Refurbished Matrix Bobcat 209S Microwave Plasma Asher Descum Semiconductor Equipment

SemiStar Corp. offers refurbished Matrix Bobcat 209S microwave plasma asher descum semiconductor equipment for qualified end-user customers. We currently have two sets in stock, both configured for 8 inch wafer processing.

The Matrix Bobcat 209S is a microwave plasma asher descum system for semiconductor photoresist removal, plasma ashing, descum, and related dry process applications. SemiStar can offer this equipment in refurbished condition with warranty, subject to final inspection, configuration review, and customer requirements.

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

The Matrix Bobcat 209S is a microwave plasma asher descum semiconductor equipment designed for dry plasma photoresist removal, ashing, and descum applications.

The system concept is similar to Matrix single-wafer plasma asher platforms used for photoresist stripping and descum, but the Bobcat 209S uses a microwave plasma configuration. This page only lists information currently available from SemiStar’s existing inventory and previous system record.

SemiStar has experience with Matrix and plasma asher equipment in general; however, the Matrix Bobcat 209S is not one of our standard long-term supported platforms like Matrix 105, Gasonics L3510, Gasonics Aura 1000, or Gasonics Aura 2000LL. Final configuration and refurbishment scope should be confirmed before quotation and PO.

Configuration Capability

• 8 inch wafer configuration
• Microwave plasma asher descum system
• Single chamber configuration
• Open cassette configuration
• Robot wafer transfer capability
• Rorze RR701 transfer unit, based on available system record
• PC control system
• Windows NT software platform, based on available system record
• MKS MFC gas box components, based on available system record
• Configurable for photoresist ashing and descum applications, subject to final process review

Applications

• Photoresist stripping
• Microwave plasma ashing
• Descum process
• Dry plasma cleaning
• Semiconductor wafer cleaning
• Resist removal after semiconductor process steps
• Research, pilot line, and semiconductor fab applications

Typical Process Capability

Typical Matrix Bobcat 209S process capability may include microwave plasma ashing, descum, controlled gas flow, open cassette wafer handling, and PC-based system operation.

• Wafer Capability: 8 inch configuration
• Process Type: Ash / plasma descum
• Chamber: Single chamber configuration
• Gas Box: 3 gas capability based on available system record
• Gases Previously Listed: O₂, N₂, and additional gas position depending on configuration
• Microwave Generator: Microwave generator listed in available system record

Actual performance depends on final system configuration, wafer type, process recipe, resist condition, refurbishment scope, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact system configuration. Typical facility items may include:

• Power: 208 VAC, 3 phase, 50/60 Hz, based on available system record
• Vacuum: Vacuum pump capability required
• Exhaust: Cabinet, chamber, and pump exhaust may be required depending on final configuration
• Process Gases: O₂, N₂, and other gases depending on process configuration
• Cooling: Cooling water or chiller may be required depending on final configuration
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or water temperature controllers if applicable, process gas supply, exhaust, CDA, power connection, and related facility support items unless otherwise specified in quotation.

PC Controller Upgrade Service

SemiStar may review PC controller upgrade or control system support requests for customer-owned working systems on a case-by-case basis. Because the Matrix Bobcat 209S is not one of our standard upgrade platforms, any upgrade request must be evaluated based on system condition, documentation, software status, parts availability, and project scope.

RFQ Information Required

To help us confirm whether the Matrix Bobcat 209S is suitable for your application and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Wafer size
• Wafer material
• Photoresist type and thickness, if available
• Required process gases
• Process specifications and target results
• Throughput requirement
• Temperature requirement, if applicable
• Endpoint or process control requirement, if applicable
• Have you used Matrix Bobcat 209S, Matrix 105, or similar plasma asher descum equipment before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-400