Typical NANOTECHNOLOGY Lab Fab Equipment

Description

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Thermal Processing
Tystar mini Tytan furnace stack
The Tystar Mini Tytan Furnace Stack contains two atmospheric pressure that are used to process batches of up to 25 6-inch or 4-inch wafers.
Rapid Thermal Anneal (RTA) system
The Allwin21 AccuThermo AW610 is a rapid thermal processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures.

Lithography
Nanoscribe Photonic Professional GT 3d Lithography system
The Nanoscribe Photonic Professional 3D Lithography System is an easy-to-operate table-top laser lithography system that enables the fabrication of true three-dimensional nanostructures using commercially available photoresists
SPX Thermal Product Solutions Curing ovens
Curing Ovens
Two ultra-stable Blue M Ovens for soft and hard baking of photoresists
Electron Beam Lithography System – 100 KeV
The Elionix ELS-G100 is a high speed, ultra high precision thermal field emission electron-beam lithography system.
Electron Beam Lithography System – 50 KeV
The 50 KeV Elionix is a high speed lithography system optimized for large area and high speed pattern writing.
EV group mask aligner
Mask Aligner
The EVG620 Mask Aligner is equipped with high-resolution top and/or bottom side microscopes for single or double-side photolithography.
Brewer Science e-beam spin coater
Spin Coater – E-Beam Resists
The Brewer Science Cee Stand-Alone Spin Coater/hotplate is dedicated for the spinning of electron beam resists.
Brewer Science photoresist and other materials spin coaters
Spin Coater – Photoresist and Other
Two additional Brewer Science Cee Spin Coaters are dedicated for photoresist processing and other non-standard materials
SAMCO UV ozone cleaner
UV Ozone Cleaner
The SAMCO UV-2 is a compact, benchtop, UV-ozone cleaning system that will not damage delicate electronic devices.
Deposition
Ultratech Atomic Layer Deposition (ALD) system
Atomic Layer Deposition (ALD) System
The Ultratech Fiji G2 system is a load-locked ALD system capable of both thermal and plasma-enhanced depositions of various dielectric and metallic films
AJA Internaitonal orion 8 RF sputter system
DC/RF Sputter Deposition System
The AJA Orion Sputtering System is a load-locked sputtering system capable of depositing metal and dielectric films over a substrate up to 6 inches in diameter.
AJA International e-beam and thermal evaporation system
E-beam & Thermal Evaporation System
The AJA Orion 8E Evaporator System is capable of both electron beam (e-beam) and thermal evaporation.
mini tytan 4600 furnace stack
LPCVD Furnace Stack
The Tystar Mini Tytan Furnace Stack contains two low pressure tubes that are used to process batches of up to 25 6-inch or 4-inch wafers.
Organics/Oxides E-beam Evaporator
The AJA Organic evaporator is a combination ebeam and thermal evaporator. The ebeam evaporator in the tool is primarily used to evaporate oxides and magnetic materials. The thermal evaporators are used to evaporate low melting point materials, such as organic semiconductors.
Oxford Instruments PECVD System
Plasma Enhanced Chemical Vapor Deposition System (PECVD)
The Oxford PlasmaPro System 100 PECVD is load-locked tool, capable of depositing silicon oxide, silicon nitride, amorphous silicon, and other films.
Cressington sputter coater
Sputter Coater
Sputter coating uses ionized argon to vaporize gold atoms from a target and deposit them in a thin layer onto a sample.

Perkin-Elmer 4400
Perkin-Elmer 4450
Perkin-Elmer 2400
MRC 603 693 TES
Temescal BJD-1800
CPA S-Gun -Sputter
MRC 643 -Sputter
MRC 603 Sputter
MRC 8671 Sputtering
Emscope SC-650
TES FC-1800
Temescal FC-1800
CHA Mark 50
CHA Evaporator
Temescal BJD-1800
Varian 3120 E-Beam
Airco FC-1800
Temescal FC-1800
SAVANNAH S200-ALD ATOMIC LAYER DEPOSITION SYSTEM
PlasmaLab 80 Plus
Plasmalab 80+ DPCVD
PlasmaTherm 790
PlasmaTherm 720
PlasmaTherm 700
STS PECVD

Etching
Oxford Instruments Inductively Coupled Plasma (ICP)
Inductively Coupled Plasma Etch – Chlorine Based (ICP Cl)
The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter.
Oxford Instruments PlasmaPro System 100/1 Cobra
Inductively Coupled Plasma Etch – Fluorine Based (ICP Fl)
The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter.
IoN 40 Plasma Processing System
Plasma Asher
The PVA Tepla IoN 40 is a plasma processing system configured for etch, strip, clean and surface treatment of wafers.
Oxford Industries PlasmaPro Reactive Ion Etcher
Reactive Ion Etch (RIE)
The Oxford PlasmaPro NPG80 RIE is an open-load medium plasma density system configured for fluorine-based etch chemistries.
SPTS Primaxx Vapor HF Etcher
Vapor Hydrofluoric Acid Etcher
The SPTS Primaxx Vapor HF Etcher is used primarily for isotropic etching of all types of SiO2 and offers a safer alternative to liquid- HF processes.
STPT Exatix e1 Xenon Difluoride Etcher
Xenon Difluoride Etcher
The SPTS Xactix E1 Xenon Difluoride Etcher can be used to isotropically etch Si, Ge, and Mo films.

Plasma Etch
- Tegal 901e
- Tegal 903e
- Lam AutoEtch 490
- Lam AutoEtch 590
- Matrix 303
- Matrix 403
- Lam Rainbow 4420
- PlasmaTherm 700

RIE/ICP/DRIE/Bosch Process

Metrology
Bruker 3D optical profiler
3D Optical Profiler
The Bruker Contour GT-I is a fully automated and programmable optical interferometric microscope that can be used to measure and map surface features in 3D.
Bruker FastScan AFM
Atomic Force Microscope (AFM)
The Bruker Dimension FastScan AFM provides high speed topographic imaging without loss of resolution or force control.
V-VASE ellipsometer
Ellipsometer
The Woollam V-VASE is a Variable Angle Spectroscopic Ellipsometer capable of automated thin-film characterization, high-precision angle, and a wide spectral range (240 nm to 2500 nm).
FEI Scanning Electron Microscope
Field Emission Scanning Electron Microscope (FE-SEM)
The FEI Nova NanoSEM™ is a high resolution scanning electron microscope intended for sample characterization.
Nikon Eclipse inspection microscope
Inspection Microscopes
The system of Nikon Eclipse Inspection Microscopes has a 6”x6” stage and is configured with bright-field, dark-field, and simple polarizing objectives.
Signatone probe station
Probe Station
The probe station is equipped with two Keithley 2400 Source Meters, a Keithley 6485 picoammeter, and a Keithley 2000 Diginal Multimeter.
Bruker stylus profiler
Stylus Profiler
The Bruker Dektak-XT is a semi-automated stylus profiler that can be used to measure step height with better than 5 Å repeatability, surface roughness, as well as 3D surface mapping.
Filmetrics F20 thin film analyzer
Thin Film Analyzer
The Filmetrics F20 is used to measure the thickness and optical constants (n and k) of transparent and semi-transparent thin films.

Back End Processing
Disco model DAD3220 dicing saw
Dicing Saw
The Disco DAD3220 is a single spindle dicing saw, capable of handling work-pieces up to a maximum of 6” square or 6” in diameter.
OEM Spin Rinse Dryer
Spin Rinse Dryer
The spin rinse dryer offers a fast way to clean and dry wafers in patches up to 25 wafers at a time.
Ultran Systems Tape Mounter
Tape Mounter
The Ultron UH114 mounts wafers to dicing tape and a metal frame to be used with the Disco Dicing Saw.
West Band wire bonder
Wire Bonder
The West Bond Wire Bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices.