Description
Used Semiconductor Equipment Parts -Updated November 10 the 2025.
These are subject to prior sale. These are only for end user. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
To search this webpage for keywords (e.g., model number, device manufacturer), press Ctrl + F on your keyboard. Then type your target keyword in the pop-up search box.
| Manufacturer | Model | Asset Type | Asset Location Country | Wafer Size |
| Ableprint Technology (APT) | VFS-60A | Cure Oven | Taiwan | 300mm |
| ACA VISION TECHNOLOGY SDN.BHD. | AWB | Wire bond inspection (3VI/3O) | China | N/A |
| Accretech/TSK | UF200 | Production Wafer Prober | Germany | 200mm |
| Accretech/TSK | UF200 | Production Wafer Prober | Germany | 200mm |
| Accretech/TSK | UF200 | Production Wafer Prober | Germany | 200mm |
| Accretech/TSK | UF3000EX-i5 | Production Wafer Prober | Japan | 300mm |
| Accretech/TSK | UF3000EX-i5 | Production Wafer Prober | Japan | 300mm |
| Accretech/TSK | UF3000EX-i5 | Production Wafer Prober | Japan | 300mm |
| ADE Corporation | AFS-3220 | Wafer Characterization | Taiwan | 300mm |
| Advanced Dicing Technologies (ADT) | 977 | Wafer Cleaner | China | N/A |
| Advanced Dicing Technologies (ADT) | 977 | Wafer Cleaner | China | N/A |
| Advanced Dicing Technologies (ADT) | 977 | Wafer Cleaner | China | N/A |
| Advanced Engineering | UV-951 | UV Cure System | Germany | 200mm |
| Advanced Technology Inc. (ATI) | MNT5 | Wax Mount | United States | 200mm |
| Aehr Test Systems | FOX-XPi | Burn-in Tester | United States | 150mm |
| Aetrium | 1164 | Dynamic Life Test System | Taiwan | 200mm |
| Air Control, Inc. | Microvoid FH-45D-SS-6 | Fume Hood Workstation | United States | |
| Aixtron | AIX G5 WW | Epitaxial Silicon (EPI) | United States | 150mm |
| Aixtron | AIX G5 WW | Epitaxial Silicon (EPI) | United States | 150mm |
| Aixtron | AIX G5 WW | Epitaxial Silicon (EPI) | United States | 150mm |
| Aixtron | AIX G5 WW | Epitaxial Silicon (EPI) | United States | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta 810 | Mid Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISion 80 | High Current Implanter | United States | 200mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISion 200 | High Current Implanter | United States | 200mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCPi | High Current Implanter | United States | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCPi | High Current Implanter | United States | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta 810XEri | Mid Current Implanter | Ireland | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | EHP-500 | Mid Current Implanter | Korea, Republic of | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | EHPi-500 | Mid Current Implanter | Korea, Republic of | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | EHP-500 | Mid Current Implanter | Korea, Republic of | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | EHPi-500 | Mid Current Implanter | Korea, Republic of | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | E500HP | Mid Current Implanter | United States | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | Viista HE XP | High Energy Implanter | United States | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | Viista HE XP | High Energy Implanter | United States | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta 900 3D | Mid Current Implanter | United States | 150mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCS | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCS | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCS | High Current Implanter | Taiwan | 300mm |
| AMAT / Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP | High Current Implanter | Taiwan | 300mm |
| Amerivacs | XAVN-20 | Bag Sealer | Singapore | |
| Applied Materials (AMAT) | Centura SiNgen Chamber | LPCVD | Taiwan | 200mm |
| Applied Materials (AMAT) | Centura 5200 HTF – ATM EPI | Epitaxial Silicon (EPI) | United States | 200mm |
| Applied Materials (AMAT) | Producer S PECVD TEOS | PECVD (Chemical Vapor Deposition) | United States | 200mm |
| Applied Materials (AMAT) | ComPLUS MP | Darkfield Inspection | Taiwan | 200mm |
| Applied Materials (AMAT) | ComPLUS MP | Darkfield Inspection | Taiwan | 200mm |
| Applied Materials (AMAT) | Centura 5200 Ti/TiN MCVD | Metal CVD (Chemical Vapor Deposition) | Taiwan | 200mm |
| Applied Materials (AMAT) | Centura 5200 Ti/TiN MCVD | Metal CVD (Chemical Vapor Deposition) | Taiwan | 200mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Centura 5200 WxZ / Sprint W | Metal CVD (Chemical Vapor Deposition) | United States | 200mm |
| Applied Materials (AMAT) | Centura 5200 WxZ / Sprint W | Metal CVD (Chemical Vapor Deposition) | United States | 200mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 200mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 200mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 200mm |
| Applied Materials (AMAT) | SEMVision GX | SEM – Defect Review (DR) | Israel | 300mm |
| Applied Materials (AMAT) | SEMVision GX | SEM – Defect Review (DR) | Israel | 300mm |
| Applied Materials (AMAT) | Uvision 5 | Brightfield Inspection | Israel | 300mm |
| Applied Materials (AMAT) | Uvision 5 | Brightfield Inspection | Israel | 300mm |
| Applied Materials (AMAT) | Uvision 5 | Brightfield Inspection | Israel | 300mm |
| Applied Materials (AMAT) | Endura 300 | PVD (Physical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | SEMVision GX | SEM – Defect Review (DR) | United States | 300mm |
| Applied Materials (AMAT) | SEMVision GX | SEM – Defect Review (DR) | United States | 300mm |
| Applied Materials (AMAT) | SEMVision GX | SEM – Defect Review (DR) | United States | 300mm |
| Applied Materials (AMAT) | Epi Centura 300 – RP | Epitaxial Silicon (EPI) | United States | 300mm |
| Applied Materials (AMAT) | Uvision 5 | Brightfield Inspection | United States | 300mm |
| Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) | Japan | 300mm |
| Applied Materials (AMAT) | Endura 300 | PVD (Physical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | SEMVision G4 Max | SEM – Defect Review (DR) | United States | 300mm |
| Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Epi Centura 300 – RP | Epitaxial Silicon (EPI) | Ireland | 300mm |
| Applied Materials (AMAT) | Epi Centura 300 – RP | Epitaxial Silicon (EPI) | Ireland | 300mm |
| Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) | Japan | 300mm |
| Applied Materials (AMAT) | Mustang ECD | ECD (Electro Chemical Deposition) | Japan | 300mm |
| Applied Materials (AMAT) | Producer XP APF KODIAK | PECVD (Chemical Vapor Deposition) | Japan | 300mm |
| Applied Materials (AMAT) | ALTA 4700i | Laser Beam Mask Writing System | United States | 300mm |
| Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) | Japan | |
| Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch | Taiwan | 300mm |
| Applied Materials (AMAT) | Mustang ECD | ECD (Electro Chemical Deposition) | Taiwan | 300mm |
| Applied Materials (AMAT) | Opus AdvantEdge | Metal Etch | Japan | 300mm |
| Applied Materials (AMAT) | Reflexion LK – Head Retaining Ring | Parts/Peripherals | Taiwan | 300mm |
| Applied Materials (AMAT) | Endura 300 | PVD (Physical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | ALTA 4700i | Laser Beam Mask Writing System | United States | 300mm |
| Applied Materials (AMAT) | ALTA 4700i | Laser Beam Mask Writing System | United States | 300mm |
| Applied Materials (AMAT) | Producer XP PECVD | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Producer XP PECVD | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Endura 5500_ | PVD (Physical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Centura 5200 DxZ Silane | PECVD (Chemical Vapor Deposition) | Taiwan | 200mm |
| Applied Materials (AMAT) | Endura II | PVD (Physical Vapor Deposition) | Japan | 300mm |
| Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) | Japan | 300mm |
| Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | Japan | 300mm |
| Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | Japan | 300mm |
| Applied Materials (AMAT) | Reflexion LK Prime Oxide | Dielectric CMP | Japan | 300mm |
| Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | Japan | 300mm |
| Applied Materials (AMAT) | Producer GT TiN MCVD | Metal CVD (Chemical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | Producer GT TiN MCVD | Metal CVD (Chemical Vapor Deposition) | United States | 300mm |
| Applied Materials (AMAT) | P-5000 Mark II DLH PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | P-5000 Mark II DLH PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Centura DPS II | Polysilicon Etch | United States | 150mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Endura 5500 Aluminum Interconnect | PVD (Physical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Producer S PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Applied Materials (AMAT) | Producer S PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Asahi Engineering Co., Ltd. | COSMO TFlex series | Molding Equipment | Taiwan | 300mm |
| ASM International | Eagle XP8 | ALD (Atomic Layer Deposition) | Japan | 300mm |
| ASML | YieldStar S-100B | Overlay Measurement System | Taiwan | 300mm |
| ASML | PAS 5500/60 | i-Line Stepper | United States | 200mm |
| ASML | PAS 5500/100D | i-Line Stepper | United States | 200mm |
| ASML | PAS 5500/250C | i-Line Stepper | United States | 200mm |
| ASML | PAS 5500/200B | i-Line Stepper | United States | 200mm |
| ASML | PAS 5500/275 | i-Line Stepper | United States | 200mm |
| ASML | TWINSCAN XT:1950Hi | Immersion Scanner | Japan | 300mm |
| ASML US, LLC | MDR-100 | Pellicle Mounting System | United States | 300mm |
| ASML US, LLC | RWT-100 | Pellicle Mounting System | United States | 300mm |
| ASML US, LLC | SFT-100 | Pellicle Mounting System | United States | 300mm |
| AST Elektronik GmbH | SHS 2800 | Standalone RTP Equipment | Korea, Republic of | |
| ATV Technologie GmbH (BEST EQ) | SRO-704 | IR reflow | Germany | N/A |
| Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher | United States | 300mm |
| Axcelis Technologies Inc. | Fusion M200PCU | UV Cure System | United States | 200mm |
| Axcelis Technologies Inc. | Fusion ES3 | Stripper/Asher | United States | 300mm |
| Axcelis Technologies Inc. | RapidStrip 210ES | Stripper/Asher | United States | 150mm |
| Axcelis Technologies Inc. / Eaton | HE3 | High Energy Implanter | Taiwan | 300mm |
| Axcelis Technologies Inc. / Eaton | Optima XE | High Energy Implanter | Taiwan | 300mm |
| BE Semiconductor Industries N.V. (BESI) | Fico sawing line (FSL) | Substrate Singulation | China | N/A |
| BE Semiconductor Industries N.V. (BESI) | Fico sawing line (FSL) | Substrate Singulation | China | N/A |
| BE Semiconductor Industries N.V. (BESI) | Fico sawing line (FSL) | Substrate Singulation | China | N/A |
| BE Semiconductor Industries N.V. (BESI) | Fico sawing line (FSL) | Substrate Singulation | China | N/A |
| BE Semiconductor Industries N.V. (BESI) | Datacon DS9000e | Die Sorter | United States | 200mm |
| BESI | ESEC 2100 xP | Die Bonder | United States | 200mm |
| Bruker / AXS / SVXR | High-Resolution Automatic X-Ray Inspection (HR-AXI) | X-Ray Inspection System | Taiwan | 300mm |
| Bruker / AXS / SVXR | High-Resolution Automatic X-Ray Inspection (HR-AXI) | X-Ray Inspection System | Taiwan | 300mm |
| C&D Semiconductor | P9000 | Coat and Develop Track | United States | 200mm |
| CAMALOT | Speedline | In-Line Adhesive Dispenser | Germany | N/A |
| CAMALOT | Speedline | In-Line Adhesive Dispenser | Germany | N/A |
| CAMECA | EX-300 | Implant Dosing Measurement | Taiwan | 300mm |
| Canon | FPA-3000 i5 | i-Line Stepper | United States | 200mm |
| Canon | FPA-3000 i5+ | i-Line Stepper | United States | 200mm |
| Canon | FPA-3000 i5 | i-Line Stepper | United States | 200mm |
| Canon | FPA-3000 i5 | i-Line Stepper | United States | 200mm |
| Canon | FPA-3000 i5 | i-Line Stepper | United States | 200mm |
| Canon | FPA-3000 i5++ | i-Line Stepper | United States | 200mm |
| Canon | FPA-6000 ES6a | 248nm (KrF) Scanner | Japan | 300mm |
| Canon | FPA-6000 ES6a | 248nm (KrF) Scanner | Japan | 300mm |
| Canon | FPA-6000 ES6 | 248nm (KrF) Scanner | Taiwan | 300mm |
| Canon | FPA-6000 ES6 | 248nm (KrF) Scanner | Taiwan | 300mm |
| Canon | FPA-5510 iZ | i-Line Wide-Field Stepper | Taiwan | 300mm |
| Canon | FPA-6000 ES6a | 248nm (KrF) Scanner | Japan | 300mm |
| Carl Zeiss | PROVE Compact | Reticle/Mask Defect Inspection System | United States | 300mm |
| Carl Zeiss | PROVE Compact | Reticle/Mask Defect Inspection System | United States | 300mm |
| Carl Zeiss | PROVE Compact | Reticle/Mask Defect Inspection System | United States | 300mm |
| Carl Zeiss Group | Axiotron 300 | Microscope | Singapore | 300mm |
| Carver Inc | 4128 | Hydraulic press | United States | N/A |
| Centrotherm | Rapid 200 | Standalone RTP Equipment | United States | 150mm |
| Centrotherm | Rapid 200 | Standalone RTP Equipment | United States | 150mm |
| Centrotherm | Rapid 200 | Standalone RTP Equipment | United States | 150mm |
| Centrotherm | Activator 200 | Vertical Furnace | United States | 150mm |
| Centrotherm | Activator 200 | Vertical Furnace | United States | 150mm |
| Centrotherm | Activator 200 | Vertical Furnace | United States | 150mm |
| CFM Technologies | Full-Flow SV 8050 | Batch Wafer Processing | United States | 200mm |
| Cost Effective Equipment | Cee 200X | Coat Module | United States | 150mm |
| Cost Effective Equipment (CEE) | Apogee Spin Developer | Roller Coater | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-80BW-AR | Wafer Scrubber | United States | 200mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | United States | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | Japan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing | Taiwan | 300mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-80EX | Wafer Scrubber | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-80EX | Wafer Scrubber | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-80EX | Wafer Scrubber | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-2000 | Single Wafer Processing | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-2000 | Single Wafer Processing | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SU-2000 | Single Wafer Processing | United States | 150mm |
| Dainippon Screen Mfg. Co. (DNS) | SS-80EX | Wafer Scrubber | United States | 150mm |
| Disco Hi-Tec | DFD6750 | Wafer Dicing Saw | China | N/A |
| Disco Hi-Tec | DTG8440 | Wafer Backside Grinder | Italy | 200mm |
| Duocom Industires,Inc. | HS-2670 | Cure Oven | Korea, Republic of | |
| E+H Metrology GmbH / HOLOGENIX | MX601 | Wafer Geometry Gauge | United States | 150mm |
| E+H Metrology GmbH / HOLOGENIX | MX 203 | Wafer Geometry Gauge | United States | 150mm |
| Ebara | FREX300 Tungsten | Tungsten CMP | Taiwan | 300mm |
| Ebara | FREX300S2 | Multi-Process CMP | Taiwan | 300mm |
| Ebara | FREX300X Tungsten | Tungsten CMP | Japan | 300mm |
| Ebara | FREX300S Dielectric | Dielectric CMP | Taiwan | 300mm |
| Ebara | FREX300X Tungsten | Tungsten CMP | Japan | 300mm |
| Ebara | FREX300X Tungsten | Tungsten CMP | Japan | 300mm |
| Ebara | EPO-222 Tungsten | Tungsten CMP | United States | 200mm |
| Edwards | iH1000 | Dry Pump | Taiwan | N/A |
| Electro Scientific Industries | 9800 | Laser Repair System | Taiwan | 200mm |
| Electro Scientific Industries | 9830 | Laser Repair System | Taiwan | 200mm |
| Electroglas Inc. (EMTS) | Horizon 4080X | Production Wafer Prober | United Kingdom | 200mm |
| Electroglas Inc. (EMTS) | Prober | Production Wafer Prober | United States | 150mm |
| ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer | Taiwan | 200mm |
| EV Group | EVG150 | Coat and Develop Track | Taiwan | 300mm |
| EV Group | EVG150 | Coat and Develop Track | United States | 150mm |
| EV Group | EVG150 | Coat and Develop Track | Taiwan | 300mm |
| EV Group | EVG850XT | SOI and Direct Wafer Bonding System | Taiwan | 300mm |
| EV Group | EVG850XT | SOI and Direct Wafer Bonding System | Taiwan | 300mm |
| Exitech | M2000 | Laser Spike Annealer | United States | 150mm |
| Exitech | M2000 | Laser Spike Annealer | United States | 150mm |
| FEI Company | Titan 80-300 | TEM | United States | |
| FEI Company | Helios NanoLab 460F1 | Focused Ion Beam (FIB) | Taiwan | 300mm |
| Ferrotec / Temescal | Temescal FC-2800 | Evaporator Deposition Equipment | United States | 150mm |
| FormFactor / Cascade | SQ-S300M-163DHT-01 | Engineering Wafer Prober | Taiwan | 200mm |
| FormFactor / Cascade | S300 | Engineering Wafer Prober | Taiwan | 200mm |
| FormFactor / Cascade | Summit 12000 | Engineering Wafer Prober | United States | 300mm |
| Fortrend Engineering | LAMINA 203 | Reticle Stocker | United States | 150mm |
| Fries Research & Technology (FRT) | MicroProf 300 | Profilometer | United States | 200mm |
| Fries Research & Technology (FRT) | MicroProf 300 | Profilometer | China | N/A |
| FSI International | Zeta 300 G3 | Batch Wafer Processing | Taiwan | 300mm |
| FSI International | Mercury MP | Batch Wafer Processing | United States | 200mm |
| FSI International | Zeta+ 300 | Batch Wafer Processing | United States | |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3510 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3510 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3500 | Stripper/Asher | United States | 200mm |
| GaSonics International | L3510 | Stripper/Asher | United States | 200mm |
| GL Automation | SWL8 | Wafer Sorter | United States | 200mm |
| HANMI Semiconductor Co., Ltd | EMI Shield Vision Attach 2.0 Dragon | EMI Shield Process | China | N/A |
| Hitachi (Semiconductor) | CG5000 | SEM – Critical Dimension (CD) Measurement | Taiwan | 300mm |
| Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement | Taiwan | 300mm |
| Hitachi (Semiconductor) | S-7800 | SEM – Defect Review (DR) | Germany | 200mm |
| Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement | Taiwan | 300mm |
| Hitachi (Semiconductor) | M-9011MX | Dielectric Etch | United States | 300mm |
| Hitachi (Semiconductor) | M-9011MX | Dielectric Etch | United States | 300mm |
| Horiba | PD3000 | Reticle Inspection | United States | 200mm |
| Horiba | PR-PD2 | Reticle Inspection | United States | 300mm |
| Horiba | PR-PD2 | Reticle Inspection | United States | 300mm |
| Horiba | PR-PD35 | Reticle Inspection | United States | 300mm |
| Horiba | PR-PD2 | Reticle Inspection | United States | 300mm |
| Horiba | PR-PD2 | Reticle Inspection | United States | 300mm |
| HPSP | GENI-SYS | Vertical Furnace | Japan | 300mm |
| HPSP | GENI-SYS | Vertical Furnace | Japan | 300mm |
| Hugle | UPC-12100 | Carrier Cleaner | Taiwan | 300mm |
| IPEC | 372M | Multi-Process CMP | United Kingdom | 200mm |
| Ismeca / Cohu | NX32LT | Turret Handler | United States | N/A |
| JEOL | JWS-7555 | SEM – Defect Review (DR) | Taiwan | 200mm |
| JEOL | JFS-9815 | Focused Ion Beam System | Taiwan | 200mm |
| JEOL | JFS-9855S | Focused Ion Beam System | Taiwan | 200mm |
| JEOL | JWS-7555S | SEM – Defect Review (DR) | Taiwan | 200mm |
| JEOL | JFS-9855S | Focused Ion Beam System | Taiwan | 200mm |
| JEOL | IB-19530 | Grinder Polisher | Taiwan | 300mm |
| JEOL | JEM-2010F | TEM | United States | |
| JEOL | JSM-6400F | FE SEM | United States | |
| Jordan Valley Semiconductors LTD | JVX 7200 | X-ray Fluorescence Spectrometer | Taiwan | 300mm |
| JTEKT ( formerly Koyo Lindberg Limited) | VF-5100 | Vertical Furnace | Germany | 200mm |
| JTEKT ( formerly Koyo Lindberg Limited) | VF-5100 | Vertical Furnace | Germany | 200mm |
| JTEKT ( formerly Koyo Lindberg Limited) | VF-5100 | Vertical Furnace | Germany | 200mm |
| JTEKT ( formerly Koyo Lindberg Limited) | VF-3000 OXIDE | Vertical Furnace | Taiwan | 150mm |
| Kaijo Corporation | 778T-A | Batch Wafer Processing | Taiwan | 200mm |
| Kashiyama Ind., Ltd. | SDE1203TZ | Dry Pump | Taiwan | N/A |
| Kashiyama Ind., Ltd. | SDE1203B | Dry Pump | Taiwan | N/A |
| Keithley Instruments, Inc. | 4200-SCS | Source Measure Unit (SMU) | Taiwan | N/A |
| Keysight / Agilent / Hewlett-Packard (HP) | 4082A | Parametric Tester | Japan | 300mm |
| Keysight / Agilent / Hewlett-Packard (HP) | 4082A | Parametric Tester | Japan | 300mm |
| KINETICS | KESG Aeris – Piranha | Batch Wafer Processing | United States | 150mm |
| KINETICS | 36″ CV Mercury Hood | Batch Wafer Processing | United States | 150mm |
| KLA / Toho Technology Inc. | FLX-2320S | Stress Measurement | United States | |
| KLA-Tencor / Filmetrics | Filmetrics F10-RT | Film Thickness Measurement System | United States | 150mm |
| KLA-Tencor Corp. | eS805 | E-beam Inspection | Taiwan | 300mm |
| KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) | Taiwan | 300mm |
| KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) | Taiwan | 300mm |
| KLA-Tencor Corp. | AIT UV | Darkfield Inspection | Singapore | 300mm |
| KLA-Tencor Corp. | Archer C700WT | Overlay Measurement System | Korea, Republic of | |
| KLA-Tencor Corp. | Archer C700WT | Overlay Measurement System | Korea, Republic of | |
| KLA-Tencor Corp. | Archer C700WT | Overlay Measurement System | Korea, Republic of | |
| KLA-Tencor Corp. | WI-2280 | Wafer Inspection Equipment | United States | 150mm |
| KLA-Tencor Corp. | WI-2280 | Wafer Inspection Equipment | United States | 150mm |
| KLA-Tencor Corp. | KLA 5200XP | Overlay Measurement System | Taiwan | 200mm |
| KLA-Tencor Corp. | KLA 5200XP | Overlay Measurement System | Taiwan | 200mm |
| KLA-Tencor Corp. | AIT II | Darkfield Inspection | United States | 200mm |
| KLA-Tencor Corp. | SpectraCD 100 | Critical Dimension (CD) Measurement (non SEM) | Singapore | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | Israel | 300mm |
| KLA-Tencor Corp. | SpectraShape 9000 | Critical Dimension (CD) Measurement (non SEM) | Israel | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | Ireland | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | Ireland | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | Ireland | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | Ireland | 300mm |
| KLA-Tencor Corp. | HRP-340 | Profilometer | United States | 300mm |
| KLA-Tencor Corp. | Archer AIM+ | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Surfscan SP2.5+ | Particle Measurement | United States | 300mm |
| KLA-Tencor Corp. | Surfscan SP2.5+ | Particle Measurement | United States | 300mm |
| KLA-Tencor Corp. | SpectraShape 9000 | Critical Dimension (CD) Measurement (non SEM) | United States | 300mm |
| KLA-Tencor Corp. | SpectraShape 9000 | Critical Dimension (CD) Measurement (non SEM) | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | SpectraShape 9000 | Critical Dimension (CD) Measurement (non SEM) | United States | 300mm |
| KLA-Tencor Corp. | Surfscan SP2.5+ | Particle Measurement | United States | 300mm |
| KLA-Tencor Corp. | Aleris 8350 | Film Thickness Measurement System | Ireland | 300mm |
| KLA-Tencor Corp. | ATL150i | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Surfscan SP1 TBI | Particle Measurement | United States | |
| KLA-Tencor Corp. | Surfscan SP1 TBI | Particle Measurement | United States | |
| KLA-Tencor Corp. | FLX-5400 | Stress Measurement | United States | |
| KLA-Tencor Corp. | Surfscan 6220 | Particle Measurement | United States | |
| KLA-Tencor Corp. | TeraStar SLF17 HR USRA | Reticle Inspection | United States | 300mm |
| KLA-Tencor Corp. | VisEdge CV300 | Edge Defect | Japan | 300mm |
| KLA-Tencor Corp. | Archer C700WT | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Aleris 8350 | Film Thickness Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 200 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM SCOL | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Archer 500 AIM | Overlay Measurement System | United States | 300mm |
| KLA-Tencor Corp. | Surfscan SP3+ | Particle Measurement | United States | 300mm |
| KLA-Tencor Corp. | Kronos 1190 | Wafer Inspection Equipment | Taiwan | 300mm |
| KLA-Tencor Corp. | ASET-F5x | Film Thickness Measurement System | United States | 300mm |
| KLA-Tencor Corp. | P-16+ | Profilometer | United States | 150mm |
| KLA-Tencor Corp. | 8250XP | SEM – Critical Dimension (CD) Measurement | United States | 150mm |
| Kokusai | Vertron-V(S2) DD-835V | Vertical Furnace | Taiwan | 200mm |
| Kokusai | ZESTONE NITR | Vertical Furnace | United States | 300mm |
| Kokusai | Quixace II Alloy | Vertical Furnace | United States | 300mm |
| Kokusai | Quixace II Alloy | Vertical Furnace | United States | 300mm |
| Kokusai | Quixace II ALD Oxide | Vertical Furnace | United States | 300mm |
| Kokusai | Quixace II ALD Oxide | Vertical Furnace | United States | 300mm |
| Kokusai | ZESTONE NITR | Vertical Furnace | United States | 300mm |
| Kokusai | Quixace | Vertical Furnace | Japan | 300mm |
| Kokusai | Quixace II Anneal | Vertical Furnace | Japan | |
| Kokusai | Quixace II Anneal | Vertical Furnace | Japan | |
| Kokusai | Quixace Doped Poly | Vertical Furnace | Taiwan | 300mm |
| Kokusai | Quixace Doped Poly | Vertical Furnace | Taiwan | 300mm |
| Kokusai | Quixace | Vertical Furnace | Japan | 300mm |
| Kokusai | LCT | Vertical Furnace | United States | 300mm |
| Kokusai | LCT | Vertical Furnace | United States | 300mm |
| Kokusai | Quixace | Vertical Furnace | Japan | 300mm |
| Kokusai | Quixace Doped Poly | Vertical Furnace | Japan | 300mm |
| Kokusai | Quixace Doped Poly | Vertical Furnace | Japan | 300mm |
| Kokusai | Quixace Doped Poly | Vertical Furnace | Japan | 300mm |
| Kokusai | Quixace Doped Poly | Vertical Furnace | Japan | 300mm |
| Kokusai | Quixace II Doped Poly | Vertical Furnace | Japan | 300mm |
| Kokusai Electric Co., Ltd. | VR-120 | Resistivity Measurement | Japan | 300mm |
| Lam / Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | Taiwan | 300mm |
| Lam / Novellus Systems Inc. | Vector – SiC Etch | PECVD (Chemical Vapor Deposition) | Ireland | 300mm |
| Lam / Novellus Systems Inc. | VECTOR | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | Ireland | 300mm |
| Lam / Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | Ireland | 300mm |
| Lam / Novellus Systems Inc. | VECTOR | PECVD (Chemical Vapor Deposition) | United States | 300mm |
| Lam / Novellus Systems Inc. | VECTOR Extreme – PECVD SILANE | PECVD (Chemical Vapor Deposition) | Japan | 300mm |
| Lam / Novellus Systems Inc. | Concept One-150 PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Lam / Novellus Systems Inc. | Concept One-150 PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Lam / Novellus Systems Inc. | Concept One-150 PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Lam / Novellus Systems Inc. | Concept One-150 PECVD Silane | PECVD (Chemical Vapor Deposition) | United States | 150mm |
| Lam / Sosul | Extrima 3100 | Bevel Etch | United States | 300mm |
| Lam / Sosul | Extrima 3100 | Bevel Etch | United States | 300mm |
| LAM Research | Rainbow 4520 | Dielectric Etch | United States | 150mm |
| LAM Research | Rainbow 4520 | Dielectric Etch | United States | 100mm |
| LAM Research | Rainbow 4520 | Dielectric Etch | United States | 150mm |
| Lam Research | EOS ES | Single Wafer Processing | Taiwan | 300mm |
| LAM Research | Alliance (A6) Exelan HP – Spare Parts | Dielectric Etch | United States | 200mm |
| LAM Research | Alliance (A6) TCP 9600PTX | Metal Etch | United States | 200mm |
| LAM Research | Rainbow 4420 | Multi-Process Etch | United States | 200mm |
| LAM Research | Alliance (A6) TCP 9400DFM | Polysilicon Etch | United States | 200mm |
| LAM Research | Rainbow 4520i | Dielectric Etch | United States | 200mm |
| LAM Research | Rainbow 4520i | Dielectric Etch | United States | 200mm |
| LAM Research | Rainbow 4520i | Dielectric Etch | United States | 200mm |
| LAM Research | Rainbow 4520i | Dielectric Etch | United States | 200mm |
| LAM Research | 2300 | Multi-Process Etch | United States | 300mm |
| LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma | Taiwan | 300mm |
| LAM Research | 2300 Syndion TSV | Polysilicon Etch | Japan | 300mm |
| LAM Research | 2300e5 | Multi-Process Etch | United States | 300mm |
| LAM Research | 2300e5 | Multi-Process Etch | United States | 300mm |
| Lam Research | EOS GS L | Single Wafer Processing | Taiwan | 300mm |
| LAM Research | Rainbow 4520XL | Dielectric Etch | United States | 150mm |
| Lam Research / Novellus Systems Inc. | SABRE xT | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / Novellus Systems Inc. | SABRE xT | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / Novellus Systems Inc. | SABRE xT | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / Novellus Systems Inc. | SABRE xT | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / Novellus Systems Inc. | SABRE xT | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / Novellus Systems Inc. | SABRE Extreme | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / Novellus Systems Inc. | SABRE Extreme | ECD (Electro Chemical Deposition) | United States | 300mm |
| Lam Research / SEZ Group | SP304 | Single Wafer Processing | Taiwan | 300mm |
| Lasertec Corporation | M6641 | Reticle Inspection | United States | N/A |
| Lasertec Corporation | BC10 | Reticle Inspection | United States | 300mm |
| Lasertec Corporation | BD100 | Reticle Inspection | United States | 300mm |
| Lasertec Corporation | SICA88 | Wafer Inspection Equipment | United States | 150mm |
| Leica Inc. | INS10 | Microscope | Taiwan | 200mm |
| Leica Inc. | INM 20 | Microscope | Taiwan | 200mm |
| Leica Inc. | INS3000 | Macro-Defect | Taiwan | 200mm |
| Leica Inc. | INS3000 DUV | Macro-Defect | Taiwan | 200mm |
| Leica Inc. | INS3000 | Macro-Defect | Taiwan | 200mm |
| Leica Inc. | INS2000 | Macro-Defect | Taiwan | 200mm |
| Leica Inc. | INS3000 | Macro-Defect | Taiwan | 200mm |
| Leica Inc. | LDS3300 | Macro-Defect | Singapore | 300mm |
| Leica Inc. | LDS3300 | Macro-Defect | Singapore | 300mm |
| Mactronix, Inc. | HJ2625P5 | Wafer Transfer | United States | 200mm |
| Matrix Integrated Systems | BobCat 208S | Stripper/Asher | United States | 150mm |
| Mattson Technology, Inc. | Aspen II – ICP | Stripper/Asher | United States | 200mm |
| Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher | Taiwan | 300mm |
| Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher | Taiwan | 300mm |
| Mattson Technology, Inc. | Hydrilis XT – Dielectric Etch | Dielectric Etch | Taiwan | 300mm |
| Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher | Taiwan | 300mm |
| Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher | Taiwan | 300mm |
| Mattson Technology, Inc. | Aspen II RTP | Platform RTP Equipment | United States | 150mm |
| Mattson Technology, Inc. | Aspen II RTP | Platform RTP Equipment | United States | 150mm |
| Micromanipulator (MM) | P300J | Engineering Wafer Prober | Taiwan | 200mm |
| Mitutoyo | FS110 | Reticle Inspection | United States | 200mm |
| Mitutoyo | VL-50S | height measurement | United States | 150mm |
| Mitutoyo | VL-50S | height measurement | United States | 150mm |
| Mitutoyo | VL-50S | height measurement | United States | 150mm |
| Mitutoyo | VL-50S | height measurement | United States | 150mm |
| Modular Process Technology | RTP-600XP | Standalone RTP Equipment | United States | 150mm |
| MPI Corporation | SKYWALKER S6 | Engineering Wafer Prober | Taiwan | 150mm |
| MPI Corporation | SKYWALKER S6 | Engineering Wafer Prober | Taiwan | 150mm |
| MPI Corporation | SKYWALKER S6 | Engineering Wafer Prober | Taiwan | 150mm |
| Nada Technologies / Nadatech | n4x | Wafer Sorter | United States | 150mm |
| Naura-Akrion / Santa Clara Plastics | V3 – Platinum Strip | Batch Wafer Processing | United States | 200mm |
| Naura-Akrion / Santa Clara Plastics | SCP 8500 – Piranha Clean | Batch Wafer Processing | United States | 200mm |
| Naura-Akrion / Santa Clara Plastics | SCP 9400 – RCA Clean | Batch Wafer Processing | United States | 200mm |
| Naura-Akrion / Santa Clara Plastics | SCP Custom – Parts Clean | Batch Wafer Processing | United States | 200mm |
| Naura-Akrion / Santa Clara Plastics | SCP Custom – Parts Clean | Batch Wafer Processing | United States | 200mm |
| Nikon | Optiphot 100 | Microscope | United States | 200mm |
| Nikon | ECLIPSE L200N / NWL200 | Microscope | United States | 200mm |
| Nikon | OPTIPHOT 200 / NWL200 | Microscope | United States | 200mm |
| Nikon | OPTIPHOT 200 | Microscope | United States | 200mm |
| Nikon | N-SISV R | Optical Review System | Singapore | 300mm |
| Nikon | V-12A | Optical comparator | Germany | N/A |
| Nikon | NWL860 | Microscope | Taiwan | 200mm |
| Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
| Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
| Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
| Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
| Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
| Nikon | NSR-S621D | Immersion Scanner | United States | 300mm |
| Nikon | ECLIPSE L200D | Microscope | United States | |
| Nikon | ECLIPSE L200D | Microscope | United States | |
| Nikon | ECLIPSE L200D | Microscope | United States | |
| Nikon | ECLIPSE L200 | Microscope | United States | |
| Nikon | NSR-2205i12D | i-Line Stepper | United States | 150mm |
| Nikon | ECLIPSE L200ND | Microscope | United States | 150mm |
| Nikon | ECLIPSE L200ND | Microscope | United States | 150mm |
| Nissin Electric Co., Ltd. | EXCEED 9600A | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | IMPHEAT | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | IMPHEAT | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | IMPHEAT | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | IMPHEAT | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | IMPHEAT-II | Mid Current Implanter | United States | 150mm |
| Nissin Electric Co., Ltd. | IMPHEAT-II | Mid Current Implanter | United States | 150mm |
| Nordson YESTECH | M1m-S Plus | Automatic Optic Inspection (AOI) | China | N/A |
| Nordson YESTECH | M1m-S Plus | Automatic Optic Inspection (AOI) | China | N/A |
| Nova Measuring Instruments, Inc. (Brook) | V2600 | Integrated CMP Endpoint / Film Measurement | Taiwan | 300mm |
| Novellus Systems Inc. | GAMMA 2130 | Stripper/Asher | Ireland | 300mm |
| Novellus Systems Inc. | Concept Three Altus Max ICEFill | WCVD (Chemical Vapor Deposition) | United States | 300mm |
| Novellus Systems Inc. | GAMMA 2130 | Stripper/Asher | United States | 300mm |
| Novellus Systems Inc. | GAMMA 2130 | Stripper/Asher | United States | 300mm |
| Novellus Systems Inc. | GAMMA 2130 | Stripper/Asher | United States | 300mm |
| Olympus | BH2-UMA | Microscope | United States | 150mm |
| Onto / Nanometrics Inc. | Atlas XP | Film Thickness Measurement System | Ireland | 300mm |
| Onto / Nanometrics Inc. | Atlas XP | Film Thickness Measurement System | Ireland | 300mm |
| Onto / Nanometrics Inc. | NanoSpec 8000X | Film Thickness Measurement System | United States | 150mm |
| Onto Innovation | NSX 330B | Macro-Defect | United States | |
| OnTrak Systems, Inc. | DSS-200 Series II | Wafer Scrubber – Post CMP | United States | 150mm |
| OnTrak Systems, Inc. | DSS-200 Series II | Wafer Scrubber – Post CMP | United States | 150mm |
| P.S.K. Tech Inc. | SURPA N – Chamber Only | Stripper/Asher | Taiwan | 300mm |
| P.S.K. Tech Inc. | SURPA N – Chamber Only | Stripper/Asher | Taiwan | 300mm |
| Perkin Elmer | 4400 | PVD (Physical Vapor Deposition) | United States | 150mm |
| Perkin Elmer | 4400 | PVD (Physical Vapor Deposition) | United States | 150mm |
| Philips / Technos | TREX 632 | X-ray Fluorescence Spectrometer | Taiwan | 300mm |
| Plasma-Therm I.P. Inc. | 790 Etch | Multi-Process Etch | Taiwan | 200mm |
| Qualitau | INF EHCT 40V | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | Infinity | HAST System | Taiwan | N/A |
| Qualitau | Infinity | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Qualitau | EM350C | HAST System | Taiwan | N/A |
| Quincy lab, Inc. (QL) | 30GC | Environmental Chamber | United States | 150mm |
| Quincy lab, Inc. (QL) | 30GC | Environmental Chamber | United States | 150mm |
| RAVE LLC | Merlin-G | Mask Inspection & Repair System | United States | 150mm |
| Raytex Corporation | RXW-1227 EdgeScan | Edge Defect | Taiwan | 300mm |
| RECIF Technologies | SIS300 | Wafer Sorter | Taiwan | 300mm |
| Revasum ( Strasbaugh ) | 6EG | Wafer Backside Grinder | United States | 300mm |
| ReVera | RVX1000 | Film Thickness Measurement System | Taiwan | 300mm |
| ReVera | RVX1000 | Film Thickness Measurement System | Taiwan | 300mm |
| Rtec-Instruments | COPM-3000 | Profilometer | United States | 300mm |
| Rudolph Technologies, Inc. | Axi 935 | Macro-Defect | Singapore | 300mm |
| Rudolph Technologies, Inc. | ultra-II | Ellipsometer | Singapore | 300mm |
| Rudolph Technologies, Inc. | NSX 105 – Spare Parts | Macro-Defect | United States | 200mm |
| Rudolph Technologies, Inc. | Waferscan 8000 | Macro-Defect | United States | 200mm |
| Rudolph Technologies, Inc. | NSX 220 | Macro-Defect | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 100mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 100mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Scia Systems GmbH | scia Trim 200 | Ion Milling | United States | 150mm |
| Semitool Inc. | SST-C-632-280-K | Batch Wafer Processing | United States | 150mm |
| Semitool Inc. | SST-C-632-280-K | Batch Wafer Processing | United States | 150mm |
| Semitool Inc. | SST-C-632-280 | Batch Wafer Processing | United States | 150mm |
| Semitool Inc. | 8300-S | Spin Rinse / Dryer (SRD) | United States | 200mm |
| Semitool Inc. | Scepter Solvent | Batch Wafer Processing | United States | 150mm |
| Semitool Inc. | SST-C-421-280 | Batch Wafer Processing | United States | 150mm |
| Shengtek / Sentek | View 250 | Microscope | Taiwan | 200mm |
| Shibaura Engineering Works Ltd. | CDE-300 | Metal Etch | Taiwan | 300mm |
| Shimadzu Rika | AG-Xplus | Universal testing | China | N/A |
| SierraThermal | 7500 Series | Horizontal Furnace | United States | 150mm |
| SierraThermal | 7500 Series | Horizontal Furnace | United States | 150mm |
| SIGMAMELTEC LTD / AMAT | SFB 3000 PEB | Bake Oven | United States | 300mm |
| SIGNALITY SYSTEM ENGINEERING CO., LTD | B1120M | Burn In | Taiwan | 200mm |
| SIGNALITY SYSTEM ENGINEERING CO., LTD | B1121M | Burn In | Taiwan | 200mm |
| Signatone Corporation (Lucas Labs) | S-1060R | Engineering Wafer Prober | United States | 150mm |
| Silpac | Various | Chemical/Gas Storage & Delivery | United States | 150mm |
| Sonix | Echo VS | Scanning Acoustic Microscopy (SAM) / Tomography (SAT) | Taiwan | 300mm |
| Speedfam / IPEC | AvantGaard 776 – Dielectric | Dielectric CMP | United States | 200mm |
| SPTS / Applied Microstructures | MVD150 | MVD (Molecular Vapor Deposition) | United States | 200mm |
| SRM INTEGRATION (M) Sdn. Bhd. | XD248 | Test Handler | Korea, Republic of | |
| Standard Research Systems | SR560 — Low-noise voltage preamplifier | Parts/Peripherals | Taiwan | N/A |
| S-TEC / S.E.S. CO., LTD. | AE1085F | Batch Wafer Processing | Taiwan | 200mm |
| Strasbaugh | 7AF | Wafer Backside Grinder | United States | 150mm |
| Struers | Hexamatic | Semi-Automatic Specimen Polisher | United States | |
| SUHWOO PRECISION CO.,LTD | SG-2000X | Strip Grinder | China | N/A |
| SUHWOO PRECISION CO.,LTD | SG-2000X | Strip Grinder | China | N/A |
| SUHWOO PRECISION CO.,LTD | SG-2000X | Strip Grinder | China | N/A |
| SUHWOO PRECISION CO.,LTD | SG-2000X | Strip Grinder | China | N/A |
| SUHWOO PRECISION CO.,LTD | SG-2000X | Strip Grinder | China | N/A |
| Suss Microtec | DSM200 | Wafer Inspection Equipment | United States | 200mm |
| Suss Microtec AG | ACS200 | Linear Wafer Tracks (Resist Coater/Developer) | Germany | 200mm |
| Suss Microtec AG | ABC200 | Wafer Bonder | United States | 200mm |
| Suss Microtec AG | ABC200 | Wafer Bonder | United States | 200mm |
| Suss Microtec AG | ABC200 | Wafer Bonder | United States | 200mm |
| Suss Microtec AG | GAMMA | Single Block (Resist Coater) | United States | 150mm |
| Suss Microtec AG | GAMMA | Single Block (Resist Coater) | United States | 150mm |
| SVG Track Division | SVG 8800 | Linear Wafer Tracks (Resist Coater/Developer) | United States | 150mm |
| SVG Track Division | SVG 90S | Linear Wafer Tracks (Resist Coater/Developer) | United States | 150mm |
| Takatori Corporation | GLP-200CT | Wafer Backside Grinder | United States | 150mm |
| TBD | Furnace Tube Cart | Quartz Tube Cart | United States | N/A |
| Teledyne TAC | PR-53 | Engineering Wafer Prober | United States | 150mm |
| Therma-Wave Inc. | Opti-Probe 2690 | Film Thickness Measurement System | United States | 200mm |
| Therma-Wave Inc. | Opti-Probe 7341XP | Film Thickness Measurement System | United States | 300mm |
| Therma-Wave Inc. | Opti-Probe 7341XP | Film Thickness Measurement System | United States | 300mm |
| Thermo (Fisher) Scientific | Orion2 | ESD Simulator / Gun | United States | N/A |
