Top

Navigation

You are here: Home > Products > Disco DFL 7160 Wafer Dicing Saw
Awaiting product image

Disco DFL 7160 Wafer Dicing Saw

Categories: , Tag:

Description

Disco DFL 7160 Wafer Dicing Saw, Laser Maximum Power: 18 W. Laser Wavelength: 355 nm.  50/60Hz, 3 Phase, 14amps.
Valid: Subject to prior sale. This item is only for end user

Please contact us for more information on the product:

[dynamichidden dynamichidden-813 "CF7_URL"]

Your Name*:

Your Email:

Your Message:

Captchac Codecaptcha

Submit:

ID-OEM-Model-2

S

Share the post "Disco DFL 7160 Wafer Dicing Saw"

  • Facebook
  • X

Related products

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers