Description
- Mask Aligner/Step/Lithography
- JEOL JBX 6300-FS Direct Write Electron Beam Lithography System, 10nm
- Nanonex NX-2000 Nanoimprint Lithography (NIL) System, 10nm
- Neutronix PLA501 Mask Aligner
- Canon PLA-501 F
- Canon PLA-501 F Mask Aligner
- Neutronix PLA 500/501 Mask Aligner
- Neutronix PLA-545 UV Mask Aligner
- Heidelberg MLA150 Maskless Aligner,1um
- ASML PAS5500/275D Stepper,280nm
- Heidelberg Instruments DWL 2000 Laser Pattern Generator, 700nm
- Suss MicroTec MA6/BA6 Contact Aligner , 1um
- Suss MicroTec MA8 Contact Aligner, 1um
- Coater, Developer, Stabilization etc. for Lithography.
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Brewer Science CEE 100 Spinner
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BREWER SCIENCE CEE 200
- CEE Apogee Spinner
- Suss MicroTec ACS200 Automated Resist Coater
- Suss MicroTec Delta12AQ Automated Resist Developer
- Bachur & Associates LS-200FSX Photoresist Stabilization System
- Silanization Oven
- Microfluidic Test Station
- PDMS Casting Station
- Assembly Hood: Envirco Laminar Hood
- Plasma Bonder: Harrick Plasma PDC-32
- Forced Convection Curing Oven: Jeio Tech OF-12G
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- Thin Film Equipment
- Evaporator: Denton Vacuum Infinity 22
- Electron Beam and Thermal Evaporator: Denton Vacuum Infinity 22
- Thermal Thin-Al Evaporator, Denton “Bench Top Turbo” thermal evaporator
- Cluster Sputter Deposition System: 4Wave IBD/BTD
- Sputtering System B104 : Denton Vacuum Discovery 550
- Atomic Layer Deposition: Oxford FlexAL
- High Density Plasma Chemical Vapor Deposition (HDPCVD): Plasma-Therm Versaline
- Parylene Deposition System: Specialty Coating Systems PDS 2010
- LPCVD Silicon Nitride: Sandvik
- LPCVD Polysilicon: Sandvik
- Thermal Oxidation Furnaces: Sandvik
- LPCVD LTO: Sandvik
- Temescal FC-1800 Electron Beam Evaporator
- CAMBRIDGE NANOTECH SAVANNAH S200 ALD. ATOMIC LAYER DEPOSITION SYSTEM
- AMAT AMP-3300 PECVD
- CPA S-Gun Sputter Deposition
- CVC AST-601 Sputter
- Emscope SC-650 Series
- Kurt J Lesker Dual Thermo
- MRC 603 MRC 693 TES
- MRC 603 Sputter
- MRC 643 Sputter
- MRC 8671 Sputtering
- Oxford 80+ DPCVD
- Perkin-Elmer 4400 Sputtering Deposition Equipment
- Perkin-Elmer 4450 Sputter
- Plasma Therm 700
- Plasmalab CVD-2
- Plasma Thermal 790 PECVD
- Temescal BJD-1800 E-Beam
- Temescal BJD-1800 -TES
- Temescal FC-1800 -TES
- Plasmalab 80 Plus PECVD
- Varian 3118 E-Beam Thermal
- Varian 3120 EB Evaporator
- CHA Industries Mark 50
- Temescal FC-1800 Evaporator
- TES FC-1800 E-Beam Evaporator
- Perkin-ELmer 2400-8L
- AIXTRON CCS 3X2 MOCVD reactor
- Dry Plasma Asher Descum
- Downstream Plasma Asher: AllWin21 AW-1008
- Microwave Asher TEPLA 300
- Branson/ICP 3000
- Allwin21 AW-B3000
- Gasonics Aura 1000
- Gasonics Aura 2000LL
- Gasonics Aura 3000
- Gasonics Aura 3010
- Gasonics PEP3510
- Gasonics L3510
- Tegal 915
- Tegal 200
- Tegal 400
- Tegal 900
- Allwin21 AW-105R
- Matrix 105
- Matrix 209
- Matrix 108
- Matrix 205
- Dry Plasma Etcher ICP RIE DRIE Bosch Process
- Deep Silicon Etcher: SPTS Omega c2L Rapier
- Allwin21 AW303R
- Allwin21 AW-901eR
- Allwin21 AW-903eR
- Matrix 303
- Matrix 403
- Tegal 903e
- Tegal 901e
- Branson/IPC 4150
- Plasma Etch BT1
- Plasma Etch PE-100 Series
- Plasma Therm 700 PECVD Plasma Etcher
