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Dicing Saws etc

Category: SS7270

Description

Description

Semiconductor Equipment parts-Process equipment-Tape Mounters, Detapers, Expanders, UV, Wafer/Mask/FPD Cleaners ,Dicing Blades ,Dicing Saws

Location: CA, U.S.A.

These are subject to prior sale. These are only for end user. Appreciate your time.

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.

1	ADT 7100 ceramic 150mm vacuum chuck
2	Advanced Engineering 951UV Dicing Tape Cure
3	Disco NBC-Z dicing blades, 52×0.03×40
4	Disco NBC-Z dicing blades, 52×0.05×40
5	Disco NBC-Z dicing blades, 52×0.07×40
6	Disco NBC-Z dicing blades, 52×0.09×40
7	Karl Suss RA120M automatic scriber for GaAs and sensitive materials
8	MDI Schott Advanced Processing GmbH MS500S High Precision automatic LCD glass scriber
9	Nanomaster SWC4000 single wafer- mask cleaner with megasonic spray for max 300mm wafers
10	SEC 3100 tape mounter for up to 150mm wafers
11	Ultron UH-101C Semiautomatic-UV Curing System
12	Ultron UH108 backlap tape applicator with Take-up roller assembly and static eliminator for 4-6 inch wafers

SS7270-1-2-1-1 and SS7270W

Recommended Hot Equipment

Metrology | Tester | Wafer Carriers
Main Refurbished Equipment

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