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AG Associates Heatpulse 4100 Utility Specification
Facility Connections of AG Associates Heatpulse 4100
Utility Requirements of AG Associates Heatpulse 4100:Standard: 200, 208, 220, 240 VAC; 50 or 60 Hz; 70 A maximum; three-phase plus neutral plus ground
Physical Dimensions of AG Associates Heatpulse4100 Rapid Thermal Annealing Systems • Width 40 in. (102 cm) • Depth 42 in. (107 cm) • Height 82 in. (208 cm) • Weight 1500 lb (680 kg) • Shipping weight 1800 lb (816 kg)
The following are the operating specifications for the AG Associates Heatpulse 4100 system.
• Wafer handling: automatic, serial processing using standard cassettes.
The AG Associates Heatpulse 4100 Rapid Thermal Processor is a versatile tool that can be useful for many applications, such as (but not limited to):
• Silicon-dielectric growth
• Implant annealing
• Glass reflow
• Silicides formation and annealing
• Nitridation of metals
• Contact alloying
• Oxygen-donor annihilation
The following options can be added to the AG Associates Heatpulse 4100 Rapid Thermal Annealer at any time: Non-Contact Wafer Aligner : Finds the flat edge or notch of a wafer prior to loading it into the heating chamber. No contact is made with the edge of the wafer; contact is on the backside of the wafer only. Susceptor Autoloader […]
The AG ASSOCIATES HEATPULSE 4100 rapid thermal processing system contains many capabilities which provide significant advantages over conventional batch processing in the production of VLSI circuits. Clean-room integrity, precise temperature control and measurement, software flexibility, and the physical structure of the system (designed for the production environment) are among these advantages.
AG Associates Heatpulse 8108 Utility Specification: The following table is a summary of the utility specifications for the Heatpulse 8108 system: UTILITY Flow Rate Pressure Tube Cooling CDA or Utility N2 35 SCFM 40 SCFM 45 SCFM 80 psi 90 psi 100 psi Valve Actuation CDA or Utility N2 <1 SCFM <1 SCFM <1 SCFM […]