Description
Used Semiconductor Equipment Parts
These are subject to prior sale. These are only for end user. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
1 | A-B Lasers Inc. (Rofin) | Waferlase Compact | Laser Scribe |
2 | A-B Lasers Inc. (Rofin) | Waferlase | Laser Scribe |
3 | Accretech/TSK | UF3000 | Production Wafer Prober |
4 | Accretech/TSK | UF3000 | Production Wafer Prober |
5 | Accretech/TSK | UF3000 | Production Wafer Prober |
6 | Accretech/TSK | UF3000 | Production Wafer Prober |
7 | Accretech/TSK | UF3000 | Production Wafer Prober |
8 | Accretech/TSK | UF3000 | Production Wafer Prober |
9 | Accretech/TSK | UF3000 | Production Wafer Prober |
10 | Accretech/TSK | UF3000 | Production Wafer Prober |
11 | Accretech/TSK | UF3000 | Production Wafer Prober |
12 | Accretech/TSK | UF3000 | Production Wafer Prober |
13 | Accretech/TSK | UF3000 | Production Wafer Prober |
14 | Accretech/TSK | UF3000EX | Production Wafer Prober |
15 | Accretech/TSK | UF3000EX | Production Wafer Prober |
16 | Accretech/TSK | UF3000EX | Production Wafer Prober |
17 | Accretech/TSK | UF3000EX | Production Wafer Prober |
18 | Accretech/TSK | UF3000 | Production Wafer Prober |
19 | Accretech/TSK | UF3000 | Production Wafer Prober |
20 | Accretech/TSK | UF3000 | Production Wafer Prober |
21 | Accretech/TSK | UF3000 | Production Wafer Prober |
22 | Accretech/TSK | UF3000 | Production Wafer Prober |
23 | Accretech/TSK | UF3000 | Production Wafer Prober |
24 | Accretech/TSK | UF3000EX | Production Wafer Prober |
25 | Accretech/TSK | UF3000EX | Production Wafer Prober |
26 | Accretech/TSK | UF3000EX | Production Wafer Prober |
27 | Accretech/TSK | UF3000EX | Production Wafer Prober |
28 | Accretech/TSK | UF3000EX | Production Wafer Prober |
29 | Accretech/TSK | UF3000EX | Production Wafer Prober |
30 | Accretech/TSK | UF3000EX | Production Wafer Prober |
31 | Accretech/TSK | FP3000 | Wafer Frame Prober |
32 | Accretech/TSK | FP3000 | Wafer Frame Prober |
33 | Accretech/TSK | FP3000 | Wafer Frame Prober |
34 | Accretech/TSK | UF3000EX | Production Wafer Prober |
35 | Acu-Gage | AG 36 | Optical comparator |
36 | ADE Corporation | Microsense 6033 | Wafer Characterization |
37 | ADE Corporation | AFS-3220 | Wafer Characterization |
38 | Advanced Design Lasers (ADLAS) | DPY421-Q-II | Power Supply |
39 | Advanced Energy | ICP 20P | Power Supply |
40 | Advanced Thermal Sciences (ATS) | DEX-20A | Chiller/Heat Exchanger |
41 | Advantest | T5383 | Memory Tester |
42 | Advantest | T5383 | Memory Tester |
43 | Advantest | T5383 | Memory Tester |
44 | Advantest | T5383 | Memory Tester |
45 | Advantest | M6542AD | Pick & Place Memory Handler |
46 | Advantest | M6542AD | Pick & Place Memory Handler |
47 | Advantest | M6542AD | Pick & Place Memory Handler |
48 | Advantest | MPT3000HVM Gen 3 | SSD Test System |
49 | Advantest | T5585 | Memory Tester |
50 | Advantest | T5585 | Memory Tester |
51 | Aetrium | 1164 | Dynamic Life Test System |
52 | Agilent / Keysight | E4990A | Impedance Measuring Instruments |
53 | Air Control, Inc. | Microvoid FH-45D-S | Fume Hood Workstation |
54 | Air Products | GASGUARD | Chemical/Gas Storage & Delivery |
55 | Akrometrix, LLC | AXP | Thermal Warpage & Strain |
56 | Alcatel | ADS 1802H | Dry Pump |
57 | Alcatel | ADS1802P | Dry Pump |
58 | Alcatel | A1803H | Dry Pump |
59 | AMETEK, Inc. | 1726 | Tachometer |
60 | Amray, Inc. | 2030 | SEM – Defect Review (DR) |
61 | Amray, Inc. | 2030 | SEM – Defect Review (DR) |
62 | Amray, Inc. | 3800c | SEM – Defect Review (DR) |
63 | Amray, Inc. | 2030 | SEM – Defect Review (DR) |
64 | Amray, Inc. | 3800c | SEM – Defect Review (DR) |
65 | APC | SMART X3000NC HV | Power Supply |
66 | Applied Materials (AMAT) | AMAT 0 | Chiller/Heat Exchanger |
67 | Applied Materials (AMAT) | Endura II Chambers: Multiple | PVD (Physical Vapor Deposition) |
68 | Applied Materials (AMAT) | Vantage RadiancePlus | Platform RTP Equipment |
69 | Applied Materials (AMAT) | Quantum II | Low/Ultra Low Energy Implanter |
70 | Applied Materials (AMAT) | Centura SiNgen Chamber | LPCVD |
71 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing |
72 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing |
73 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing |
74 | Applied Materials (AMAT) | ComPLUS MP | Darkfield Inspection |
75 | Applied Materials (AMAT) | ComPLUS MP | Darkfield Inspection |
76 | Applied Materials (AMAT) | Centura 5200 Ti/TiN MCVD | Metal CVD (Chemical Vapor Deposition) |
77 | Applied Materials (AMAT) | Centura 5200 Ti/TiN MCVD | Metal CVD (Chemical Vapor Deposition) |
78 | Applied Materials (AMAT) | Raider ECD_ | ECD (Electro Chemical Deposition) |
79 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
80 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
81 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
82 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
83 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
84 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
85 | Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) |
86 | Applied Materials (AMAT) | Producer GT PECVD Silane | PECVD (Chemical Vapor Deposition) |
87 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
88 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
89 | Applied Materials (AMAT) | Producer SE SACVD | SACVD (Chemical Vapor Deposition) |
90 | Applied Materials (AMAT) | Raider ECD_ | ECD (Electro Chemical Deposition) |
91 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
92 | Applied Materials (AMAT) | Centura AP DPS II Polysilicon | Polysilicon Etch |
93 | Applied Materials (AMAT) | Centura AP DPS II Polysilicon | Polysilicon Etch |
94 | Applied Materials (AMAT) | Reflexion LK Copper | Copper CMP |
95 | Applied Materials (AMAT) | Centura AP DPS II Polysilicon | Polysilicon Etch |
96 | Applied Materials (AMAT) | Producer Etch eXT Dielectric | Dielectric Etch |
97 | Applied Materials (AMAT) | Producer Etch eXT Poly | Polysilicon Etch |
98 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
99 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
100 | Applied Materials (AMAT) | VeritySEM 4i | SEM – Critical Dimension (CD) Measurement |
101 | Applied Materials (AMAT) | VeritySEM 4i+ | SEM – Critical Dimension (CD) Measurement |
102 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
103 | Applied Materials (AMAT) | Reflexion LK | Multi-Process CMP |
104 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
105 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
106 | Applied Materials (AMAT) | Producer Etch eXT Dielectric | Dielectric Etch |
107 | Applied Materials (AMAT) | Centris AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
108 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
109 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
110 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
111 | Applied Materials (AMAT) | Producer SE SACVD | SACVD (Chemical Vapor Deposition) |
112 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
113 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
114 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
115 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
116 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
117 | Applied Materials (AMAT) | Producer SE PECVD TEOS | PECVD (Chemical Vapor Deposition) |
118 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
119 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
120 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
121 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
122 | Applied Materials (AMAT) | Producer SE PECVD TEOS | PECVD (Chemical Vapor Deposition) |
123 | Applied Materials (AMAT) | Reflexion LK | Multi-Process CMP |
124 | Applied Materials (AMAT) | Producer SE PECVD TEOS | PECVD (Chemical Vapor Deposition) |
125 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
126 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
127 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
128 | APT Automation LLC. | TP-155 | Tape Peel Force |
129 | Aqueous Technologies | Trident III | Flux Cleaner |
130 | ASM International | A600 LPCVD-OXIDE | Vertical Furnace |
131 | ASM International | Eagle XP EmerALD | ALD (Atomic Layer Deposition) |
132 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
133 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
134 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
135 | ASM International | A412 POLY | Vertical Furnace |
136 | ASM International | A412 POLY | Vertical Furnace |
137 | ASM Pacific Technology (ASMPT) | NUCLEUS XP | Wafer Substrate Bonding |
138 | ASM Pacific Technology Ltd. (ASMPT) | iHawk-V | Wire Bonder |
139 | ASML | YieldStar S-100B | Overlay Measurement System |
140 | ASML | YieldStar S-200B | Overlay Measurement System |
141 | ASML | YieldStar S-250 | Overlay Measurement System |
142 | ASML | TWINSCAN XT:400G | i-Line Scanner |
143 | ASML | TWINSCAN XT:400F | i-Line Scanner |
144 | ASML | TWINSCAN XT:400F | i-Line Scanner |
145 | ASML | TWINSCAN AT:400 | i-Line Scanner |
146 | Athlete-FA Corporation | BM-2000WI | Solder Ball Mount |
147 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
148 | Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher |
149 | Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher |
150 | BESI | Fico AMS-i 306 | Molding Equipment |
151 | Blue M Electric Company | DC-146 | Cure Oven |
152 | Blue M Electric Company | DCC-206 | Bake Oven |
153 | Blue M Electric Company | General Purpose Oven | Cure Oven |
154 | Blue M Electric Company | General Purpose Oven | Cure Oven |
155 | Blue M Electric Company | General Purpose Oven | Cure Oven |
156 | Blue M Electric Company | STK-05I-E-UP55A | Cure Oven |
157 | Bluefors Oy | BF-XLD400 | Cryogenic system |
158 | Boschman | BXXP\21 | Molding Equipment |
159 | Branson/IPC | S3000 | Stripper/Asher |
160 | Brooks Automation, Inc. | MTX2000 | Wafer Sorter |
161 | Brooks Automation, Inc. | MTX2000 | Wafer Sorter |
162 | Brooks Automation, Inc. | MTX 4000 | Wafer Sorter |
163 | Brooks Automation, Inc. | MTX2000 | Wafer Sorter |
164 | Bruce Technology International | BDF-41 | Horizontal Furnace |
165 | Bruker | Contour GT | Profilometer |
166 | Bruker | Contour GT | Profilometer |
167 | Bruker | Contour GT | Profilometer |
168 | BUEHLER | MetaServe 2000 | Grinder Polisher |
169 | BUEHLER | EcoMet 3000 | Grinder Polisher |
170 | BUEHLER | HandiMet 2 | Grinder Polisher |
171 | C&D Semiconductor | P8000 | Coat and Develop Track |
172 | CAMECA | EX-300 | Implant Dosing Measurement |
173 | Canon | Surpass 300 | Stripper/Asher |
174 | Canon | FPA-6000 ES6a | 248nm (KrF) Scanner |
175 | Canon | FPA-6000 ES6a | 248nm (KrF) Scanner |
176 | Canon | FPA-6000 ES6a | 248nm (KrF) Scanner |
177 | Canon | FPA-6000 ES6a | 248nm (KrF) Scanner |
178 | Canon | FPA-5500 iZ+ | i-Line Wide-Field Stepper |
179 | Canon | FPA-6000 ES5 | 248nm (KrF) Scanner |
180 | Canon | FPA-6000 ES5 | 248nm (KrF) Scanner |
181 | Canon | FPA-6000 ES6 | 248nm (KrF) Scanner |
182 | Canon | FPA-5500 iZ+ | i-Line Wide-Field Stepper |
183 | Cascade | S300 | Engineering Wafer Prober |
184 | Chemwest | K232 | Quartz Tube Cleaner |
185 | Chemwest | K232 | Quartz Tube Cleaner |
186 | Chroma ATE Inc. | 58630 | Test Handler |
187 | Chroma ATE Inc. | 58630 | Test Handler |
188 | Chroma ATE Inc. | 58630 | Test Handler |
189 | Chroma ATE Inc. | 58630 | Test Handler |
190 | Chroma ATE Inc. | 58640 | Test Handler |
191 | Cleanroom Depot | SW6168 | Portable Clean Room |
192 | Control Laser Corporation. (CLC) | FALIT | Package Auto Decap System |
193 | CUSTOM HANDLER | Test Handler | Test Handler |
194 | Cybeq Systems | 6000 robot | Robot Arm Accessories |
195 | CyberOptics | SQ3000-DD | Automatic Optic Inspection (AOI) |
196 | CyberOptics | SE600 | Solder Paste Inspection (SPI) |
197 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
198 | Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing |
199 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
200 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
201 | Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing |
202 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
203 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
204 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
205 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
206 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
207 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
208 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
209 | Dainippon Screen Mfg. Co. (DNS) | SS-3000-AR | Wafer Scrubber |
210 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
211 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
212 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
213 | Dainippon Screen Mfg. Co. (DNS) | SS-3000-AR | Wafer Scrubber |
214 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
215 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
216 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing |
217 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
218 | DAS | ESCAPE DUO | Chemical/Gas Treatment System |
219 | DAS | ESCAPE DUO | Chemical/Gas Treatment System |
220 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
221 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
222 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
223 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
224 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
225 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
226 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
227 | Delatech Inc. | 858 – V2 | Abatement – CDO Scrubber |
