Surface Technology Systems STS Multiplex ICP Plasma Etcher
- System Type:Multiplex ICP
- Wafer Size: 4 inch. Can be upgraded for 5″,6″,8″ at refurbished condition.
- Chuck: E-chuck
- STS Main Etch chamber(72” L x 24” W x 48” H): ASE
- Type of loadlock:Single Wafer Loadlock
- RF Power Chart(32” L x 24” W x 40” H): ENI ACG-3 and ENI ACG-10B
- Low electrode Chiller ( 32” L x 24” W x 32” H): Neslab CFT-75
- Electronics Rack Location:Standard layout proposed
- Pumps and pumping lines: leybold Turbo Pump
- Chamber Backing Pump:N/A
- Loadlock Pump:N/A
- Computer and monitor
- STS remote gas cabinet (32” L x 13” W x 60” H), Air cannister (12” L x 12” W x 24” H) & accessories. 5 gas lines with 4 of MFCs including Cl2 at refurbished condition.
********** Used. Great Condition.
Valid : It is only for end users and is subject to prior sale without notice. Appreciate your time!
Condition: We sell it at AS IS or complete, working, functional test at extra cost.
Photos: Please contact us.
Info on the system from the owner for your reference.