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SS11215-Wire Bonding Machine

Description

Wire Bonding Machine – West-Bond / K&S or Equivalent – Provider Wanted

For information about how SemiStar Providers Wanted works, please visit: About SemiStar Providers Wanted .

Inquiry ID: SS11215-1-1
Inquiry Date: September 10, 2026
Status: OPEN
Installation / Delivery Location: CT, USA

Customer Requirement

A customer is seeking a wire bonding machine for semiconductor and microelectronic device assembly. The system should be suitable for fine-wire ball and/or wedge bonding.

Systems of Interest

  • West-Bond 7700A
  • West-Bond 35363730F
  • K&S wire-bonding systems
  • Other suitable systems providing better ball/wedge bonding flexibility

The provider may recommend another system if it is more suitable for the customer’s application.

Information Requested from Provider

If you can provide a suitable system, please provide complete and correct information whenever possible, including:

  • Manufacturer and exact model
  • Equipment description and history
  • Configuration and installed options
  • Current condition
  • Supported wire materials and diameters
  • Relevant specifications
  • Refurbishment and testing scope
  • Included tooling and accessories
  • Warranty
  • Overall dimensions and weight
  • Current equipment location
  • Asking price
  • Availability and lead time
  • Installation and training capability
  • Long-term spare parts and technical support
  • Current photos, videos, specification sheets, test reports, or other supporting information

Working, tested, refurbished, or otherwise supportable equipment is preferred.

Can You Provide This Solution?

Please submit your information below and reference Inquiry ID.

Please also tell us about your equipment inventory, technical expertise, repair capabilities, and service coverage. SemiStar may contact you regarding similar future customer inquiries.

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This inquiry is subject to the current status of the original customer requirement. Please review About SemiStar Providers Wanted for program details and conditions.

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