Description
Model: Matrix 105 semiconductor process equipment
Photos: Download here
Category: Plasma Asher Plasma Descum
Original Equipment Manufacturer: Matrix Integrated Systems, Inc
Condition: Refurbished.
Wafer Size: 6 inch configuration or customized.
Process Gasses: O2 and N2
Valid Time: Subject to prior sale without notice.
Lead Time: To be decided after payment
Warranty: 6 months non-consumable parts. Buyer is responsible for shipping.
Installation and training: Available at extra charge
Service Contract: Available at extra charge
Matrix 105 plasma Asher Plasma descum semiconductor equipment General Description
The Matrix 105 plasma Asher Plasma descum semiconductor equipment represents the Industry Standard in single-wafer photoresist removal and the mainstay of the highly successful System One family. Developed in cooperation with many of the world’s leading IC producers, the Matrix 105 plasma Asher Plasma descum semiconductor equipment has been designed for optimum performance and Cost of Ownership.
The Model 105 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round or square, and ranging from 50mm up to 150mm. By maintaining independent closed-loop system controls, the system optimizes vital device parameters:
• Enhanced gate oxide integrity
• Reduced threshold and capacitance voltage shifts
• Reduced contact resistance/ oxidation.
These benefits are coupled with exceptional reliability proven in more than 700 System One installations worldwide.
The Matrix Model 105 is available free-standing (as shown here) or in a through-the-wall configuration.
Matrix 105 plasma Asher Plasma descum semiconductor equipment Applications
Photoresist Stripping
• High dose implant (As+, B+, P+)
• Post-polysilicon etch
• Post-metal etch
• Post-oxide etch
• Rework
Controlled Resist Removal
• Post-develop descum (pre-etch)
• Dry/wet process capability
• Uniformity capability (<5% 1σ)
GaAs, InP wafer Strip and Descum
Thin Film Head Resist Cleaning
Opto-Electronic Devices Cleaning
MEMS (Micro Systems Technology)
Matrix 105 plasma Asher Plasma descum semiconductor equipment Features/Benefits
Single Wafer, Multi-Step Processing
• Precisely controlled & repeatable stripping of each wafer
• 3 programmable steps + overstrip
• Capable of long process times for exceptional control
High Throughput
• >35 WPH on 150mm substrates (60 second process time)
Aluminum Wafer Chuck
Provides Fast, Precise, Uniform Removal of Resist
Low Particles
<0.1 particles (>0.3μm) added per cm2
Proven System Performance
>700 System Ones in use worldwide,
>95% uptime
Proven Reactor Design
Optically dense and mechanically robust quartz baffle assembly provides separation of wafer from plasma for true “downstream” performance, with maximum gate oxide protection
Closed-Loop Temperature Control
Resistively heated wafer chuck, stable range for strip: 150°C – 250ºC (+/-5°C), for descum: 70°C – 150ºC (+/-5°C), provides precise temperature control and reduces thermal degradation and electrical damage.
Photocell Endpoint
Automatic endpoint detection for optimizing throughput.
Pick-and-Place Wafer Handling
Brooks Orbitran® system, cassette to cassette wafer handling
Production Oriented
Easy to learn, one-button operation Process recipe stored on magnetic card
System Diagnostics/Modularity
Maintenance is quick and simple
Small Footprint
Only 25” W x 28” D (63.5cm x 71cm)
All the Matrix 105 Plasma Asher Plasma Descum semiconductor process equipment trademarks belongs to Matrix Integrated Systems, Inc, the original equipment manufacturer. All rights reserved.
Please contact us to check the availability of the following Plasma Asher equipment . They are only for end user. They are subject to prior sale without notice.
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| 31 | Brooks Automation ORBITRAN MODEL 6100-87, MATRIX 105 PLASMA ASHER |
| 32 | Brooks Automation ORBITRAN MODEL 6100-87, MATRIX 105 PLASMA ASHER |
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Activation Annealing Furnace,VF-3000H Vertical Furnace for Gate Insulating Film Formation,VF-3000H Vertical Furnace for Gate Insulating Film Formation,RLA-3100-V Lamp Annealing System for Contact Annealing,RLA-3100-V Lamp Annealing System for Contact Annealing,Rapid temperature rise annealing furnace RTP_Table ，RTP_Table type rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace RTP_SA ，RTP ，semi-automatic rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace ，RTP_Auto ，automatic rapid temperature rise annealing furnace，RTP600V，RTP600Z，RTP500Z，RTP500V，RTP500SV，快速退火炉，北京东之星应用物理研究所，快速升溫退火爐，estarlabs，Glovebox+PVD,2D material CVD,LPCVD & furnace,Vacuum Sintering Furnace,RTP,Plasma Doping (PDS),ASHER,Wet bench,Crystal Si solarcell Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor, Sonog-age 200, Sono-gage 300, Sonogage200, Sonogage 300, Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition Singulus,singular, pecvd,Plasma Enhanced Chemical Vapor Deposition, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment Furnace, MRL, MRL 4 Stack,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment ,快速退火炉，速升溫退火爐，保护气氛快速退火炉，保護氣氛快速退火爐，快速退火爐，红外灯加热，红外灯快速退火，卤素灯加热，高温计，红外高温计，等离子去胶机，等离子刻蚀，深刻蚀，各向同性，各向异性，等离子清洗，溅射台，蒸发台，磁控溅射台，直流电源溅射，高频溅射，自动刻蚀机，自动去胶机，手动去胶机，手动刻蚀机，干法去胶机，湿法去胶机，干法刻蚀机，湿法刻蚀机，半导体设备，半导体旧设备，半导体中古设备，半导体前道工艺设备，半导体后道工艺设备，半导体前道设备，半导体后道设备，半导体量测仪器，半导体量测设备，美国制造，紅外線燈加熱，紅外線燈快速退火，鹵素燈加熱，高溫計，紅外線高溫計，等離子去膠機，等離子蝕刻，深刻蝕，各向同性，各向異性，等離子清洗，濺射台，蒸發台，磁控濺射台，直流電源濺射，高頻濺射，自動蝕刻機，自動去膠機，手動去膠機，手動蝕刻機，乾式去膠機，濕式去膠機，乾法蝕刻機，濕蝕刻機，半導體設備，半導體舊設備，半導體中古設備，半導體前道製程設備，半導體後道製程設備，半導體前道設備，半導體後道設備，半導體量測儀器，半導體量測設備，美國製造 Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean,Gasonics AE 2001, Gasonics AE 2000LL Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Plasma RIE ,Reactive Ion Etch System, Reactive Ion Etch System, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915,Tegal 701,Tegal 703,Tegal 801,Tegal 803,Tegal 981e,Tegal 903e,Tegal 915, Tegal 965, Tegal 405, Tegal 401 Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam Rainbow 4400, Lam Rainbow 4420, Lam Rainbow 4428, Lam Rainbow 4500, Lam Rainbow 4520, Lam Rainbow 4528, Lam Rainbow 4600, Lam Rainbow 4620, Lam Rainbow 4628, Lam Rainbow 4700, Lam Rainbow 4720, Lam Rainbow 4728, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch, Downstream Plasma Etch Enviro,ENVIRO-1XaENVIRO-1Xa ,2CENVIRO-Optima,Luminous NA,NA-8000NA-1300NA-1500 ,Multifilm,NE-550EXaNE-950EX, APIOSNE-5700Deep, Oxide Etching ,NLD-570EXaRISE System,RISE Series,Cluster Systems,SME SeriesuGmni Series,SRH SeriesULDiS Series,SMV-500FRoll-coater,SPW SeriesIn-line Systems,SIV SeriesSDH-4550LR&D,CS-200, 300mm,ENTRON-EXENTRON-EX2,Evaporation Roll Coater,EW SeriesR&D/Pilot Production,Ei-5In-line Systems, Ei-H series,Si Processing,IMX-3500SOPHI-200/260 ,SiC,IH-860,Brazing Furnace,FB SeriesFHHn series ,Vacuum Sintering,FSC SeriesVacuum,Induction Melting,FMI Series,Vacuum Heat Treatment,FHB-60CFHV Series,Single-Substrate,CC Series,CME Series,In-line Systems, ULGLAZE Series,Lyophilizer,DFB Series,Micropowder Dry, UPD-400D,FM Series,DFR Series,Centrifugal Type,CEH-400B,ULVAC Rapid Thermal Process, Modular Process Technology, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, 4100 , 4100S 4108, 8108 ,Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800, ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, STEAG-MATTSON 2900, STEAG-MATTSON 3000, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse, rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ，Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular Process Technology, Solaris150,AS-One,AS-Micro, ADDAX, JetFirst, JetLight, JetStar, MPT-600S,MPT-800S, MPT-600XP, MPT-800XP, MPT-3000, Jipelec Jetfirst 150,Jipelec Jetfirst 200, JETFIRST 100,AnnealSys AS-One, RTP-3000, ULVAC, Ulvac Technology MILA 3000 ,Rapid Thermal Annealing, ULVAC RTA-2000,ULVAC RTA-4000,ULVAC RTA-6000,ULVAC RTA-8000,ULVAC RTA-12000, EasyTube® 3000EXT, CVD Equipment Corporation, Dr. Eberl MBE-Komponenten GmbH, AO 600,Rapid Thermal Annealing System,MBE Components,MBE Systems,OCTOPLUS 300,OCTOPLUS 400,OCTOPLUS 500,OCTOPLUS 500 EBV,OCTOPLUS 600,OCTOPLUS 600 EBV,OCTOPLUS-O 400,Thin Film Systems,Organic Deposition System,Rapid Thermal Annealing,MBE Components,Thin Film / CIGS / CZTS / CdTe,ECM, Annealsys AS-Premium, Annealsys Zenith-100, Annealsys AS-One, Annealsys AS-Master, Jipelec JetStar, Annealsys AS-Micro, Jipelec JetLight, Jipelec JetFirst 100, Jipelec JetFirst 200, Jipelec JetFirst 300, CreaTec Fischer & Co. GmbH, Rapid Thermal Anneling System, Mini MBE System,Growth System, Research Linear Transfer System,RTA System,UHV Shuttle System, SemiTEq JSC, Molecular-Beam Epitaxy Systems (MBE),PVD Systems,RTP & RTA Systems,ICP/RIE/PECVD Systems,Components and accessories, STE RTP150, STE RTA100, STE ICP200 , ADVANCE RIKO, Inc., RTP-mini, Atmospheric Thermoelectric Module Evaluation System F-PEM,Mini Lamp Annealer MILA-5050,infrared lamp heating system, ULTECH CO.LTD,Real RTP-100,Real RTP-100,Real RTP-150,Real RTP-Mini,SPUTTER,DRY ETCHER,PECVD,ALD,E beam evaporator,Thermal Evaporator, SJ High Technology ,Tube RTA,R-8160,drawer type RTA, R-401, Dai-ichi Kiden Co.,Ltd., Combustion furnace,High vacuum heating system,Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system, Koyo Thermo Systems Co.,Ltd., Premtek Technology Co， 技鼎股份有限公司，技鼎股份有限公司，VF-5900 300mm Large Batch,VF-5700 300mm Mini Batch,VF-5300,8 inch,Large Batch,VF-5100,8 inch,Wide-Range Batch,VF-3000,8 inch,Low-Cost Mini Batch,VF-1000,Small Production and R&D,VFS-4000,Large Bore Vertical Furnace,Koyo Thermo Systems Co.,Ltd.,Model 200 Series Horizontal Furnaces for Mass Production and Experiments,Model 206A Horizontal Furnace for PV Production ,Model 206A Horizontal Furnace for PV ,Production,RLA-3100 Lamp Annealing System for Rapid Thermal Processing,RLA-1200 Lamp Annealing System for Rapid Thermal Processing,RLA-1200 Lamp Annealing System for Rapid Thermal Processing,SO2-12-F Heated-air Circulating Type Clean Oven for 300-mm Wafers,CLH Series High-Temperature Clean Ovens,CLH Series High-Temperature Clean Ovens,VFS-4000 Large Bore Vertical Furnace,VF-5300HLP Activation Annealing Furnace,VF-5300H Vertical Furnace for Gate Insulating Film Formation,VF-5300H Vertical Furnace for Gate Insulating Film Formation,RLA-4106-V Lamp Annealing System for Contact Annealing,RLA-4106-V Lamp Annealing System for Contact Annealing,VF-3000HLP Activation Annealing Furnace, VF-3000HLP Activation Annealing Furnace,VF-3000H Vertical Furnace for Gate Insulating Film Formation,VF-3000H Vertical Furnace for Gate Insulating Film Formation,RLA-3100-V Lamp Annealing System for Contact Annealing,RLA-3100-V Lamp Annealing System for Contact Annealing,Rapid temperature rise annealing furnace RTP_Table ，RTP_Table type rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace RTP_SA ，RTP ，semi-automatic rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace ，RTP_Auto ，automatic rapid temperature rise annealing furnace，RTP600V，RTP600Z，RTP500Z，RTP500V，RTP500SV，快速退火炉，北京东之星应用物理研究所，快速升溫退火爐，estarlabs，Glovebox+PVD,2D material CVD,LPCVD & Furnace,Vacuum Sintering Furnace,RTP,Plasma Doping (PDS),ASHER,Wet bench,Crystal Si solarcell Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor, Sonog-age 200, Sono-gage 300, Sonogage200, Sonogage 300, Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition Singulus,singular, pecvd,Plasma Enhanced Chemical Vapor Deposition, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment Furnace, MRL, MRL 4 Stack,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment
