Description
Varian XM 2000 Sputtering Deposition System. Varian’s XM-2000 Cassette-to-Cassette Sputtering System brings enhanced computer control to the field-proven XM-2000 Sputtering System. Automatic process control with superior diagnostic capabilities for more efficient deposition and ease of operation. The XM-2000 can process wafers from 3′ to 6″ in diameter, and accommodates odd-size substrates.
Process Versatility – Wide variety of metals can be deposited, using both reactive and non reactive gases, with superb run-to-run repeatability and uniformity. Ideal for both R&D and production applications. Highly Flexible – System can deposit metal films on backside as well as front side of substrates. Adapters allow sputtering on odd-sizes, pieces, and multiple-size wafers within a single run. Fully Automated – Automatic, touch-screen computer control and straightforward system design facilitate operation and system maintenance. Production Worthiness – Computerized process and diagnostic control, combined with independently vented and pumped load locks, provide well-monitored and continuous deposition. Eliminates Cross-contamination – Plasma confinement shields physically isolate process stations and capture precious metals for easy recovery. The XM2000 uses the single wafer sputtering concept, processing every wafer identically for repeatable films, run after run.
Valid time: Subject to prior sale without notice.
Contact us (sales@semistarcorp.com) for the availability and more info pls. Appreciate your time.
ID-SS1184
