Description
FSM Adhesion Testers – Thin Film and Film Stack Adhesion Measurement Systems
Thin Film Adhesion Testing and Material Evaluation
SemiStar Corp. provides information and equipment inquiries for Frontier Semiconductor Measurements (FSM) Adhesion Testers.
FSM adhesion testing systems are designed for evaluating the adhesion of thin films and thin-film stacks on substrates for material evaluation.
The FSM Adhesion Testers product family includes two measurement technologies:
- MELT – Modified Edge Liftoff Test
- Aquaflex – 4-Point Bend Film Adhesion Test
FSM Adhesion Testing Systems
1. FSM MELT – Modified Edge Liftoff Test
The FSM MELT (Modified Edge Liftoff Test) system measures the adhesion of thin films and thin-film stacks on a wide variety of crystalline and non-crystalline substrates.
FSM identifies the following compatible substrate material categories:
- Silicon
- III-V compound semiconductors
- Glass
- Other crystalline substrates
- Other non-crystalline substrates
The MELT method is suitable for medium-adhesion samples.
2. FSM Aquaflex – 4-Point Bend Film Adhesion Test
The FSM Aquaflex system uses the 4-Point Bend film adhesion test method.
The system supports film adhesion measurements in:
- Air
- Liquid
The Aquaflex system is suitable for low-to-medium adhesion samples.
A multi-chamber option is available for rapid testing.
FSM MELT vs. Aquaflex – Adhesion Testing Comparison
| Parameter | FSM MELT | FSM Aquaflex |
|---|---|---|
| Measurement Technology | Modified Edge Liftoff Test | 4-Point Bend Film Adhesion Test |
| Measurement Application | Adhesion measurement of thin films and thin-film stacks | Film adhesion testing |
| Adhesion Range | Medium adhesion | Low-to-medium adhesion |
| Substrate Materials | Crystalline and non-crystalline substrates, including silicon, III-V compounds, and glass | Not specified on the manufacturer category page |
| Measurement Environment | Not specified on the manufacturer category page | Air or liquid |
| Multi-Chamber Option | Not specified on the manufacturer category page | Available for rapid testing |
Thin Film and Film Stack Adhesion Measurement
FSM Adhesion Testers provide measurement solutions for evaluating thin-film adhesion on substrates.
The MELT method is identified by FSM for measuring the adhesion of thin films and thin-film stacks on crystalline and non-crystalline materials.
The Aquaflex system provides an alternative 4-point bend adhesion testing method for low-to-medium adhesion samples, with measurement capability in air or liquid.
FSM Adhesion Tester Selection
The selection between FSM MELT and Aquaflex depends on the required adhesion testing method and sample characteristics.
- FSM MELT: Modified Edge Liftoff Test for medium-adhesion thin films and thin-film stacks on crystalline and non-crystalline substrates.
- FSM Aquaflex: 4-Point Bend Film Adhesion Test for low-to-medium adhesion samples, with testing in air or liquid and an optional multi-chamber configuration.
FSM Adhesion Testers – Equipment Inquiry and Quotation
SemiStar Corp. welcomes inquiries from semiconductor manufacturers, compound semiconductor fabs, MEMS manufacturers, advanced packaging facilities, universities, research institutes, and semiconductor process development laboratories.
For an FSM Adhesion Tester equipment inquiry, please provide the following information:
- Preferred equipment: FSM MELT or FSM Aquaflex
- Substrate material
- Substrate size and thickness
- Thin-film material or film stack
- Required adhesion measurement range
- Air or liquid testing requirements, if applicable
- Multi-chamber requirements, if applicable
- Equipment purchase timeline
Equipment availability, configuration, pricing, delivery schedule, and commercial terms are subject to confirmation.
Frontier Semiconductor Measurements (FSM) – Semiconductor Metrology Equipment
SemiStar Corp. is a distributor of Frontier Semiconductor Measurements (FSM) semiconductor metrology equipment, providing measurement solutions for semiconductor manufacturing, compound semiconductor fabs, MEMS, advanced packaging, universities, and research laboratories.
FSM specializes in semiconductor wafer metrology and electrical characterization, including thin film stress, wafer bow, wafer curvature, wafer thickness, Total Thickness Variation (TTV), sheet resistance, four-point probe (4PP), and thin film adhesion testing. FSM measurement systems are available in desktop, semi-automatic, and fully automatic cassette-to-cassette configurations, depending on the equipment model.
FSM Semiconductor Metrology Equipment Models
- FSM 128NT / FSM 128L: Thin film stress, wafer bow, and wafer curvature measurement systems.
- FSM 128 C2C / FSM 128L C2C: Automated cassette-to-cassette thin film stress, wafer bow, and curvature measurement systems.
- FSM 500TC: High-temperature thin film stress and wafer curvature measurement system.
- FSM 900TC / FSM 900TC-VAC: High-temperature wafer stress and curvature measurement systems, including vacuum configurations.
- FSM 900TC C2C / FSM 900TC-VAC C2C: Fully automated cassette-to-cassette high-temperature stress and curvature measurement systems.
- FSM 413 MOT: Desktop wafer and thin film thickness measurement system using Echoprobe™ infrared interferometry.
- FSM 413 SA: Semi-automatic wafer and thin film thickness measurement system with enclosure.
- FSM 413 C2C: Fully automatic cassette-to-cassette wafer thickness, thin film thickness, and TTV measurement system.
- FSM 4PP: Contact four-point probe and non-contact sheet resistance measurement systems, including tabletop and automated cassette-to-cassette configurations.
- FSM MELT: Modified Edge Liftoff Test system for thin film and film stack adhesion measurement.
- FSM Aquaflex: Four-point bend film adhesion testing system for low-to-medium adhesion samples.
Semiconductor Metrology Applications
FSM equipment supports semiconductor process development, wafer characterization, thin film deposition evaluation, ion implantation, diffusion, metallization, wafer thinning, wafer bonding, MEMS fabrication, and advanced semiconductor manufacturing.
Contact SemiStar Corp. for FSM semiconductor metrology equipment selection, technical specifications, system configurations, and quotations.