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STS / CPX Multiplex Plasma Enhanced Chemical Vapor Deposition (PECVD) system

Vacuum load-lock: Manual

Load-lock / Process chamber: Automatic transfer

Loader substrates: Up to 200 mm diameter

Chuck: 100 mm diameter

Load lock: MK4 Single wafer load lock

Dual frequency:

High frequency PECVD

Low frequency PECVD

RF Generator: 187.5 kHz, 375kHz

Remote gas box




Operating system: Windows 2000

Affinity chiller

EDWARDS IH600 Vacuum pump: Chamber

VARIAN SH-100 Vacuum pump: Load lock

Operation manuals

Electrical drawings

Auxiliary equipment manuals

Deposit silicon dioxide (SiO2)

Silicon nitride (Si3N4)

Silicon carbide (SiC)

Gas box (Process gases):

SiH4-Ar (Silane-Ar), 100 sccm

NH3 (Ammonia), 500 sccm

N2O, 5000 sccm

N2, 5000 sccm

CF4, 1000 sccm

O2, 500 sccm

Ar, 1000 sccm

C2H2, 1000 sccm

(2) Purge lines: Silane / CH43.

Valid : It is only for end users and is subject to prior sale without notice. Appreciate your time!

SemiStar Corp. may provide certain information related to equipment offered for sale. Any and all such information is unverified and, therefore,  supplied for information purposes only without guarantees or warranties of any kind. This picture is representative of the STS available

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  • OEM-00-PECVD-1

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers