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Lapping Bonding Polishing

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Description

Semiconductor Equipment parts-Process equipment-Lapping Bonding Polishing

Location: CA, U.S.A.

These are  subject to prior sale. These are only for end user. Appreciate your time.

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.

1 Lapmaster 15 conditioning rings
2 Logitech 1ACCS-0700 Diamond Conditioning Block 127mm 40 micron- NEW
3 Logitech 1P5AC-0100 Sample mounting pad-NEW
4 Logitech 1P5AC-2500 wafer mounting plate and 1P5AC-2700 spacer ring
5 Logitech 1PL34-0100 35cm polishing plate- NEW
6 Logitech 1PLE1-0600 300mm expanded poly lapping plate
7 Logitech 1PLE1-0700 300mm Platten with expanded poly 304-NEW
8 Logitech 1SDG1 flat polishing fixture with dial gauge 100mm
9 Logitech 200mm vacuum chuck
10 Logitech 370mm platten with circular grooves for LP50
11 Logitech 90 degree Main Gear Drive Motor pn 2MTR-050- NEW for LP50 lapping machine
12 Logitech Glass Conditioning block 127mm
13 Logitech Glass conditioning block 127mm 1ACCS-0400
14 Logitech LP50 350mm lapping plate
15 Logitech motor for LP50 abrasive cylinder drive 2MTR-061 NEW
16 Logitech PM4 lapping and polishing machine
17 Logitech Polishing Jig holder 1ACCS-1100
18 Logitech PP51-0400 Angular adjustment assembly-NEW
19 Logitech PP5A jig with angular adjustment plate and 2.2″ mounting pad-Reconditioned
20 Logitech PP8 polishing jig for 150mm wafers
21 Logitech PSM (programmable sample monitor)
22 Logitech roller yoke for 3″ jigs
23 Logitech Sample loading gauge
24 Logitech Slurry Cylinder-Autofeed with valve for LP50
25 Logitech VS-2 vacuum unit
26 stainless/phenolic conditioning rings
27 Ultra Tec conditioning ring

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SS7270-1-2-1-1 and SS7270W

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers