Main Maker

Wanted

We are currently looking for the following. Please send us information on them in detail if you own any of them. We appreciate your time.

  • Tegal 981e Plasma Etcher, 8 inch
  • Tegal 983e Plasma Etcher, 8 inch
  • GSI LT2100 laser Trimmer-ID-5142
  • KLA-Tencor RS100-ID-4781
  • Metal CVD, Preferable is dual chamber (one metal: W and the other SiO2/Si3N4).  400C Max.No brand in particular-SS5604
  • ICP with EOP function, Oxford or STS or PlasmaTherm-408
  • AIX G4 and AIX G5 MOCVD-SS7515
  • Varian 3290 sputter-SS3475
  • ESD 160 Implant-SS3475
  • Suss SB8 or Suss SB6 wafer bonder-SS8493
  • PN: 47800107, Box, graphite, 8 inch, for 6 inch wafer, for Mattson Steag 2800 Rapid Thermal Processing equipment
  • PN: 47800108, Box, graphite, 8 inch, top cover, for Mattson Steag 2800 Rapid Thermal Processing equipment
  • Hitachi FE-SEM 4700, 4800, 4500
  • Tegal 901e electrode, PN 39-733-001
  • PVA Tepla 100 plasma system-SS5261-12
  • VARIAN Model: E500 HP Wafer Size: 8″,Medium current ion implanter (SS5279)
  • CHA Industries – Mark 50
  • Eco-Snow ACS 1600 WaferClean System-SS4503
  • Tegal 901e etcher
  • Tegal 903e etcher
  • PN 39-344-002 Tegal
  • Lam TCP 9600 metal etcher
  • Lam Rainbow 4520i etcher
  • EG 4090u or 4090u+ with COLD option
  • Robot/controller for KLA Asset F5X tool
  • Lam Rainbow 4520XL Bottom electrode   PN: 839-440562-306 or 839-440462-306
  • Heatpulse 8108 RTP
  • Gasonics AE 2001 Etcher
  • KLA 6220
  • KLA 6420
  • ASM PG300RM -SS5305
  • ASM MS100 -SS5305
  • Hesse Bondjet 820 Automatic Fine Wire Wedge Bonder -SS8060

 

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers