The following options can be added to the AG Associates Heatpulse 4100 Rapid Thermal Annealer at any time:
- Non-Contact Wafer Aligner : Finds the flat edge or notch of a wafer prior to loading it into the heating chamber. No contact is made with the edge of the wafer; contact is on the backside of the wafer only.
- Susceptor Autoloader : Provides the capability to process wafers in a Autoloader susceptor. Wafers are automatically loaded into a susceptor for processing and unloaded at the end of the process cycle. This application is ideal for processing GaAs wafers.
- Slip Free :Hardware and software that dramatically reduces slip for high-temperature processing. Option includes either the flatfinder or non-contact wafer aligner.
- Dual-Color Pyrometer: The Dual-Color Pyrometer (DCP) measures the wafer Pyrometer temperature at two different wavelengths. Using the emissivity correction software, the system can compensate for variations in emissivity from one wafer to another.
- Emissivity Temperature Calibrator : Device that calibrates the system pyrometer to a reference wafer to allow fast emissivity-correction. Includes a portable cart, vacuum source, and closed-loop cooling system.
- Rear Controller: Touch-screen controller for operation from the rear of the system to facilitate maintenance activities.
- E-SECS :Protocol messages which facilitate the remote control of the HEATPULSE 4100 from a host computer system. Option includes communication processor with 12K ROM and 16K RAM. Option supports common SECS II communications protocol required to operate the AG Associates HEATPULSE 4100.
