Refurbished Gasonics Aura 1000 Microwave Downstream Plasma Asher Semiconductor Equipment

SemiStar Corp. offers refurbished Gasonics Aura 1000 microwave downstream plasma asher semiconductor equipment refurbished to OEM specification for qualified end-user customers. The Aura 1000 is a proven single-wafer downstream plasma photoresist ashing system widely used for semiconductor wafer fabrication, descum, resist stripping, and related semiconductor process applications.

This microwave downstream plasma asher supports low-damage photoresist removal with isotropic ashing capability for compound semiconductor, MEMS, university, research institute, and advanced semiconductor manufacturing applications.

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

The Gasonics Aura 1000 is a compact automated microwave downstream plasma asher semiconductor equipment designed for single-wafer photoresist stripping, descum, and low-damage plasma cleaning applications.

Its downstream microwave plasma architecture helps minimize wafer and device damage while supporting front-side and back-side isotropic photoresist removal. The system is suitable for semiconductor fabs, compound semiconductor applications, MEMS processing, universities, research institutes, and pilot production environments.

The Aura 1000 supports 75 mm to 150 mm wafer processing with automated pick-and-place wafer handling and configurable gas control capability.

Configuration Capability

• 75 mm to 150 mm wafer capability
• Single-wafer automated processing
• Pick-and-place wafer handling
• Microwave downstream plasma ashing configuration
• Low-damage downstream plasma process capability
• Up to 4 MFC gas configuration capability
• O₂ / N₂ process gas capability
• Endpoint detection capability
• Variable lamp heating for temperature control
• Closed-loop temperature control option, if available
• Pressure control option, if available
• SMIF-compatible configuration option, depending on system configuration
• SECS II interface option, depending on configuration
• Tabletop or floor / through-wall configuration, depending on system version

Applications

• Photoresist stripping
• Microwave downstream plasma ashing
• Bulk photoresist removal
• High-dose implanted resist removal
• Descum process
• Semiconductor wafer cleaning
• Low-damage plasma cleaning
• Non-oxidizing metal processing
• Front-side and back-side isotropic resist removal
• Compound semiconductor processing
• MEMS process applications
• Research, pilot line, and semiconductor fab ashing applications

Typical Process Capability

Typical Aura 1000 process capability may include downstream microwave plasma ashing, variable lamp heating, endpoint monitoring, and controlled O₂ / N₂ gas flow. Actual performance depends on the final system configuration, wafer type, process recipe, resist condition, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact system configuration. Typical facility items may include:

• Power: 208 VAC, 3 phase, 60 Hz, approximately 30 A
• Vacuum: Pumping capability required
• Exhaust: Cabinet exhaust required
• Process Gases: O₂, N₂, and other gases depending on process configuration
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers (if applicable), process gas supply, exhaust, CDA, power connection, and related facility support items unless otherwise specified in quotation.

PC Controller Upgrade Service

In addition to offering refurbished Gasonics Aura 1000 systems, SemiStar also provides PC controller upgrade solutions for customer-owned working systems. This option is intended for customers who already own an Aura 1000 or similar downstream plasma asher and want to improve system usability, replace obsolete controls, or extend equipment life.

RFQ Information Required

To help us recommend the correct configuration and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Wafer size
• Wafer material
• Photoresist type and thickness, if available
• Required process gases
• Process specifications and target results
• Throughput requirement
• Temperature requirement
• Endpoint detection requirement
• Have you used Gasonics Aura 1000 or similar downstream plasma asher equipment before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-175