Description
Used Semiconductor Equipment Parts
These are subject to prior sale. These are only for end user. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
1 | Accretech/TSK | UF3000EX | Production Wafer Prober |
2 | Applied Materials (AMAT) | Centris SYM3X Poly – Chamber Only | Polysilicon Etch |
3 | Applied Materials (AMAT) | Centris AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
4 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
5 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
6 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
7 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
8 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing |
9 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
10 | Despatch Industries | LCD1-51N-5 | Cure Oven |
11 | Despatch Industries | LCD1-51N-5 | Cure Oven |
12 | Despatch Industries | LCD1-51N-5 | Cure Oven |
13 | Ebara | FREX300S Tungsten | Tungsten CMP |
14 | Ebara | FREX300X Dielectric | Dielectric CMP |
15 | Ebara | FREX300S Dielectric | Dielectric CMP |
16 | Ebara | FREX300S Tungsten | Tungsten CMP |
17 | Hermes Microvision (HMI) | eScan 430 | E-beam Inspection |
18 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
19 | KLA-Tencor Corp. | SpectraShape 8660 | Optical Review System |
20 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
21 | Kokusai | Quixace II Nitride | Vertical Furnace |
22 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
23 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
24 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
25 | Kokusai Electric Co., Ltd. | Lambda-300LE | Stripper/Asher |
26 | Kokusai Electric Co., Ltd. | Lambda-300N | Stripper/Asher |
27 | Kokusai Electric Co., Ltd. | Lambda-300N | Stripper/Asher |
28 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
29 | LAM Research | 2300e6 KIYO EX | Polysilicon Etch |
30 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
31 | LAM Research | 2300 Versys Metal H | Metal Etch |
32 | LAM Research | 2300 Versys Metal H | Metal Etch |
33 | LAM Research | 2300 Versys Metal H | Metal Etch |
34 | LAM Research | 2300 Exelan Flex FX+ – Chamber Only | Dielectric Etch |
35 | LAM Research | 2300e6 Exelan Flex FX | Dielectric Etch |
36 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
37 | Nissin Electric Co., Ltd. | EXCEED 3000AH-EVO2 | Mid Current Implanter |
38 | Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter |
39 | Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter |
40 | Novellus Systems Inc. | VECTOR – PECVD Silane | PECVD (Chemical Vapor Deposition) |
41 | Rorze | RSC222 | Wafer Sorter |
42 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
43 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
44 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
45 | Tokyo Electron Ltd. (TEL) | Trias EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
46 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
47 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS COAT ONLY | Coat only Track |
48 | Tokyo Electron Ltd. (TEL) | TELINDY Plus IRad process TBD | Vertical Furnace |
49 | Tokyo Electron Ltd. (TEL) | ALPHA-303i CURE | Vertical Furnace |
50 | Tokyo Electron Ltd. (TEL) | Cellcia | Production Wafer Prober |
51 | Tokyo Electron Ltd. (TEL) | Cellcia | Production Wafer Prober |
52 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
53 | Tokyo Electron Ltd. (TEL) | Tactras Vigus RK3 | Dielectric Etch |
54 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
55 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
56 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
SS5319-0-2024-3