Description
Refurbished Oxford Plasmalab 133+ RIE CL Reactive Ion Etcher
SemiStar Corp. offers one refurbished Oxford Plasmalab 133+ RIE CL Reactive Ion Etcher configured for GaN and compound semiconductor plasma etching applications. The system is located in Nanjing, Jiangsu, China and is available in refurbished condition with OEM specifications, 6 months warranty, and installation support if necessary.
The Oxford Plasmalab 133+ RIE CL is a high-performance reactive ion etching platform designed for advanced semiconductor, MEMS, GaN, compound semiconductor, and research plasma processing applications. The system supports large substrate processing up to 300 mm wafers and provides stable plasma process control with advanced endpoint detection capability.
Product photos are for reference only. Actual system configuration, accessories, utilities, software, installed options, and cosmetic condition should be confirmed by SemiStar’s final quotation and inspection report.
Availability
| Equipment Model | Oxford Plasmalab 133+ RIE CL |
| Equipment Type | Reactive Ion Etcher (RIE) |
| Category | RIE / Plasma Etcher / Compound Semiconductor Etch System |
| Manufacturer / OEM | Oxford Instruments Plasma Technology |
| Model Year | 2004 |
| Serial Number | 417728 |
| Condition | Refurbished, used good condition |
| Quantity | 1 system |
| Location | Nanjing, Jiangsu, China |
| Warranty | 6 months after shipment, subject to final quotation terms |
| Installation / Training | Available if necessary |
| Price | Contact SemiStar by filling out the inquiry form below |
| Validity | Subject to prior sale without notice |
System Description
The Oxford Plasmalab 133+ RIE CL is a large-format reactive ion etching platform configured for advanced plasma etching applications including GaN, compound semiconductor materials, dielectric etching, and research plasma process development.
The system supports substrate sizes up to 300 mm with a 330 mm platen and includes water-cooled electrode capability, advanced optical endpoint detection, and multi-gas plasma process flexibility.
Current Configuration
- Oxford Plasmalab 133+ RIE CL Reactive Ion Etcher
- Supports wafer sizes up to 300 mm
- 330 mm platen configuration
- Mechanical chuck
- Configured for GaN plasma etching applications
- 600 W RF generator
- 13.56 MHz RF plasma architecture
- Water-cooled electrode
- Electrode temperature range: 10°C to 80°C
- Verity Optical Emission Spectroscopy endpoint detection
- Windows PC with user-friendly GUI interface
- 8-line gas pod configuration
Installed Gas Configuration
| Gas | MFC Range |
|---|---|
| Argon (Ar) | 100 SCCM |
| Chlorine (Cl2) | 100 SCCM |
| Boron Trichloride (BCl3) | 100 SCCM |
| Nitrous Oxide (N2O) | 200 SCCM |
| CHF3 | 200 SCCM |
| Ammonia (NH3) | 100 SCCM |
| Methane (CH4) | 50 SCCM |
The gas pod includes 8 gas lines with 7 installed MFCs as listed above.
Endpoint Detection System
- Verity Optical Emission Spectroscopy (OES)
- Spectral range: 200–800 nm
- Real-time plasma endpoint monitoring capability
- Suitable for advanced etch process control
RF Power and Process Information
- RF Power: 600 W
- RF Frequency: 13.56 MHz
- Reactive Ion Etching (RIE) plasma architecture
- Water-cooled electrode system
- Electrode temperature range: 10°C to 80°C
- Suitable for compound semiconductor plasma etching
Typical Applications
- GaN plasma etching
- Compound semiconductor processing
- III-V semiconductor etching
- Dielectric plasma etching
- MEMS process development
- Research and pilot production plasma processing
- Advanced semiconductor plasma etching
- University and R&D cleanroom applications
Wafer Capability
- Supports wafer sizes up to 300 mm
- 330 mm platen configuration
- Large substrate plasma process capability
- Mechanical chuck substrate holding
Control System
- Windows PC controller
- User-friendly graphical interface (GUI)
- Recipe management capability
- Process monitoring and control capability
- Data logging capability
Facility Requirements
- Electrical power requirements to be confirmed during final configuration review
- Process gas cabinets and gas delivery systems required
- Vacuum pump and exhaust requirements to be reviewed
- Cooling water/chiller requirements required
- Facility exhaust and scrubber compatibility required
- Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation
Refurbishment and Support
SemiStar can provide the equipment in refurbished condition with OEM specifications. Refurbishment scope, functional testing, installation, training, utilities integration, and warranty scope will be confirmed based on the final purchase order and customer requirements.
The standard offering includes a 6-month warranty after shipment unless otherwise stated in the official quotation. Installation and startup support are available if necessary.
RFQ Information Requested
To help us recommend the best final configuration and support scope, please provide:
- Substrate size and material
- Target etch material and process application
- Required plasma chemistry
- Expected etch profile, rate, and selectivity requirements
- Facility readiness and utility information
- Required installation or startup support
- Expected purchase timeline and budget range
Important Notes
- Subject to prior sale without notice.
- Final specifications subject to SemiStar official quotation and inspection confirmation.
- All OEM names, trademarks, and model names belong to their respective owners.
- SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
- Final purchase specifications, refurbishment scope, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.
Contact SemiStar
ID-OEM-MODULE-1 MSP-175-195