Refurbished Gasonics L3510 Microwave Downstream Plasma Asher Semiconductor Equipment

SemiStar Corp. offers refurbished Gasonics L3510 microwave downstream plasma asher semiconductor equipment refurbished to OEM specification for qualified end-user customers. The Gasonics L3510 is a production-proven downstream plasma photoresist ashing system widely used for semiconductor wafer fabrication, descum, resist stripping, and related semiconductor process applications.

This microwave downstream plasma asher supports low-damage photoresist removal with excellent process flexibility for compound semiconductor, MEMS, university, research institute, and advanced semiconductor manufacturing applications.

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

The Gasonics L3510 is a versatile automated microwave downstream plasma asher semiconductor equipment designed for clean, damage-free removal of difficult photoresist structures and semiconductor residues.

Utilizing the production-proven Gasonics L-Series platform, the L3510 provides a wide process window through its patented microwave plasma source technology. Programmable heating and process controls contribute to excellent process flexibility and repeatable downstream plasma ashing performance.

The system supports 75 mm to 200 mm wafer processing with configurable gas delivery, automated wafer handling capability, endpoint detection, and low-damage plasma processing for semiconductor fabrication environments.

Configuration Capability

• 75 mm to 200 mm wafer capability
• Single-wafer automated processing
• Microwave downstream plasma ashing configuration
• Low-damage downstream plasma process capability
• Platen and lamp heating for process flexibility
• Reliable endpoint detection capability
• O₂, N₂/H₂, and N₂ process gas capability
• Pressure control capability
• Programmable process controls
• Optional SMIF indexer capability
• Optional AGV and robotic cassette loading capability
• Stand-alone or flush-mount installation configuration
• Quartz process chamber configuration
• System performance matching capability

Applications

• Photoresist stripping
• Microwave downstream plasma ashing
• Bulk photoresist removal
• Implanted and damaged resist removal
• Descum process
• Semiconductor wafer cleaning
• Low-damage plasma cleaning
• Non-oxidizing metal processing
• Compound semiconductor processing
• MEMS process applications
• University and research institute applications
• Pilot production and semiconductor fab applications

Typical Process Capability

Typical Gasonics L3510 process capability may include downstream microwave plasma ashing, programmable lamp and platen heating, endpoint monitoring, and controlled process gas flow.

• Microwave Power: 0–1200 watts at 2.45 GHz
• Pressure: 0.5 to >5.0 torr
• Platen Temperature: 100–300°C
• Ash Rate: Up to 3.5 µm/min
• Throughput: Typically 45–60 WPH depending on application
• Within Wafer Uniformity: ±5% to 10%
• Wafer-to-Wafer Uniformity: ±5% to 10%

Actual performance depends on the final system configuration, wafer type, process recipe, resist condition, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact system configuration. Typical facility items may include:

• Power: 200–240 VAC, Single Phase, 50/60 Hz, approximately 30 A
• Vacuum: Pumping capability required
• Exhaust: Cabinet exhaust required
• Process Gases: O₂, N₂/H₂, N₂, and other gases depending on process configuration
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers (if applicable), process gas supply, exhaust, CDA, power connection, and related facility support items unless otherwise specified in quotation.

PC Controller Upgrade Service

In addition to offering refurbished Gasonics L3510 systems, SemiStar also provides PC controller upgrade solutions for customer-owned working systems. We can upgrade legacy Gasonics L3510 platforms with modern PC-based control systems, graphical user interfaces, updated electronics, and replacement of obsolete components to improve reliability, usability, and long-term support capability.

RFQ Information Required

To help us recommend the correct configuration and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Wafer size
• Wafer material
• Photoresist type and thickness, if available
• Required process gases
• Process specifications and target results
• Throughput requirement
• Temperature requirement
• Endpoint detection requirement
• Have you used Gasonics L3510 or similar downstream plasma asher equipment before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-350