecular Beam Epitaxy Thin Film Processing Dielectric MBE Molecular Beam Epitaxy (MBE) Thin Film Processing Dielectric MBE Molecular Beam Epitaxy, Multi-source Thin Film Processing Dielectric MBE Molecular Beam Kinetics Metrology/Characterization Thin Film Other Molecular Vapor Deposition Thin Film Processing Dielectric CVD MOS Clean Anneal 2 – Bank B-1 Thin Film Processing Metal Annealing MOS Clean Bench & Tanks Cleaning All Cleaning Wet Bench MOS Metal Anneal 3 -Bank C-1 Thin Film Processing Metal Annealing MOS Metal Anneal 4 -Bank C-2 Thin Film Processing Metal Annealing MPMS Squid Metrology/Characterization Chemical Analysis Other MRC 944 Sputtering Tool Thin Film Processing Metal Sputter MRC Reactive Ion Etcher Etching Dry RIE MRL 1414 Diffusion Furnace Thin Film Processing Dielectric Oxidation MRL boron diffusion Thin Film Processing Dielectric Doping MRL Furnace – Tube 3 Thin Film Processing Dielectric Oxidation MRL Furnace – Tube 4 Thin Film Processing Dielectric Annealing MRL furnaces Thin Film Processing Dielectric Annealing MRL Oxidation Thin Film Processing Dielectric Oxidation MSA1 Metrology/Characterization Structure or Device Other MST Molecular Vapor Deposition System Thin Film Processing Dielectric Other MTI 1700 MTOME1 Imaging All Imaging Sample Prep Muffle Furnace Multi-wavelength Scanning Ellipsometer Metrology/Characterization Thin Film Thickness Multimode AFM (Nanoscope) Imaging All Imaging Probe Multiprep Imaging All Imaging Sample Prep MultiPrep Polisher Imaging All Imaging Sample Prep Multiprep Polishers Imaging All Imaging Sample Prep Multiprep Polishers Imaging All Imaging Sample Prep Multiprep Polishers Imaging All Imaging Sample Prep Multipurpose XRD Metrology/Characterization Thin Film XRD MWCNT Synthesis Reactors N4373C 67 GHz Lightwave Component Analyzer Metrology/Characterization Structure or Device Electrical N4906B Serial BERT Metrology/Characterization Structure or Device Electrical N9010A EXA Signal Analyzer, 26 GHz Metrology/Characterization Structure or Device Electrical Nabity Lithography All Lithography EBL Nano Mill Imaging All Imaging Sample Prep Nano-SIMS Metrology/Characterization Chemical Analysis Mass Spec Nano/Microfiber Electrospinning System NANO1 Metrology/Characterization Thin Film Thickness Nanoimprint NX-2500 Patterning All Patterning NIL Nanoimprinter Patterning All Patterning NIL Nanoindenter Metrology/Characterization Thin Film Mechanical Nanoindenter Metrology/Characterization Structure or Device Other Nanoindenter Metrology/Characterization Thin Film Mechanical Nanometrics Metrology/Characterization Thin Film Thickness Nanometrics Nanospec Thin Film Thickness System #2 Metrology/Characterization Thin Film Thickness NanoMill 1040 Imaging All Imaging Sample Prep Nanonex 2600 Nanoimprint Aligner Patterning All Patterning NIL Nanonex 2600 Nanoimprinter Patterning All Patterning NIL Nanonex NX-B200 Nanoimprinter Patterning All Patterning NIL Nanoparticle Tracking Analyzer Particle All Particle Size Nanoscience TraxSTM Imaging All Imaging Probe Nanoscribe Lithography All Lithography UV Nanoscribe 3D Lithography System Lithography All Lithography Other Nanoscribe 3D Lithography System Patterning All Patterning 3D Printing Nanoscribe 3D Lithography System Patterning All Patterning 3D Printing Nanosight300 Particle All Particle Size Nanospec Metrology/Characterization Thin Film Thickness Nanospec 3000 Metrology/Characterization Structure or Device Optical Nanospec Film Thickness Measurement System Metrology/Characterization Thin Film Thickness Nanospec Reflectometer – Inorganic Metrology/Characterization Thin Film Thickness Nanospec Reflectometer – Pettit Metrology/Characterization Thin Film Thickness Nanostrip Tank Cleaning All Cleaning Wet Bench NEC Mini-Tandem 5.1 MeV Ion Accelerator Metrology/Characterization Thin Film Other Negative Resist Hot Plate Tower Lithography All Lithography Resist Processing Negative Resist Oven Lithography All Lithography Resist Processing Negative Resist Spinner Lithography All Lithography Resist Processing Negative Resist Spinner Lithography All Lithography Resist Processing Netzsch STA Metrology/Characterization Chemical Analysis Chromatography NewView 7300 3D Optical Surface Profiler Metrology/Characterization Structure or Device Optical Nexcelom Bioscience Cellometer Vision Trio Cell Profiling System Biological All Biological Other Neytech Furnace Thin Film Processing Metal Other Nickel Electroforming System Other All Other Other Nicolet 6700 FTIR Metrology/Characterization Chemical Analysis Spectroscopy Nicolet iN10 MX FTIR Microscope Imaging All Imaging Optical Nicolet iN10 MX FTIR Microscope Metrology/Characterization Chemical Analysis Spectroscopy Nikon Eclipse E-800 (2 units) Imaging All Imaging Optical Nikon Eclipse L200 Microscope (3) Imaging All Imaging Optical Nikon L200 Eclipse Microscope Imaging All Imaging Optical Nikon LV150 Metrology/Characterization Structure or Device Optical Nikon Microscope Metrology/Characterization Structure or Device Optical Nikon SMZ-1500 Imaging All Imaging Optical Nion UltraSTEM 100 Imaging All Imaging TEM Nitride and Tweezer Cleaning Wetbench Cleaning All Cleaning Wet Bench Novellus Concept II PECVD Thin Film Processing Dielectric PECVD OAI 808 Aligner Lithography All Lithography UV OAI 8808 Mask Aligner w/DUV Lithography All Lithography UV OAI Mask Aligner Lithography All Lithography UV Obducat Nano-imprinter (NIL) Patterning All Patterning NIL ObjetPRO 3D Printer Patterning All Patterning 3D Printing OEM Piezoelectric AlN Depostion Thin Film Processing Dielectric Sputter Oerlikon Sputter Thin Film Processing Metal Sputter Oerlikon Versaline Deep Si Etcher Etching Dry Deep Silicon (Bosch) Olympus Confocal Microscope Imaging All Imaging Confocal Olympus Inspection Microscope Imaging All Imaging Optical Olympus Inspection Microscope Imaging All Imaging Optical Olympus Inspection Microscope Imaging All Imaging Optical Olympus Inspection Microscope Imaging All Imaging Optical Olympus IX-71 Inverted Fluorescence Microscope Imaging All Imaging Optical Olympus LEXT 3D Material Confocal Microscope Imaging All Imaging Confocal Olympus MX-50 Imaging All Imaging Optical Olympus MX50 Microscope Imaging All Imaging Optical Olympus MX61 Microscope – Pettit Imaging All Imaging Optical Olympus polarizing Microscope Imaging All Imaging Optical Omicron VT-STM/AFM Imaging All Imaging Probe Open Architecture High Temperature Production Platform Patterning All Patterning 3D Printing OPT1 Metrology/Characterization Thin Film Spectroscopy OPT2 Metrology/Characterization Chemical Analysis Spectroscopy OPT3 Metrology/Characterization Thin Film Spectroscopy OPTEC Femtosecond Laser Micro-machining System Patterning All Patterning Laser Optical Measuring System Metrology/Characterization Structure or Device Optical Optical Microscope Imaging All Imaging Optical Optical Microscope Imaging All Imaging Sample Prep Optical Microscopes – Other Imaging All Imaging Optical Optical Parametric Amplifier Metrology/Characterization Chemical Analysis Spectroscopy Optical Particle Size and Shape Analyzer Particle All Particle Size Optical Profilometer Metrology/Characterization Structure or Device Profilometry Optical Profilometer Metrology/Characterization Structure or Device Profilometry Optomec BJ300 Patterning All Patterning Inkjet Orion V Thin Film Processing Metal Sputter Orion V Thin Film Processing Metal Sputter Orion VIII Thin Film Processing Metal Sputter Osmium Coater Imaging All Imaging Sample Prep Oven Imaging All Imaging Sample Prep OVEN1 Thin Film Processing Dielectric Annealing OVEN2 Thin Film Processing Dielectric Other OVEN4 Thin Film Processing Dielectric Annealing OVEN5 Thin Film Processing Dielectric Other OVEN6 Thin Film Processing Dielectric Other Oxford 100 Etcher Etching Dry RIE Oxford 80+ RIE II Etching Dry RIE Oxford 81 Etcher Etching Dry RIE Oxford 82 Etcher Etching Dry RIE Oxford ALD FlexAL Thin Film Processing Dielectric ALD Oxford Cobra ICP Etcher Etching Dry RIE Oxford Cryogenic ICP Etching Dry ICP Oxford Dielectric Etcher Etching Dry RIE Oxford End-point RIE Etching Dry RIE Oxford Etcher Etching Dry ICP Oxford ICP Etching Dry ICP Oxford ICP-PECVD Etching Dry ICP Oxford ICP100 Etching Dry ICP Oxford III-V etcher Etching Dry ICP Oxford NPG80 Reactive Ion Etcher Etching Dry RIE Oxford PECVD Thin Film Processing Dielectric PECVD Oxford PECVD Thin Film Processing Dielectric PECVD Oxford Plasma Lab 100 Thin Film Processing Dielectric PECVD Oxford Plasmalab 100 ICP Reactive Ion Etcher Etching Dry RIE Oxford Plasmalab 80 – Chlorine Etching Dry RIE Oxford Plasmalab 80 – Fluorine Etching Dry RIE Oxford PlasmaLab 80+ (DE-04) Etching Dry RIE Oxford PlasmaLab 80+ (Unit 2) Etching Dry RIE Oxford Reactive Ion Etcher RIE Etching Dry RIE Oxidation Diffusion Wetbench Etching Wet Wet Bench P-7 Profilometer Metrology/Characterization Structure or Device Profilometry P10 Profilometer Metrology/Characterization Structure or Device Profilometry P15 Metrology/Characterization Structure or Device Profilometry PAMS_JEOL_Pre-Alignment Lithography All Lithography Other PANalytical Empyrean Metrology/Characterization Thin Film XRD Panalytical Empyrean Metrology/Characterization Thin Film XRD PANalytical Empyrean Linear Detector and Non-ambient Environment Metrology/Characterization Thin Film XRD PANalytical MRD Metrology/Characterization Thin Film XRD Panalytical X’Pert PRO MRD XRD Metrology/Characterization Thin Film XRD Panalytical XPert PRO Alpha-1 XRD Metrology/Characterization Thin Film XRD Panalytical XPert XRD (Line Source) Metrology/Characterization Thin Film XRD Panalytical XPert XRD (Point Source) Metrology/Characterization Thin Film XRD Paralyne Deposition System Thin Film Processing Polymer Other Park NX10 Atomic Force Microscope Imaging All Imaging Probe Particle Size Analyzer Particle All Particle Size PARYL1 Thin Film Processing Dielectric Evaporation Parylene Coater Thin Film Processing Polymer Other Parylene Coater Thin Film Processing Polymer Other Parylene Coater Thin Film Processing Polymer Other Parylene Deposition Thin Film Processing Dielectric CVD Parylene Deposition System Thin Film Processing Polymer Other PDMS Casting Station (PDMS station) Lithography All Lithography Soft Lithography PDMS Process Bench Lithography All Lithography Soft Lithography PDMS Processing Clean Space Lithography All Lithography Soft Lithography PdR Atomic Layer Deposition Thin Film Processing Dielectric ALD PDS 2010 Parylene Coater Thin Film Processing Polymer Other PE-200 Cleaning All Cleaning Plasma/Stripper PE-200 Cleaning All Cleaning Plasma/Stripper PE-50 Cleaning All Cleaning Plasma/Stripper PE100 Cleaning All Cleaning Plasma/Stripper PEALD Thin Film Processing Dielectric ALD PECVD Thin Film Processing Dielectric PECVD PECVD1 Thin Film Processing Dielectric PECVD PECVD1 Thin Film Processing Dielectric PECVD PECVD2 Thin Film Processing Dielectric PECVD PECVD; Diamond Thin Film Processing Dielectric PECVD Peel Tester Metrology/Characterization Thin Film Mechanical Perkin Elmer DMA 8000 Dynamic Mechanical Analyzer Metrology/Characterization Thin Film Mechanical Perkin Elmer DSC 6000 Differential Scanning Calorimeter Metrology/Characterization Chemical Analysis DSC Perkin Elmer Lambda 18 UV vis spectrometer Metrology/Characterization Chemical Analysis Spectroscopy PerkinElmer Spectrum Metrology/Characterization Chemical Analysis Other PESA: Riken AC-2 Photoelectron Spectrometer Metrology/Characterization Thin Film Other Pfeiffer HiCube 80 Turbo Pumping Station Pfeiffer Vacuum ADIXEN ASM 380 Leak Detector PGSTAT Thin Film Processing Dielectric ALD PHI Quantera Scanning XPS Metrology/Characterization Thin Film XPS Philips Vertical Scanning Diffractometer Metrology/Characterization Thin Film XRD Philips X’Expert XRD Metrology/Characterization Thin Film XRD Philips XPERT Theta-Theta Diffractometer Metrology/Characterization Thin Film XRD Phillips EM420 Imaging All Imaging TEM phosphorous diffusion Thin Film Processing Dielectric Doping Phosphorus Disk Doping (Tylan Furnace C3) Thin Film Processing Dielectric Doping Phosphorus Doping – Bank D-2 Thin Film Processing Dielectric Doping Photo Resist Dispensing System Lithography All Lithography Resist Processing Photo Resist Exposing System Lithography All Lithography Resist Processing PHOTO1 Lithography All Lithography UV PHOTO2 Lithography All Lithography UV Photoemission Electron Microscope Imaging All Imaging Other Photolithography Hotplates (Rm 121) Lithography All Lithography Resist Processing Photolithography Spinners (Rm 121) Lithography All Lithography Resist Processing Photolithography Spinners (SU8 etc) Lithography All Lithography Resist Processing Photolithography Wet Benches (Rm 121) Lithography All Lithography Resist Processing Photolithography Wet Benches (Rm 133) Lithography All Lithography Resist Processing Photolithography Wet Benches (SU8 etc) Lithography All Lithography Resist Processing Photomask Aligner Lithography All Lithography UV Photomask Laser Pattern Generator Lithography All Lithography Mask Making Photoresist Developer Station Lithography All Lithography Resist Processing Photoresist Spinner/Thermal Bench Thin Film Processing Polymer Spin Coating Photovoltatic test system Metrology/Characterization Structure or Device Electrical Physical Properties Measurement System (PPMS) Metrology/Characterization Structure or Device Other PI-Oven Lithography All Lithography Resist Processing Pick & Place Packaging All Packaging Other PicoHarp 300 PicoQuant Time-Correlated Single Photon Counting (TCSPC) system Metrology/Characterization Structure or Device Optical Picosecond SFG Metrology/Characterization Chemical Analysis Other PiFM Imaging All Imaging Probe PIPS Imaging All Imaging Sample Prep PLAP1 Etching Wet Other Plas-Mos Ellipsometer Metrology/Characterization Thin Film Thickness Plasma -Therm Diamond RIE Etching Dry ICP Plasma Asher Cleaning All Cleaning Plasma/Stripper Plasma Cleaner Imaging All Imaging Sample Prep Plasma Cleaner Imaging All Imaging Sample Prep Plasma Cleaner Packaging All Packaging Other Plasma Cleaner Imaging All Imaging Sample Prep Plasma Cleaner Cleaning All Cleaning Plasma/Stripper Plasma cleaner Imaging All Imaging Sample Prep Plasma Cleaner Cleaning All Cleaning Plasma/Stripper Plasma Cleaner Cleaning All Cleaning Plasma/Stripper Plasma Cleaner Etching Dry Other Plasma CVD TEOS Oxide Thin Film Processing Dielectric CVD Plasma Enhanced Chemical Vapor Deposition Thin Film Processing Dielectric PECVD Plasma Enhanced Chemical Vapor Deposition (PECVD) Thin Film Processing Dielectric PECVD Plasma Etch PE-100 Plasma ystem Cleaning All Cleaning Plasma/Stripper Plasma Etcher Imaging All Imaging Sample Prep Plasma Lab 80+ PECVD and Etching Etching Dry RIE Plasma Pen Etching Dry Other Plasma Therm ICP Etching Dry ICP Plasma Therm PECVD Thin Film Processing Dielectric PECVD Plasma Therm RIE Etching Dry RIE Plasma Therm SLR RIE Etching Dry RIE Plasma Therm SLR RIE Etching Dry Deep Silicon (Bosch) Plasma Therm Versaline DSE Etching Dry Deep Silicon (Bosch) Plasma Therm Versaline LL ICP Deep Silicon Etcher Etching Dry Deep Silicon (Bosch) Plasma Therm Versaline LL ICP Dielectric Etcher Etching Dry ICP Plasma Therm Versaline LL ICP Metal Etcher Etching Dry ICP Plasma-enhanced Chemical Vapor Deposition System Thin Film Processing Dielectric PECVD Plasma-Etcher Plasma Cleaner Cleaning All Cleaning Plasma/Stripper Plasma-Therm Apex SLR HDPCVD Thin Film Processing Dielectric CVD Plasma-Therm ICP Chlorine Etch Etching Dry ICP Plasma-Therm ICP Fluoride Etch Etching Dry ICP Plasma-Therm Versaline Deep Si RIE Etching Dry Deep Silicon (Bosch) Plasma-Therm Vision 310 PECVD Thin Film Processing Dielectric PECVD Plasmatech CVD Thin Film Processing Dielectric CVD Plasmatherm 790 RIE Etching Dry RIE PlasmaTherm Apex ICP Etching Dry ICP Plasmatherm AV Etcher-Keller Etching Dry RIE PlasmaTherm Shuttlecock PECVD System Thin Film Processing Dielectric PECVD PlasmaTherm SLR ICP Etch Etching Dry ICP PlasmaTherm Versaline HDP VCD System Thin Film Processing Dielectric PECVD Plassys Electron Beam Evaporator Thin Film Processing Metal Evaporation Plating Station 1-4 Thin Film Processing Metal Plating PLD Thin Film Processing Dielectric Other Plunge-Freezer (1) Biological All Biological Sample Prep Plunge-Freezer (2) Biological All Biological Sample Prep POCL3 Doping – Furnace A2 Thin Film Processing Dielectric Oxidation POCL3 MRL furnaces Thin Film Processing Dielectric Doping Polarized LM: Nikon LV100 Imaging All Imaging Optical Polaron Thin Film Processing Metal Evaporation Polisher Imaging All Imaging Sample Prep Polisher Grinder Imaging All Imaging Sample Prep Polyimide Curing Oven Thin Film Processing Polymer Other Pore Scale Micromodels Other All Other Other Positive Resist Hot Plate Tower Lithography All Lithography Resist Processing Positive Resist Oven Lithography All Lithography Resist Processing Positive Resist Spinner Lithography All Lithography Resist Processing Positive Resist Spinner Lithography All Lithography Resist Processing Positive/Negative Photoresist Station Lithography All Lithography Resist Processing Potentiostat Metrology/Characterization Structure or Device Electrical Potentiostat Metrology/Characterization Structure or Device Electrical Potentiostat Metrology/Characterization Structure or Device Electrical Potentiostat Metrology/Characterization Structure or Device Electrical Potentiostat Metrology/Characterization Structure or Device Electrical Powder X-Ray Diffractomer Metrology/Characterization Thin Film XRD Powder XRD Metrology/Characterization Thin Film XRD Precision CNC Dicing / Cutting Saw Packaging All Packaging Dicing Press Packaging All Packaging Other Primaxx Vapor HF Etcher Etching Dry Other Princeton Instruments Tri-Vista spectrometer with SI and InGaAs array detectors Metrology/Characterization Chemical Analysis Spectroscopy Princeton VeraSTAT4 Potentiostat/Galvanostat Metrology/Characterization Structure or Device Other PRINT3D Patterning All Patterning 3D Printing Probe Station Metrology/Characterization Structure or Device Electrical Probe Station Metrology/Characterization Structure or Device Electrical probe station Metrology/Characterization Structure or Device Electrical Probe Station Metrology/Characterization Structure or Device Electrical Probe station and Electronics Rack Metrology/Characterization Structure or Device Electrical Probe Station I: I-V & C-V Testing Metrology/Characterization Structure or Device Electrical PROBE2 Metrology/Characterization Structure or Device Electrical PROF2 Metrology/Characterization Structure or Device Profilometry Profilm3D Optical Profiler Metrology/Characterization Structure or Device Optical Profilometer Metrology/Characterization Structure or Device Profilometry Profilometer Metrology/Characterization Structure or Device Profilometry Profilometer: Bruker Dektak 150 Metrology/Characterization Structure or Device Profilometry Prometrix Resistivity Mapping System Metrology/Characterization Structure or Device Electrical PT72 Etcher Etching Dry RIE PT720 Etcher Etching Dry RIE PT740 Etcher Etching Dry RIE PT770 Etcher – Left Side (Metal Etch) Etching Dry ICP PT770 Etcher – Right Side (III-V) Etching Dry ICP Pulsed Laser Deposition Thin Film Processing Dielectric Other Pulsed Laser Deposition System Thin Film Processing Dielectric Other Pulsed-CVD Thin Film Processing Metal Other Pulsed/CW X-Band (9.5 GHz) EPR Metrology/Characterization Structure or Device Other PVA Tepla Ion 10 Cleaning All Cleaning Plasma/Stripper PVD 75 Sputter Deposition Thin Film Processing Metal Sputter PVD E-Beam Deposition System Thin Film Processing Metal Evaporation PVD Filament Evaporator (Instructional Lab) Thin Film Processing Metal Evaporation PVD Products PLD/MBE 2300 Thin Film Processing Dielectric Other PVD Products PLD/MBE 2300 Thin Film Processing Metal Other PVD75 Filament Evaporator Thin Film Processing Metal Evaporation PVD75 RF Sputterer Thin Film Processing Dielectric Sputter Q-sense QCM-D Biological All Biological QCM Q-Switched Nd:YLF Laser Metrology/Characterization Chemical Analysis Spectroscopy Q600 TGA/DSC Metrology/Characterization Chemical Analysis TGA QCM: Biolin Q-Sense Quartz Crystal Microbalance Biological All Biological QCM QCMD Biological All Biological QCM qNano Particle All Particle Size qNano Particle All Particle Concentration Quanta 200 Environmental SEM Imaging All Imaging SEM Quanta 250 Imaging All Imaging SEM Quanta 600 FEG ESEM Imaging All Imaging SEM Quantachrome AS-1 BET Particle All Particle Other Quantum Design PPMS 9 T Metrology/Characterization Structure or Device Other Quantum Design PPMS 9 Tesla with EverCool-II Metrology/Characterization Structure or Device Other Quantum Designs MPMS 7 Tesla with EverCool-II Metrology/Characterization Structure or Device Other Quantum Efficiency measurement tool Metrology/Characterization Structure or Device Optical Quartz Crystal Microbalance with Dissapation (QCM-D) Metrology/Characterization Structure or Device Other Questar Q7800 Automatic Wedge Bonder Packaging All Packaging Bonding Quick Circuit 7000 PCB Milling Machine Packaging All Packaging Other QuickLaze Laser Trimmer Other All Other Other Quorum Q-150T ES Imaging All Imaging Sample Prep R Stand Metrology/Characterization Structure or Device Electrical Radiological AFM Imaging All Imaging Probe Radiological FIB/SEM (Quanta) Imaging All Imaging SEM Radiological Powder XRD Metrology/Characterization Thin Film XRD Radiological XPS Imaging All Imaging Other Raith 150 Electron Beam Lithography System Lithography All Lithography EBL RAITH 150 TWO E-BEAM WRITER Lithography All Lithography EBL Raith E-line Lithography All Lithography EBL Raith EBPG5000 Plus E-Beam Writer Lithography All Lithography EBL Raith Pattern generator Lithography All Lithography EBL Raith Voyager 50kV/10kV Lithography All Lithography EBL Raith-150 E-Beam Lithography All Lithography EBL Raman Microscope Metrology/Characterization Thin Film Spectroscopy Rame Hart 260-F4 Goniometer/Tensiometer Metrology/Characterization Thin Film Contact Angle Rame-Hart 500 Contact Angle Goniometer Metrology/Characterization Thin Film Contact Angle Rapid Thermal Annealer Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealer Thin Film Processing Metal RTA/RTP Rapid Thermal Annealer Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealer Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealer Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealer Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealer Thin Film Processing Metal Other Rapid Thermal Annealer 1 Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealer 2 Thin Film Processing Dielectric RTA/RTP Rapid Thermal Annealing System Thin Film Processing Dielectric RTA/RTP Rapid Thermal Processing (RTP) Thin Film Processing Dielectric RTA/RTP Rapid Thermal Processing System Thin Film Processing Dielectric RTA/RTP Rapid Thermal Processor Thin Film Processing Dielectric RTA/RTP Rapid Thermal Processor Thin Film Processing Dielectric RTA/RTP RCA Clean Wet Process Station Cleaning All Cleaning Wet Bench RCA Cleaning Wet Bench Cleaning All Cleaning Wet Bench Reactive Ion Etcher Etching Dry RIE Reactive Ion Etcher (RIE) Samco RIE-10NR Etching Dry RIE Real-Time PCR Detection System Biological All Biological Other RECO1 RECO2 Reflectance mapping system Metrology/Characterization Thin Film Thickness Reflectometer Metrology/Characterization Thin Film Thickness Reflow Oven Packaging All Packaging Other Renishaw inVia confocal Raman microscope Metrology/Characterization Chemical Analysis Spectroscopy Renishaw inVia Confocal Raman Microscope (UV-IR) Imaging All Imaging Confocal Renishaw inVia Confocal Raman Microscope (UV-IR) Metrology/Characterization Chemical Analysis Spectroscopy Renishaw Qontor Confocal Raman Microscope (Vis/Near IR) Imaging All Imaging Confocal Renishaw Qontor Confocal Raman Microscope (Vis/Near IR) Metrology/Characterization Chemical Analysis Spectroscopy Resist Clean Wetbench Cleaning All Cleaning Wet Bench Resist Hot Strip Bath Lithography All Lithography Resist Processing Resonetics IR laser Patterning All Patterning Laser Reynolds Tech E-Beam Resist Spin & Develop Bench Lithography All Lithography Resist Processing Reynolds Tech Negative Photoresist Develop Bench Lithography All Lithography Resist Processing Reynolds Tech Negative Photoresist Spinner Bench Lithography All Lithography Resist Processing Reynolds Tech Positive Photoresist Develop Bench Lithography All Lithography Resist Processing Reynolds Tech Positive Photoresist Spinner Bench Lithography All Lithography Resist Processing RF-PECVD Thin Film Processing Dielectric CVD RF/DC Sputter deposition Thin Film Processing Metal Sputter RGA Series 200 AMU Residual Gas Analyzer Metrology/Characterization Chemical Analysis Other Rheometer: TA Instrument ARES-G2 Metrology/Characterization Chemical Analysis Other Rheosense m-VROC Viscometer Metrology/Characterization Chemical Analysis Other RIE Etching Dry RIE RIE etching system Etching Dry RIE RIE1 Etching Dry RIE RIE2 Etching Dry RIE RIE3 Etching Dry Deep Silicon (Bosch) RIE: Oxford PlasmaPro 80 Etching Dry RIE Rigaku ATXG Metrology/Characterization Thin Film XRD Rigaku D / Max -B Metrology/Characterization Thin Film XRD Rigaku Gemini A Single Crystal Diffractometer Metrology/Characterization Thin Film XRD Rigaku Laue/Precession Metrology/Characterization Thin Film XRD Rigaku Multiflex Metrology/Characterization Thin Film XRD Rigaku SmartLab Metrology/Characterization Thin Film XRD Rigaku Smartlab Metrology/Characterization Thin Film XRD Rigaku Smartlab Step2 3kW Metrology/Characterization Thin Film XRD Rigaku Smartlab Step2 9kW Metrology/Characterization Thin Film XRD Rigaku SmartLab X-Ray Diffractometer Metrology/Characterization Thin Film XRD Rigaku Smartlab XE 9kW Metrology/Characterization Thin Film XRD Rigaku Smartlab XRD Metrology/Characterization Thin Film XRD Rigaku Smax3000 Metrology/Characterization Thin Film XRD Rigaku Ultima IV Metrology/Characterization Thin Film XRD Rigaku Ultima IV Metrology/Characterization Thin Film XRD Rikagu Metrology/Characterization Thin Film XRD Roll-to-Roll Coater Thin Film Processing Polymer Other Rotating Disc Electrode Metrology/Characterization Chemical Analysis Other RTA – AG610a Thin Film Processing Dielectric RTA/RTP RTA – AG610b Thin Film Processing Dielectric RTA/RTP RTA-Clean Thin Film Processing Dielectric RTA/RTP RTA-Metals Thin Film Processing Dielectric RTA/RTP RTA1 Thin Film Processing Dielectric RTA/RTP Rudolph Auto EL Ellipsometer Metrology/Characterization Thin Film Thickness S-Probe Metrology/Characterization Thin Film XPS Samco UV & Ozone Stripper Etching Dry RIE Samco UV Ozone Dry Stripper Cleaning All Cleaning Stripper SAMCO UV-1 UV/Ozone Etching Dry Other Sandvik/MRL Thin Film Processing Dielectric Annealing Sandvik/MRL Thin Film Processing Dielectric Annealing Sandvik/MRL Thin Film Processing Dielectric Annealing Sandvik/MRL Thin Film Processing Dielectric Annealing Santa Clara Stainless Steel Wet Bench Cleaning All Cleaning Wet Bench Savanah ALD Thin Film Processing Dielectric ALD Savannah Atomic Layer Deposition Thin Film Processing Dielectric Sputter Savannah Atomic Layer Deposition System Thin Film Processing Dielectric ALD Savannah/Plasma Cleaner in Glovebox System Thin Film Processing Dielectric ALD SAW3 Packaging All Packaging Dicing SAXS1 Metrology/Characterization Thin Film Other SAXS2 Metrology/Characterization Thin Film Other SB1 Packaging All Packaging Dicing SC4500 Even-Hour Evaporator Thin Film Processing Metal Evaporation SC4500 Odd-Hour Evaporator Thin Film Processing Metal Evaporation Scanning Auger Electron Microprobe Metrology/Characterization Thin Film Other Scanning confocal Raman spectrometer with atomic force microscope / near-field scanning optical microscope Metrology/Characterization Chemical Analysis Spectroscopy Scanning Electron Microscope Imaging All Imaging SEM Scanning electron Microscope Imaging All Imaging SEM Scanning electron Microscope Imaging All Imaging SEM Scanning Electron Microscope Imaging All Imaging SEM Scanning Electron Microscope with EDS Imaging All Imaging SEM Scanning Ellipsometer Metrology/Characterization Thin Film Thickness Scanning Kelvin Probe: SKP5050 Imaging All Imaging Probe Scanning Probe AFM Compound Microscope Imaging All Imaging Probe Scanning TEM Imaging All Imaging TEM Scanning Tunneling Microscope Metrology/Characterization Structure or Device Profilometry Scattering IR SNOM Imaging All Imaging Other Schmid APCVD Thin Film Processing Dielectric CVD Schott IR Inspector Imaging All Imaging Optical Sciex Qtrap 6500 Metrology/Characterization Chemical Analysis Mass Spec Scintag X1 Theta-Theta Diffractometer Metrology/Characterization Thin Film XRD Scintag XDS2000 Metrology/Characterization Thin Film XRD SCOPE1 Imaging All Imaging Optical SCOPE3 Imaging All Imaging Optical SCOPE4 Imaging All Imaging Optical SCOPE7 Imaging All Imaging Optical Screen Printer Packaging All Packaging Other Screen Printer Packaging All Packaging Other Screen Printers Thin Film Processing Metal Annealing SCS G3P8 -Soft-lithography Lithography All Lithography Soft Lithography SCS G3P8 Spin Coater — Instructional Center Thin Film Processing Polymer Spin Coating SCS G3P8 Spin Coater 1 (small pieces) Thin Film Processing Polymer Spin Coating SCS G3P8 Spin Coater 2 – Pettit Thin Film Processing Polymer Spin Coating SCS G3P8 Spin Coater 3 – Inorganic Thin Film Processing Polymer Spin Coating SCS Parylene Coater Thin Film Processing Polymer Other SCS Spin Coater Lithography All Lithography Resist Processing SCS Spin Coater Thin Film Processing Polymer Spin Coating SEM Imaging All Imaging SEM SEM Imaging All Imaging SEM SEM Imaging All Imaging SEM SEM Sputterer Imaging All Imaging Sample Prep SEM/FIB with Zyvex S100 Imaging All Imaging SEM SEM/STEM Imaging All Imaging TEM SEM1 Imaging All Imaging SEM SEM2 Imaging All Imaging SEM SEM3 Imaging All Imaging SEM SEM4 Imaging All Imaging SEM SEM: FEI Magellan Imaging All Imaging SEM SEMCON electroplating Thin Film Processing Metal Plating Semi-Automated Die Bonder Packaging All Packaging Other Semi-Automatic Probe Station Metrology/Characterization Structure or Device Other Semi-Automatic Wire Bonder Packaging All Packaging Bonding Semiautomatic Screen Printer Lithography All Lithography Other Semiconductor Characterization System Metrology/Characterization Structure or Device Electrical Semiconductor Parameter Analyzer #1-#2 Metrology/Characterization Structure or Device Electrical SemiTest SCA-2500 Surface Charge Analyzer Metrology/Characterization Thin Film Other Semitool Spin Rinse Dryer — Instructional Center Cleaning All Cleaning Spin Rinse Drying Semprex Spectrometer – Instructional Center Metrology/Characterization Thin Film Spectroscopy Sensofar S-neox, non contact 3D optical profiling Metrology/Characterization Structure or Device Profilometry Sequencing, Next Generation, High Throughput – Ion S5 Other All Other Other SFIL IMPRIO100 Lithography All Lithography Other Sharon E-Beam Evaporator Thin Film Processing Metal Evaporation Sharon Thermal Evaporator TE-3 Thin Film Processing Metal Evaporation Sharon Thermal Evaporator TE-4 Thin Film Processing Metal Evaporation Sharon Thermal Evaporator TE-5 Thin Film Processing Metal Evaporation Shielded Antenna Chamber Metrology/Characterization Structure or Device Other Shimadzu Prominence HPLC Metrology/Characterization Chemical Analysis Chromatography Shimadzu Prominence HPLC Metrology/Characterization Chemical Analysis Chromatography Siemens Magnetom Trio MRI 3T Scanner Metrology/Characterization Chemical Analysis Other Signatone Checkmate CM-21X Probe Station Metrology/Characterization Structure or Device Electrical Signatone Four-point Probe Metrology/Characterization Structure or Device Electrical Signatone Probe Station Metrology/Characterization Structure or Device Electrical Signatone Probe Station Metrology/Characterization Structure or Device Electrical Silicon Dioxide LPCVD System Thin Film Processing Dielectric CVD Silicon Nitride LPCVD System Thin Film Processing Dielectric CVD SIM – Structured Illumination Super Resolution Fluorescence Microscope Imaging All Imaging Other SIMS Metrology/Characterization Thin Film SIMS SIMS: Cameca IMS 7f GEO Metrology/Characterization Thin Film SIMS SIMS: Cameca NanoSIMS 50l Metrology/Characterization Thin Film SIMS Simultaneous Thermal Analyzers Metrology/Characterization Chemical Analysis TGA Sine-wave Vibro Viscometer Metrology/Characterization Chemical Analysis Other Singe Oven Thin Film Processing Polymer Other Single-Molecule Fluorescence Microscope Imaging All Imaging Other Sinton Lifetime Tester Metrology/Characterization Structure or Device Optical Sioutas impactors Particle All Particle Size Small Angle X-Ray Scattering (SAXS) Metrology/Characterization Thin Film XRD Small Angle/Wide Angle X-Ray Scattering (SAXS) Metrology/Characterization Thin Film XRD Smart Zoom Imaging All Imaging Optical SMI MOCVD System Thin Film Processing Dielectric Other Soft Lithography Hot Plate Tower Lithography All Lithography Resist Processing Solar Cell Testing Glovebox Metrology/Characterization Structure or Device Electrical Solar Simulator Metrology/Characterization Structure or Device Other Solar Simulator Metrology/Characterization Structure or Device Other Solaris 150 RTP Rapid Thermal Annealer Etching Dry Other Solvent Based Photoresist Developer Station Lithography All Lithography Resist Processing Solvent Benches Etching Wet Wet Bench Solvent Fumehood Left Cleaning All Cleaning Wet Bench Solvent Fumehood Right Cleaning All Cleaning Wet Bench Solvent Process Bench Cleaning All Cleaning Wet Bench Solvent Processing Station Cleaning All Cleaning Wet Bench Solvent Wetbench Etching Wet Wet Bench Solvent/Headway Spinner Bench Lithography All Lithography Resist Processing Solvents Wet Bench Cleaning All Cleaning Wet Bench Solvents Wet Bench (Photolithography Bay) Cleaning All Cleaning Wet Bench SOLVHOOD1 Etching Wet Wet Bench SOLVHOOD2 Etching Wet Wet Bench SOLVHOOD3 Etching Wet Wet Bench Sonoscan C-Mode Scanning Acoustic Microscope Imaging All Imaging Other South Bay RIE Etching Dry RIE South KJL Thin Film Processing Metal Sputter Southbay PC2000 Plasma Cleaner Imaging All Imaging Sample Prep Spark Plasma Sintering Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy Spectroscopic Ellipsometer Metrology/Characterization Thin Film Thickness Spectroscopic Ellipsometer Metrology/Characterization Thin Film Thickness Spectroscopy: Agilent Cary 6000i UV/Vis/NIR Metrology/Characterization Chemical Analysis Spectroscopy Spectroscopy: Horiba FluoroLog Fluorimeter Metrology/Characterization Chemical Analysis Other Spectroscopy: Horiba XploRA+ Confocal Raman Imaging All Imaging Confocal Spectroscopy: Nicolet iS50 FT/IR Spectrometer Metrology/Characterization Thin Film Spectroscopy Spin Coater Thin Film Processing Polymer Spin Coating Spin Coater Thin Film Processing Polymer Spin Coating Spin Coater 1 Thin Film Processing Polymer Spin Coating Spin Coater 2 Thin Film Processing Polymer Spin Coating Spin Rinse Dryer Cleaning All Cleaning Spin Rinse Drying Spin Rinse Dryer Cleaning All Cleaning Spin Rinse Drying Spin Rinse Dryer (Photolithography Bay) Cleaning All Cleaning Spin Rinse Drying Spin Rinse Dryer (Wet Etch Bay) Cleaning All Cleaning Spin Rinse Drying Spin Rinse Dryers (SRD) Cleaning All Cleaning Spin Rinse Drying Spin Rinser & Drier SAT Cleaning All Cleaning Spin Rinse Drying Spin Rinser & Drier- 8″ Cleaning All Cleaning Spin Rinse Drying Spin Track Thin Film Processing Polymer Spin Coating Spincoater Lithography All Lithography Resist Processing Spinner Lithography All Lithography Resist Processing Spinner Lithography All Lithography Resist Processing Spinner Bench Lithography All Lithography Resist Processing SPM: Bruker Dimension Icon Imaging All Imaging Probe SPM: Horiba Labram Raman Imaging All Imaging Confocal SPM: Park NX-10 Imaging All Imaging Probe SPM: Park XE-100 Imaging All Imaging Probe SPM: Park XE-70 Imaging All Imaging Probe SPM: Scanning SQUID Microscope Imaging All Imaging Probe SPM: WITec Alpha 500 Raman Imaging All Imaging Confocal SPR: GE Biacore X100 Surface Plasmon Resonance Biological All Biological SPR Spray developer Lithography All Lithography Resist Processing SPTS Deep Silicon Etch (DE-03) Etching Dry Deep Silicon (Bosch) SPTS Rapier DRIE Etching Dry Deep Silicon (Bosch) SPTS uEtch HF Vapor Etcher Etching Dry Other SPTS uetch vapor etch Etching Dry Other SPTS Xactix Xetch (DE-06) Etching Dry Other SPTS-DRIE Etching Dry Deep Silicon (Bosch) SPUT2 Thin Film Processing Dielectric Sputter SPUT3 Thin Film Processing Metal Sputter SPUT6 Imaging All Imaging Sample Prep Sputter Coater Imaging All Imaging Sample Prep Sputter coater Imaging All Imaging Sample Prep Sputter Coater Imaging All Imaging Sample Prep Sputter deposition Thin Film Processing Dielectric Sputter Sputter Deposition System Thin Film Processing Metal Sputter Sputter-Lesker Thin Film Processing Metal Sputter Sputtering Thin Film Processing Metal Sputter Sputtering System – 3 target Thin Film Processing Metal Sputter Sputtering System – 6 target Thin Film Processing Metal Sputter SQUID Magnetometer Metrology/Characterization Structure or Device Electrical SRD 1-4 Cleaning All Cleaning Spin Rinse Drying SRD SPIN RINSER & DRIER Cleaning All Cleaning Spin Rinse Drying SRI Gas Chromatographer Metrology/Characterization Chemical Analysis Chromatography SSI RTP Thin Film Processing Dielectric RTA/RTP ST270 Spin Rinse Dryer Cleaning All Cleaning Spin Rinse Drying Stand Alone Glovebox Thin Film Processing Polymer Spin Coating Static Platform Thin Film Processing Polymer Other Steam Oxidation (Furnace D1) Thin Film Processing Dielectric Oxidation Stencil Printer Packaging All Packaging Other Stereo Microscope Imaging All Imaging Optical Stereoscope Imaging All Imaging Optical STF1200 Oxidation and Annealing Furnace Thin Film Processing Dielectric Oxidation Stopped-Flow Absorbance/Fluorescence Spectrometer Metrology/Characterization Chemical Analysis Spectroscopy STORM/PALM – Super Resolution Fluorescence Microscope Imaging All Imaging Other Stratagene Robocycler Gradient 96 Gradient Thermal Cycler Biological All Biological Sample Prep Stratasys uPrint Patterning All Patterning 3D Printing Stratysis 3D Printer Patterning All Patterning 3D Printing STS AGE ICP – Chlorine Etching Dry Deep Silicon (Bosch) STS AOE ICP Etching Dry ICP STS ASE ICP DRIE – Fluorine Etching Dry ICP STS Deep RIE Etcher Etching Dry Deep Silicon (Bosch) STS Etcher Etching Dry RIE STS HRM ICP Etching Dry ICP STS ICP Etching Dry ICP STS ICP RIE Etching Dry ICP STS PECVD Thin Film Processing Dielectric PECVD STS PECVD 2 Thin Film Processing Dielectric PECVD STS PECVD 3 Thin Film Processing Dielectric PECVD STS Pegasus ICP Etching Dry Deep Silicon (Bosch) STS Plasma Enhanced CVD Thin Film Processing Dielectric PECVD STS SOE ICP Etching Dry ICP Stylus Profilometer Metrology/Characterization Structure or Device Profilometry Stylus Profilometer Metrology/Characterization Structure or Device Profilometry Stylus Profilometer Metrology/Characterization Structure or Device Profilometry SU-8 and PDMS Baking Lithography All Lithography Resist Processing SU-8 Hotplates Lithography All Lithography Resist Processing SU-8 Spin Coating Station Lithography All Lithography Resist Processing SU-8/PDMS Resist Spinner Lithography All Lithography Resist Processing SU-8/PDMS Spin Bench Lithography All Lithography Soft Lithography SUEX / ADEX Laminator Lithography All Lithography Resist Processing Sulfurization furnace Thin Film Processing Dielectric Other Sum Frequency Generation for Surface Vibrational Spectroscopy Metrology/Characterization Chemical Analysis Spectroscopy Surface particle Measurement Metrology/Characterization Thin Film Other Surrey CNT NanoGrowth Thin Film Processing Dielectric Other Suss AltaSpray Spray Coater Thin Film Processing Polymer Spray Coating Suss Backside Alignment Measurement Metrology/Characterization Structure or Device Other SUSS MA6 Mask Aligner Lithography All Lithography UV Suss MA6-BA6 Contact Aligner Lithography All Lithography UV Suss MicroTec AltaSpray Automated Spray Coated AS8 Lithography All Lithography Resist Processing SUSS MicroTec MA-6 Lithography All Lithography UV Suss Microtec MA6/BA6 Contact Aligner Lithography All Lithography UV Suss Microtec MJB4 Lithography All Lithography UV Suss Microtec MJB4 Lithography All Lithography UV Suss MJB4 Contact Aligner Lithography All Lithography UV SUSS MJB4 Manual Mask Aligner Lithography All Lithography UV Suss MJB4 Mask Aligner Lithography All Lithography UV Suss SB8e Substrate Bonder Packaging All Packaging Bonding SVG Resist Coat Tracks 1&2 Thin Film Processing Polymer Spin Coating SVG Resist Develop tracks 1&2 Thin Film Processing Polymer Other SWC 3000-C Mask Cleaner Cleaning All Cleaning Other TA Q200 DSC Differential Scanning Calorimeter Metrology/Characterization Chemical Analysis DSC TA Q500 TGA Thermogravimetric Analyzer Metrology/Characterization Chemical Analysis TGA Tabletop SEM Imaging All Imaging SEM Talos TEM Imaging All Imaging TEM Talos TEM Imaging All Imaging TEM Tandem Accelerator Metrology/Characterization Chemical Analysis Other TANG Thin Film Processing Metal Sputter Tank Mixer Thin Film Processing Dielectric Annealing Tape Frame Applicator Packaging All Packaging Dicing Tau Science Flash QE Metrology/Characterization Thin Film Spectroscopy Technics Micro PD – Instructional Center Etching Dry Other Technics Micro RIE – Organic Cleanroom Etching Dry RIE Technics RIE Multipurpose I Etching Dry RIE Technics RIE Multipurpose II Etching Dry RIE Technotron-ASTeX Thin Film Processing Dielectric Other Technotron-ASTeX Thin Film Processing Dielectric Other Technotron-ASTeX Thin Film Processing Dielectric Other Tecnai F20 (FEI) Imaging All Imaging TEM TECNAI TEM Imaging All Imaging TEM Tegal 421 Etching Dry Other TEM Imaging All Imaging TEM TEM 2010F Imaging All Imaging TEM TEM Mill Imaging All Imaging Sample Prep TEM Mill Imaging All Imaging Sample Prep TEM2 Imaging All Imaging TEM TEM: FEI Tecnai Imaging All Imaging TEM TEM: FEI Titan Imaging All Imaging TEM Temescal BJD 1800 Ebeam Evaporator (1) Thin Film Processing All Thin Film Processing Evaporation Temescal BJD 1800 Ebeam Evaporator (2) Thin Film Processing All Thin Film Processing Evaporation Temp/Humidity Chamber Metrology/Characterization Structure or Device Other Tempress boron diffusion Thin Film Processing All Thin Film Processing Doping Tempress Furnace Thin Film Processing Dielectric Oxidation Tempress Metal Anneal Thin Film Processing Metal Annealing Tempress Oxidation Thin Film Processing All Thin Film Processing Oxidation Tempress phosphorus diffusion Thin Film Processing All Thin Film Processing Doping Tencor P15 Profilometer Metrology/Characterization Structure or Device Profilometry Tencor P15 Profilometer (left) Metrology/Characterization Structure or Device Profilometry Tencor P15 Profilometer (right) Metrology/Characterization Structure or Device Profilometry Tencor P2 Profilometer Metrology/Characterization Structure or Device Profilometry Tencor profilometer Metrology/Characterization Structure or Device Profilometry Tenney C-EVO Environmental Test Chamber TenuPol Imaging All Imaging Sample Prep Tepla 100 Cleaning All Cleaning Plasma/Stripper Tescan Focused Ion Beam Microscope Imaging All Imaging FIB TFM2.1200 Vapor Phase Deposition System Thin Film Processing Dielectric CVD TFT LPCVD LT410 (low temp oxide) Bank A-3 Thin Film Processing Dielectric CVD TFT Polysilicon – Bank A-4 Thin Film Processing Dielectric CVD TGA/DTA Metrology/Characterization Chemical Analysis Other TGA: TA Instrument Q500 Metrology/Characterization Chemical Analysis TGA Thermal Analysis Equipment Metrology/Characterization Chemical Analysis Other Thermal Deposition #1 (Digital Interface) Thin Film Processing Dielectric Evaporation Thermal Deposition #2 (Analog Interface) Thin Film Processing Dielectric Evaporation Thermal Evaporator Thin Film Processing Metal Evaporation Thermal Evaporator Thin Film Processing Metal Evaporation Thermal Evaporator Denton Vacuum Explorer 14 Thin Film Processing Metal Evaporation Thermal Evaporator (Bell Jar) Thin Film Processing Metal Evaporation Thermal Oxidation Thin Film Processing Dielectric Oxidation Thermal Shock Chamber Metrology/Characterization Structure or Device Other Thermco LPCVD Low Temperature Oxide Thin Film Processing Dielectric CVD Thermco LPCVD Poly 1/2 Thin Film Processing Dielectric CVD Thermco Oxidation Furnace Thin Film Processing Dielectric Oxidation Thermionics Ebeam Evaporator Thin Film Processing Metal Evaporation Thermo Fisher Scientific Apreo SEM Imaging All Imaging SEM Thermo Fisher Scientific Quanta FEG 250 SEM Imaging All Imaging SEM Thermo Fisher Scios DualBeam FIB/SEM Imaging All Imaging FIB Thermo Fisher Scios DualBeam FIB/SEM Imaging All Imaging SEM Thermo K-Alpha XPS Metrology/Characterization Thin Film XPS Thermo LPCVD Nitride Thin Film Processing Dielectric CVD Thermo Scientific 325a Rotary Microtome Biological All Biological Sample Prep Thermo Scientific Escalab Xi+ Metrology/Characterization Thin Film XPS Thermo Scientific Nanodrop 2000c Spectrophotometer Biological All Biological Other Thermo Scientific Precision Oven Other All Other Other Thermo UV-VIS Spectrometer Metrology/Characterization Chemical Analysis Spectroscopy Thermoevaporator Thin Film Processing Metal Evaporation Thermogravimetric Analyzer Metrology/Characterization Chemical Analysis TGA Thermogravimetry analysis system Metrology/Characterization Chemical Analysis TGA Thermolyne Furnace Imaging All Imaging Sample Prep Thermtest TPS2500S Thermal Conductivity Instrument Metrology/Characterization Structure or Device Other Thin Film Measurement System Metrology/Characterization Thin Film Thickness Thin Film Measurement System Metrology/Characterization Structure or Device Profilometry Thin Film Processing Thin Film Processing Polymer Spin Coating Thin Film Stress Measurement System Metrology/Characterization Thin Film Mechanical Thin Film Stress Measurement System Metrology/Characterization Thin Film Other Thin Film Thickness Measurement System Metrology/Characterization Thin Film Thickness Thinky Mixer Thinky Mixer Thin Film Processing Polymer Other THINKY1 Other All Other Other Thorlabs Nanomax 606/609L 6-axis piezo stages Other All Other Other Ti-Sapphire Laser Metrology/Characterization Structure or Device Other TI980 Nanoindenter Metrology/Characterization Thin Film Mechanical Ti:Sapphire Regenerative Laser Amplifier Metrology/Characterization Chemical Analysis Spectroscopy Time of Flight Secondary Ion Mass Spectrometer (TOF.SIMS 5) Metrology/Characterization Thin Film SIMS Time-of-Flight Secondary Ion Mass Spectrometer Metrology/Characterization Thin Film SIMS Time-of-Flight SIMS Metrology/Characterization Chemical Analysis Spectroscopy Time-of-Flight SIMS Metrology/Characterization Thin Film SIMS Tinius Olsen Model IT 503 Low Energy Pendulum Impact Tester Metrology/Characterization Thin Film Mechanical Tinius Olsen Model IT 503 Low Energy Pendulum Impact Tester Metrology/Characterization Structure or Device Other Titan 300/80 (FEI) Imaging All Imaging TEM Titan Krios (FEI) Imaging All Imaging TEM Titan Krios (FEI) Imaging All Imaging SEM Toho Technology FLX-2320 Thin Film Stress Measurement System Metrology/Characterization Thin Film Mechanical Total internal reflection fluorescence atomic force microscope Metrology/Characterization Chemical Analysis Spectroscopy Tousimis 916B Critical Point Dryer Cleaning All Cleaning Critical Point Drying Tousimis AutoSamdri 815A Cleaning All Cleaning Critical Point Drying Tousimis Autosamdri 815B Cleaning All Cleaning Critical Point Drying Tousimis Critical Point Dryer Cleaning All Cleaning Critical Point Drying Tousimis Critical Point Dryer Cleaning All Cleaning Critical Point Drying Tousimis Super Critical Dryer (Marcus) Cleaning All Cleaning Critical Point Drying Tousimis Super Critical Dryer (Pettit) Cleaning All Cleaning Critical Point Drying Tractrix Spinbot Lithography All Lithography Resist Processing Transient Kinetic Analysis Other All Other Other Transilluminators – multiple Biological All Biological Other Transmission Electron Microscope Imaging All Imaging TEM Transmission Electron Microscope (TEM) Imaging All Imaging TEM Triboindenter Metrology/Characterization Structure or Device Other Triboindenter Metrology/Characterization Thin Film Mechanical TRION Etching Dry RIE Trion Etcher Etching Dry ICP Trion Phantom Etching Dry Other Trion RIE/ICP Etching Dry ICP TriStar 3000 Metrology/Characterization Structure or Device Profilometry TSI 3321 Aerodynamic Particle Sizer (APS) Spectrometer Particle All Particle Size TSI 3936NL Scanning Mobility Particle Sizer (SMPS) Particle All Particle Size TSI 9306 Aerotrak Optical Particle Counter Particle All Particle Other TSI DustTrak 8520 PM Monitor Particle All Particle Other Turbo Pumping System Other All Other Other Twin-jet Electro Polisher Imaging All Imaging Sample Prep Twin-jet Electro-polisher Imaging All Imaging Sample Prep Tystar Bank1 Low Temp Silicon Dioxide Thin Film Processing Dielectric Oxidation Tystar Bank1 Non-Metal Anneal Thin Film Processing Dielectric Annealing Tystar Bank1 Polysilicon Thin Film Processing Dielectric Annealing Tystar Bank1 Silicon Nitride Thin Film Processing Dielectric CVD Tystar Bank2 Metal Anneal Thin Film Processing Dielectric Annealing Tystar Bank2 TEOS Silicon Dioxide Thin Film Processing Dielectric Oxidation Tystar Bank2 Wet/Dry Oxidation Thin Film Processing Dielectric Oxidation Tystar LPCVD nitride Thin Film Processing Dielectric Other Tystar LPCVD polysilicon Thin Film Processing All Thin Film Processing CVD Tystar Mini-Tytan 4600 Furnace System Thin Film Processing Dielectric CVD Tystar Nitride Furnace 1 Thin Film Processing Dielectric Doping Tystar Nitride Furnace 2 Thin Film Processing Dielectric Doping Tystar Nitride Furnace 3 Thin Film Processing Dielectric Oxidation Tystar Nitride Furnace 4 Thin Film Processing Dielectric Other Tystar Oxidation Furnace Thin Film Processing Dielectric Oxidation Tystar Poly Furnace 1 Thin Film Processing Dielectric Annealing Tystar Poly Furnace 2 Thin Film Processing Dielectric Oxidation Tystar Poly Furnace 3 Thin Film Processing Dielectric Other Tystar Poly Furnace 4 Thin Film Processing Dielectric Other Tystar TEOS Deposition Thin Film Processing Dielectric CVD UHV VT AFM Imaging All Imaging Probe Ultrafast Ti:Sapphire Laser Oscillator Metrology/Characterization Chemical Analysis Spectroscopy Ultramicrotome Imaging All Imaging Sample Prep Ultramicrotome Imaging All Imaging Sample Prep Ultramicrotome Imaging All Imaging Sample Prep Ultrasonic (wedge) Wire Bonder Packaging All Packaging Bonding Ultrasonic and Megasonic Cleaners Cleaning All Cleaning Other Ultrasonic Cutter Imaging All Imaging Sample Prep Ultrasonic Disc Cutter Imaging All Imaging Sample Prep Ultrasonicator System Particle All Particle Other Ultratech Plate Cleaner Cleaning All Cleaning Other Ultratech/Cambridge Fiji G2 Plasma-Enhanced ALD Thin Film Processing Dielectric ALD Ultratech/Cambridge Savannah ALD System Thin Film Processing Dielectric ALD Ultraviolet Flood Exposure System Lithography All Lithography Resist Processing Ultron UH-102 UV Curing Oven Thin Film Processing Polymer Resist Processing ULTRON UH104 UV Curing System Packaging All Packaging Dicing ULTRON UH114 Wafer/Frame Film Applicator Packaging All Packaging Dicing ULVAC Deep Oxide Etcher Etching Dry Deep Oxide Ulvac Mini-Annealer Thin Film Processing Dielectric Annealing Unaxis 770 Deep Si Etcher Etching Dry Deep Silicon (Bosch) Unaxis PECVD Thin Film Processing Dielectric PECVD Unaxis RIE Etching Dry RIE Unaxis Shuttleline ICP RIE Etching Dry RIE Unifilm Sputterer Thin Film Processing Metal Sputter Universal Laser Systems PLS4.75 Laser Cutter/Engraver Patterning All Patterning Laser UPS Metrology/Characterization Thin Film Other UT FIB FEI Imaging All Imaging FIB UT PTL-LPCVD-Nitride Thin Film Processing Dielectric CVD UT PTL-LPCVD-Polysilicon Thin Film Processing Dielectric CVD UT PTL-LTO Thin Film Processing Dielectric CVD UV Ozone Cleaner Cleaning All Cleaning Plasma/Stripper UV-Vis Spectrometers (Perkin Lambda 950) Metrology/Characterization Thin Film Spectroscopy UV-VIS Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy UV-Vis Spectrophotometer Metrology/Characterization Chemical Analysis Spectroscopy UV-Vis Spectrophtometer Metrology/Characterization Chemical Analysis Spectroscopy Vac Glove Box Syste Other All Other Other Vacuum Oven Lithography All Lithography Resist Processing Vapor Prime Oven Lithography All Lithography Resist Processing Vapor treatment system Thin Film Processing Polymer Other Variable Pressure Scanning Electron Microscope Imaging All Imaging SEM Variable Temperature UHV STM/AFM Imaging All Imaging Probe VCA Optima Contact Angle Metrology/Characterization Thin Film Contact Angle Veeco 4-point probe Metrology/Characterization Structure or Device Electrical Veeco AP-150 Metrology/Characterization Structure or Device Electrical Veeco BioScope II Imaging All Imaging Probe Veeco Dektak 150 Profilometer Metrology/Characterization Structure or Device Profilometry Veeco Dektak Profilometer Metrology/Characterization Structure or Device Profilometry Veeco Dimension 3100 AFM Metrology/Characterization Thin Film Mechanical Veeco Four-point Probe — Instructional Center Metrology/Characterization Structure or Device Electrical Veeco Mulitmode Atomic Force Microscope (AFM) Imaging All Imaging Probe Veeco NanoMan AFM Imaging All Imaging Probe Veeco NT1100 Optical Profiling System Metrology/Characterization Structure or Device Optical Veeco Savannah S200 Thermal ALD Thin Film Processing Dielectric ALD Veeco Scanning Probe Microscope Imaging All Imaging Probe Veeco Thermal Evaporator Thin Film Processing Metal Evaporation Vega 3 SEM Imaging All Imaging SEM VersaLaser Engraver/Cutter Tool Patterning All Patterning Other Verteq Spin Rinse Dryer — Instructional Center Cleaning All Cleaning Spin Rinse Drying Verteq Spin Rinse Dryer — Instructional Center Cleaning All Cleaning Spin Rinse Drying Verteq Superclean Spin Rinse Dryer Cleaning All Cleaning Wet Bench VG Scientific Multilab 3000 Metrology/Characterization Thin Film XPS Vibrating Sample Magnetometer Metrology/Characterization Structure or Device Other Vibromet Imaging All Imaging Sample Prep Vibrotome Biological All Biological Sample Prep Video Microscope Imaging All Imaging Optical Vision RIE 1 Etching Dry RIE Vision RIE 2 Etching Dry RIE Vision-RIE Etching Dry RIE Vistec EBPG Lithography All Lithography EBL Vistec EBPG5000+ Lithography All Lithography EBL VITRO1 Imaging All Imaging Sample Prep VITRO2 Imaging All Imaging Sample Prep Vitrobot Imaging All Imaging Sample Prep Vitrobot Imaging All Imaging Sample Prep Voltera Patterning All Patterning Other VWR Oven Other All Other Other VWR Oven Other All Other Other WAFAB Acid/Base Bench Etching Wet Wet Bench WAFAB Bottle Washer Bench Cleaning All Cleaning Wet Bench WAFAB Cleaning Bench Cleaning All Cleaning Wet Bench WAFAB Developer Bench Lithography All Lithography Resist Processing WAFAB HF/TMAH Bench Etching Wet Wet Bench WAFAB Resist Bench (2) Lithography All Lithography Resist Processing WAFAB Solvent Bench Cleaning All Cleaning Wet Bench WAFAB Toxic Corrosives Bench Etching Wet Wet Bench Wafer Back Grinder Packaging All Packaging Other Wafer Bonder Packaging All Packaging Bonding Wafer Cleaner Packaging All Packaging Other Wafer Dicing Saw Packaging All Packaging Dicing Wafer Inspection Camera Metrology/Characterization Structure or Device Optical Wafer Level Bonder Packaging All Packaging Bonding Wafer Polisher Packaging All Packaging CMP Waters Prep150 HPLC Metrology/Characterization Chemical Analysis Chromatography Waters Prep150 HPLC Metrology/Characterization Chemical Analysis Chromatography Waters Synapt G2S-i Q-TOF with ion mobility Metrology/Characterization Chemical Analysis Mass Spec Wedge Bonder Packaging All Packaging Other Wedge Bonder Packaging All Packaging Bonding Wedge/Ball Bonder Packaging All Packaging Other WestBond Packaging All Packaging Bonding Westbond Wirebonder Packaging All Packaging Bonding Westbond Wirebonder Packaging All Packaging Bonding Wet Bench – Etching Cleaning All Cleaning Wet Bench Wet Bench – General Use Cleaning All Cleaning Wet Bench Wet Bench – General Use Cleaning All Cleaning Wet Bench Wet Bench – HF Cleaning All Cleaning Wet Bench Wet Bench – KOH Cleaning All Cleaning Wet Bench Wet Bench – RCA Cleaning All Cleaning Wet Bench Wet Bench – Resist Lithography All Lithography Resist Processing Wet Bench – Solvents Cleaning All Cleaning Wet Bench Wet Chemistry for Wafer Cleaning Cleaning All Cleaning Wet Bench Wet/Dry Oxide – Bank B-2 Thin Film Processing Dielectric Oxidation WIBO1 Packaging All Packaging Bonding Wild Metrology/Characterization Structure or Device Optical Wire Bonder Packaging All Packaging Bonding Wire Bonder Packaging All Packaging Bonding Wire Bonder Packaging All Packaging Bonding Wire Bonder Packaging All Packaging Bonding Wire Pull/Ball Shear Tester Metrology/Characterization Structure or Device Other Wirebonder Packaging All Packaging Bonding Wirebonder (Ball) Packaging All Packaging Bonding Wirebonder Wedge Packaging All Packaging Bonding Witec Raman Confocal Atomic Force Microscope Metrology/Characterization Chemical Analysis Spectroscopy Wollam Ellipsometer Metrology/Characterization Thin Film Thickness Woolam-Ellipsometer Metrology/Characterization Thin Film Thickness Woollam Ellipsometer Metrology/Characterization Thin Film Thickness Woollam M2000 Ellipsometer Metrology/Characterization Thin Film Thickness Woollam Spectroscopic Ellipsometer Metrology/Characterization Thin Film Spectroscopy Woollam Spectroscopic Ellipsometer Metrology/Characterization Thin Film Thickness Woollam Spectroscopic Ellipsometer Metrology/Characterization Structure or Device Optical Woollam Spectroscopic Ellipsometer Metrology/Characterization Thin Film Thickness Woollam Vase Ellipsometer Metrology/Characterization Thin Film Thickness WPS- acid C11 C14 C16 G12-14 H14-15 Cleaning All Cleaning Wet Bench WPS- solvent F06 G8-11 Cleaning All Cleaning Wet Bench Wyko Metrology/Characterization Structure or Device Optical Wyko NT2000 Profilometer (VEECO) Metrology/Characterization Structure or Device Profilometry Wyko Optical Profilometer Metrology/Characterization Structure or Device Profilometry Wyko Profilometer NT3300 Metrology/Characterization Structure or Device Profilometry X-Ray Fluorescence Spectrometer Metrology/Characterization Thin Film XRF X-ray Imaging System Imaging All Imaging Other X-ray Photoelectron Spectrometer Metrology/Characterization Thin Film XPS X-ray Photoelectron Spectrometer Axis Ultra DLD Metrology/Characterization Thin Film XPS X-ray Powder Diffraction Spectrometer Metrology/Characterization Thin Film XRD X-ray Powder Diffractometer Metrology/Characterization Chemical Analysis Other X-ray topography instrument Metrology/Characterization Thin Film XRD Xactix XeF2 Etcher Etching Dry Other Xactix XeF2 etcher Etching Dry Other Xactix Xenon Difluoride Etcher Etching Dry Other Xactix Xenon Difluoride Etcher Etching Dry Other Xactix Xenon Difluoride Etcher Etching Dry Other XCT: Zeiss Xradia 520 Versa X-ray CT Imaging All Imaging Other XDIF1 Metrology/Characterization Thin Film XRD XeF2 Etcher Etching Dry Other XeF2 System Etching Dry Other Xenon Difluoride Etcher Etching Dry Other XL30 Environmental FEG Imaging All Imaging SEM XPS Metrology/Characterization Thin Film XPS XPS Metrology/Characterization Thin Film XPS XPS Metrology/Characterization Thin Film XPS XPS Metrology/Characterization Thin Film XPS XPS Metrology/Characterization Thin Film XPS XPS/UVS – SPECS System with PHOIBOS 150 Analyzer Metrology/Characterization Thin Film XPS XPS1 Metrology/Characterization Thin Film XPS XPS: PHI Quantera SXM Metrology/Characterization Thin Film XPS XPS: PHI Versaprobe Metrology/Characterization Thin Film XPS XPS: PHI Versaprobe Metrology/Characterization Thin Film XPS XRD Metrology/Characterization Thin Film XRD XRD: Bruker Single Crystal D8 Venture Metrology/Characterization Thin Film XRD XRD: Multiwire Laue Metrology/Characterization Thin Film XRD XRD: PANalytical X’Pert 1 Metrology/Characterization Thin Film XRD XRD: PANalytical X’Pert 2 Metrology/Characterization