Description
Tokyo Diamond Tools – Diamond Grinding Wheels & Pad Conditioners for Semiconductor Applications
SemiStar offers Tokyo Diamond Tools precision diamond tooling for semiconductor wafer processing and semiconductor production equipment applications in the U.S. and Canada.
Tokyo Diamond Tools has been developing and manufacturing diamond and CBN tools since 1932. Many products are customized according to the customer’s material, equipment, process, drawings and application requirements.
1. Wafer Grinding & Back-Grinding Wheels
Diamond grinding wheels for surface grinding and back-grinding of semiconductor wafers, with particular applications for hard and brittle compound semiconductor materials.
- SiC and other compound semiconductor wafers
- Rough grinding wheels
- Finish grinding wheels
- Customized wheel specifications for the customer’s wafer, equipment and process
- Alternative solutions for existing or OEM-supplied grinding wheels
Technical Information – Wafer Grinding / Back-Grinding Wheels (PDF)
2. Wafer Edge Grinding & Notch Grinding Wheels
Precision diamond wheels for wafer edge grinding, beveling and notch grinding. Applications include semiconductor and compound semiconductor wafer manufacturing.
- Silicon (Si)
- Silicon Carbide (SiC)
- Sapphire
- GaN
- Edge grinding / beveling
- Notch grinding
- Customized wheel design for specific wafer and process requirements
Technical Information – Edge & Notch Grinding Wheels (PDF)
3. CMP Pad Dressers / Pad Conditioners
Electroplated diamond pad dressers for conditioning polishing pads used in semiconductor wafer polishing and CMP-related applications.
- Electroplated diamond construction
- Different diamond grain sizes and shapes
- Customizable diamond patterns
- Solutions can be optimized according to pad type and process requirements
- Available for evaluation as alternatives to existing pad conditioners
Technical Information – Pad Dressers / Pad Conditioners (PDF)
4. Diamond Tools for Quartz, Ceramics & SiC Components
Customized diamond grinding tools are also available for machining hard and brittle materials used in semiconductor production equipment.
- Quartz glass
- Ceramics
- SiC
- Glass and other hard/brittle materials
- Pocket machining
- Helical machining
- Edge, internal and external grinding
- Custom tools based on component geometry and machining requirements
Product Catalog – Semiconductor Production Equipment Applications (PDF)
Technical Information – Semiconductor Equipment Parts Processing (PDF)
5. DEXmill Diamond Tools
DEXmill diamond tooling is available for precision machining applications. Please provide the workpiece material, drawing, machining equipment and process requirements so the appropriate tool can be reviewed.
DEXmill Product Information (PDF)
Custom & Replacement Applications
Most Tokyo Diamond semiconductor tools are application-specific rather than simple off-the-shelf replacement parts. Customers may contact SemiStar when:
- Looking for an alternative to an existing grinding wheel or pad conditioner
- Looking for an alternative to a consumable originally supplied with equipment
- Experiencing wheel life, surface finish, chipping, cracking or other process issues
- Looking for improved performance, price or lead time
- Developing a new wafer, material or machining process
For an inquiry, please provide as much information as available, including the current tool/wheel information, equipment manufacturer and model, workpiece or wafer material, wafer size, drawings/photos, current process conditions, and the issue or improvement being requested.
Applications are reviewed case by case. SemiStar will work with Tokyo Diamond Tools to evaluate the customer’s requirements and propose a suitable solution.
Pad Dresser | Wafer Grinding Wheels | Edge & Notch Grinding | SPE Product Catalog | SPE Parts Processing | DEXmill
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