228 | Despatch Industries | LCD1-51N-3 | Cure Oven |
229 | Dionex | DX-600 | Ion Chromatography |
230 | Disco Hi-Tec | DAD3350 | Wafer Dicing Saw |
231 | Disco Hi-Tec | DFL7340 | Laser Saw |
232 | Disco Hi-Tec | DFS8910 | Surface Planarization |
233 | Ebara | FREX300 Tungsten | Tungsten CMP |
234 | Ebara | FREX300S2 | Multi-Process CMP |
235 | Ebara | FREX300S Tungsten | Tungsten CMP |
236 | Ebara | FREX300S Tungsten | Tungsten CMP |
237 | Ebara | FREX300S Tungsten | Tungsten CMP |
238 | Ebara | FREX300S Tungsten | Tungsten CMP |
239 | ECSAL Technologies Pte. Ltd. | Hydrotek-03 | Flux Cleaner |
240 | Edwards | E2M8 | Pump/Blower |
241 | Edwards | Misc Pump Parts | Dry Pump |
242 | Edwards | QDP80 | Dry Pump |
243 | Edwards | OMB500 | Pump Controller |
244 | Edwards | HOX | Abatement – Exhaust Management System |
245 | Edwards | Atlas TPU+WESP | Abatement – Scrubber |
246 | Edwards | iL70 | Dry Pump |
247 | Electroglas Inc. (EMTS) | Horizon 4080X | Production Wafer Prober |
248 | Electroglas Inc. (EMTS) | Horizon 4090 | Production Wafer Prober |
249 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
250 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
251 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
252 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
253 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
254 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
255 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
256 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
257 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
258 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
259 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
260 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
261 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
262 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
263 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
264 | Electroglas Inc. (EMTS) | 2001X | Production Wafer Prober |
265 | Electron Vision Corporation | ElectronCure 30X | UV Cure System |
266 | Electrovert / SPEEDLINE | Aquastorm 100C | Aqueous Cleaner |
267 | Entegris | KA198-80M | Wafer Cassette |
268 | Entergris/Atcor | Ultra 6210V | Carrier Cleaner |
269 | Entergris/Atcor | Ultra 6210V | Carrier Cleaner |
270 | ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer |
271 | ESTEE | EI903 | Ionizer Fan |
272 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
273 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
274 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
275 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection |
276 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
277 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
278 | Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection |
279 | Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection |
280 | Estek Automation SDN BHD | WIS-850 | Broadband Patterned Wafer Defect Inspection |
281 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection |
282 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection |
283 | Estek Automation SDN BHD | WIS-150 | Broadband Patterned Wafer Defect Inspection |
284 | Evatech/Balzers | BAK SPLIT | PVD (Physical Vapor Deposition) |
285 | Evatech/Balzers | BAK SPLIT | PVD (Physical Vapor Deposition) |
286 | EXATRON | 1010 | Manual Taping |
287 | Fischione | 1050 | Specimen Preparation |
288 | Fischione | 1050 | Specimen Preparation |
289 | Four Dimensions | 280 Series | Resistivity Measurement |
290 | FSI International | Excalibur | Batch Wafer Processing |
291 | FSI International | Excalibur | Batch Wafer Processing |
292 | FSI International | Zeta 300 G3 | Batch Wafer Processing |
293 | FTS Systems (SP Scientific) | RC311GLAM | Chiller/Heat Exchanger |
294 | Future Fab | Future Fab Solvent Hood | Fume Hood Workstation |
295 | Future Fab | Future Fab Solvent Hood | Fume Hood Workstation |
296 | GCA Tropel | Autosort Mark II 150 | Flatness Measurement |
297 | Gecko Alliance | Aqua Flo XPO | Pumps |
298 | Genesis | 2020B | Vapor Prime Oven |
299 | Genesis Automation | VCSEL | Industrial Automation Systems |
300 | Genesis Automation | GLOVE BOX | Glove Box |
301 | GSI Lumonics | WaferMark 200HS | Laser Scribe |
302 | HANSOM | Clean Hood | Chemical/Fume Hood/Sink |
303 | Hermes Microvision (HMI) | eP3 XP | E-beam Inspection |
304 | Hermes Microvision (HMI) | eScan 320 | E-beam Inspection |
305 | Hermes Microvision (HMI) | eScan 320 | E-beam Inspection |
306 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
307 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
308 | Hitachi (Semiconductor) | CG5000 | SEM – Critical Dimension (CD) Measurement |
309 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
310 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
311 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
312 | Hitachi (Semiconductor) | S-4800 | FE SEM |
313 | Hitachi (Semiconductor) | S-5500 | FE SEM |
314 | Hitachi (Semiconductor) | CG4000 | SEM – Critical Dimension (CD) Measurement |
315 | Hitachi (Semiconductor) | S-5500 | FE SEM |
316 | HPSP | GENI-SYS | Vertical Furnace |
317 | INFICON | UL 200 | Leak Detector |
318 | IPEC | 372M | Multi-Process CMP |
319 | Ismeca | TMBZ SP | Taping |
320 | Ismeca | TMBZ SP | Taping |
321 | JEOL | JEM-2010F | TEM |
322 | JEOL | JSM-6400F | FE SEM |
323 | JEOL | JWS-7555 | SEM – Defect Review (DR) |
324 | JEOL | JFS-9815 | Focused Ion Beam System |
325 | JEOL | JFS-9855S | Focused Ion Beam System |
326 | JEOL | JWS-7555S | SEM – Defect Review (DR) |
327 | JEOL | JWS-7855S | Mask Inspection & Repair System |
328 | Jordan Valley Semiconductors LTD | JVX 7200 | X-ray Fluorescence Spectrometer |
329 | JTCorp | JST-2000 | Burn-in Board Loader/Unloader |
330 | JTCorp | JST-2000 | Burn-in Board Loader/Unloader |
331 | JUKI Automation Systems GmbH | CX-1 | SMT Mounter (Pick and Place) |
332 | JUSTRITE | Sure-Grip EX Flammable Waste Safety Cabinets | Chemical/Gas Storage & Delivery |
333 | JUSTRITE | Sure-Grip EX Classic Safety Cabinets | Chemical/Gas Storage & Delivery |
334 | Kaijo Corporation | 778T-A | Batch Wafer Processing |
335 | Kaijo Corporation | SFT-300 | Batch Wafer Processing |
336 | Kaijo Corporation | SFT-300 | Batch Wafer Processing |
337 | Keithley Instruments, Inc. | 300 | Switching Matrix |
338 | Keysight / Agilent / Hewlett-Packard (HP) | 16500C | Logic Analysis & Emulation Solutions |
339 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
340 | Keysight / Agilent / Hewlett-Packard (HP) | 4073B | Parametric Tester |
341 | Keysight / Agilent / Hewlett-Packard (HP) | 4073B | Parametric Tester |
342 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
343 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
344 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
345 | Keysight / Agilent / Hewlett-Packard (HP) | 4072B | Parametric Tester |
346 | Keysight / Agilent / Hewlett-Packard (HP) | 4072B | Parametric Tester |
347 | Keysight / Agilent / Hewlett-Packard (HP) | 4072B | Parametric Tester |
348 | Keysight / Agilent / Hewlett-Packard (HP) | 4072B | Parametric Tester |
349 | KLA-Tencor Corp / SensArray | SensArray 1790 | Temperature Monitoring |
350 | KLA-Tencor Corp / SensArray | SensArray 1530 | Temperature Monitoring |
351 | KLA-Tencor Corp. | Ultrapointe 1000 | Optical Review System |
352 | KLA-Tencor Corp. | Surfscan 7700 | Particle Measurement |
353 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
354 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
355 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
356 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
357 | KLA-Tencor Corp. | CRS-1200 | Optical Review System |
358 | KLA-Tencor Corp. | AIT UV | Darkfield Inspection |
359 | KLA-Tencor Corp. | eS805 | E-beam Inspection |
360 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) |
361 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) |
362 | KLA-Tencor Corp. | SpectraCD 200 | Film Thickness Measurement System |
363 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
364 | KLA-Tencor Corp. | Archer 500 | Overlay Measurement System |
365 | KLA-Tencor Corp. | Archer 500 | Overlay Measurement System |
366 | KLA-Tencor Corp. | SpectraShape 8660 | Optical Review System |
367 | KLA-Tencor Corp. | SpectraShape 8660 | Optical Review System |
368 | KLA-Tencor Corp. | VisEdge CV300R | Edge Defect |
369 | Kokusai | ZESTONE DJ-1223VN-DF | Vertical Furnace |
370 | Kokusai | Vertron-V(S2) DD-835V | Vertical Furnace |
371 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
372 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
373 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
374 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
375 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
376 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
377 | Kokusai | Quixace II Poly | Vertical Furnace |
378 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
379 | Kokusai | Quixace II Anneal | Vertical Furnace |
380 | Kokusai | Quixace II Anneal | Vertical Furnace |
381 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
382 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
383 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
384 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
385 | Kokusai | Quixace Ultimate TEOS | Vertical Furnace |
386 | Kokusai | Quixace Ultimate TEOS | Vertical Furnace |
387 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
388 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
389 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
390 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
391 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
392 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
393 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
394 | Kokusai | Quixace II Nitride | Vertical Furnace |
395 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
396 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
397 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
398 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
399 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
400 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
401 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
402 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
403 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
404 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
405 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
406 | Kokusai | Quixace II ALD Oxide | Vertical Furnace |
407 | Kokusai | Quixace II CURE | Vertical Furnace |
408 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
409 | Kokusai | Quixace II CURE | Vertical Furnace |
410 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
411 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
412 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
413 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
414 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
415 | Kokusai | Quixace II Nitride | Vertical Furnace |
416 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
417 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
418 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
419 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
420 | Kokusai | Quixace II Poly | Vertical Furnace |
421 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
422 | Kokusai | Quixace II Nitride | Vertical Furnace |
423 | Kokusai | Quixace II Nitride | Vertical Furnace |
424 | Kokusai | Quixace II ALD TIN | Vertical Furnace |
425 | Kokusai | Quixace Ultimate ALD SiO2 | Vertical Furnace |
426 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
427 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
428 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
429 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
430 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
431 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
432 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
433 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
434 | Kokusai Electric Co., Ltd. | Lambda-300LE | Stripper/Asher |
435 | Kokusai Electric Co., Ltd. | Lambda-300LE | Stripper/Asher |
436 | Kokusai Electric Co., Ltd. | Lambda-300LE | Stripper/Asher |
437 | Kokusai Electric Co., Ltd. | Lambda-300LE | Stripper/Asher |
438 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
439 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
440 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
441 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
442 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
443 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
444 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
445 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
446 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
447 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
448 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
449 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
450 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
451 | LAM Research | Lam Research Parts | Parts/Peripherals |
452 | LAM Research | 2300e4 Exelan Flex GXE | Dielectric Etch |
453 | LAM Research | AutoEtch 590 | Dielectric Etch |
454 | LAM Research | AutoEtch 490 | Polysilicon Etch |
455 | LAM Research | AutoEtch 490 | Polysilicon Etch |
456 | LAM Research | Alliance (A6) Exelan HP – Spare Parts | Dielectric Etch |
457 | LAM Research | Alliance (A6) TCP 9400DSiE | Polysilicon Etch |
458 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
459 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
460 | LAM Research | 2300e6 KIYO FX | Polysilicon Etch |
461 | LAM Research | 2300e6 Exelan Flex FX | Dielectric Etch |
462 | LAM Research | 2300e5 KIYO FX | Polysilicon Etch |
463 | LAM Research | 2300e5 KIYO FX | Polysilicon Etch |
464 | LAM Research | 2300e6 KIYO FX | Polysilicon Etch |
465 | LAM Research | 2300e6 KIYO FX | Polysilicon Etch |
466 | LAM Research | 2300e5 KIYO FX | Polysilicon Etch |
467 | LAM Research | 2300e5 KIYO FX | Polysilicon Etch |
468 | LAM Research | 2300e6 Exelan Flex HX | Dielectric Etch |
469 | LAM Research | 2300 Exelan | Dielectric Etch |
470 | LAM Research | 2300e5 KIYO EX | Polysilicon Etch |
471 | Lam Research | EOS | Single Wafer Processing |
472 | LAM Research | 2300e5 Exelan Flex FX | Dielectric Etch |
473 | LAM Research | 2300e5 Exelan Flex FX | Dielectric Etch |
474 | LAM Research | 2300e5 Exelan Flex FX | Dielectric Etch |
475 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
476 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
477 | LAM Research | 2300e5 Exelan Flex FX | Dielectric Etch |
478 | Lam Research | EOS | Single Wafer Processing |
479 | Lam Research | EOS | Single Wafer Processing |
480 | Lam Research | EOS | Single Wafer Processing |
481 | Lam Research | EOS | Single Wafer Processing |
482 | LAM Research | 2300 Exelan Flex FX – Chamber Only | Dielectric Etch |
483 | Lam Research | EOS – Parts | Single Wafer Processing |
484 | Leatherwood Plastics | Wet Process Station | Chemical/Fume Hood/Sink |
485 | LEE OS | WQIC-100 | Vision inspection |
486 | Leica Inc. | INS3300 | Macro-Defect |
487 | Leica Inc. | INS10 | Microscope |
488 | Leica Inc. | INM 20 | Microscope |
489 | Leica Inc. | INS2000 | Macro-Defect |
490 | Leica Inc. | INS2000 | Macro-Defect |
491 | Leica Inc. | INS3300 | Macro-Defect |
492 | Leica Inc. | INS3300 | Macro-Defect |
493 | Leica Inc. | INS3300 | Macro-Defect |
494 | Mactronix, Inc. | EDL-800 | Wafer Transfer |
495 | Mactronix, Inc. | EV1-600 | Wafer Transfer |
496 | Mactronix, Inc. | MCL-425 | Wafer Transfer |
497 | March Plasma Systems, Inc.(Nordson) | AP-1000 | Plasma Cleaner |
498 | March Plasma Systems, Inc.(Nordson) | PM-1000 | Plasma Cleaner |
499 | Matrix Integrated Systems | Matrix 105 | Stripper/Asher |
500 | Matrix Integrated Systems | Matrix 105 | Stripper/Asher |
501 | Matrix Integrated Systems | Matrix 105 | Stripper/Asher |
502 | Matrix Integrated Systems | Matrix 105 | Stripper/Asher |
503 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
504 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
505 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
506 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
507 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
508 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
509 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
510 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
511 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
512 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
513 | Mattson Technology, Inc. | Suprema | Stripper/Asher |
514 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
515 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
516 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
517 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
518 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
519 | MAT-VAC TECHNOLOGY, INC. | MVT 942 | PVD (Physical Vapor Deposition) |
520 | Mechatronics Inc. | SG200 XPO Bearing | Parts/Peripherals |
521 | Melles Griot | 3227H-C-64 Laser | Parts/Peripherals |
522 | Metryx | Mentor OC23 | Mass Measurement |
523 | Metryx | Mentor OC23 | Mass Measurement |
524 | Micromanipulator (MM) | P300J | Engineering Wafer Prober |
525 | MicroTure Machine Tool Corp. | 4 Sigma Wafer Polisher | Wafer Polisher |
526 | Micro-Vu | VERTEX 420 | Confocal Vision System |
527 | Miscellaneous | Misc Equipment | Other |
528 | MKS Instruments Inc. | In-Line Valve | Parts/Peripherals |
529 | MOSAID Technologies | MS4205 | Design Verification Tester |
530 | MOSAID Technologies | MS4205 | Design Verification Tester |
531 | MOSAID Technologies | MS3490 | Design Verification Tester |
532 | MOSAID Technologies | MS3490 | Design Verification Tester |
533 | MOSAID Technologies | MS3480 | Design Verification Tester |
534 | MOSAID Technologies | MS3490 | Design Verification Tester |
535 | MOSAID Technologies | MS3480 | Design Verification Tester |
536 | MOSAID Technologies | MS3490 | Design Verification Tester |
537 | MOSAID Technologies | MS3480 | Design Verification Tester |
538 | MRL Industries | SMALL BATCH FURNACE | Horizontal Furnace |
539 | MRL Industries | SMALL BATCH FURNACE | Horizontal Furnace |
540 | MRL Industries | SMALL BATCH FURNACE | Horizontal Furnace |
541 | MRL Industries | SMALL BATCH FURNACE | Horizontal Furnace |
542 | MTI Instruments, Inc. | PROFORMA 300 | Flatness Measurement |
543 | MultiProbe Inc. | AFP-MP2 | Engineering Wafer Prober |
544 | Muratec Murata Machinery, Ltd. | G3-2 | Wafer Stocker |
545 | Muratec Murata Machinery, Ltd. | SRC330 | Wafer Stocker |
546 | Nanometrics Inc. | NanoSpec II | Film Thickness Measurement System |
547 | Nanometrics Inc. | Tevet Trajectory T3 | Film Thickness Measurement System |
548 | NARISHIGE | MF-90 | Microforge |
549 | Nidec Power Motor Corporation | EN-8T1 | Motor |
550 | Nikon | MICROSCOPE | Microscope |
551 | Nikon | UM-2 | Microscope |
552 | Nikon | N-SISV R | Optical Review System |
553 | Nikon | OPTIPHOT 200C | Microscope |
554 | Nikon | OPTIPHOT 200C | Microscope |
555 | Nikon | NSR-S308F | 193nm (ArF) Scanner |
556 | Nikon | AMI-3000 | Macro-Defect |
557 | Nikon | NSR-S308F | 193nm (ArF) Scanner |
558 | Nikon | NSR-S308F | 193nm (ArF) Scanner |
559 | Nikon | NSR-S308F | 193nm (ArF) Scanner |
560 | Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter |
561 | Nisso engineering co. ltd / NISON | 1800S-55C | Batch Wafer Processing |
562 | Nordson Asymtek | S920N | Adhesive Dispenser |
563 | Nordson Asymtek | S920N | Adhesive Dispenser |
564 | Nordson Asymtek | S920N | Adhesive Dispenser |
565 | Nordson Asymtek | S920N | Adhesive Dispenser |
566 | Nordson Asymtek | Forte | Adhesive Dispenser |
567 | Nordson Asymtek | Forte | Adhesive Dispenser |
568 | Nordson Asymtek | S920N | Adhesive Dispenser |
569 | Nordson Asymtek | S920N | Adhesive Dispenser |
570 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
571 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
572 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
573 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
574 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
575 | Nova Measuring Instruments, Inc. (Brook) | V2600 | Integrated CMP Endpoint / Film Measurement |
576 | Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) |
577 | Novellus Systems Inc. | SABRE 3D | ECD (Electro Chemical Deposition) |
578 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) |
579 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) |
580 | Novellus Systems Inc. | Concept Three Speed MAX | HDP CVD (Chemical Vapor Deposition) |
581 | Novellus Systems Inc. | SABRE 3D | ECD (Electro Chemical Deposition) |
582 | Olympus | AL100 | Microscope |
583 | Olympus | MX50T-F | Microscope |
584 | Onto / Accent Optical Technologies | RPM 4000 | Wafer Characterization |
585 | Opto System Co. Ltd. / P. System | OSM-90TS | Wafer Breaker |
586 | Opto System Co. Ltd. / P. System | LDH-30TS | Wafer Cleaver |
587 | Orient Service | 1862-WA | Chemical/Gas Treatment System |
588 | Panasonic Factory Solutions Co., Ltd | NPM-D3 (NM-EJM6D) | SMT Mounter (Pick and Place) |
589 | Panasonic Factory Solutions Co., Ltd | NPM-D3 (NM-EJM6D) | SMT Mounter (Pick and Place) |
590 | Panasonic Factory Solutions Co., Ltd | PanaCIM | Line Management System |
591 | PBT Works s.r.o. | SuperSWASH II | Stencil Cleaner |
592 | PCI Ozone and Controls Systems Inc. | G-7 | Ozone Generator |
593 | Pfeiffer Vacuum GmbH | Various | Dry Pump |
594 | Philips / Technos | TREX 632 | X-ray Fluorescence Spectrometer |
595 | Plasma-Therm I.P. Inc. | SLR Series ICP | Multi-Process Etch |
596 | Plasma-Therm I.P. Inc. | Versaline Large-Area PECVD | PECVD (Chemical Vapor Deposition) |
597 | Plasma-Therm I.P. Inc. | 790 Etch | Multi-Process Etch |
598 | Poly-Flow Engineering | S-422 | Quartz Tube Cleaner |
599 | Prometrix | SM-300/SpectraMap | Film Thickness Measurement System |
600 | PS System | FPS 6000 | Trim From Combo |
601 | PS System | FPS 6000 | Trim From Combo |
602 | PVA TePla America, Inc. | PS 660 | Plasma Cleaner |
603 | PVA TePla America, Inc. | PS 660 | Plasma Cleaner |
604 | R. Howard Strasbaugh | Fine Polisher | Wafer Polisher |
605 | Raytex Corporation | RXW-1227 EdgeScan | Edge Defect |
606 | ReVera | RVX1000 | Film Thickness Measurement System |
607 | ReVera | RVX1000 | Film Thickness Measurement System |
608 | ReVera | RVX1000 | Film Thickness Measurement System |
609 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger |
610 | Risshi / Maruyama | YR-8020 | Chiller/Heat Exchanger |
611 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger |
612 | Rogers Machinery | DUAL COMPRESSOR | Air Compressors |
613 | Rorze | RR4111 | Clean Booth |
614 | Rudolph Technologies, Inc. | Axi 935 | Macro-Defect |
615 | Rudolph Technologies, Inc. | ultra-II | Ellipsometer |
616 | Rudolph Technologies, Inc. | NSX 105 – Spare Parts | Macro-Defect |
617 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
618 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
619 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
620 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
621 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
622 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
623 | Rudolph Technologies, Inc. | MetaPULSE 300 | Film Thickness Measurement System |
624 | Rudolph Technologies, Inc. | MetaPULSE 300 | Film Thickness Measurement System |
625 | Rudolph Technologies, Inc. | MetaPULSE 300 | Film Thickness Measurement System |
626 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
627 | SCREEN PRINTING ENTERPRISES, INC. | LPEH1-30/10 | Bake Oven |
628 | Seiko Instruments | SFT 7155 | X-ray Fluorescence Spectrometer |
629 | SEMI-GAS / Applied Energy Systems (AES) | Three Cylinder Fully Automatic Gas Cabinet | Chemical/Gas Storage & Delivery |
630 | Semitool Inc. | 270-ST | Spin Rinse / Dryer (SRD) |
631 | Semitool Inc. | Semitool SRD Parts | Spin Rinse / Dryer (SRD) |
632 | Semitool Inc. | Raider ECD310 | ECD (Electro Chemical Deposition) |
633 | Semitool Inc. | Raider ECD310 | ECD (Electro Chemical Deposition) |
634 | Semitool Inc. | 270-ST | Spin Rinse / Dryer (SRD) |
635 | Semitool Inc. | 270-ST | Spin Rinse / Dryer (SRD) |
636 | SEZ Group | SP203 | Single Wafer Processing |
637 | SEZ Group | SP304 | Single Wafer Processing |
638 | SEZ Group | SP4300 | Single Wafer Processing |
639 | SEZ Group | DV-34 | Single Wafer Processing |
640 | Shibaura Engineering Works Ltd. | CDE-300 | Metal Etch |
641 | SpeedFam Corp. | IPEC 472 | Multi-Process CMP |
642 | Standard Research Systems | SR560 — Low-noise voltage preamplifier | Parts/Peripherals |
643 | Steag Industrie AG | Marangoni IPA Dryer | Batch Wafer Processing |
644 | S-TEC / S.E.S. CO., LTD. | AE1085F | Batch Wafer Processing |
645 | Strasbaugh | 6DS-SP | Multi-Process CMP |
646 | Strasbaugh | 6DS-SP | Multi-Process CMP |
647 | Strasbaugh | 6DS-SP | Multi-Process CMP |
648 | Strasbaugh | 6DS-SP | Multi-Process CMP |
649 | Strasbaugh | 6DS-SP | Multi-Process CMP |
650 | Strasbaugh | 6DS-SP | Multi-Process CMP |
651 | Strasbaugh | 6DS-SP | Multi-Process CMP |
652 | Strasbaugh | 6DS-SP | Multi-Process CMP |
653 | Strasbaugh | 6DS-SP | Multi-Process CMP |
654 | Strasbaugh | 6DS-SP | Multi-Process CMP |
655 | Strasbaugh | 6DS-SP | Multi-Process CMP |
656 | Strasbaugh | 6DS-SP | Multi-Process CMP |
657 | Strasbaugh | 6DS-SP | Multi-Process CMP |
658 | Struers | Hexamatic | Semi-Automatic Specimen Polisher |
659 | Sumitomo Eaton Nova (SEN) | SHX II | High Current Implanter |
660 | Sumitomo Eaton Nova (SEN) | SHX II | High Current Implanter |
661 | Sumitomo Eaton Nova (SEN) | SHX II | High Current Implanter |
662 | Sumitomo Eaton Nova (SEN) | NV-GSD-HE3 | High Energy Implanter |
663 | Sumitomo Eaton Nova (SEN) | NV-GSD-HE3 | High Energy Implanter |
664 | Sumitomo Precision Products Co., Ltd. | SGRC Series | Ozone Generator |
665 | TBD | Furnace Tube Cart | Quartz Tube Cart |
666 | Tecdia Inc. | TEC-1228AL | Wafer Breaker |
667 | Teikoku Taping System Co., Ltd. | DXL2-800CS-LSR-BMP-CE | Tape Laminator |
668 | Teikoku Taping System Co., Ltd. | DXR2-800CS-CE | Taper/Detaper |
669 | Teikoku Taping System Co., Ltd. | DXL2-800CS-LSR-BMP-CE | Tape Laminator |
670 | Teikoku Taping System Co., Ltd. | DXL2-800CS-LSR | Taper/Detaper |
671 | Teikoku Taping System Co., Ltd. | EXM 800CS UVR CE | Taper/Detaper |
672 | Teikoku Taping System Co., Ltd. | DXR2-800CS-CE | Taper/Detaper |
673 | Tektronix | 177 | Curve Tracer |
674 | Teradyne, Inc. | Parts | Parts/Options |
675 | Teradyne, Inc. | J993 | Memory Tester |
676 | TestEquity LLC. | Half Cube Model 105 | Temperature/Humidity Chamber |
677 | Texas INstruments | LIS 4000ER | Lead Inspection Equipment |
678 | Thermal Product Solutions (TPS) /Tenney/Lunaire | TJR | Temperature/Humidity Chamber |
679 | Therma-Wave Inc. | Therma-Probe 300 | Implant Dosing Measurement |
680 | Therma-Wave Inc. | Opti-Probe 3290 | Film Thickness Measurement System |
681 | Thermco | Mini-Brute MB-80 | Horizontal Furnace |
682 | Thermo (Fisher) Scientific | Orion2 | ESD Simulator / Gun |
683 | Thermo Fisher Scientific (Electron) | Theta 300 MKII | Wafer Characterization |
684 | Thermo Scientific | UFP5030A | Freezers |
685 | Thermo Scientific | PlasmaQuad XS | Spectrometry |
686 | Thermo Scientific / Heraeus | UT 6 P | Vapor Prime Oven |
687 | Thermotron | SE-600-10-10 | Environmental Chamber |
688 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK MARK V | Single Block (Resist Coater/Developer) |
689 | Tokyo Electron Ltd. (TEL) | TEL Various Parts | Parts/Peripherals |
690 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
691 | Tokyo Electron Ltd. (TEL) | Tactras Vesta NV3 | Polysilicon Etch |
692 | Tokyo Electron Ltd. (TEL) | Tactras Vesta NV3 | Polysilicon Etch |
693 | Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch |
694 | Tokyo Electron Ltd. (TEL) | TELINDY Plus IRAD Oxide | Vertical Furnace |
695 | Tokyo Electron Ltd. (TEL) | ALPHA-303i process TBD | Vertical Furnace |
696 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
697 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
698 | Tokyo Electron Ltd. (TEL) | Tactras Vigus – Chamber Only | Dielectric Etch |
699 | Tokyo Electron Ltd. (TEL) | P-8 | Production Wafer Prober |
700 | Tokyo Electron Ltd. (TEL) | P-8 | Production Wafer Prober |
701 | Tokyo Electron Ltd. (TEL) | P-12XLn+ | Production Wafer Prober |
702 | Tokyo Electron Ltd. (TEL) | P-8 | Production Wafer Prober |
703 | Tokyo Electron Ltd. (TEL) | P-12XL | Production Wafer Prober |
704 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
705 | Tokyo Electron Ltd. (TEL) | Tactras Vigus | Dielectric Etch |
706 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
707 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) |
708 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) |
709 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
710 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
711 | Tokyo Electron Ltd. (TEL) | TELINDY ALDOX | Vertical Furnace |
712 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS COAT ONLY | Coat only Track |
713 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
714 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
715 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
716 | Tokyo Electron Ltd. (TEL) | UW300Z | Batch Wafer Processing |
717 | Tokyo Electron Ltd. (TEL) | P-12XL | Production Wafer Prober |
718 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
719 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) |
720 | Tokyo Electron Ltd. (TEL) | Cellcia | Production Wafer Prober |
721 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) |
722 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) |
723 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
724 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
725 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
726 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Oxide | Vertical Furnace |
727 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
728 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
729 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) |
730 | Tokyo Electron Ltd. (TEL) | TELINDY ALDOX | Vertical Furnace |
731 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) |
732 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS Pro | Multi Block (Resist Coater/Developer) |
733 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) |
734 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
735 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
736 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
737 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch |
738 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
739 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
740 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
741 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
742 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
743 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
744 | Tokyo Electron Ltd. (TEL) | Tactras DRM3 | Dielectric Etch |
745 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
746 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
747 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
748 | Tokyo Electron Ltd. (TEL) | TELINDY ALD High-K | Vertical Furnace |
749 | Tokyo Electron Ltd. (TEL) | P-12XLn+ | Production Wafer Prober |
750 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) |
751 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
752 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
753 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
754 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
755 | Tokyo Electron Ltd. (TEL) | TELINDY ALDOX | Vertical Furnace |
756 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
757 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
758 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
759 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
760 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
761 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
762 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
763 | Tokyo Electron Ltd. (TEL) | TELINDY ALDOX | Vertical Furnace |
764 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
765 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
766 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
767 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
768 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
769 | Tokyo Electron Ltd. (TEL) | Precio | Production Wafer Prober |
770 | Tokyo Electron Ltd. (TEL) | Precio | Production Wafer Prober |
771 | Tokyo Electron Ltd. (TEL) | Precio XL | Production Wafer Prober |
772 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
773 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
774 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
775 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
776 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
777 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
778 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
779 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
780 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
781 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
782 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) |
783 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) |
784 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS SINGLE BLOCK | Single Block (Resist Coater/Developer) |
785 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
786 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
787 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
788 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
789 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
790 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
