Archive | Heatpulse 4100

AG Associates Heatpulse 4100 Utility Specification

Facility Connections of AG Associates Heatpulse 4100

Utility Requirements of AG Associates Heatpulse 4100:Standard: 200, 208, 220, 240 VAC; 50 or 60 Hz; 70 A maximum; three-phase plus neutral plus ground

Physical Dimensions of AG Associates Heatpulse4100 Rapid Thermal Annealing Systems • Width 40 in. (102 cm) • Depth 42 in. (107 cm) • Height 82 in. (208 cm) • Weight 1500 lb (680 kg) • Shipping weight 1800 lb (816 kg)

The following are the operating specifications for the AG Associates Heatpulse 4100 system.
• Wafer handling: automatic, serial processing using standard cassettes.

The AG Associates Heatpulse 4100 Rapid Thermal Processor is a versatile tool that can be useful for many applications, such as (but not limited to):
• Silicon-dielectric growth
• Implant annealing
• Glass reflow
• Silicides formation and annealing
• Nitridation of metals
• Contact alloying
• Oxygen-donor annihilation

The following options can be added to the AG Associates Heatpulse 4100 Rapid Thermal Annealer at any time: Non-Contact Wafer Aligner : Finds the flat edge or notch of a wafer prior to loading it  into the heating chamber. No contact is made with the edge of the wafer; contact is on the backside of the wafer only. Susceptor Autoloader […]

The AG ASSOCIATES HEATPULSE 4100 rapid thermal processing system contains many capabilities which provide significant advantages over conventional batch processing in the production of VLSI circuits. Clean-room integrity, precise temperature control and measurement, software flexibility, and the physical structure of the system (designed for the production environment) are among these advantages.