Refurbished Branson/IPC L3200 Automatic Single Wafer Plasma Asher Photoresist Stripper Descum Semiconductor Equipment

SemiStar Corp. offers refurbished Branson/IPC L3200 automatic single wafer plasma asher photoresist stripper descum semiconductor equipment for qualified end-user customers. This system is configured for plasma ashing, photoresist stripping, descum, dry cleaning, and related semiconductor process applications.

This Branson/IPC L3200 unit was upgraded with a PC controller, touchscreen monitor, Equipe ATM-105 robot, and ESC-200 robot controller instead of the original frog robot configuration.

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

The Branson/IPC L3200 is an automatic single-wafer plasma asher photoresist stripper descum semiconductor equipment platform used for semiconductor wafer processing, dry plasma cleaning, photoresist removal, and descum applications.

This upgraded L3200 system replaces the original frog robot concept with an Equipe ATM-105 robot and ESC-200 robot controller, providing a modernized wafer transfer approach compared with the original legacy handling configuration.

The upgraded PC controller and touchscreen monitor improve system operation, user interface, recipe control, and long-term serviceability compared with the original legacy control system.

Configuration Capability

• Automatic single-wafer plasma asher configuration
• Photoresist stripping and descum process capability
• Dry plasma cleaning capability
• Upgraded PC controller
• Touchscreen monitor interface
• Automatic wafer handling with upgraded Equipe ATM-105 robot
• ESC-200 robot controller upgrade
• Replacement of original frog robot configuration
• RF plasma processing capability
• Wafer size capability to be confirmed based on final installed configuration
• Gas configuration to be confirmed based on installed MFCs and process requirements
• Vacuum pump and exhaust configuration to be confirmed before quotation

Applications

• Photoresist stripping
• Plasma ashing
• Plasma descum
• Dry plasma cleaning
• Polymer residue removal
• Organic residue removal
• Semiconductor wafer cleaning
• MEMS process applications
• Compound semiconductor R&D
• University and research institute applications
• Semiconductor process development

Typical Process Capability

Typical Branson/IPC L3200 process capability may include RF plasma ashing, photoresist stripping, descum, controlled process gas flow, vacuum processing, and upgraded PC-based system operation.

• Process Type: Plasma ashing, photoresist stripping, descum, and dry cleaning
• Controller: Upgraded PC controller with touchscreen monitor
• Wafer Handling: Equipe ATM-105 robot with ESC-200 controller
• Original Robot: Original frog robot replaced by upgraded robot handling system
• Wafer Size: To be confirmed based on final configuration
• Gas Lines: Configuration dependent
• RF Power: Configuration dependent

Actual performance depends on final system configuration, wafer size, substrate material, process gas, sample loading, recipe, refurbishment scope, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact system configuration. Typical facility items may include:

• Power: Final power requirement to be confirmed based on exact system configuration
• Vacuum: Vacuum pump capability required
• Cooling: Cooling water or chiller may be required depending on RF generator and system configuration
• Process Gases: Customer process gases depending on photoresist stripping, descum, or dry cleaning application
• CDA / N₂: May be required depending on system configuration
• Exhaust: Process exhaust and pump exhaust required
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or water temperature controllers if applicable, process gas supply, exhaust, CDA / N₂, power connection, and related facility support items unless otherwise specified in quotation.

PC Controller Upgrade Service

SemiStar also provides PC controller upgrade solutions for selected Branson/IPC plasma asher and plasma etcher systems. Upgrade scope may include new PC controller, touchscreen monitor, updated interface, control electronics, robot integration, gas control integration, and replacement of obsolete control components.

PC controller upgrade feasibility must be reviewed case by case based on exact model, current system condition, original wiring, installed options, documentation, robot configuration, and available parts.

RFQ Information Required

To help us confirm the correct configuration and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Wafer size or sample size
• Wafer material or sample material
• Application: photoresist stripping, plasma ashing, descum, dry cleaning, or other process
• Required process gases
• Photoresist type and thickness, if available
• Process specifications and target results
• Throughput requirement
• Robot / wafer handling requirement
• Vacuum pump requirement or existing pump information
• Have you used Branson/IPC L3200 or similar plasma asher equipment before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-245