791 | Tokyo Electron Ltd. (TEL) | Cellesta | Single Wafer Processing |
792 | Tokyo Electron Ltd. (TEL) | Cellesta | Single Wafer Processing |
793 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
794 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
795 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
796 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
797 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
798 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
799 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
800 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
801 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
802 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
803 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
804 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
805 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
806 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
807 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) |
808 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) |
809 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Developer) |
810 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
811 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
812 | Tokyo Electron Ltd. (TEL) | Trias EX-II Plus HT Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
813 | Tokyo Electron Ltd. (TEL) | Trias EX-II Plus HT Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
814 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
815 | Tokyo Electron Ltd. (TEL) | Tactras Vigus RK3 | Dielectric Etch |
816 | Tokyo Electron Ltd. (TEL) | Tactras Vigus RK3 | Dielectric Etch |
817 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
818 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS MULTI BLOCK | Multi Block (Resist Coater/Developer) |
819 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
820 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
821 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
822 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
823 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
824 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
825 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
826 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
827 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
828 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
829 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
830 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
831 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
832 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
833 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
834 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
835 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK ACT 12 | Single Block (Resist Coater/Developer) |
836 | Tokyo Electron Ltd. (TEL) | Tactras Vigus RK5 – Chamber Only | Dielectric Etch |
837 | Tokyo Electron Ltd. (TEL) | NS 300Z | Wafer Scrubber |
838 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
839 | Toray Engineering Co., Ltd. | PB3000 | Flip Chip Bonder |
840 | Toray Engineering Co., Ltd. | FC3000WL | Flip Chip Bonder |
841 | Towa Corporation | FFT1030G | Molding Equipment |
842 | Toyota Industries Corporation | T100L | Dry Pump |
843 | UENO SEIKI CO.,LTD. | WS-evo | Wafer Inspection Equipment |
844 | UENO SEIKI CO.,LTD. | WS-evo | Wafer Inspection Equipment |
845 | UENO SEIKI CO.,LTD. | WS-evo | Wafer Inspection Equipment |
846 | UENO SEIKI CO.,LTD. | WS-evo | Wafer Inspection Equipment |
847 | Ultratech | CGS-300 | Stress Measurement |
848 | Ultron Systems Inc | UH102-8 | UV Irradiator |
849 | Ultron Systems Inc | UH102-8 | UV Irradiator |
850 | Ultron Systems Inc | UH102-8 | UV Irradiator |
851 | Ulvac Corporation | Entron-EX: Aluminum Interconnect | PVD (Physical Vapor Deposition) |
852 | Unaxis/Balzers | EHV215A | Power Supply |
853 | Unisem | UN-2002A-PG | Abatement – Scrubber |
854 | Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
855 | Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
856 | Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
857 | Unity SC / HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
858 | Unknown | Dry Box | Cabinets |
859 | Varian Semiconductor Equipment Associates (VSEA) | 979-HE | Leak Detector |
860 | Varian Semiconductor Equipment Associates (VSEA) | VIISta 810 | Mid Current Implanter |
861 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP+ | High Current Implanter |
862 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP+ | High Current Implanter |
863 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HCP+ | High Current Implanter |
864 | Varian Semiconductor Equipment Associates (VSEA) | VIISta PLAD | High Dose Implant |
865 | Varian Semiconductor Equipment Associates (VSEA) | VIISta PLAD | High Dose Implant |
866 | Varian Semiconductor Equipment Associates (VSEA) | VIISta PLAD | High Dose Implant |
867 | Varian, Inc. | Turbo-V 300 HT | Turbo Pump |
868 | VARIOUS | 1.25″ SILICON WAFER | Wafers |
869 | VARIOUS | 1.5″ SILICON WAFER | Wafers |
870 | VARIOUS | 1.875″ SILICON WAFER | Wafers |
871 | VARIOUS | 2″ SILICON WAFER | Wafers |
872 | VARIOUS | 2.25″ SILICON WAFER | Wafers |
873 | VARIOUS | 2.5″ SILICON WAFER | Wafers |
874 | VARIOUS | 2.875″ SILICON WAFER | Wafers |
875 | VARIOUS | 3″ SILICON WAFER | Wafers |
876 | VARIOUS | 3.25″ SILICON WAFER | Wafers |
877 | VARIOUS | 200MM SILICON WAFER | Wafers |
878 | VARIOUS | SILICON INGOT | SILICON INGOT |
879 | VARIOUS | 100MM SILICON WAFER | Wafers |
880 | VARIOUS | 125MM SILICON WAFER | Wafers |
881 | VARIOUS | 150MM SILICON WAFER | Wafers |
882 | Various | Various | Parts/Peripherals |
883 | Veeco / Solid State Equipment Corporation (SSEC) | Waferstorm 3300 / M3303 / M3304 (SSEC 3303/4) | Single Wafer Processing |
884 | Veeco Instruments Inc. | Dimension 7000 | Atomic Force Microscope (AFM) |
885 | Verigy (Agilent) | V4400 | Memory Tester |
886 | Verigy (Agilent) | V4400 | Memory Tester |
887 | Verigy (Agilent) | V4400 | Memory Tester |
888 | Verigy (Agilent) | V4400 | Memory Tester |
889 | VERSA CONN CORP. | WB-302 Triple+ | Semi Automated High Force Wafer Bonder |
890 | Verteq, Inc. | ST800 | Batch Wafer Processing |
891 | Vistec Semiconductor Systems | SB254 | E-beam Lithography System |
892 | Vistec Semiconductor Systems | SB254 | E-beam Lithography System |
893 | Wentworth Laboratories | MP-2000 | Engineering Wafer Prober |
894 | X-Tek | Orbita 160Xi | X-Ray Inspection System |
895 | YAMATO WORKS | NRY-101V6W/LU | IR reflow |
896 | Zeiss | UMSP 80 | Spectrophotometer |
897 | Zygo Corp. | AutoKMS-100 | Reticle CD SEM |
898 | Zygo Corp. | UniFire 7900 | Overlay Measurement System |
899 | Zygo Corp. | UniFire 7900 | Overlay Measurement System |
SS5319-0-2024-2-3-1