| Thermo Fisher Scientific (Electron) | Theta 300 MKII | Wafer Characterization | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus IRAD Oxide | Vertical Furnace | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | TELINDY-B | Vertical Furnace | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | NS 300Z | Wafer Scrubber | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-303i process TBD | Vertical Furnace | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SE Poly | Vertical Furnace | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SE Nitride | Vertical Furnace | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SE Oxide | Vertical Furnace | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SE Oxide | Vertical Furnace | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | UNITY II e 855PP | Dielectric Etch | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus Doped Poly | Vertical Furnace | Korea, Republic of | |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus Doped Poly | Vertical Furnace | Korea, Republic of | |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus Doped Poly | Vertical Furnace | Korea, Republic of | |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus Doped Poly | Vertical Furnace | Korea, Republic of | |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus Doped Poly | Vertical Furnace | Korea, Republic of | |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 MULTI BLOCK | Multi Block (Resist Coater/Developer) | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 SINGLE BLOCK | Single Block (Resist Coater/Developer) | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 SINGLE BLOCK | Single Block (Resist Coater/Developer) | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 MULTI BLOCK | Multi Block (Resist Coater/Developer) | United States | 200mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 COAT ONLY | Coat only Track | United Kingdom | 200mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) | Israel | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS COAT ONLY | Coat only Track | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS COAT ONLY | Coat only Track | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS COAT ONLY | Coat only Track | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro V-i | Multi Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro V-i | Multi Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro V | Multi Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | Telius 304 | Polysilicon Etch | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro V-i | Multi Block (Resist Coater/Developer) | Ireland | 300mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 MULTI BLOCK | Multi Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 MULTI BLOCK | Multi Block (Resist Coater/Developer) | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | TELINDY Plus IRAD Oxide | Vertical Furnace | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 COAT ONLY | Coat only Track | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 COAT ONLY | Coat only Track | United States | 300mm |
| Tokyo Electron Ltd. (TEL) | NS 300+ | Wafer Scrubber | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | NS 300+ | Wafer Scrubber | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | NS 300+ | Wafer Scrubber | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | Precio XL | Production Wafer Prober | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | Precio XL | Production Wafer Prober | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | Tactras Boxer Vigus LK3 | Dielectric Etch | Japan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 MULTI BLOCK | Multi Block (Resist Coater/Developer) | Taiwan | 300mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 SINGLE BLOCK | Single Block (Resist Coater/Developer) | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 DEVELOP ONLY | Develop Track | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 8 MULTI BLOCK | Multi Block (Resist Coater/Developer) | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | CLEAN TRACK MARK 8 | Polyimide Curing | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | Precio octo | Production Wafer Prober | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SEi PYRO | Vertical Furnace | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SEi PYRO | Vertical Furnace | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SEi Poly | Vertical Furnace | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | ALPHA-8SEi Anneal | Vertical Furnace | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | Nexx Nimbus XP | Sputtering System | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | Nexx Nimbus XP | Sputtering System | United States | 150mm |
| Tokyo Electron Ltd. (TEL) | NEXX Apollo XP | Sputtering System | United States | 150mm |
| Ultratech | CGS-300 | Stress Measurement | Taiwan | 300mm |
| Ultratech | XLS 7800 | XLS Stepper | United States | 150mm |
| Ultratech Stepper | Ultratech 1500 | Broadband | United States | 150mm |
| Ulvac Corporation | Entron-EX 300S | PVD (Physical Vapor Deposition) | Japan | 300mm |
| Ulvac Corporation | Entron-EX 300S | PVD (Physical Vapor Deposition) | Singapore | 300mm |
| Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | Singapore | 300mm |
| Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | Taiwan | 300mm |
| Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | Taiwan | 300mm |
| Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | Taiwan | 300mm |
| Various | Various | Production Wafer Prober | Malaysia | 200mm |
| Veeco / Solid State Equipment Corporation (SSEC) | Waferstorm 3300 / M3303 / M3304 (SSEC 3303/4) | Single Wafer Processing | United States | 150mm |
| Veeco / Solid State Equipment Corporation (SSEC) | SSEC 3308/12 | Single Wafer Processing | United States | 150mm |
| Veeco / Solid State Equipment Corporation (SSEC) | Waferstorm M3308-12 | Single Wafer Processing | United States | 150mm |
| Veeco Instruments Inc. | Dimension 7000 | Atomic Force Microscope (AFM) | Taiwan | 200mm |
| VERSA CONN CORP. | WB-302 Triple+ | Semi Automated High Force Wafer Bonder | Taiwan | 150mm |
| Vitronics Soltec ( ITW EAE ) | XPM2 | IR reflow | Korea, Republic of | |
| WAFAB International | 120″ 304 SST | Batch Wafer Processing | United States | 150mm |
| Zeiss | CDC32 | Reticle Inspection | Taiwan | 300mm |
| ZESTRON | ZESTRON EYE CM | Chemical Mix & Distribution | China | N/A |
| Zygo | AMS 310RT | Reticle/Mask Defect Inspection System | Taiwan | 200mm |
| Zygo Corp. | AutoKMS-100 | Reticle CD SEM | Taiwan | 200mm |
SS5319-S-4-1-1