Brand New SAMCO RIE-200C Automatic Reactive Ion Etch Plasma Etching System

SemiStar Corp. offers one brand new SAMCO RIE-200C Automatic Reactive Ion Etch Plasma Etching System located at our Morgan Hill, California, USA facility. The system remains in original OEM shipping crates and has never been installed or powered on.

The SAMCO RIE-200C is a high-throughput cassette-to-cassette reactive ion etching (RIE) platform designed for semiconductor manufacturing, university cleanrooms, advanced R&D, pilot production, and silicon-based plasma etching applications. The system is based on SAMCO’s proven CCP RIE technology platform and supports automated wafer handling, process repeatability, and high-uniformity plasma etching capability.

Product photos are OEM reference images for reference only. Actual system configuration, accessories, software, utilities, and shipment condition should be confirmed by SemiStar’s final quotation and inspection documentation.

Availability

System Overview

The SAMCO RIE-200C is a cassette-to-cassette reactive ion etching platform designed for high-throughput automated semiconductor plasma etching applications. Developed from SAMCO’s long-proven CCP RIE technology platform, the system is designed to provide excellent plasma process repeatability, etch uniformity, and automated wafer handling capability for advanced semiconductor processing.

The RIE-200C supports automated wafer transfer and process operation for semiconductor fabs, pilot production facilities, university cleanrooms, and advanced materials process development environments.

Key Features

• Cassette-to-cassette automatic operation
• Dual cassette configuration
• Double-arm atmospheric transfer robot
• Atmospheric high-speed transfer system
• No conventional load lock required
• Higher throughput and reduced cycle time
• Up to 8-inch (200 mm) wafer capability
• Fully automated PLC control architecture
• Touch panel operation interface
• Recipe storage and process control capability
• Data logging capability
• High-precision CCP RIE plasma processing platform
• Excellent etch uniformity and process stability

Wafer Handling Configuration

• Cassette loading automatic system
• Double-arm atmospheric wafer transfer robot
• Cassette-to-cassette automated processing
• Up to 200 mm / 8 inch wafer capability
• High-throughput wafer transfer architecture

Typical Applications

The system is suitable for high-precision plasma etching of:

• Silicon (Si)
• Polysilicon (Poly-Si)
• Silicon Dioxide (SiO2)
• Silicon Nitride (SiN)
• Photoresist plasma ashing
• Photoresist stripping and descum
• Organic contaminant removal
• Advanced semiconductor plasma processing

Typical End Users

• Semiconductor fabrication facilities
• University cleanrooms
• Research institutes
• Advanced R&D laboratories
• Pilot production lines
• MEMS and compound semiconductor facilities

Automation and Process Control

• Automatic cassette-to-cassette wafer handling
• PLC-based process control system
• Touchscreen operation interface
• Recipe management capability
• Process monitoring and data logging
• Automated production-oriented operation

Condition Details

• Brand new system
• Never installed
• Never powered on
• Still sealed in original OEM shipping crates
• OEM reference photos shown for reference

Facility Requirements

• Electrical power requirements to be confirmed during final installation planning
• Process gas cabinets and gas delivery systems required
• Vacuum pump and exhaust requirements to be reviewed
• Cooling water/chiller requirements to be confirmed
• Facility exhaust and scrubber compatibility required
• Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation

Installation and Support

SemiStar can provide installation coordination, startup assistance, training, and technical support if required. Final installation scope, utilities interface responsibility, process support scope, and warranty terms will be confirmed in the official quotation.

RFQ Information Requested

To help us confirm the best configuration and support scope, please provide:

• Target wafer size and substrate material
• Target plasma etching application
• Required process gases and chemistry
• Expected throughput requirements
• Facility readiness and utilities information
• Required installation or startup support
• Expected purchase timeline and budget range

Important Notes

• Subject to prior sale without notice.
• Final specifications subject to SemiStar official quotation and inspection confirmation.
• All OEM names, trademarks, and model names belong to their respective owners.
• SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
• Final purchase specifications, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.

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