Thin Film XRD YES Asher Cleaning All Cleaning Plasma/Stripper YES Asher Cleaning All Cleaning Plasma/Stripper YES CV200 RFS Plasma Strip / Descum System Cleaning All Cleaning Plasma/Stripper YES III Vapor Prime Oven Lithography All Lithography Other YES Image Reversal Oven Lithography All Lithography Resist Processing YES Image Reversal Oven Lithography All Lithography Other YES Oven – HMDS and Image Reversal Lithography All Lithography Other YES Polyimide Bake Oven Lithography All Lithography Resist Processing YES Prime Oven Thin Film Processing Polymer Other YES Vapor Phase Deposition System Lithography All Lithography Resist Processing YES Vapor Prime Oven Lithography All Lithography EBL YES Vapor Prime Oven Lithography All Lithography Resist Processing YES-310TA Vapor Prime and Image Reversal Oven Thin Film Processing Polymer Resist Processing YES-58TA Vacuum Bake/HMDS Vapor Prime & Image Reversal System Lithography All Lithography Other YES-G1000 Plasma Asher Cleaning All Cleaning Plasma/Stripper YES-R1 Plasma Cleaner Cleaning All Cleaning Plasma/Stripper Zeiss Auriga Crossbeam FIB-FESEM Imaging All Imaging FIB Zeiss Axio Imager Z2m Imaging All Imaging Optical Zeiss Axio Observer A1 Imaging All Imaging Optical Zeiss Axio Observer Spinning Disc Confocal Microscope Imaging All Imaging Confocal Zeiss EVO LS VP-SEM Imaging All Imaging SEM Zeiss EVO SEM Imaging All Imaging SEM Zeiss FE-SEM Neon40 Imaging All Imaging SEM Zeiss Flourescence Microscope Imaging All Imaging Optical Zeiss Libra 120 PLUS TEM Imaging All Imaging TEM Zeiss Optical Microscope Imaging All Imaging Sample Prep Zeiss Orion Plus Helium Ion Microscope Imaging All Imaging Other Zeiss Sigma 500 Imaging All Imaging SEM Zeiss Supra SEM Imaging All Imaging SEM Zeiss Ultra SEM Imaging All Imaging SEM Zeiss Ultra60 FE-SEM Imaging All Imaging SEM Zeiss Ultra60 FE-SEM Metrology/Characterization Thin Film EDS/WDS Zeiss Zxiolmager M2M microscope Imaging All Imaging Optical Zeta Potential Analyzer Particle All Particle Zeta Potential Zeta Potential Analyzer Particle All Particle Zeta Potential Zetasizer Particle All Particle Size Zetasizer Particle All Particle Zeta Potential Zetasizer Particle All Particle Size Zygo Optical Profilometer Metrology/Characterization Structure or Device Profilometry Zygo Zegage Optical profilometer Metrology/Characterization Structure or Device Optical ZYGO1 Metrology/Characterization Structure or Device Profilometry Zyvex Nanoprobes for Ultra SEM Metrology/Characterization Structure or Device Other Photolithography expand_less Photolithography (also known as Optical Lithography) is generally useful for features down to about a 0.25 micrometer lateral feature size. Light projected through a chrome mask is used to expose an area of light sensitive film (photoresist) on the substrate. CNF has both facilities for generation of the photomasks and photoexposure of wafers and substrates. ABM Contact Aligner The ABM High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid-and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. ASML PAS 5500/300C DUV Wafer Stepper The ASML PAS 5500/300C DUV Wafer Stepper is our most advanced photolithography tool. It uses a KrF excimer laser to expose features smaller than 0.2 micrometers with layer-to-layer registration better than 45 nanometers. This projection printer uses a DUV (248nm) lens column (0.63 N.A.) to provide a 4:1 reduction with an exposure field size up to 22mm square. GCA 6300 DSW 5X g-line Wafer Stepper The GCA 6300 DSW 5X g-line Wafer Stepper is a 5X reduction stepper using the mercury g-line (436 nm) with an ultimate resolution of 0.9 micrometers. It is generally used when depth of field is more important than resultion. This projection printer uses a lens column with 0.30 N.A. to provide a 5:1 reduction with a variable field size up to 15mm square. GCA AutoStep 200 DSW i-line Wafer Stepper The GCA AutoStep 200 DSW i-line Wafer Stepper is a 5X reduction wafer exposure tool designed for up to 200mm wafers. All operations are automated, including wafer loading (100mm wafers) and aligning, and reticle loading and aligning (5″). Resolution is better than 0.65um. Heidelberg Mask Writer – DWL2000 The DW2000 is an advanced laser writing system for mask fabrication. It can write mask features as small as 0.8 micrometer. Heidelberg Mask Writer – DWL66FS The DWL 66fs is a high-resolution imaging system for exposing Cr mask plates or wafers, with minimum feature size 2 micrometers. The DWL 66fs will accommodate media up to 6 x 6 inches. NanoScribe GT2 The NanoScribe GT2 Laser Lithography System is a state of the art two-photon polymerization volumetric maskless printer. It can create three-dimensional nanostructures using a NIR femtosecond laser via direct-write onto a photosensitive resin that is subjected to a non-linear two-photon absorption process. This process involves cross-linking the resin via UV absorption. SUSS MA6-BA6 Contact Aligner The MA6 is a workhorse contact lithography system (contact aligner) for up to 150 mm wafers. It can align to features on either the front or the back of the wafer using a video alignment system. SUSS MJB4 Contact Aligner The MJB4 contact aligner can be used for Topside Alignment and Backside Infrared Alignment on substrate sizes ranging 5mm square to 100mm in diameter. It is capable of printing 0.7um lines and spaces with a 365-436nm light source Electron Beam Lithography expand_less Electron beam lithography (EBL) has long been established as the premier technique for defining structures at the nanoscale. Since it’s inception in 1979, the Cornell Nanoscale Science and Technology Facility (CNF) has remained at the forefront of nanofabrication research by providing state-of-the-art EBL tools to the academic and industrial user community. Although these tools can be used for mask fabrication, at CNF they are generally only used for direct-write applications JEOL 6300 The JBX 6300FS system is an advanced direct write ebeam lithography system for up to 150mm wafers. The unique capability of the JEOL 6300 is that a fifth lens can be used to get a smaller beam spot size and write sub-10 nm features. JEOL 9500 The JBX 9500FS is the next generation direct write ebeam lithography system from JEOL. CNF has one of only two 9500s in the U.S., and the only one in an academic environment. The tool is capable of loading samples from 10 mm up to 300 mm and writing features as small as 6 nm or less at 100 MHz clock speed. The system features dramatically improved stitching and overylay over previous systems. Nabity Nanometer Pattern Generator System (NPGS) The Nabity system turns an SEM into a simple e beam lithography system. The pattern generator takes control of the deflection system on the SEM and can then be used to expose patterns in resist. This is particularly useful when there is a need for low energy exposures. The tool is very manual, as opposed to the fully automated JEOL systems. Other Lithography expand_less Nanoimprint NX-2500 The NX-2500 is a multi-level nanoimprint machine with imprint capabilities in thermoplastic, photo-curable and embossing. This machine also eliminates relative lateral shifting between substrate and mold which affects mold lifetime. A very small thermal mass, ensure rapid and cooling, resulting in fast process cycles. Lithography Support expand_less To support lithography operations, CNF has dozens of manual spinners, hot plates, and ovens, along with facilities for vapor priming, image reversal, resist development, and resist stripping. Brewer Science 300 mm Hot Plate Hot plate for heating 300 mm wafers, and also other large substrates such as large glass plates used for displays. Brewer Science 300 mm Spinner Spinner for applying resist on 300 mm wafers, and also on photomasks and large glass plates, such as substrates for displays. Edge Bead Removal System This Edge Bead Removal System uses a Brewer Science Cee Flange Spinner Model 200 platform along with a Nordson 752 Series Diaphragm Dispense Valve and their patented BackPack valve actuator controlled by their ValveMate 8000 Controller. The nozzle is mounted on a 4-axis cantilevered T-Slot arm with position micrometer on the X-axis for adjusting the bead size. It utilizes Microposit EBR 10A as a solvent. SUSS Gamma The Suss MicroTec Gamma Cluster Tool is an automated photoresist and wet processing system designed to meet needs for clean, reliable and high throughput photolithography processing. In addition to the manual facilities used for small lots, CNF has this advanced robotic coating/development system which can process cassettes of wafers up to 200 mm. It also incorporates the AltaSpray spray coating system for non-planar substrates. Hamatech HMx900s The Hamatechs are single wafer automated chemical processors. CNF has a total of six of these units, configured for various cleaning, stripping, and resist development processes. Cee 1300X Hotplates 1300X hotplates are configured for proximity baking of resist and other films at various temperatures from 90C to 205C. Cee Apogee Spinners Cee manual resist spinners accommodate substrates from small pieces to 200mm wafers, with spin speeds over 6000 rpm and acceleration up to 30,000 rpm/sec. YES Process Ovens CNF has three Yield Engineering Systems ovens, a Vapor Priming vacuum oven, an Ammonia Image Reversal oven, and a Polyimide Curing oven. All three systems allow fully programmed operation. Physical Vapor Deposition expand_less PVD encompasses the vacuum thin film deposition techniques of evaporation and sputtering. CNF has systems that can deposit a wide range of materials. AJA Orion Sputtering Systems CNF has two AJA magnetron sputtering systems that can be used to deposit a variety of materials. The systems are load locked, allowing rapid sample exchange. Each system has five S-gun type sputtering sources. Both DC and RF magnetron sources are available. CHA SE600 Thermal Evaporator The CHA thermal evaporator is the only PVD tool at the CNF designated for depositing thin films on substrates that are composed of high vapor pressure materials. CHA Mark 50 Electron Beam Evaporator The large chamber on this electron beam evaporator enables users to deposit metals on moderately sized production runs. The tool is capable of conformal evaporation on 4” and 6” wafers and has liftoff platens for 4”, 6” and 8” wafers. OEM Endeavor M1 The Endeavor is a specialized magnetron sputtering tool for the deposition of piezoelectric Aluminum Nitride on up to 150 mm wafers. Lesker PVD 75 The PVD75 is a small box coater for reactive sputtering Indium Tin Oxide (ITO), a transparent conductor and Titanium Dioxide (TiO2). CVC 4500 Electron Beam Evaporator CNF has two CVC cryopumped evaporators used for thin film depositions. The Odd-Hour is capable of both thermal and electron beam evaporation. The Even-Hour has a six-pocket electron-beam crucible turret and is designated for low temperature oxide and nitride depositions. Chemical Vapor Deposition and Hot Processes expand_less Arradiance ALD This system is solely configured for thermal ALD and presently has precursors for Al, Ti, Pt, hf, and Zr. The system also has an ozone generator which allows films to be deposited at lower temperatures. It is uniquely configured for ALD of nanoparticles in either a static or rotational mode. The following films can be deposited: Pt, HfO2, Al2O3, TiO2, TiN, and ZrO2. MRL Atmospheric Furnaces CNF has 10 atmospheric furnace tubes for up to 150mm wafers. They are used for thermal oxidation of silicon and for annealing. Carbon Nanotube/Graphene Furnace CNF has a First Nano 3500 tube furnace for CVD deposition of Graphene and carbon nanotubes on up to 100 mm wafers MRL Vacuum Furnaces CNF has 10 vacuum tube furnaces of chemical vapor deposition on 150 mm wafers. Processes include CVD oxides, CVD nitrides, and CVD polysilicon. GSI PECVD The load-locked GSI Plasma Enhanced Chemical Vapor Deposition (PECVD) system can conformally deposit a variety of dielectric films as well amorphous silicon on whole 100 and 150 mm diameter wafers. Oxford ALD FlexAL This system has both thermal and (remote)plasma enhanced atomic layer deposition. The system has precursors for Al, Ta, Hf, and Si. The oxides and nitrides of these elements can be deposited, as well as tertiary compounds such as HfAlOx, HfSiOx, and HfSiOxNy. Films can be deposited up to 400C. Oxford PECVD The Oxford 100 PECVD is a (capacitively coupled) plasma enhanced CVD tool for deposition of silicon dioxide and silicon nitride. AG 610 Rapid Thermal Annealers Rapid Thermal Annealers (AG Heatpulse 610) use high intensity, visible radiation to heat samples (up to 150mm) for short periods (1-600 seconds) at high temperatures (400-1150 C) in an annealing ambient of oxygen, argon, nitrogen, or forming gas (5% H2 in Ar). Applications include ion implant activation, annealing, oxide reflow, silicide formation, contact alloying, and gallium arsenide processing. Dry Etching expand_less Dry Etching, known variously as plasma etching or reactive ion etching, uses a plasma to dissociate a generally non-reactive gas into a plasma of reactive radicals. Various gases and plasma configurations are used depending of the material and desired process results. AJA Ion Mill The AJA Ion Mill is a 22 cm diameter Kaufman RF-ICP gridded ion source producing a collimated Argon ion beam which provides uniform etching of samples up to 6 inch diameter. The sample holder is water cooled at 23 degrees C. and has motorized tilt (0-180 degrees), and continuous sample rotation up to 25 RPM. The system is Cryo Pumped with a base pressure in the 10-8 torr range. It is generally used for materials for which there is no appropriate chemical/plasma etch. Anatech Resist Strip The Anatech USA, model SCE-110-RF, Oxygen plasma Asher is a 10 inch diameter all quartz barrel asher. It is ICP powered 13.56 MHz up to 900 Watts. It is equipped for both oxygen and nitrogen plasma. It can process small pieces and up to 200 mm wafers. Glen 1000 Resist Strip The Glen 1000 system utilizes a oxygen plasma source for stripping of photoresist and other organics. The tool can be setup to give direct ion bombardment or in a downstream ion mode for lower surface damage. Nitrogen is also available. Oxford 100 ICP This ICP system is dedicated to silicon based dielectrics (SiO2, Si3N4, SiOxNy) and is uniquely equipped with a gas ring in addition to traditional shower head gas delivery of highly polymerizing fluorocarbon and hydrofluorocarbon gases. Gases include CF4, CHF3, C4F8, C4F6, CH2F2 as well as additives such as O2, Ar, He, and CO2. This system is mechanically clamped and can accommodate up to 100mm diameter wafers. Oxford 80s CNF has two Oxford 80 open load reactive ion etching systems configured with varous fluorocarbon gases, primarily for etching silicon based films. Oxford Cobra This ICP system is configured with chlorine, bromine, and fluorine chemistry. This system is used to etch silicon and germanium photonics structures using HBr, magnetic tunnel junction (MTJ) layers using methanol (CH3OH) based chemistry, and silicon carbide with an SF6 based etch. Fluorine based metal etches such as tungsten are also included in this system. This system is mechanically clamped and can accommodate up to 100mm diameter wafers. PlasmaTherm Versaline Deep Silicon Etcher The Versaline DSE is an advanced deep Silicon etcher configured for fast switching Bosch p rocesses. It can create high aspect ratio trenches and channels in Silicon wafers, or completely etch through Silicon wafers. Plasma-Therm Takachi ALE Primaxx Vapor HF Etcher This system is primarily used to isotropically etch silicon dioxide using anhydrous vapor HF. The VHF/alcohol process enables release of silicon MEMS structures without stiction. It is highly selective to silicon, alumina, aluminum, and silicon carbide. Plasma Therm System 72 The Plasma Therm System 72 is open load reactive ion etching systems configured with various fluorocarbon gases, primarily for etching silicon based films. Plasma Therm 720/740 This is a dual chamber RIE loadlocked system with both chlorine and fluorine based chemistry. The 740 (left chamber) has been designated a Au exposure system. It can be used to etch metals and dielectrics with either Au exposure or termination. The 720 (right chamber) is designated for chlorine and fluorine based etching of 2D materials such as MoS2, WSe2, NbSe2, AsSe2, and GaSe and perovskites such as SrRuOx, SrLaAlOx, and BaSrOx. Both chambers can accommodate up to 200mm diameter wafers. Plasma Therm Dual Chamber 770 This is a dual chamber loadlocked ICP system with both chlorine and fluorine based chemistry. The left chamber is for chlorine based metal, metal oxide, and metal nitride etching including Cr, Ti, Al, Al-Si-Cu, Ta, Al2O3, Nb, TiN, TaN, AlN, piezo-AlN, and MoSi2. The right chamber is dedicated to III-V materials and includes gases such as Cl2, BCl3, CH4, H2, and SiCl4. Both chambers are mechanically clamped and can accommodate up to 100mm diameter wafers. Samco UV/Ozone System Utilizes UV light, heat, and Ozone for the removal of organic contamination as well as th e descumming, UV curing, and stripping of resist. Trion Minilock III ICP Etcher The Trion is a small load-locked ICP system with BCl3, Cl, CHF3, CF4, O2, N2, O2, and Ar f or etching a wide variety of materials. PlasmaTherm Unaxis 770 Deep Silicon Etcher The Unaxis 770 is a deep silicon etcher that utilizes the Bosch process as well as other unique processes developed at CNF. Xactix XeF2 This system is primarily used to isotropically etch silicon, Ge, Mo and any materials that react spontaneously with atomic fluorine. One of its main purposes is to release MEMS structures by etching sacrificial materials without stiction. XeF2 is highly selective to silicon oxide, polymers, and most metals. Y.E.S. Asher Vacuum system with Oxygen Plasma, designed for Resist Stripping and Descum. It uses a 9″ diameter Hot Plate stage to control wafer temperature. The system is used to strip resist off single wafers, up to 8″ diameter. The 40 KHz plasma is isolated from the wafer by a grounded, perforated metal plate, making this a Down Stream system. YES EcoClean Asher The YES EcoClean is a single wafer, downstream ICP stripper designed for photoresist and polyimide strip, descum, and inorganic substrate cleaning/surface modification. The remote ICP source produces a high-density oxygen plasma and confines any charged plasma species to the plasma chamber such that only charge-neutral species flow from the source to the substrate. The tool can process silicon and gallium arsenide wafers of 2″, 3″, 4″, 5″, 6″, and 8″ diameter. Tool capabilities include 3,000 W RF power and hot plate temperature up to 300 C for fast resist removal. Structure Characterization expand_less AFM Bruker Icon The AFM Bruker Icon is an atomic force microscope which operates in both contact and tapping mode to map surface topography of a solid substrate. Tool can scan 100 um X 100 um of surface area and measure trenches as deep as 13.7 um. It accepts smaller pieces and whole wafers (magnetic pucks are available for the smaller pieces). Stylus Profilomoters CNF has a Tencor P-10, a Tencor P-7, and a Dektak stylus profiolometeris for measuring step heights Focused Ion Beam CNF maintains a Hitachi single ion beam focused ion beam tool for sample preparation and failure analysis. Other more sophisticated “dual beam” FIBs are available elsewhere on the Cornell campus (CCMR). Hummer Au/Pd Sputtering System A small sputter system for sputtering thin conductive coatings on samples prior to SEM imaging or electron beam lithography. It is setup for Gold / Palladium. The manual machine allows for quick coating of conductive films to assist in electron beam work Polaron Gold Sputter SystemA small sputter systems for coating samples prior to SEM imaging or electron beam lithography. This system is setup for Gold, typically used in electron beam writing. The manual machine allows for quick coating of thin conductive films to assist in electron beam work. Zeiss SEMs CNF has two Zeiss digital field emission scanning electron microscopes, an Ultra 55 and a Supra 55VP. The Ultra features a more advanced detector, while the Supra has capabilities for charge compensation for insulating materials. An EDX for materials characterization is also available on the Supra. Thin Film Characterization expand_less Bruker Energy-dispersive X-ray Spectrometer (EDS) The Bruker QUANTAX 200 Energy Dispersive X- ray Spectrometer (EDS) with XFlash®6 silicon drift detector is a modular EDS system for qualitative and quantitative microanalysis. The system’s standard-less quantification software enables manual, automatic or interactive spectra evaluation and provides reliable results for specimens with polished or irregular surfaces, thin layers and particles. Filmetrics CNF has several Filmetrics spectrophotometers for measuring the effective thickness of transparent thin films, including systems for microspot measurement and wafer mapping. FleXus Film Stress Measurement A laser scan technique is used to measure wafer surface curvature before, and after wafer processing. Two wavelengths (670 nm and 780 nm) are available to ensure adequate reflected signal from the wafer. The calculated change in wafer curvature is then used to calculate the stress in the film. The wafer is scanned on a hot plate which can be programed for stress vs. temperature measurements. Metricon Model 2010/M Prism Coupler The Metricon is a prism coupler for precision measurement of optical index of transparent thin films. P-10 Profilometer The P-10 profilometer is a useful metrology tool used to measure surface characteristics in the micron or finer scale. It is an ideal tool for step height measurements to determine film thickness, etch depth and surface roughness in semiconductor fabrication. The unit is a stylus-based surface profiler, with a motorized XY stage with variable speed, capable of 1 Å resolution, 280-300 um vertical dynamic range, 60mm scan length, 1 µm/sec to 25 mm/sec scan speed and 150-600X image magnification. P7 Profilometer A profilometer is a precision metrology tool used to measure surface characteristics in the micron to nanometer scale. It is an ideal tool for measuring step heights. This is useful for measuring film thickness, etch depth, surface roughness, wear-scar measurements. Many parameters of surface roughness and waviness can be measured. The P-7 is a stylus-based surface profiler, with motorized XY stage with vacuum hold down, and a wide range of scan parameter settings. Rudolph FTM This can be a useful tool for very quick and easy measurement of resist thickness and uniformity. The resist index of refraction needs to be known for accurate thickness measurement.. Measurement range is only about 300 nm to 5 microns. Schott IR Inspector The Schott IR Inspection Tool is a general all-purpose semi-automatic inspection tool for the front side, buried layers, and backside inspection. The machine can handle substrates size up to 200mm in Diameter. The Schott IR Inspection can be utilized for void detection and quality of bonds in wafer bonding. It also serves as a good way to detect chipping and cracking post-CMP and post-Dicing for top and buried layers VCA Optima Contact Angle The VCA is able to measure the water contact angle on wafer surfaces up to 6 inch in diameter. It is a useful metrology tool for measuring the quality of surface treatments put down in the Applied Microstructures MVD100 tool. Woollam RC2 Spectroscopic Ellipsometer The Woollam RC2 is a modern automated variable angle spectroscopic ellipsometer. It can also be used to extract both optical indexes and film thicknesses for components in a thin film stack. Newer technology enables measurements on the order of 100 times faster than the Woollam WVASE, mapping of thickness and optical properties, and measurement of anisotropic materials. Woollam Spectroscopic Ellipsometer The Woollam V-VASE is a variable angle spectroscopic ellipsometer. It can be used to extract both optical indexes and film thicknesses for components in a thin film stack. Electrical Testing expand_less Everbeing 4-Point Probe A manual 4 point probe stand. Everbeing EB-6 DC Probe Station The EB-6 is a manual electrical probe station for up woth150mm wafers. It sits in a dark box. Zyvex Nanoprobes The Zyvex S-100 Nanoprobes are installed on the Zeiss Ultra-55 SEM and operate under vacuum during imaging or with the beam blanked. The S-100 consists of three individually controlled nanoprobes which can be placed with a precision of five nanometers. The probes have a minimum tip radius of fifty nanometers for precision measurements. Miscellaneous and Back End Processing expand_less Tousimis Critical Point Dryer The Tousimis Critical Point Dryer is used to prevent surface tension while gently drying devices such as MEMS and Microfluidics to prevent stiction after a wet etch process. This tool can handle samples from small pieces up to 6″ wafers. Disco Dicing Saw The Disco Dicing Saw can dice device sizes from small pieces up to 8″ wafers. It can dice wafers on simple basic X Y axis or advanced settings for multiple angles. There are two standard blades that we use for dicing different types of substrates such as Silicon and many types of Glass. As well as some specialty blades for various other substrate. K&S Gold Ball Bonder This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally coupled to the stage, and heated to about 170 degrees C. Logitech Orbis CMP (Chemical Mechanical Polishing) The Logitech Orbis is a CMP tool capable of polishing 4 and 6 inch whole wafers. It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. MVD100 This tool is capable of depositing conformal monolayer coatings on a wide variety of substrates using a vapor phase process from liquid precursors. Objet30 Pro 3D Printer The ObJet30 Pro prints proprietary UV-curable polymers that mimic acrylic or polypropylene. Pico MA FinePlacer FlipChip Bonder The FLIPCHIP, FINEPLACER pico ma uses a precision optical system to align patterns on a small chip ( up to 20 x 20 mm) over patterns on a substrate (up to 100 x 100 mm, ). Alignment and placement accuracy is 5 microns. The two devices are then pressed together with a force, up to a maximum of 20 N (4.5 lb.). Temperature profiles (up to 450 deg. C) for the substrate support and for the chip holder are programmable for solder re-flow, or solder paste. A fiber optic UV source is also available for UV curing adhesives. A dispensing system is available for adhesives or solder pastes. Suss SB8e Substrate Bonder The Suss SB8e VAC substrate bonder is a universal tool for bonding proses for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding, and Thermal Compression Bonding. This tool can sustain wafers up-to 150mm. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar. The bonding process takes place in a controlled environment. Versalaser Engraver/Cutter Tool The Universal Laser Systems VersaLaser VLS3.50 is a CO2 laser that emits in the infrared spectrum to cut or etch patterns by vaporizing the substrate. Westbond 7400A Ultrasonic Wire Bonder A wire bonder is used to connect the micron-scale pads of your device to the pads, or leads, in a package. This wedge-wedge ultrasonic type wire bonder (aka, wedge bonder) is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen. Biotechnology expand_less Fluidic Probe Station The Corsolutions Fluidic probe station is for quick testing of microfluidic devices. It features special fluid probes for contacting the device and precision pumps with integrated flow meters for measuring flow. Malvern Nano ZS Zetasizer The Zetasizer characterizes nanomaterials in a solution. It uses Dynamic Light Scattering to determine the polydispersity of a sample and measure particle charge and size. Malvern NS300 NanoSight The NanoSight uses the technology of Nanoparticle Tracking Analysis (NTA) to characterize nanoparticles from 30 to 800 nanometers in liquid. AFM NanoScope Analysis AutoDesk Cadence CorelDRAW Coventor SEMulator3D GenISys Layout BEAMER GenISys Layout LAB GenISys ProSEM GenISys TRACER L-Edit CAD Software LinkCAD pattern preparation software MATLAB PROLITH by KLA-Tencor Bio EM Sample prep Sample preparation Ellipsometer (M2000) Optical spectroscopy FT-IR / FT-Raman (Bruker IFS66V/S and PerkinElmer Frontier FTIR) Optical spectroscopy Furnaces Materials processing and calorimetry Gas-Mixing Furnace Materials processing and calorimetry General Lab Materials processing and calorimetry Ion Beam Analysis of Materials (IBeAM) Ion beam analysis of materials Multi-Anvil press High-pressure synthesis Piston Cylinder High-pressure synthesis Profilometer – optical (ZeScope) Surface imaging Profilometer – Stylus (Bruker Dektak XT) Surface imaging Raman / AFM (Witec Alpha 300 RA+) Optical spectroscopy, Surface imaging Raman Spectrometer (custom built multi-wavelengths) Optical spectroscopy Residual Gas Analysis (SRS200) Materials processing and calorimetry Scanning Probe/ Atomic force Microscopy (SPM/AFM) Surface imaging SEM – FEG XL30 (FEI) SEM SEM Electron Microprobe Analyzer SEM, Quantitative X-ray analysis SEM JEOL JSM6300 (Bio) SEM SEM SNE-4500M table top SEM SEM/FIB Focused Ion Beam – Helios 5 UX (ThermoScientific) Focused ion beam and sample preparation SEM/FIB Focused Ion Beam – Nova 200 NanoLab (FEI) Focused ion beam and sample preparation TEM/STEM 2010F (JEOL) TEM/STEM TEM/STEM ARM200F (JEOL) Aberration corrected TEM/STEM TEM/STEM CM200-FEG (Philips) TEM/STEM TEM/STEM Nion Monochromate UltraSTEM 100 Aberration corrected TEM/STEM, 4D-STEM, Electron Energy Loss Spectroscopy TEM/STEM Philips CM 12 TEM (Bio) TEM/STEM TEM/STEM Titan 300/80 (FEI) Aberration corrected TEM/STEM TEM/STEM Titan Krios (FEI) TEM/STEM Thermal Analysis (TGA/DTA/DSC) Materials processing and calorimetry UV-Vis Spectrometers (Perkin Lambda 950) Optical spectroscopy X-ray Diffractometer – High Resolution (PANalytical X’Pert PRO MRD) X-ray diffraction X-ray diffractometer – Powder (Bruker D8) X-ray diffraction X-ray Diffractometer – Powder (Malvern PANalytical Aeris) X-ray diffraction X-ray diffractometer – Single Crystal (Bruker Smart APEX) X-ray diffraction X-ray fluorescence spectrometer -Energy dispersive (Bruker S2 PUMA) X-ray fluorescence X-ray Photoelectron Spectroscopy (VG 220i-XL) Surface composition and film deposition X-ray topography (Rigaku XRT-100) X-ray diffraction AS-One 150 RTP rapid thermal processing Cambridge Savannah ALD Deposition Tool Thin film deposition CEE Spin Coater #1 and #2 Lithography CHA E-Beam Evaporator Thin film deposition Edwards2 Thermal Evaporator Thin film deposition EVG 620 Aligner Lithography Filmetrics F20 and F40 Optical reflectometry GCA 8500 5X Stepper Lithography Heat Pulse RTP rapid thermal processing Hitachi S-4700 Field Emission Scanning Electron Microscope Characterization JEOL JBX-6000 FS/E Electron Beam Lithography Lithography Lesker #1 Sputter Deposition Tool Thin film deposition Lesker #2 Sputter Deposition Tool Thin film deposition Lesker #3 E-Beam Evaporator Thin film deposition Lesker #4 E-Beam Evaporator Thin film deposition Lesker #5 Sputter Deposition Tool Thin film deposition OAI 808 Aligner Lithography Oxford PECVD Thin film deposition PlasmaLab M80 Plus – Chlorine Dry etch, reactive ion etching PlasmaLab M80 Plus – Fluorine Dry etch, reactive ion etching PlasmaTherm 790 RIE – Fluorine Dry etch, reactive ion etching PlasmaTherm Apex ICP Dry etch, Inductively coupled plasma etching SCS Spin Coater Lithography STS AGE ICP – Chlorine Dry etch, Inductively coupled plasma etching STS ASE ICP DRIE – Fluorine Dry etch, Inductively coupled plasma etching Tegal 421 Dry etch, reactive ion etching, barrel ashing Xactix XeF2 Si Etcher Dry etch, dry vapor phase etching Zygo ZeGage Characterization, 3D optical profiling 3D Optical Profiler Zygo NewView 5000 The 3-D Optical Profiler uses interferometry for imaging and quantifying topographical features such as step heights, critical dimensions, curvature, and roughness. 3D Printer FormLabs Form 2 3D printing .STL or .OBJ 3D models created from software programs like CAD, or directly from MicroCT data. Analysis PC for MicroCT Velocity S58SQ – Quadro M6000 Analysis of CT Data, Image Processing, 3D Visualization and Animation, CT Segmentation, CAD vs. Actual Comparison, Volume Rendering, Morphometric Data Collection, Quality Assurance, Graphics Work Atomic Force Microscope Asylum Cypher Atomic Force Microscope Asylum Cypher ES Environmental atomic force microscope. This AFM allows for temperature control and fluid or gas perfusion. It also has blueDrive photothermal excitation, which, by directly exciting the cantilever photothermally, provides significant ease of use and performance benefits for imaging topography, mechanical, electrical, and magnetic properties in air and liquids. Bake Oven Thermo Scientific Lindberg/Blue M General-Purpose Oven Annealing, baking and curing up to 260C in air Biological Hood Biological Hood Biological Hood Biological Hood Biological Hood Biological Hood Critical Point Dryer Bal-Tec CPD 030 Critical Point CO2 Drying of non-biological samples Critical Point Dryer LADD CPD3 Critical Point CO2 Drying of Biological Samples Cryo Transmission Electron Microscope ThermoFisher Krios G3i Cryo TEM Cryo TEM for single particle analysis DC Sputter System Kurt Lesker PVD 75 DC sputter coating of metals Develop Hood Air Control Develop Hood For photoresist base develop processing Dicing Saw Disco DAD3220 Programmed dicing of silicon and other substrates Dry Oxidation Tempress 6304 4-Stack Furnace Dry oxidation (950C-1050C) in Oxygen E-beam & Thermal Metal Evaporator Kurt Lesker PVD 75 E-beam and thermal evaporation of metal films E-Beam Lithography System Elionix ELS-7500 EX E-Beam Lithography System Electron Beam Lithography and SEM imaging E-Beam Metal Evaporator CHA Industries Solution E-Beam Deposition of thin metal films Ellipsometer Rudolph Auto EL III Thickness and index of refraction measurements of thin oxide, nitride, and organic films and optical constants of substrates. Environmental Scanning Electron Microscope with EDS detector FEI XL30 ESEM with Bruker XFlash 4010 EDS The ESEM + EDS is an instrument that can be used to image and complete elemental analysis on dry or hydrated samples. A tensile stage is available for use on the ESEM Equipment Model Applications Equipment Model Applications Film Thickness Measurement Nanometrics 210 Film thickness measurements up to 50mm Fluorescence Microscope w/camera Zeiss AxioImager Fluorescence and Optical Microscopy Frontside/Backside Mask Aligner Karl Suss MA6/BA6 For Topside or Backside photo alignment and exposure FT-IR Spectrometer Thermo Electron Nicolet 8700 Optical characterization of samples over Infra-Red wavelengths High Resolution X-ray Computed Tomography Scanner Nikon XTH 225 ST X-ray Imaging, Non-destructive CT, Quality Assurance, CAD vs. Actual Comparison (GD&T), Non-Destructive Internal Inspection, 3D Digitization, 3D Metrology, Surface Rendering, Morphology, Morphometrics High Temperature Anneal N-type doping Tempress 6304 4-Stack Furnace High Temperature Annealing (750C-1050C) in Nitrogen used for N-type doped substrates High Temperature Bake Oven Keison Carbolite LHT 6/30 Annealing, baking and curing up to 600C in an N2 ambient III-V Reactive Ion Etcher Trion Technology Minilock II Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries Ion Beam Milling System Leica EM TIC 3x Uses high-energy argon-ion beam to mill away material, creates smooth surfaces for electron microscopy or atomic force microscopy samples. Large ADA Acid Chemical Hood Air Control Acid Hood For acid chemical processing Large ADA Solvent Chemical Hood Air Control Solvent Hood For solvent chemical processing (including ultrasonics) Liquid Array Printer Scienion S11 sciFlexarrayer Liquid Array Printing Low Temp Anneal and High Temp Anneal for P-type doping Tempress 6304 4-Stack Furnace Low Temperature Annealing (400C-600C) in Nitrogen or Forming Gas and High Temp Annealing (up to 1050C) in Nitrogen of P-type substrates Low Temperature Oven for Non-Hazardous Materials VWR 1350U Low temperature baking of non-hazardous materials up to 100C Mask Aligner Suss MicroTec MJB3 Photolithographic patterning Microscope w/ camera (manual) Nikon Eclipse ME600 Optical Microscopy Micro-Strain Analyzer TA Instruments RSA III Mechanical analysis (stress/strain, etc) of materials samples such as polymer films, fibers, and elastomers Nomarski Microsope w/camera Zeiss AxioImager BF, DF, and Nomarski (DIC) optical microscopy Oxide/Nitride/Polymer Reactive Ion Etcher Trion Technology Phantom II Reactive Ion Etching (RIE) of oxide, nitride, and polymer films with fluorine and oxygen chemistries Parylene Coater Cookson Electronics PDS 2010 LABCOTER2 Accurate deposition of parylene films PDMS Oven Barnstead/Thermolyne Type 19200 Low temperature oven for baking and curing PDMS and similar materials PELCO Glow Discharge System easiGlow 91000 Designed to make TEM carbon support grids hydrophilic. Plasma Asher Emitech K-1050X O2 / Ar plasma ashing of photoresist and other organic materials Plasma Enhanced Chemical Vapor Deposition System Advanced Vacuum Vision 310 PECVD deposition of Oxide, Nitride, and Oxynitride films Plasma-Enhanced Atomic Layer Deposition (PE-ALD) System Kurt Lesker ALD-150LX Plasma-Enhanced Atomic Layer Deposition (PE-ALD) Polishing and Lapping Machine Logitech PM5 Polishing and Lapping Prep/Offline Acid Chemical Hood Air Control Acid Hood For acid chemical processing in a non-cleanroom environment Prep/Offline Solvent Chemical Hood Air Control Solvent Hood For solvent chemical processing in a non-cleanroom environment Probe Station Cascade EPS150 Triax The probe station consists of a manual probe system with 4 independent probe micro-manipulators. It is configured with a parametric analyzer and a LCR meter for measuring current, voltage, resistance, capacitance, and conductance of devices and structures. This system also includes a 4 point resistivity probing system for making sheet-resistance and resistivity measurements of substrates and films Profilometer Bruker Dektak 150 Surface profiling and step height measurements RAMAN/PL Horiba Jobin Yvon LabRam ARAMIS Raman and PL spectroscopy Rapid Thermal Anneal System Jipelec JetFirst 100 Rapid thermal annealing up to 1000C in air, vacuum, N2, or forming gas (N2/H2) Reconstruction PC for MicroCT RECO1 X-ray CT Reconstruction of Nikon CT Data, Analysis of CT Data, Image Processing, 3D Visualization and Animation, CT Segmentation, CAD vs. Actual Comparison, Volume Rendering, Morphometric Data Collection, Quality Assurance, Graphics Work Reconstruction PC for MicroCT RECO2 X-ray CT Reconstruction of Nikon CT Data, Quick Analysis of CT Data, Image Processing, Quick Volume Rendering RF Dielectric Sputter System Kurt Lesker PVD 75 RF sputter coating of dielectric materials Scanning Electron Microscope FEI XL30 SEM-FEG The SEM is a high magnification imaging tool. Resolution is on the order of 2nm Scanning Electron Microscope with EDS Detector Apreo S by ThermoFisher Scientific (formerly FEI) The SEM is a high magnification imaging tool Scanning Probe Microscope Digital Instruments Dimension 3100 The scanning probe microscope (SPM) produces high resolution, three dimensional images by scanning a sharp tip over the sample surface Silicon DRIE SPTS Pegasus Deep Silicon Etcher Deep Silicon Reactive Ion Etching (DRIE) Small Acid Chemical Hood Air Control Acid Hood For acid chemical processing Small Angle X-Ray Scattering – Point Source SAXSLab Ganesha Point collimated pinhole system for WAXS, MAXS, SAXS and Extreme SAXS of nano-particles for shape & structure analysis; GI-SAXS & GI-WAXS of surfaces for typography Small Solvent Chemical Hood Air Control Solvent Hood For solvent chemical processing Spin Coat Hood – ANY MATERIAL Air Control Spin Coat Hood For spin coating materials Spin Coat Hood – RESIST ONLY Air Control Spin Coat Hood For spin coating photoresist and EBL resists ONLY Sputter Coater Denton Desk V Deposition of a gold film Stereo Microscope American Scope SM-4TZ-FRL Stereo Microscope Tabletop Scanning Electron Microscope Hitachi TM3030Plus Tabletop SEM The SEM is a tabletop high magnification imaging tool with secondary electron and backscattered electron detectors. Thermal Evaporator JEOL IB-29500VED Thermal Evaporation Thinky PDMS Mixer/Degasser Thinky Mixer AR-100 Mixing and degassing PDMS Transmission Electron Microscope FEI Tecnai G² Twin The TEM is a high magnification imaging tool. Resolution is on the order of 0.3nm Ultra Microtome Ultracut For thin sectioning embedded biological samples. Ultramicrotome with cryo chamber Leica Ultracut UC7 with Cryo Chamber For thin sectioning embedded biological samples for TEM or for thin sectioning frozen samples for AFM or EM. UV-Vis-NIR Spectrophotometer Shimadzu UV-3600 Optical characterization of samples over UV-Vis-NIR wavelengths Vacuum Bake Oven Fisher Scientific Isotemp Model 282A Vacuum and nitrogen baking and curing Vitrobot FEI Mark IV Vitrifies suspension samples for imaging with the cryo-TEM. Vitrobot FEI Mark IV Vitrifies suspension samples for imaging with the cryo-TEM. Vitrobot Hood Air Control For preparing Cryo-TEM and other TEM samples. Wire Bonder West Bond 747677E Wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices. X-Ray Diffractometer Panalytical X’Pert PRO MRD HR XRD System The X-Ray diffraction system can be used for characterizing structural properties of a wide range of materials X-Ray Photoelectron Spectrometer Kratos Analytical Axis Ultra XPS is a technique for the detection of variations in chemical composition and oxidation state. The AXIS Ultra provides a high energy resolution capability for both conductive and insulating samples. SEM Hitachi SU8010 FE-SEM Hitachi SU8230 FE-SEM LEO 1530 FE-SEM Zeiss Ultra 60 FE-SEM FEI Nova 200 FIB/SEM TEM Hitachi HT7700 JEOL 100CX-II Hitachi HD-2700 FEI Tecnai F30 SPM Bruker Dimension ICON AFM Hysitron TI 900 Nanoindenter Optical Renishaw Qontor Micro-Raman Renishaw InVia UV-mid IR Raman Microscope Nicolet 6700 FTIR Thermo iN10 FTIR microscope Keyence VHX-600 digital optical microscope Surface Science Kratos Axis Ultra XPS/UPS Thermo K-alpha XPS IONTOF ToF-SIMS XRD Malvern PANalytical Empyrean Malvern PANalytical Alpha 1 MPD Malvern PANalytical MPD Malvern PANalytical X’Pert Pro MRD Sample Prep Cressington Carbon Coater Hummer V Sputterer Quorum 150T ES Sputterer/C-coater Equipment AB-M contact aligner YES III vapor prime oven Solvent/Headway spinner bench EMS Hotplate TrioTech Hotplate Laurell Spin Coater CEE Spin Coater and hotplate Deposition Equipment Amod Evaporator Angstrom Sputter System Modulab Evaporator EvoVac Evaporator Etching Equipment Oxford ICP March 1703 PVA Tepla Ion 10 Harrick HP-001 High Power Plasma Cleaner Thermal Processing Equipment ATV PEO 603 Oxidation Furnace Modulab Oxidation Furnace Modulab Phosphorus Diffusion Furnace Lindberg/Blue Boron Diffusion Furnace Packaging Equipment Microautomation 1006 dicing saw K&S 4523AD Wedge Bonder AML Wafer Bonder Disco DAD 3221 Dicing Saw Metrology Equipment Ambios XP2 Filmetrics Profilm3D Filmterics F20 Wet Benches Equipment Acid process wetbench Oxidation diffusion wetbench Cobleigh 523 General Use Wetbench Cobleigh 525A General Use Wetbench Barnard 107 Cleaning Bench Barnard 107 Acid Bench Barnard 107 Base Bench Barnard 107 Solvent Bench Miscellaneous Equipment MRL oxidation Crest ultrasonic cleaner COMSOL FEA Mixer Coming Soon: New Time of Flight system Time-of-Flight Secondary Ion Mass Spectrometer (ToF-SIMS) PHI TRIFT 1 ICAL is working to upgrade the facility with a new Time-of-Flight Secondary Ion Mass Spectrometer. Coming Soon: New Time of Flight system Field Emission Scanning Electron Microscope(FE SEM) Zeiss SUPRA 55VP Thanks to funding by the National Science Foundation, ICAL will be purchasing and installing a new Field Emission Scanning Electron Microscope. Photo of Atomic Force Microscope Atomic Force Microscope (AFM) VEECO MultiMode V and Dimension 3100 Imaging of conducting and non-conducting surfaces Sub-nanometer resolution Imaging in air and liquid, allowing in-situ measurements and real time imaging of biological and chemical processes AFM can be used to measure and localize many different forces including: adhesion strength, magnetic forces and mechanical properties True 3D imaging and measurements Magnetic, friction, chemical, and phase imaging MORE INFORMATION » Scanning Electron Microscope Scanning Electron Microscope (SEM) JEOL JSM-6100 Secondary Electron Imaging (SEI) Backscattered Electron Imaging (BEI) Cathodo-Luminescence detection and imaging (CL) Energy Dispersive x-ray Spectroscopy (X-Flash fast X-ray mapping detector) Cryo-preparation chamber with cold / hot stage High-resolution imaging Digital image capture Quantitative elemental analysis of the “bulk” material Fast elemental mapping and / or linescan of area of interest Topographical and density imaging Detection of small variations of trace element content Analysis and Imaging of samples in their natural, hydrated state MORE INFORMATION » Photo of instrument X-ray Photoelectron Spectrometer X-ray Photoelectron Spectrometer (XPS) Physical Electronics 5600 Elemental identification and quantification Chemical functional group identification and quantification Chemical state imaging Surface sensitivity Layer-by-layer depth profiling Minimal sample damage Analysis of insulating and conducting samples Data collection / stage automation Cold stage MORE INFORMATION » Photo of instrument X-ray Powder Diffraction Spectrometer X-ray Powder Diffraction Spectrometer (XRD) Scintag X1 Diffraction System Rapid identification of materials Ease of sample preparation Computer-aided material identification Large library of known crystalline structures Multi-sample stage MORE INFORMATION » Photo of Scanning Auger Electron Nanoprobe Scanning Auger Electron Nanoprobe (AUGER) Physical Electronics 710 Rapid sample introduction Low-Z elemental detection Quantitative analysis, mapping, linescan for AES and EDS Surface sensitivity of 1-5 nm Enhanced lateral spatial resolution for elemental analysis (<8 nm with a 20kV, 1nA electron beam ) Limited chemical information Sputter depth profiling (three dimensional analysis) High resolution secondary electron imaging of analysis area MORE INFORMATION » Photo of Epifluorescence Optical Microscope Epifluorescence Optical Microscope OLYMPUS BX-61 Precision objectives including air, oil and water immersion objectives Suite of reflected (fluorescent) filters (DAPI, FITC/CY2, TRITC/CY3, triple band and RBF) Significantly reduced autofluorescence and signal-to-noise ratio DIC imaging (10x, 20x, 40x, 60x) Digital camera imaging for still and time-lapse observations MORE INFORMATION » Photo of Critical Point Dryer Critical Point Dryer (CPD) Tousimis SAMDRI-795 Alternative to air drying for vacuum samples Reduces imaging artifacts Uses liquid CO2 CHARACTERIZATION 3D Optical Profiler – Zygo Atomic Force Microscope – Bruker Edge Contact Angle Measurement – VCA Optima XE Electrical Test Station Microscope – Nikon LV150 Reflectometer – Filmetrics F20 Spectroscopic Ellipsometer – J.A. Woollam alpha-SE Stylus Profilometer – Veeco Dektak-8 DEPOSITION Atomic Layer Deposition – Arradiance GEMStar XT-P E-beam Evaporator – AJA Parylene Coater – SCS Labcoter2 Parylene Deposition System Plasma Enhanced Chemical Vapor Deposition (PECVD) – STS LpX CVD Sputter I – AJA Orion Sputter II – AJA Orion Thermal Evaporator – Denton Vacuum Explorer 14 ETCHING – ASHING Deep Reactive Ion Etcher (DRIE) – STS LpX Pegasus Plasma Cleaner – Samco PC-300 Reactive Ion Etcher (RIE) – Samco RIE-10NR Xenon Difluoride Etcher – Xactix FURNACES Furnace – Tystar Rapid Thermal Processor – AW-610 PACKAGING Laser Cutter – LPKF ProtoLaser R Wire Bonder -Ball- iBond5000 Wire Bonder – Wedge – West Bond 747677E PHOTOLITHOGRAPHY Convection Ovens – Blue M DCC-146-C-ST350 Develop Hood Mask Aligner – Suss MABA6 Mask Aligner – Suss MJB4 Maskless Aligner – Heidelberg MLA150 Maskless Aligner – Heidelberg uPG501 Microscope – Nikon LV150 Polyimide/SU8 Hood Spinner Hood Ultraviolet Flood Exposure System – Inpro Technologies F300S Vacuum Oven – YES WET PROCESSING Acid Hoods Critical Point Dryer – Tousimis Automegasamdri – 915B, Series C Ultrasonic and Megasonic Cleaners Instrument Rigaku oxford diffraction XtaLAB Synergy-S (Cu-Synergy) Rigaku oxford diffraction XtaLAB Synergy-S (Mo-Synergy) Bruker KAPPA APEX II (Molly) STOE STADI-P STOE STADI-MP Mass Spectrometry Instrument Bruker Impact II q-ToF (HRMS w/ UPLC and nano LC) Bruker AmaZon SL (LCMS ESI Flow Injection) Bruker AmaZon SL (LCMS ESI) Bruker Autoflex III MALDI Agilent 6210 LC-TOF (ESI, APCI, APPI) Agilent 5973 GCMS w/ headspace Agilent 5973 GCMS Waters GC-TOF Sciex 6500 Q-Trap (quantitation w/ UPLC and nano LC) NMR spectroscopy Instrument Agilent 600 MHz DD2 w/ HCN cryoprobe AVANCE III 600 MHz AVANCE III 500 MHz w/ direct cryoprobe F500 500 MHz DD2 I500 INOVA 500 MHz Mercury 400 (Agilent MR400 DD2) Agilent Au 400 (MR400 DD2 Console) Solids-400 Mhz (VNMRS console) Physical Characterization Technique Thermal analysis Elemental analysis Optical Optical Optical Azure c300 Gel Imager CFX Connect Cytation3 Plate Reader and Imager Freezer/Mill IncuCyte Live Cell Analysis System Lyophilizers MCR 302 Rheometer NanoSight300 Piuma Nanoindenter Plasma Cleaner Refrigerated Centrifuge Zetasizer Nano ZSP 3D Printing Metals Meltio M450 DED printer 3D Systems ProX 300 #2 LPBF HP T-16585, Dalmata V2.9 inkjet plotter Digital Manufacturing nScrypt 3Dn Benchtop Printer Filament Prusa i3 MK3S Analytical Equipment Density Analyzers Micromertics AccuPyc II 1340 Gas Pycnometer FTIR Thermo Fisher Nicolet IS50 FT-IR FTIR Gas Chromatograph Hewlett Packard 6890 Series GC System Perkin Elmer Clarus 500 Mass Spectrometry Hiden Analytical HPR-20 TGA Mass Spec Stanford Research Systems O100TDP Sputter System RGA Thermogravimetric Differential Scanning Calorimetry TA Instruments Q600 TGA/DSC with Mass Spec Bonding Press Thermal Technology HP30-4560 Vacuum Hot Press Carver Hot Press Brazing CamCo JVAC-12-1824 High Temp Vacuum Furnace Gluing Nordson Asymtek D583 Dispensemate Fluid Dispenser Welding Branson 900 Ultrasonic welder Unitek Phasemaster 7 with Thin-line Model 80 Weld Head AC Resistance Welder Fume Hoods Room 0185C Parts Cleaning Room 0185C Ovens Room 1012 GC Prep Room 1090 Thin Film Processing Room 1091 General Use Room 1091 Solvent Room 1091A HEPA Metrology and Material Characterization Film measurement Filmetrics F20-EXR J A Woollam M-2000 ellipsometer Material Properties Instron 5969 tensile strength tester Jandel Engineering RM3000 4-point probe Other Avantes AVASPEC-3648-USB2-UA optical spectrometer Hitachi TM-4000Plus SEM EDX Surface Profiling KLA Alpha-Step D-600 stylus profiler Zygo ZeScope 3D non-contact optical profiler Furnaces and High Temp Processing Rapid Temp Tube Box H2 CamCo JVAC-12-1824 high temp vacuum furnace CM Furnaces 1212 FL box furnace with hydrogen gas controller CM Furnaces 1630-20-3ZHT 3Z tube furnace with hydrogen gas controller Oven Fischer Scientific Isotemp Model 281 Vacuum Oven Precision Vacuum Oven Model 19 Thermolyne 47900 Furnace Machining and micro-milling HAAS VF-1 CNC vertical mill LPKF ProtoMat S103 micro mill pcb machining Birmingham BP9X49 variable speed vertical mill Grizzly G4002 metal lathe DoALL Vertical Contour Band Saw Enco Belt Sander Grinder Baldor Grinder Buffer ALC Abrasive Blaster Clausing Drill Press DoAll flat granite block Metal Additive Manufacturing Lab Powder Processing Hydrotron NG-DHYD1-30-5-5 downdraft table Ruwac NA35-EX wet immersion vacuum Branson 8800 ultrasonic bath Metal Flammables Cabinets Metal Powder Rated Firer Extinquishers Tyvek Suites Thin Film Processing and Patterning Deposition AJA International Orion-8-HV Sputter Deposition System Veeco S200 ALD Cressington 108 Auto/SE SEM Sample Coater Etch Xei Scientific C 02 Plasma Cleaner Etcher Patterning OAI 206IR Contact Aligner Embossing Jenoptik HEX-01 Hot Embosser Lasers, Microscopes and Cameras Lasers LPKF MicroLine 2820P UV Laser Cutter pcb Patterning Rofin-Sinar Inc FL010 IR Cutter Welder Optical Microscopes Amscope MU300 Digital Camera and Software Leica DMR Leica Wild M3Z Stereomicroscope Zeiss Axiotron Cameras Vision Research-MIRO4-1024MM High Speed Camera Metallography Isomet Low Speed Diamond Saw Pace Giga 0900 Vibratory Polisher Pace NANO-2000T Automated Polisher Pace Pico 155 Saw Pace Terapress 7001 Hot Press Vari Pol VP-50 Polisher Miscellaneous Instruments Alcatel ASM180T-Autocal He Leak Detector Restek 28500 Flammable Gas Detector TIF 8800X Flammable Gas Detector Met One Airborne Particle Counter Browne and Sharp Tesa-Hite Micrometer Pexto Metal Sheet Cutter Precision Granite Flat Granite Block SHOP FOX M1011 Metal Sheet Bender CAD Workstation 110°C Oven oven110 90°C Oven oven90 AFM-Asylum afm-asylum Aix-ccs aix-ccs Aix200 aix200 Aixtron Black Magic graphene CVD furnace aixtron-graphene AJA Evaporator aja-evap Alphastep 500 Profilometer alphastep Alveole Primo alveole AMAT P5000 Etcher p5000etch AMT Oxide Plasma Etcher amtetcher ASML PAS 5500/60 i-line Stepper asml Aw610_l aw610_l Aw610_r aw610_r Biologic SP-300 biologic Blue M Oven bluem Bruker Dimension ICON AFM Critical Point Dryer cpd CytoViva HSI cytoviva Digital Instruments AFM Nanoscope Dimension 3000 afm2 DISCO Backgrinder disco-backgrind DISCO Wafer Saw DISCO wafersaw DLS: Brookhaven Instrument Nanobrook Omni Drytek 100 Plasma Etcher drytek2 Ebeam Process Wet Bench wbebres Epi2 epi2 Epilog Fusion M2 Laser Cutter lasercutter EV Group Contact Aligner evalign EV Group Wafer Bonder evbond EVG 101 Spray Coater evgspraycoat Ex Fab Develop Wet Bench wbexfab_dev Ex Fab Solvent Wet Bench wbexfab_solv FEI Titan Environmental Transmission Electron Microscope (TEM) Fiji 1 fiji1 Fiji 2 fiji2 Fiji 3 fiji3 Finetech Lambda flipchipbonder First Nano carbon nanotube CVD furnace cvd-nanotube Fisher Accuspin 24C centrifuge Flexus 2320 Stress Tester stresstest Formlabs Form2 3D Printer form2-3d-printer Fujifilm Dimatix Ink Jet Printer nanoinkjet Fumehood 1 fumehood1 Fumehood 2 fumehood2 Fumehood 3 fumehood3 Fumehood 4 fumehood4 Gasonics Aura Asher gasonics Glovebox-l glovebox-l Glovebox-r glovebox-r GnP POLI-400L cmp Headway 3 Manual Resist Spinner headway3 Headway Manual Resist Spinner headway2 Heidelberg MLA 150 heidelberg Heidelberg MLA 150 – 2 heidelberg2 HMDS Vapor Prime Oven, YES yes HMDS Vapor Prime Oven, YES2 yes2 Hummer V Sputter Coater hummer Ika T18 Disperser disperser Innotec Evaporator Innotec Intlvac Evaporation Intlvac_evap Intlvac Ion Mill Etcher Ion Mill_fcr (at SNSF) Jasco UV-Vis-NIR jasco-uv-vis-nir Karl Suss MA-6 Contact Aligner 1 karlsuss Karl Suss MA-6 Contact Aligner 2 karlsuss2 Karl Suss Wafer Bonder ksbonder Keyence Digital Microscope VHX-6000 keyence KJL Evaporator KJL Lakeshore Hall Measurement System LakeshoreHall Lam Research TCP 9400 Poly Etcher lampoly Laurell Manual Resist Spinner laurell-R LEI1500 Contactless Sheet Resistance Mapping eddycurrent Lesker Sputter lesker-sputter Lesker2 Sputter lesker2-sputter Lithography Solvent Bench lithosolv Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls Mask Scrubber masksrub Matrix Plasma Resist Strip matrix Metalica Sputter metalica MFS Large Evaporator MFS Large MFS Small Evaporator MFS Small Micro Mist Coater PDR-04 micromist-coater micromanipulator6000 IV-CV probe station micromanipulator6000 Minitech-GX Micromill micromill MRC Reactive Ion Etcher mrc MVD mvd Nanoscribe Photonics GT nanoscribe Nanospec 210XP nanospec2 Nanospec 3 nanospec3 Oerlikon Leybold Sputter Optomec Printer optomec-printer Oriel Deep UV Exposure Lamp oriel-duv Oxford Dielectric Etcher oxford-rie Oxford III-V etcher Ox-35 Oxford PlasmaPro 80 – Reactive Ion etcher RIE: Oxford PlasmaPro 80 (at SNSF) Park XE-70 XE-70_snl PDMS Hotplate hotplate-1 PDMS Spin Coater spincoat-g3p8 PDMS Workbench PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox Plasma Therm Versaline LL ICP Metal Etcher PT-MTL Plasmaetch PE-50 plasma-etch PlasmaTherm Shuttlelock PECVD System ccp-dep PlasmaTherm Versaline HDP CVD System hdpcvd Prometrix Resistivity Mapping System prometrix QSonica Q700 Sonicator sonicator Reflectance Spectrometer Filmetrics F40 filmetrics Samco PC300 Plasma Etch System samco Savannah savannah Sensofar S-neox s-neox Sinton Lifetime Tester sinton-lifetime-tester Solidscape Wax 3D Printer 3d-wax-printer SPF Measurement Bench SPTS uetch vapor etch uetch STS Deep RIE Etcher stsetch STS Plasma Enhanced CVD sts SVG Develop Track 1 svgdev SVG Develop Track 2 svgdev2 SVG Resist Coat Track 1 svgcoat SVG Resist Coat Track 2 svgcoat2 Technics Asher technics Tencor P2 Profilometer p2 Teos2 teos2 Thermco1 thermco1 Thermco3 thermco 3 Thermco4 thermco4 ThermcoLTO thermcoLTO ThermcoNitride thermconitride1 ThermcoPoly1 thermcopoly1 ThermcoPoly2 thermcopoly2 Thermolyne thermolyne Thermoscientific Oven thermoscientific-oven Thinky AR-100 Mixer thinky-mixer Tylan9 tylan9 TylanBPSG tylanbpsg Tylanfga tylanfga Ultraviolet Photoresist Cure uvcure Voltera voltera Wet Bench Clean 1 wbclean-1 Wet Bench Clean 2 wbclean-2 Wet Bench Clean_res- hotphos wbclean_res-hotphos Wet Bench Clean_res-hf wbclean_res-hf Wet Bench Clean_res-piranha wbclean_res-piranha Wet Bench CMOS Metal (wbclean3) wbclean3 Wet Bench Decontamination wbdecon Wet Bench Flexcorr 1 wbflexcorr-1 Wet Bench Flexcorr 2 wbflexcorr-2 Wet Bench Flexcorr 3 wbflexcorr-3 Wet Bench Flexcorr 4 wbflexcorr-4 Wet Bench Flexible Solvents wbflexsolv Wet Bench Flexible Solvents 1 wbflexsolv-1 Wet Bench Flexible Solvents 2 wbflexsolv-2 Wet Bench Germanium wbgen2 Wet Bench Miscellaneous wbmiscres White Oven white-oven Woollam woollam Xactix Xenon Difluoride Etcher xactix Xplore Micro Compounder N/A XPS: PHI VersaProbe 1 PHI_XPS_snl XPS: PHI VersaProbe 3 3C Technical GCA AutoStep 200 5x Reduction Stepper The GCA AutoStep 200 Stepper is an I-line 5x reduction stepper with repeat exposure capabilities. It is capable of submicron resolution and high accuracy alignment. AJA ATC 2200 UHV Sputtering System The AJA ATC 2200 Sputtering System is a PVD tool which deposits films on a substrate by a method known as sputtering. Magnetron sputtering uses accelerated, positively charged ions from a plasma source to deposit films with an increased deposition rate and more controlled electron bombardment than evident in other sputtering systems (such as diode sputtering). AJA ATC Orion 8 UHV Sputtering System The AJA ATC Orion 8 UVH Sputtering System is a PVD tool which deposits films on a substrate using magnetron sputtering. Magnetron sputtering uses accelerated, positively charged ions from a plasma source to deposit films with an increased deposition rate and more controlled election bombardment than evident in other sputtering systems (such as diode sputtering). Angstrom EvoVac Electron Beam Evaporator The Angstrom EvoVac Electron Beam Evaporator is a PVD tool which evaporates high melting point materials, such as refractory metals and ceramics, using an electron beam. The EvoVac provides multiple sources of flexibility in its deposition system including resistive thermal evaporation, ion assisted and sputter deposition, as well as principal electron beam evaporation. Angstrom Nexdep Thermal E-Beam Evaporator The Angstrom Nexdep Thermal E-Beam Evaporator is a PVD tool that offers E-Beam and Thermal evaporation for a variety of high melting point substrates. The NexDep can be configured for a variety of PVD processes including resistive thermal evaporation, sputter and ion assisted deposition, and principal E-Beam and Thermal evaporation capacities. Bachur and Associates UV Flood Exposure System The system’s exposure optics employ a proven, high performance optic train that employs an elliptical reflector, dielectric heat removing primary and secondary mirrors, a multi-element optical integrator system and collimating optics. The optical integrator system produces non-coherent radiation that virtually eliminates the detrimental effects of diffraction. These high intensity systems can resolve fine structures even in thick resist. Bruker Dimension Icon AFM The Bruker Dimension Icon AFM (Atomic Force Microscope) is a very high resolution scanning microscope used in scanning microscopy (SPM) which produces three dimensional images. It is used for nanoscale surface topography, nano-mechanical, nano-electircal, and nano-scale chemical mapping, and morphology measurement. Despatch LCC1-15-5 Resist Oven The Despatch LCC1 Resist Oven are used in die-curing and other semiconductor packing processes. The ovens are configured for 50/60 Hz. Disco DAD3240 Automatic Dicing Saw The Disco DAD3240 Dicing Saw is a compact, manual, precision dicing saw with an automatic function which is common to the DAD3000 series. Its operating system and LCD touch panel allow for intuitive handling and it can cut through a range of materials, including difficult-to-cut materials essential to the nanofabrication process such as silicon. EBARA ESR20N Vacuum Pump The EBARA ESR20N Vacuum Pump is an ESR (Energy Saving Roots) multistage dry vacuum pump. It is engineered for clean to medium processes and has minimum nitrogren purge requirements with no nitrogen purge requirements for clean processes. The PNF uses a standardized set of EBARA pumps throughout the facility to reduce equipment downtime. EBARA EV-A03-1 Vacuum Pump The EBARA EV-A03-1 Vacuum Pump is a small, air cooled dry vacuum pump which offers high pumping speeds (9 cfm) and a no-contact design. The PNF uses a standardized set of EBARA pumps throughout the facility to reduce equipment downtime. EBARA EV-A06-1 Vacuum Pump The EBARA EV-A06-1 Vacuum Pump is an air cooled dry vacuum pump which offers high pumping speeds (21.6 cfm) and high water vapor pumping (350 g/hr) The PNF uses a standardized set of EBARA pumps throughout the facility to reduce equipment downtime. EMS 1300 Critical Point Dryer The procedure of critical point drying is an efficient method for drying delicate samples for SEM applications. The EMS 1300 Critical Point Dryer provides a clear view of the fluid level and visibility of the phase change at the critical point. FEI Quanta 650 FEG SEM with Nabity Pattern Generator The FEI Quanta 650 FEG SEM (Scanning Electron Microscope) is a variable pressure microscope used for high resolution imaging. It is capable of resolving features on a scale of less than 5 nm. It is equipped with a Field Emission Gun (FEG) which allows for bright-field and dark-field sample imaging. The SEM is equipped with a total of 8 detectors for the purpose of imaging and analysis as well as a Nabity Nanometer Pattern Generation System (NPGS) which allows for advanced electron beam lithography by means of the SEM. Filmetrics F3 Film Thickness Spectral Reflectometer The Filmetrics F3 Film Thickness Spectral Reflectometer is most commonly used to measure thin-film properties by adding thickness and refractive index software modules. The thickness and reactiveness can be measured in less than 3 seconds. Fisher Scientific Isotemp FMS Refrigerator The Fisher Scientific Isotemp FMS Refrigerator is use for safe storage of volatile materials, pharmaceuticals, clinical reagents, and biological samples. Fisher Scientific Revco FMS Freezer The Fisher Scientific Revco FMS Freezer is used for medical and scientific applications such as storage of reagents, pharmaceuticals, biologicals or other commonly used laboratory materials. FMS Thin Film Stress Measurement System The FMS Thin Film Stress Measurement System is used to test the stress of different films and substrates. It can also test the coefficient of thermal expansion (CTE) of films. Heidelberg MLA150 Direct Write Lithographer The Heidelberg Direct Write Lithography system is a flexible, high resolution pattern generator for direct writing. The MLA150 creates the design and exposes it directly onto a wafer, no photomask is necessary. The system features environmental control, temperature stabilization, backside alignment, and a 150 x 150 mm2 exposure area. Horiba UVISEL 2 Spectroscopic Ellipsometer The UVISEL 2 is an accurate and sensitive ellipsometer and includes a wide range of integrated automated features useful for the investigation of all materials. The UVISEL 2 is simple to operate and has the performance required for characterizing all current materials as well as the next generation of materials and structures. IoN Wave 10 Plasma Asher The IoN Wave 10 Plasma Asher is a mid-size wafer batch plasma microwave asher used for the removal of photoresists from etched wafers, wafer descum, and wafer cleaning prior to wet etching, among other applications. It is capable of high photoresist ashing rates with minimal exposure to electro static discharge (ESD). K&S 4129 Wedge Bonder The K&S 4129 Wedge Bonder is an aluminum and gold wire wedge bonder that is used for binding devices. Keysight B1500A Semiconductor Device Analyzer The Keysight B1500A Semiconductor Device Analyzer provides a wide range of measurement capabilities to cover the electrical characterization and evaluation of devices, materials, semiconductors, active/passive components, or virtually any other type of electronic device with uncompromised measurement reliability and efficiency. KLA-Tencor P-7 Surface Profilometer The KLA-Tencor P-7 Surface Profilometer is a research grade stylus profiler for surface metrology and measurement. The KLA-Tencor P-7 is software equipped with parameters for a wide range of measurements including depth, step height, roughness, waviness, slop, flatness, distance, bearing ratio, radius of curvature, and more. Memsstar Orbis Alpha Oxide Etch System The Memsstar Orbis Alpha Oxide Etch System is a small footprint, self-contained oxide etch system which utilizes hydrogen fluoride etchants along with memsstar’s unique patented high volume production process to enable researchers to develop production-capable processes for the next generation of MEMS devices. MiniPack Torre MVS-45X Vacuum Sealer The Minipack MVS 45X chamber sealer is an industrial-level vacuum sealer designed to packaging products. The large 18.5″ x 16″ x 4.5″ chamber allows plenty of room for packaging a variety of products. The basin is seamless, making it easy to clean. Nikon Eclipse L200 Microscope The Nikon Eclipse L200 Optical Microscope is a microscope capable of greater contrast, high resolving power and darkfield images up to three times brighter than other models. It can be used for the precise optical inspection of wafers, photo masks, reticles and other substrates. Pfeiffer HiCube 80 Turbo Pumping Station The HiCube 80 is a versatile, mobile Turbo Pimping Station. It uses a HiPace turbo pump as well as a backing pump that are inter-coordinated for a wide range of applications and fast pump downtime. Pfeiffer Vacuum ADIXEN ASM 380 Leak Detector The ASM 380 is a high performance, mobile, leak detector. It has an ACP 40 dry backing pump and a high vacuum pump which allows for high testing sensitivity and short pump down times, even for large volumes. Plasma-Therm Apex SLR HDPCVD The Plasma-Therm Apex SLR is a High Density Plasma Chemical Vapor Deposition (HDPCVD) system. It uses an Inductively Coupled Plasma (ICP) source to generate higher density plasma than a PECVD system providing deposition at lower temperatures for higher quality, low temperature films. Plasma-Therm ICP Chlorine Etch The Plasma-Therm ICP (Inductively Coupled Plasma) Chlorine Etch is an etching system which uses chlorine based chemistries to etch metal films and compound semiconductors. Chlorine plasma etching differs from Fluoride etching (see Plasma-Therm ICP Fluoride Etch) in respect of the chemistries, Chlorine and Fluoride based, used in each. Plasma-Therm ICP Fluoride Etch The Plasma-Therm ICP (Inductively Coulped Plasma) Fluoride Etch is an etching system which uses fluoride solutions to etch metal films and compound semiconductors. Fluoride plasma etching differs from Chlorine etching (see Plasma-Therm ICP Chlorine Etch) in respect of the chemistries, Chlorine and Fluoride based, used in each. Plasma-Therm Versaline Deep Si RIE The Plasma-Therm Versaline DSE (Deep Silicon Etcher) is a deep silicon etcher Plasma RIE that runs the Bosch Si process. It is primarily used for deep etching of MEMS structures in silicon. The Bosch process is used for the creation of deep, almost vertical, high aspect ratio structures and is an alternative to cryogenic chuck adapted ICP RIE systems and allows for deeper SI etches and a higher aspect ratio relative to these systems. Plasma-Therm Vision 310 PECVD The Plasma-Therm Vision 310 PECVD (Plasma Enhanced Chemical Vapor Deposition) system is a CVD system which utilizes plasma to significantly lower the temperatures at which a given film is deposited on a substrate. The Vision 310 can be used for the controlled deposition of SiNx, SiC, a-Si, and SiOxNy films, among others. Plassys Electron Beam Evaporator The Plassys Electron Beam Evaporator MEB550S is a state of the art tool for Electron Beam Evaporation, a speciality PVD process here at the PNF where electron beam processes are used in highly specialized nanofabrication to meet the diverse needs of PNF based researchers, students, and clients (see Angstrom EvoVac Electron Beam Evaporator and Angstrom NexDep Thermal Electron Beam Evaporator). Electron beam evaporation is one of two broad families of PVD processes, the other being Sputtering. The PNF can accomodate users interested in either (see AJA ATC 2200 UHV Sputtering System and AJA ATC Orion 8 UHV Sputtering System). Questar Q7800 Automatic Wedge Bonder The Questar Q7800 Automatic Wedge Bonder is used for connecting wires in chips, sensors, and such. Raith EBPG5000 Plus E-Beam Writer The Raith EBPG5200 E-Beam lithography system is a high-performance nanolithography system used chiefly for write lithography and R&D mask making. It is the latest model in the EBPG series, preceded by the EBPG5150. Signatone Checkmate CM21X Probe Station The Signatone CheckMate Probe Station is an ultra-stable 200mm / 300mm analytical probe station with coarse and fine wafer stage movement to provide fast wafer movement as well as submicron resolution. SUSS MJB4 Manual Mask Aligner The MJB4 is a high precision manual mask aligner that works with small substrates, wafers, and pieces. It is frequently used for MEMS and optoelectronic applications. It can handle fragile III-V materials. Tystar Mini-Tytan 4600 Furnace System The Tystar Mini-Tytan 4600 Furnace system is designed for diffusion, oxidation, and LPCVD applications. The system consists of four vacuum tubes in one furnace stack. Two of these are atmospheric pressure tubes and the other two are low-pressure tubes. The Tystar 4600 can perform low-temperature oxide processes and the deposition of materials such as silicon nitride and polysilicon. The Tystar 4600 offers high process uniformity and incorporates some of the most advanced concepts in high-performance wafer processing. Ultratech/Cambridge Fiji G2 Plasma-Enhanced ALD The Ultratech Fiji G2 plasma system is a modular high-vacuum ALD (Atomic Layer Deposition) system that accommodates a wide range of deposition modes while using a flexible system architecture that permits multiple configurations of precursors and plasma gases. The result is a plasma ALD system that reproduces the thermal and plasma enhanced ALD films of the literature as well as providing experimental flexibility for future ALD innovations. Ultratech/Cambridge Savannah ALD System Ultratech/Cambridge Savannah ALD System is equipped with high-speed pneumatic pulse valves to enable thin film deposition on Ultra High Aspect Ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1. Ultron UH104 UV Curing System The Ultron UH104 UV Curing System is used to toughen and strengthen polymer materials by cross-linking polymer chains. It accommodates up to 8″ (200mm) wafers on film frames or grip rings and up to 12″ (300mm) wafer capability. Ultron UH114 Wafer/Frame Film Applicator The Ultron UH114 Wafer/Frame Film Applicator is used in the process of slicing/ sawing applications in which lamination is crucial. This device ensures a bubble free lamination with adjustable features. WAFAB Acid/Base Bench The WAFAB Manual Acid/Base Bench is a non-automated front-acces wet bench designed to handle acidic and basic materials without degrading. WAFAB Bottle Washer Bench The WAFAB Manual Bottle Washer is a non-automated wet station designed for washing glassware used in various processes and dispoing of waster water. WAFAB Cleaning Bench The WAFAB Cleaning Bench is a non-automated front-access wet bench designed for cleaning wafers before further processing. WAFAB Developer Bench The WAFAB Manual Developer Bench is a non-automated front-access wet bench designed to handle chemicals used for developing photoresist. WAFAB HF/TMAH Bench The WAFAB Manual Solvent Bench is a non-automated front-access wet bench designed to handle hydrofluoric acid and tetramethylammonium hydroxide used in etching. WAFAB Solvent Bench The WAFAB Manual Solvent Bench is a non-automated front-access wet bench designed to handle solvents used for cleaning substrates. WAFAB Toxic Corrosives Bench The WAFAB Manual Toxic Corrosives Bench is a non-automated front-access wet bench deigned to handle, contain, and properly dispose of toxic and corrosive materials. YES CV200 RFS Plasma Strip / Descum System The YES CV200 RFS Plasma Strip / Descum System is used for the removal of thick layers of photoresist or polymide in short production times; accomodating the strict requirements of contemporary front-end semiconductor processing equipment. The YES CV200 RFS operates in two main modes, a powerful plasma stripping mode removes tough and / or thick resists while a gentler descum mode can be used to deal with the cleaning of inorganic substrates. YES G1000 Plasma Cleaning System The YES G1000 Plasma Cleaning System is a plasma cleaning system used for the cleaning and low temperature descum of substrates, as well the surface modification and gentle cleaning of inorganic substrates. The use of plasma at a low generation frequency (40 kHz) in substrate cleaning allows for flexibility around cleaning processes, including, for example, the cleaning of electronically sensitive devices. The YES G1000 generates plasma between an active and grounded electrode plate, free electrons, created in the plasma field, are drawn down by the grounded plate allowing only active ions to pass through to clean components; the result is uniform and consistent processing which, as highlighted previously, leaves the electronic properties of cleaned components unchanged. YES-58TA Vacuum Bake/HMDS Vapor Prime and Image Reversal System The YES Vapor Prime and Image Reversal Oven utilizes NH3 vapor to allow the creation of negative images using a positive photo-resist. CNC micro milling machine Back End Processing Disco Automatic Dicing Saw 3220 Back End Processing PDMS Clean Space Back End Processing QuikLaze-50 ST2 Back End Processing Thinky Mixer Back End Processing Tousimis AutoSamdri 815A Back End Processing Tousimis Autosamdri 815B Back End Processing TPT Wedge/Ball Bonder Back End Processing UVO Cleaner Back End Processing Vapor treatment Back End Processing West Bond Ball Bonder Back End Processing West Bond Wedge Bonder Back End Processing Idonus HF VPE-150 Dry Etching Oxford Plasmalab 100 RIE/ICP Dry Etching Oxford Plasmalab 80+ RIE Dry Etching Plasma Etch PE100 Dry Etching Plasma-Therm SLR RIE/ICP Plasma Etch System Dry Etching PVA TePla PS100 Dry Etching Trion RIE/ICP Dry Etcher Dry Etching Xactix XeF2 Etcher Dry Etching GDSII Editor PC Ebeam Lithography GDSII Editor PC #2 Ebeam Lithography Vistec EBPG 5200 Ebeam Lithography FEI Apreo SEM Materials Characterization FEI Quanta FEG 250 Materials Characterization FEI Scios DualBeam FIB/SEM Materials Characterization Microfluidics Workstation – Valves controller Materials Characterization Thermofisher Talos F200X G2 S/TEM Materials Characterization Veeco Scanning Probe Microscope Materials Characterization Zeiss Sigma 500 Materials Characterization AJA DC Sputter Deposition Tool Metalization / Thin Film Deposition AJA RF Sputter Deposition Tool Metalization / Thin Film Deposition Beneq TFS200 Atomic Layer Deposition Metalization / Thin Film Deposition Denton 502A Thermal Evaporator Metalization / Thin Film Deposition Denton Desk IV Sputter Coater Metalization / Thin Film Deposition Denton Discovery 18 Sputter System Metalization / Thin Film Deposition Denton Discovery 635 Sputter System Metalization / Thin Film Deposition Emitech K575X Sputter Coater Metalization / Thin Film Deposition Nickel Electroforming System Metalization / Thin Film Deposition Oxford Plasmalab 80+ PECVD Metalization / Thin Film Deposition PDS 2010 Parylene Coater Metalization / Thin Film Deposition Plasma-Therm SLR PECVD Metalization / Thin Film Deposition Temescal BJD 1800 Ebeam Evaporator (1) Metalization / Thin Film Deposition Temescal BJD 1800 Ebeam Evaporator (2) Metalization / Thin Film Deposition Agilent B1500A Semiconductor Device Analyzer Metrology Axio Fluorescence Microscope Metrology Dektak 150 Metrology DektakXT Stylus Profilometer Metrology Filmetrics F20 Metrology Filmetrics F20 (2) Metrology Filmetrics Profilm3D Optical Profiler Metrology HP 4155 Parametric Analyzer/Probe Station Metrology J.A. Woollam M-2000D Spectroscopic Ellipsometer Metrology Jandel Four Point Probe with RM3000 Test Unit Metrology Keyence VHX1000 Metrology Rudolph Auto EL Ellipsometer Metrology Toho Technology FLX-2320 Thin Film Stress Measurement System Metrology Veeco NT1100 Optical Profiling System Metrology Zeiss Axio Imager Optical Microscope Metrology EVG620 Lithography/NIL System Photolithography Heidelberg MLA150 Laser Writer Photolithography HTG Mask Aligner Photolithography Karl Suss MA6 Mask Aligner Photolithography Karl Suss MJB3 Mask Aligner Photolithography AccuThermo AW 610 RTP (1) Thermal Processing AccuThermo AW 610 RTP (2) Thermal Processing Carbolite HTCR 6/28 High Temperature Clean Room Oven Thermal Processing Carver Hot Embossing System Thermal Processing Fisher Oven Thermal Processing Hot Laminator – GBC Catena 35 Thermal Processing Lindberg Mini-Mite Tube Furnace Thermal Processing Ulvac MILA-3000 Minilamp Annealer Thermal Processing AB-M Mask Aligner Acid Wet Bench Allwin21 Rapid Thermal Annealing System Asylum Bio-AFM Asylum MF3D AFM w/ 3D haptic controller and liquid cell Atomic Layer Deposition (ALD) CPK Spin/Develop/Etch Bench Deep Reactive Ion Etching System (DRIE) – STS MESC Multiplex ICP Dektak Profilometer Developer Wet Bench Disco Dicing Saw -DAD321 EDP Wet Bench Electroplating Bench Filmetrics Ellipsometer Finetech Flip Chip Bonder Four Point Probe Heidelberg DWL66FS Laser Pattern Generator (Photomask Generator) HF-8 Barrel Asher Hitachi Bench Top SEM KOH & TMAH Wet Bench Kulicke & Soffa Ball Wirebonder Kulicke & Soffa Wedge Wirebonder Leitz Ergolux Microscope Lesker E-beam Evaporator Lesker PVD 75 Sputtering System Lindberg Tube Furnaces (Oxidation, Annealing, Diffusion & General Thermal Treatments) Lindburg Blue M Vacuum Ovens MA6/BA6 Mask Aligner March Reactive Ion Etcher Molecular Vapor Deposition (Hydrophobic Coatings) Oxford Plasma Enhanced Chemical Vapor Deposition Parylene C Depostion System PDMS Spinner Phantom Hi-Speed Camera Photolithography Developer Bench Photoresist Spinner Bench Probe Station QFI Mid-Wave Thermal Imaging System Rapid Thermal Processing System RCA Cleaning Wet Bench Solvents Wet Bench Solvents Wet Bench (in Lithography Bay) Spin Rinse Dryer SPTS Primaxx HF Vapor Etch System Stereoscope Suss SB6e Wafer Bonder Technics Sputtering System Ted Pella Sputter Coater Thermo-Fisher Scientific Apreo Scanning Electron Microscope (SEM) Toho Thin Film Stress Measurement System Tousimis Critical Point Dryer Trion ICP / RIE Chlorine & Flourine Metal Etching System VASE Ellipsometer Xactix XeF2 System YES Image Reversal Oven Yes Polimide Curing Oven Zeiss Axiolmager M2M Microscope Zeiss Axiotron Microscope Zygo New View 7300 Ellipsometer AB-M Allwin21 Applied MicroStructures Asylum Asylum Beneq Cascade CPK Disco Filmetrics Finetech Gold Series Rhetech Heidelberg Hitachi JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing JST Manufacturing Kulicke & Soffa (K&S) Kulicke & Soffa (K&S) Kurt J Lesker Kurt J Lesker Leitz Lindberg Lindburg March Modular Process Technology Oxford Instruments Plasmaline QFI SCS Labcoter Solitec SPTS SPTS Suss SUSS MicroTec Technics Ted Pella Thermo-Fisher Scientific TOHO Technology Tousimis Trion Veeco Veeco Vision Research Woollam Xactix Yield Engineering Systems Yield Engineering Systems Zeiss Zeiss Zygo Scanning Electron Microscopy (SEM) – Hitachi S-4700 with EDS Scanning Electron Microscopy (SEM) – FEI Helios 600 Nanolab with EDS Transmission Electron Microscopy (TEM)– Thermo Scientific Talos F200X with EDS Atomic Force-Infrared (AFM-IR) – Bruker nanoIR3 Atomic Force Microscopy (AFM) – Asylum Research MFP3D Nanoindenter – Optics11 Piuma fabrication FABRICATION Thin film deposition Atomic Layer Deposition (ALD) – Veeco/Cambridge Nanotech Savannah S200 Plasma Enhanced Chemical Vapor Deposition (PECVD) – Advanced Vacuum Vision 310 E-beam evaporation – KJL PROLine PVD 75 E-beam evaporation – Thermionics VE100 Metal Sputtering – KJL PVD 75 Reactive Ion Etching Deep Reactive Ion Etching (DRIE) – Alcatel AMS 100 Lithography Mask Aligner – Karl Suss MA6/BA6 E-beam lithography – NPGS on FEI Helios FIB and Hitachi SEM Surface Patterning Focused Ion Beam (FIB) – FEI Helios 600 Nanolab spectroscopy SPECTROSCOPY X-ray Photoelectron Spectroscopy (XPS) – Kratos Axis Ultra DLD with UPS Ultraviolet Photoelectron Spectroscopy (UPS) – on Kratos XPS Microspectrophotometry (MSP) – Craic 20/30 PV Fourier Transform Infrared (FTIR) – Bruker Optics Hyperion 1000 with Tensor 27 Atomic Force-Infrared (AFM-IR) – Bruker nanoIR3 Spectroscopic Ellipsometry – J.A. Woollam VASE Energy Dispersive Spectroscopy (EDS) – Oxford Instruments, INCA PentaFET X-ray Diffraction (XRD) – Rigaku SmartLab microscope Specimen Preparation FIB lift-out Nanomanipulator – FEI EasyLift Cryo Ultramicrotome – Leica EM UC7 Critical Point Dryer Sputter Coater – Cressington 108 Auto Additional Metrology Stylus Profilometry – KLA-Tencor P-6 Reflectometry – F50 Thin Film Mapper Optical Microscopy – Nikon … Misc. Processing Oxygen Plasma Cleaner – Glow Research Wet benches Spin coater Hot plates Orbital shaker Photoresist Laminator Ion miller Oxford ionfab 300 Dicing Saw ACT Electroplating – Nickel Maskless Lithography – Bruker Lightning NASCENT nmFab Services sputtering KJL south cleanroom TriboIndenter TI 950 : Nanomechanical characterization Vacuum Oven (Blue vacuum Oven) Wire bonder (Au ball ) Kulicke & Soffa Wire Bounder West-bond 7400A Acid Hood Metal etch (no Au) Acid Hood Resist removal (no Au) Acid Hood KoH Etch Acid Hood ALD Cambridge NanoTech SavannahTM 200 ALD Fiji w/ remote plasma & ozone generator Anneal (Doped) – MRL Anneal (Field Oxide) – MRL Anneal (Gate Oxide) – MRL Anneal (Undoped) – MRL Asher (Microwave) 300 PVA Tepla Asher Nordson March PX-250 Atomic Force Microscope – DI3000 Atomic Force Microscope BRUKER Icon – New Chemical-mechanical planarization (CMP) Diffusion Doping POCl3 – MRL Diffusion Field Oxide – BRUTE- Undoped Tube Diffusion Gate Oxide – BRUTE – 4″ Tube Diffusion Oxide – BRUTE – Undoped – 4″ Diffusion Pre-clean Acid Hood Diffusion Pre-clean Acid Hood Diffusion Pre-clean Acid Hood Diffusion Sintering -BRUTE- 4″ E-beam Evaporator & Ion Assisted – CHA E-beam evaporator CHA E-beam evaporator CHA E-line Raith – Electron beam lithography Ellipsometer J.A. Woollam M-2000 DI Etcher ICP 2300 Exelan Flex LAM Etcher ICP Deep Silicon PlasmaTherm Versaline Etcher ICP Oxford 100 Etcher ICP STS Etcher RIE 790 Plasma Therm Etcher RIE 790 Plasma Therm Etcher RIE Batchtop PlasmaTherm Etcher RIE Oxford 80 Etcher Trion Oracle Four-point probe Veeco FPP5000 Furnace (Sintering ) – MiniBrute HMDS – YES Oven LPCVD Amorphous silicon – MRL LPCVD Low Temp Oxide – MRL LPCVD LTO PTL LPCVD Nitride – MRL LPCVD Nitride PTL LPCVD PolySilicon PTL Optical Confocal Microscope LEXT Olympus Optical Microscope Olympus BH-2 Optical Microscopes Olympus BX51 Optical Profilometer -Dektak 150 PECVD (790 Plasma Therm) Photolithography E-beam writer Jeol 6000 FSE Photolithography i-g line mask aligner – EVG Photolithography i-g line mask aligner – MJB4 Suss Microtec Photolithography i-g line mask aligner SussMicrotec -MA6/BA6 Photoresist Spin Coater – (no Au) Photoresist Spin coater Photoresist Spin coater- Brewer Science Plasma Cleaner _TEM holder Rapid Thermal Anneal – AG Associates-Allwin610 III-V Rapid Thermal Anneal Silicon -Allwin 610 Rapid Thermal Process -AET- SEM ZEISS Neon 40 – Bruker EDS – Raith Elphy pattern generator Solvent Hood -Lift off applications Solvent Hood Cr/Al etch Solvent Hood (No Au) Solvent Hood Solvent Hood Spectrophotometer Nanospec AFT 180 Spectrophotometer Nanospec Reflectometer AFT Spin Rinse Dryer SAT (no PR. no Metal) Spin Rinse Dryer Verteq (No Photoresist, no Metal) Sputter Coater Emitech K575X -SEM sample preparation Sputter DC Aluminum/ Ti – UNIVEX450 Sputter DC/RF- KJL TEM TECNAI G2 F30 X-TWIN Thermal Evaporator (Metal Deposition) – Veeco UV Ozone cleaner Wafer Bonder AML Wafer Press XRD Rigaku SmartLab Lithography: i-line Stepper (5x) Contact Mask Aligner Direct Write Laser/Mask Writing Electron Beam Lithography (JEOL JBX-6300FS) Nanoscribe Nano 3D printer Etch: Deep Reactive Ion Etch Chlorine and Fluorine ICP Etch Reactive Ion Etch HF and XeF2 Vapor Etch Deposition: Chemical Vapor Deposition (CVD) Atomic Layer Deposition (ALD) Electron Beam Evaporation Sputter Electroplating (Au, Cu, Ni, others) Parylene C, N Core Processing: Atmospheric Diffusion Furnace Rapid Thermal Anneal (RTA) Vacuum Anneal Wet Chemical Processing Precision Wafer Bonding Lapping / Polishing Wire Bonding Dicing Saw Metrology: Optical Microscopy Scanning Electron Microscopy (SEM) Contact and Non-contact Profilometers White Light Interferometer Reflectometer AFM – Molecular Vista PiFM AFM Bruker ICON AFM CypherES Apreo Variable Pressure SEM Bruker D8 Discover with IμS 2-D XRD System capillary Differential Scanning Calorimeter Critical Point Drier Dektak Profilometer Dimple Grinder Dual beam UV/vis Dualbeam FIB-SEM Electron Back-Scatter Diffraction (EBSD) – Apreo SEM Energy Dispersive X-ray Spectroscopy (EDS) – Dualbeam FIB-SEM Energy Dispersive X-ray Spectroscopy (EDS) – XL30 SEM EVOS Falling Ball Viscometer Gatan Solarus Plasma Cleaner GDOES In-situ SEM Indenter Ion Mill IONTOF TOF.SIMS 5 Time-of-flight secondary ion mass spectrometer Isothermal Titration Calorimeter Kratos Axis Ultra DLD X-ray Photoelectron Spectrometer Lapping/Polishing Station Laser Confocal Microscope Light-Microscopes Low-Speed Diamond Saw Nanoindenter Plasma Cleaner Femto QCM-D Renishaw Raman Confocal SEM Sample Coater Sirion XL30 SEM SPR Sum Frequency Generation Surface Plasmon Resonance – Biacore T200 Surface Science Instruments S-Probe X-ray Photoelectron Spectrometer Tecnai G2 F20 SuperTwin TEM Tecnai F20 Twin Cryo/In-situ Transient Absorption-Time Resolved Photoluminescence Ultracut 6 Microtome Ultrasonic Disc Cutter Woollam Spectroscopic Ellipsometer XANES–BL1  Optical Microscopes  Oxford Instruments X-MaxN Energy-Dispersive Spectrometer  SEM Sample Preparation Sputterer AccuThermo AW610 RTP for III/V or PZT AccuThermo AW610 RTP III/V -no metal AccuThermo AW610 RTP Si MOS Clean AccuThermo AW610 RTP Si Non-MOS AccuThermo AW810 RTP Si MOS Clean Acid/base batch processing AET GaAs/AlGaAs Oxidation Furnace Allwin21 Matrix Silicon Oxide/Nitride Etcher Amatepi MOS Sink AML AWB-08 Wafer Bonder AMST Molecular Vapor Deposition System MVD100 Angstrom Sun MSP300 Microspectrophotometer Angstrom Sun Spectroscopic Ellipsometer Applied Materials Epi Si & Ge Deposition APT Chrome Mask Process APT Emulsion Mask Process ASAP-Liftoff M6100 ASML DUV Stepper Model 5500/300 AST Electron Beam Dielectric Deposition Atomic Force Microscopy Class Atomic Layer Deposition Automated Four-Point Probe Resistivity Measurement System BaySpec Raman Spectrometer Bonding & Packaging Cambridge ALD Deposition System Canon 4X Projection Mask Aligner CDE ResMap Four Point Probe (automated mapper 2″ -12″) CHA Solution E-Beam Evaporator Chemical Vapor Deposition CMP Wet Sink Compound Etch Chamber Crestec CABL-9510CC Electron Beam Lithography System Crestec CABL-UH Series Electron Beam Lithography System Dektak 3030 Surface Profiler Diamond Seeding and The Lift-Off Process (General Solvent Sink) Die Bonder Digital Instrument AFM Disco DAD3240 Automatic Dicing Saw Dymax 2000 UV Flood System E+H Wafer Geometry Gauge E-Beam Microscopy and Imaging Edwards Sputter System Electrical Measurements Electroglass Autoprobe in DCL Electron Beam 10 kW 6-pocket Evaporator Electroplating Sink Endeavor AT Eshylon Apache TTCS MESC Charging Station Everbeing EB-8 Analytical Probe Station FEI Nova NanoSEM 650 Scanning Electron Microscope Film Thickness and Index Finetech Flipchip Bonder Flexus Thin Film Stress Measurement Fourier Transform IR Spectrometer Fusion M200PCU Photostabilizer System Gaetner Stokes Ellipsometer GCA 3600 Pattern Generator GCA8500 Wafer Stepper (6″) General Purpose Sink General Purpose Sink Glovebox for Inert Atmosphere GnP Poli 500 CMP Headway Manual Load Photoresist Spinner at msink3 Headway Stand-Alone Manual Load Photoresist Spinner Heidelberg MLA150 Maskless Aligner HMDS vapor prime oven III-V Processing Sink Inductively Coupled Plasma with Bias Ion Mill IR Inspection Camera IR Microscopy and Imaging Karl Suss MA6 Mask Aligner Keyence VHX-500 Digital Microscope KLA-Tencor Alpha-Step D-600 Profilometer KOH and TMAH Silicon Etch kruss Contact Angle Measurement System Lam  Poly-Si TCP Etcher Lam Metal (Al) TCP Etcher Lam Oxide Rainbow Etcher Leica INM100 Microscope Linewidth Measuring System Linewidth2 Zeiss Axioplan2 Measuring System Manual Spin Coat & Develop Sink Matrix 106 Resist Removal System Metal contaminated PR Strip Sink Metal Etch Chamber MPI Optical IV Probe Station MRC 944 Sputtering System with Sputter-Etch Multi Target Co-Sputtering System MxP+ Etch Chamber B Nanometrics 210 XP Scanning UV Nanospec/DUV Microspectrophotomet NanoSpec Film Thickness Measurement System Nanospec/AFT Thin Film Measurement System Non-MOS Clean NRC Evaporator Olympus LEXT OLS4000 3D Laser Confocal Microscope Optical Microscopy and Imaging Oxford Plasmalab 100 ICP (Compound III-V) Oxford Plasmalab 80plus PECVD System Oxford Plasmalab System 100 PECVD System Oxford Plasmalab System 100 PECVD System Oxford Plasmalab System100 Sputter Chamber Oxford Plasmalab System100 Sputter Chamber  Oxford RIE System Park Systems Atomic Force Microscope Parylene Deposition System 2010 Labcoater 2 Photoresist Strip & Pre-Furnace Metal Clean Sink Pi Scientific 6-inch Ion Beam Mill Picosun Atomic Layer Deposition (ALD) Picotrack Coater System Picotrack Developer System Planarization Plasma Quest ECR PECVD System Plasma-Therm Parallel Plate Etcher Quintel Q4000 Mask Aligner Rapid Thermal Annealers Reactive Ion Etch Refractory Metal Processing Sink Reichert Microscope Sartorius A200S Electronic Analytical Balance Scanning Electron Microscopy Class SEMI RIE System Siemens D5000 X-Ray Diffractometer Small Vacuum Oven for Low Temperature Anneal Small Vacuum Oven for Polymer Curing sp3 HFCVD Diamond Deposition Reactor Strausbaugh CMP Structure and Composition STS Advanced Planar Source Oxide Etch System Surface Charge Analyzer Surface Properties Surface Technology Systems (STS) Advanced Silicon Etch (ASE) SVG 6″ Developer SVG 6″ Spin Coater SVG 8626 6″ Lift -Off resist and BARC Coat Track Technical Eningeering Services Thermal Evaporator Technics C Plasma Etching System Tensiometer (KSV Sigma 701) Testing & Inspection Equipment Thin Film Thickness/Refractive Index Measurement System Tousimis 815 Critical-Point Dryer (small samples) Tousimis 915B Critical-Point Dryer Tystar 200mm N-Type Doping Tystar 200mm P-Type Doping Tystar 200mm Wet/Dry Oxidation Tystar Atmospheric Dry/Wet Oxidation (NON-MOS) Tystar MOS 200mm Stoichiometric and Low Stress Nitride Tystar MOS Clean Aluminum Sintering Atmospheric (4″ and 6″) Tystar MOS Clean Dry/Wet Oxidation & Anneal Atmospheric (4″ and Tystar MOS Clean Gate Oxidation Atmospheric (4″ and 6″) Tystar MOS Clean LTO LPCVD (4″ and 6″) Tystar MOS Clean Polycrystalline Silicon LPCVD (4″ and 6″) Tystar MOS Clean Si-Ge LPCVD (4″ and 6″) Tystar MOS Clean Silicon Nitride (Si3N4) LPCVD (4″ and 6″) Tystar Non-MOS 200mm LTO LPCVD Tystar NON-MOS Clean Dry/Wet Oxidation & Anneal Atmospheric (4″ Tystar Non-MOS Clean LTO LPCVD (4″ and 6″) Tystar NON-MOS Clean POCl3 Doping (4″ and 6″) Tystar Non-MOS Clean Si-Ge LPCVD (4″ and 6″) Tystar Non-MOS Low Stress Nitride & High Temp. Oxide LPCVD (4″ Tystar Non-MOS Poly-Silicon Carbide LPCVD (6″) uEtch HF Vapor Release System Ultek2 Angled Cooled Chuck E-Beam Evaporator Ultratech Mask Copier UV Microscopy and Imaging UV-VIS Spectrophotometer VLSI MOS Clean Westbond Wirebonder Model 7400B Wet Chemical Processing Wyko NT3300 Profiling System Xenon Difluoride Etching System YES Vacuum Oven YES-G500 Plasma Cleaning System Zeiss Scanning Electron Microscope Crystal Systems Corp. Four Mirror Optical Floating Zone Furnace Crystal Systems Corp. Vertical Molysili Furnace with Rotating Lifter MELLEN ADAPT Control System MELLEN Bridgman Furnace CEE 200CBX Coat-Bake System Precision coat-bake system combines a track-quality precision spin coater with a high-uniformity bake plate. Heidelberg DWL 200 Laser Lithography System Direct write lithography tool used as a high resolution pattern generator for photomask fabrication and patterning of substrates. Nikon Eclipse LV100 Microscope Nikon Optical Microscope Suss MicroTec MA/BA6 Aligner Contact aligner for broadband lithography. Backside alignment capability. JSW AFTY AFTEX-6200 ECR Plasma Deposition System Wet Processing Wet benches available for solvent, developer, and acid/base processing. Organic PhotoVoltaic Device Manufacturing System YES-R3 Plasma Cleaning System Oxygen plasma cleaning system with downstream and direct plasma cleaning capabilities. Minipack MVS 45X Vacuum Sealer Vacuum sealer for transport of sensitive samples. Ney Vulcan 3-1750 Box Furnace Programmable bench-top box furnace. Wet Processing Wet benches available for solvent, developer, and acid/base processing. SEKI Diamond CVD Confocal Raman and PL System MELLEN Manual Tilting Furnace Bruker DektakXT Stylus Profilometer MELLEN SC12.5R Three Zone Tube Furnaces ASML PAS 5500/200 – Stepper AST Goniometer AST Goniometer Carbolite High Temperature Oven CDE ResMap CHA Mark 40 Evaporator (new) CHA Mark 40 Evaporator (old) Chemical Wet Benches (E-IV) Chemical Wet Benches (E-IV) Dektak 6 Surface Profile Measuring System Dektak 6 Surface Profile Measuring System Denton Desk II Deposition Sputter Denton Desk II Deposition Sputter Denton Desk V Thin Film Deposition System Denton Desk V Thin Film Deposition System Denton Discovery Sputterer Denton Discovery Sputterer Deposition – CVC 601 Sputterer Deposition LPCVD Nitride – Tystar Tube Deposition LPCVD Nitride/Poly/LTO Deposition LPCVD Nitride/Poly/LTO Deposition LPCVD Polysilicon – Tystar Tube Deposition LPCVD Tystar Titan II – Tube Deposition Oxidation – Tystar Tytan 3600 – Tube Deposition PECVD – BMR Technology Deposition PECVD – BMR Technology Deposition PECVD – Plasma Therm 790 EDAX Genesis EDAX Genesis FEI Nova 600 Nanolab DualBeam SEM/FIB FEI Nova 600 Nanolab DualBeam SEM/FIB Fision UV Systems Fision UV Systems G&P Technology Poli 400L Headway Spin Coater Headway Spin Coater Heidelberg DWL 66 LaserWriter Heidelberg DWL 66 LaserWriter HF Vapor Etcher HF Vapor Etcher HF-Buffered Oxide Etch HF-Buffered Oxide Etch Hitachi S4700 SEM Hitachi S4700 SEM Jeol 7500F – Field Emission Scanning Electron Microscope Jeol 7500F – Field Emission Scanning Electron Microscope Karl Suss MA6 Aligner Karl Suss MA6 Aligner Karl Suss SB6 Wafer Bonder Karl Suss SB6 Wafer Bonder Leica DM2500 Microscope Leica DM2500 Microscope Lithography Logitech PM5 Polisher/Grinder Logitech PM5 Polisher/Grinder Loomis LSD-100 Loomis LSD-100 M&M probe station M&M probe station Matrix 105 Matrix 105 Measurement Microscopes Measurement Microscopes Modular Process Technology RTP 610 Modular Process Technology RTP 610 Modular Process Technology RTP-650 Modular Process Technology RTP-650 Nanometrics Nanospec 2100 Thin Film Measuring System Nanometrics Nanospec 2100 Thin Film Measuring System Nitrogen-Purged Muffle Furnace Nitrogen-Purged Muffle Furnace Optical Microscopes Optical Microscopes Oxford Plasmalab 80 Plus Oxford Plasmalab 80 Plus Plasma Etch PE-100 Plasma System Plasma Etch PE-100 Plasma System Plasma-Therm FDRIE DSE II Plasma-Therm FDRIE DSE II Porous Si Etcher Porous Si Etcher Prometrix Omnimap RS35C Prometrix Omnimap RS35C Raith EBPG 5000+ES – Electron Beam Writer Raith EBPG 5000+ES – Electron Beam Writer SCI Filmtek 2000 SCI Filmtek 2000 SCS PDS 2010  Parylene Deposition SCS PDS 2010 Parylene Deposition SemiTool Spin Rinse Dryer SemiTool Spin Rinse Dryer Sloan E-Beam Evaporator Sloan E-Beam Evaporator Sopra GES5 Ellipsometer Sopra GES5 Ellipsometer STS AOE Advanced Oxide Etcher STS AOE Advanced Oxide Etcher SVG 8800 Track Coater & Developer SVG 8800 Track Coater & Developer Technics Micro-RIE Series 800 Technics Micro-RIE Series 800 Tegal Plasmaline 515 Photoresist Asher Tegal Plasmaline 515 Photoresist Asher Tencor Flexus 2320A Stress Tester Tencor Flexus 2320A Stress Tester Tousimis 915B Critical Point Dryer Tousimis 915B Critical Point Dryer Ultratech Fiji – Atomic Layer Deposition Ultratech Fiji – Atomic Layer Deposition Ultratech Savannah Atomic Layer Deposition Ultratech Savannah Atomic Layer Deposition Ulvac JSP 8000 Metal Deposition Sputter Ulvac JSP 8000 Metal Deposition Sputter Ulvac NE 550 Chlorine Etcher Ulvac NE 550 Chlorine Etcher Ulvac NLD-570 Oxide Etcher Ulvac NLD-570 Oxide Etcher ULVAC UNECS-2000 Ellipsometer ULVAC UNECS-2000 Ellipsometer Unaxis DRIE Unaxis DRIE Veeco Dektak 150 Surface Profiler Veeco Dektak 150 Surface Profiler Veeco Dektak 8 Profilometer Veeco Dektak 8 Profilometer VEECO DI 3100 Atomic Force Microscope VEECO DI 3100 Atomic Force Microscope Veeco DiInnova Atomic Force Microscope Veeco DiInnova Atomic Force Microscope VWR-Vacuum Oven VWR-Vacuum Oven Wyko NT3300 Optical Profiler Wyko NT3300 Optical Profiler Xiatix Xenon Difluoride Etching System Xiatix Xenon Difluoride Etching System YES LPIII Vacuum Oven YES LPIII Vacuum Oven 3D Surface Profilometer 6′ Solvent Bench 7′ Wet bench (base)7′ Wet bench (base) 8′ Wet Bench (acid) AJA Sputter System Atomic Force Microscope Atomic Layer Deposition System C/V Stress (plotter) Chemical Processing Station CVD Furnace E-beam Direct Write Lithography System Focused Ion Beam (FIB) Hi Q Engineering UltraViolet Ozone Cleaner ICP Etch System K&S 4523A Digital Wedge Bonder Mask Design Station Nikon L150 Optical Microscope Oxford Cobra Metal Trench Etcher Oxford Cobra Silicon Trench Etcher Rapid Thermal Annealer (RTA) Reactive Ion Etch System (RIE) Resist Coat Spin Station Spin Rinser Dryer Surface Profilometer Thin film stress gauge Karl Suss Mask Aligner EMS 1050X Plasma Asher Quintel Mask Aligner Optical Scope w/ Film Thickness Measurement Ellipsometer IV Probe station PECVD System E-Beam Evaporator E-Beam Evaporator Thermal Evaporator Oxford Instruments INCA EDS Oxford Electron Backscatter Detector (EBSD) Scanning Transmission Electron Microscopy TES Sputter System Atomic Force Microscope E-beam Lithography System WestBond 7700E Wire Ball Bonder Karl Suss MA6 Mask Aligner Angstrom NexDep DC/RF Sputter System Cambridge Nanotech Savannah Atomic Layer Deposition (ALD) System Convection Ovens Convection Ovens Copper, Nickel, and Gold Electroplating CS1701F Reactive Ion Etcher Denton Desk V Sputter Coater ETP Corona Discharge Wand Fume Hoods Fume Hoods Inspection Microscope Laurell WS-400B-6NPP-Lite Manual Spinners LC Tech Thermal Evaporator Marpet Enterprises MEI1204B Manual Ball Bonder MicroAutomation MA1006 Dicing Saw Miller FPP-5000 Four Point Probe NSC 3000 DC Magnetron Sputter Tool OAI Model 204IR Mask Aligner Ocean Optics Nanocalc Film Thickness Measurement PDS 2010 Parylene Coater PDS 2010 Parylene Coater Probestation SSI Rapid Thermal Processor Stylus Profilometer – Dektak XT Tegal Plasmod Oxygen Plasma Cleaner Tescan VEGA3 Scanning Electron Microscope Tescan VEGA3 Scanning Electron Microscope Thermolyne Muffle Furnace Tousimis Model 810 AutoSamdri Critical Point Dryer (CPD) Zygo NewView 600s

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers