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SAMCO RIE 10 NR RIE, ~8″

Description

Refurbished SAMCO RIE-10NR Reactive Ion Etch System

SemiStar Corp. offers refurbished SAMCO RIE-10NR Reactive Ion Etch Systems for semiconductor, MEMS, university, research institute, nanotechnology, and advanced materials plasma etching applications. Systems are available subject to final configuration, refurbishment scope, and prior sale.

The SAMCO RIE-10NR is a compact, high-performance, fully automatic reactive ion etching (RIE) system designed for fluorine-based plasma etching applications and advanced semiconductor process development. The platform is widely used in university cleanrooms, semiconductor R&D laboratories, pilot production facilities, and MEMS fabrication environments.

Product photos are for reference only. Actual system configuration, accessories, utilities, software, process capability, and cosmetic condition should be confirmed by SemiStar’s final quotation and inspection report.

Availability

Equipment Model SAMCO RIE-10NR
Equipment Type Reactive Ion Etch Plasma Etching System
Category RIE / Plasma Etcher / Dry Etching System
Manufacturer / OEM SAMCO
Condition Refurbished, used good condition
Wafer Capability Up to 200 mm / 8 inch wafer
Location Morgan Hill, California, USA
Lead Time Estimated 6–10 weeks depending on PO timing and final PO conditions
Warranty 6 months after shipment, subject to final quotation terms
Installation / Training Available if necessary; scope and cost to be confirmed
Price Contact SemiStar by filling out the inquiry form below
Validity Subject to prior sale without notice

System Description

The SAMCO RIE-10NR is a low-cost, high-performance reactive ion etching system designed for highly selective anisotropic plasma etching applications. The platform supports fluorine chemistry plasma processing and provides stable process repeatability, excellent etch uniformity, and automated operation capability.

The system is designed with compact cleanroom footprint requirements while maintaining high-performance plasma etching capability for semiconductor, MEMS, nanotechnology, compound semiconductor, and advanced materials processing applications.

Key Features

  • Highly selective anisotropic plasma etching capability
  • Processing capability up to ø220 mm
  • Supports 8 inch (200 mm) wafer processing
  • Fully automatic “one-button” operation
  • Full manual operation override capability
  • Computerized touch panel operation interface
  • Recipe storage and parameter control capability
  • Automatic pressure control independent of gas flow
  • Compact cleanroom footprint
  • Dry pump compatible system architecture
  • Easy maintenance configuration
  • Stable plasma process repeatability
  • Parallel plate cathode coupling plasma configuration

Current Configuration

  • SAMCO RIE-10NR reactive ion etching system
  • Computerized touchscreen control system
  • Automatic pressure control system
  • RF plasma etching platform
  • Parallel plate plasma configuration
  • Compact cleanroom installation footprint
  • Research and pilot production capability

Typical Process Capability

The SAMCO RIE-10NR platform is commonly used for plasma etching of:

  • Silicon (Si)
  • Silicon Dioxide (SiO2)
  • Silicon Nitride (SiN)
  • Polysilicon (Poly-Si)
  • GaAs and compound semiconductor materials
  • Polyimide
  • Photoresist ashing and stripping
  • Organic contaminant removal
  • Surface modification applications

Typical Installed Gas Configuration

Installed gas configuration may vary depending on the actual system configuration. Typical RIE-10NR fluorine chemistry configurations may include:

  • CF4
  • CHF3
  • SF6
  • O2
  • Ar / N2

Actual installed gas lines, MFC ranges, and process chemistry capability should be confirmed during final inspection and quotation review.

RF Power and Process Information

  • Typical RF frequency: 13.56 MHz
  • Typical RF power configuration: up to 300 W
  • Automatic matching capability
  • Automatic pressure control architecture
  • Stable plasma process control

Wafer Processing Capability

  • Up to ø220 mm processing capability
  • Typical configurations include:
  • ø3 inch × 5 wafers
  • ø4 inch × 3 wafers
  • ø8 inch × 1 wafer

Typical Applications

  • Reactive ion etching (RIE)
  • Anisotropic plasma etching
  • Silicon and dielectric etching
  • MEMS fabrication
  • Compound semiconductor process development
  • Photoresist strip and descum
  • Failure analysis sample preparation
  • University and research institute plasma research
  • Nanotechnology process development

Facility Requirements

  • Electrical power requirements to be confirmed during final configuration review
  • Process gas cabinets and gas delivery systems required
  • Vacuum pump and exhaust requirements to be reviewed
  • Cooling water/chiller requirements to be confirmed
  • Facility exhaust and scrubber compatibility required
  • Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation

Refurbishment and Support

SemiStar can provide the equipment in refurbished condition with OEM specifications. Refurbishment scope, functional testing, installation, training, utilities integration, and warranty scope will be confirmed based on the final purchase order and customer requirements.

The standard offering includes a 6-month warranty after shipment unless otherwise stated in the official quotation. Installation and training can be quoted separately if required.

RFQ Information Requested

To help us recommend the best final configuration and support scope, please provide:

  • Substrate size and material
  • Target etch material and process application
  • Required process gases and chemistry
  • Required etch profile and selectivity targets
  • Expected throughput requirements
  • Need for installation, startup, or training support
  • Facility readiness and utility information
  • Expected purchase timeline and budget range

Important Notes

  • Subject to prior sale without notice.
  • Final specifications subject to SemiStar official quotation and inspection confirmation.
  • All OEM names, trademarks, and model names belong to their respective owners.
  • SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
  • Final purchase specifications, refurbishment scope, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.

Reference Information

OEM reference information and manual available for reference:


SAMCO RIE-10NR Reactive Ion Etch System Manual

Contact SemiStar

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Reference information derived from OEM and publicly available technical sources.

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LOCATION: SS380EB

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers