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Tester Equipment

Category: Resell Products Tag: Tester

Description

Description

The following Tester Equipment are only for end user. Please contact us if you have any questions. Subject to prior sale without notice. Appreciate your time!

Condition: Used

1	Agilent	3070 S-III
2	Accretech	UF3000
3	Agilent	93000 C400e
4	Chroma	3110TT
5	Credence	ASL-x
6	Credence	ASL-1000
7	Credence	Quartet
8	Credence	SC Micro
9	Credence	SC312
10	Delta	Eclipse
11	Eagle Test	ETS-364
12	Electroglas	4090u
13	esi	9830
14	GenRad	2287i
15	GenRad	228X
16	GenRad	TS128
17	HP	307X
18	HP	5DX
19	LTX	Fusion HF
20	LTX-Credence	Fusion CX
21	Multitest	8704
22	NexTest	Magnum
23	NexTest	Maverick PTII
24	Seiko-Epson	NS6040
25	Semics	Opus II
26	TEL	P12-XLn+
27	TEL	P-8XL
28	Teradyne	Spectrum
29	Teradyne	SP8851
30	Teradyne	SP8852e
31	Teradyne	SP8855
32	Teradyne	TSLH 121
33	Teradyne	TSLH 128
34	Teradyne	Catalyst
35	Teradyne	J750
36	Teradyne	J750ex
37	Teradyne	microFLEX
38	Teradyne	P-8XL Parts
39	Teradyne
40	Teradyne	UltraFLEX
41	TSK	APM-90
42	Verigy	V93000 PS

ID-SS6369-1-1-1

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Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam Rainbow 4400, Lam Rainbow 4420, Lam Rainbow 4428, Lam Rainbow 4500, Lam Rainbow 4520, Lam Rainbow 4528, Lam Rainbow 4600, Lam Rainbow 4620, Lam Rainbow 4628, Lam Rainbow 4700, Lam Rainbow 4720, Lam Rainbow 4728, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch, Downstream Plasma Etch,Enviro,ENVIRO-1XaENVIRO-1Xa ,2CENVIRO-Optima,Luminous NA,NA-8000NA-1300NA-1500 ,Multifilm,NE-550EXaNE-950EX, APIOSNE-5700Deep, Oxide Etching,NLD-570EXaRISE System,RISE Series,Cluster Systems,SME SeriesuGmni Series,SRH SeriesULDiS Series,SMV-500FRoll-coater,SPW SeriesIn-line Systems,SIV SeriesSDH-4550LR&D,CS-200, 300mm,ENTRON-EXENTRON-EX2,Evaporation Roll Coater,EW SeriesR&D/Pilot Production,Ei-5In-line Systems,Ei-H series,Si Processing,IMX-3500SOPHI-200/260 ,SiC,IH-860,Brazing Furnace,FB SeriesFHHn series ,Vacuum Sintering,FSC ,eriesVacuum,Induction Melting,FMI Series,Vacuum Heat Treatment,FHB-60CFHV Series,Single-Substrate,CC Series,CME Series,In-line Systems, ULGLAZE Series,Lyophilizer,DFB Series,Micropowder Dry, UPD-400D,FM Series,DFR Series,Centrifugal Type,CEH-400B,ULVAC,Rapid Thermal Process, Modular Process Technology, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, 4100 , 4100S 4108, 8108 ,Atmospheric Rapid 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Equipment，Eaton Reliance 850，SOLARIS 100,SOLARIS 200,SOLARIS 150,SOLARIS 150UV,surface science integration, ssi-rtp,ecm-usa,Jipelec JetLight,Jipelec JetFirst 100,Jipelec JetFirst 200,Jipelec JetFirst 300,Jipelec JetStar,Annealsys AS-Micro,Annealsys AS-150,Annealsys AS-100,Annealsys AS-One,Annealsys AS-Master,Annealsys AS-Premium,Annealsys Zenith-100, unitemp, Vacuum Solder System , VSS-450-300 ,RTP-100,RTP-100-EP,RTP-100-HV,RTP-100-HV-EP,RTP-150,RTP-150-EP,RTP-150-HV,RTP-200,VPO-300,VPO-300-HV, hot plate HP-220,hot plate , VSS-450-300, RSO-200, RSO-300, RSS-210-S, RSS-160-S, RSS-110-S , ULVAC, Real RTP-100,Real RTP-150,Real RTP-Mini, SJ High Technology Company, ULTECH, Mattson,Helios XP, Helios C200,Millios,Aspen III,Aspen II,Alpine, Plasma Asher, Descum, Clean, Novyka, Selective Etch Systems, Surface Treatment Systems, Interface Treatment Systems, paradigmE, inductively coupled plasma, ICP, SUPREMA, plasma dry strip , Dry Strip, Plasma ETCH,Plasma ETCH,Surface Treatment 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formation,radical-based oxidation process,rapid thermal processing spike anneal,300mm RTP spike anneal process,ramp-up methodologies, rampdown methodologies,Rapid thermal annealing apparatus,RTA furnace,Dai-ichi Kiden,Dai-ichi Kiden RSA, Combustion furnace, High vacuum heating system, Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system,CreaTec Fischer,Growth Systems,Mini MBE System,LT-STM/AFM,Evaporators,Centrotherm,centrotherm c.HORICOO 300 ,horizontal batch-type system,centrotherm c.HORICOO 200 , field-proven , ultra-versatile tube furnace system ,centrotherm c.VERTICOO , batch-type wafer processing , semiconductor device fabrication, atmospheric processes, LPCVD processes,centrotherm c.ACTIVATOR, high-temperature annealing, high-volume SiC device manufacturing, electrical activation , post implantation annealing ,SiC MOSFET , diode manufacturing,Cost-efficient dopant activation,Annealing of AlN seed layers , Annealing of AlN epitaxial layers,centrotherm c.OXIDATOR , high-temperature oxidation furnace , Rapid Thermal Processing system for silicon and compound semiconductors,c.RAPID 200,fully automatic loading system,centrotherm PECVD,c.PLASMA, c.DIFF,centrotherm highly versatile diffusion,wide band gap,c.CRYSCOO HTA,AP Systems,AP Systems Korea,KORONA RTP-12MP, KORONA RTP-12LPO , KORONA RTP-12LR/LPRR,Seebeck Coefficient / Electric Resistance Measurement System ZEM-3 series，Mini Lamp Annealer MILA-5050， Atmospheric Thermoelectric Module Evaluation System F-PEM，