- Plasma Therm 790 RIE
- Lam Research AutoEtch 490 590 690 790
- Lam Research Rainbow 4400 4500 4600 4700
- Lam Research Rainbow 4420 4520 4620 4720
- Lam Research Rainbow 4428 4528 4628 4728
- Deep Silicon Etcher: Unaxis Shuttleline DSEII
- Hydrofluoric Acid Vapor Etcher: SPTS microEtch
- Inductively Coupled Plasma (ICP) Dielectric Etcher: Oxford Plasmalab 100
- Plasmatherm SLR 720
- STS MULTIPLEX -ICP Bosch
- STS Multiplex ICP Plasma Etcher
- STS Multiplex ICP MACS
- Technics PE-11A
- Oxford Plasmalab 800Plus RIE
- AST Plasma Etch
- SAMCO RIE-10NT
- Inductively Coupled Plasma (ICP) Etcher: Plasmatherm Unaxis Shuttleline
- Inductively Coupled Plasma (ICP) Metal Etcher: Oxford Plasmalab 100
- Oxford PlasmaLab System 133 RIE
- Oxford PlasmaLab System 100 RIE
- Inductively Coupled Plasma (ICP) Silicon Etcher: Oxford Plasmalab 100
- Inductively Coupled Plasma (ICP) III-V Etcher: Oxford Plasmalab 100
- Ion Milling System: 4Wave IBE-20B
- Reactive Ion Etcher: Plasmatherm Unaxis 790
- Xenon Difluoride Silicon Etcher: Xactix Xetch
- Thermal Processors
- Anneal Furnaces: Sandvik
- AG Associates Heatpulse 210.Rapid Thermal Annealer
- AG Associates Heatpulse 310
- AG Associates Heatpulse 410
- AG Associates Heatpulse 610
- AG Associates Heatpulse 610I
- AG Associates Heatpulse 4100
- AG Associates Heatpulse 4100S
- AG Associates Heatpulse 8008
- AG Associates Heatpulse 8108
- AG Associates Heatpulse 8800
- Allwin21 AccuThermo AW610
- Allwin21 AccuThermo AW810
- Allwin21 AccuThermo AW820
- Allwin21 AccuThermo AW820R
- Allwin21 AccuThermo AW820V
- AnnealSys AS-Master
- MPT RTP-3000
- MPT 600S
- MPT 600XP
- MPT 800S
- JIPELEC JETFIRST 200
- JIPELEC JETFIRST 100
- Wet processing
- SSEC Single Wafer Cleaning System
- Coppy MHY Plating
- EEJA Manual Plater Model #4
- Gold Techni TG25T Bath Rhodium 225
- Semitool SD250 Spin Dryer
- STI Semitool Spin Rinse Dryer ST-260
- Technic Inc. Portable Wet Bench
- Wet Process Equipment
- Critical Point Dryer: Tousimis Automegasamdri-916B Series C
- Critical Point Dryer: Tousimis Automegasamdri-815 Series B
- Spray Solvent Lift-off Tool: Microprocess Technology Avenger
- RCA Wet Bench: Reynolds
- RCA Wet Bench B102: Reynolds
- Silicon Nitride Etch Wet Bench: Reynolds
- Silicon Etch Wet Bench: Reynolds
- Spin Rinse Dryer: Semitool PSC-101
- Back End Equipment
- Dicing Saw: Disco DAD-341
- Dynex GSX Scribe and Break Tool
- Flip Chip Bonder: Tresky T-3000-FC3-HF
- Wedge Wire Bonder: Kulicke and Soffa Model 4526
- Chemical Mechanical Polisher (CMP): IPEC 472
- Post-CMP Wafer Cleaner: GnP 412S
- Wafer Bonder: Suss MicroTec SB6e
- Metrology Imaging Analysis
- Compound Optical Microscope: Nikon L200
- Contact Angle Goniometer: First Ten Angstroms FTA125
- Contact Profilometer: Bruker Dektak XT
- Contact Profilometer: Bruker Dektak 6M
- F.E.I. Quanta 200 FEG SEM
- Nikon Microscope AFX-II
- KLA Tencor P6
- KLA Tencor P-7
- CDE ResMap 178 Four Point Probe
- EG 1034
- West Bond Wire Bonder
- Micromanipulator Probe Station
- EG4090u+ 8 inch wafer probe
- EG 4085X 8 inch wafer probe
- Hitachi S-4700 SEM Working
- Tencor M-Gage 200
- Tencor MGage 300
- Tencor Sonogage 200
- Sloan Dektak II Profilometer I39930
- Dektak model 3 Surface Stylus Profiler
- Signatone CM170-6
- Emscope SC-650 Series
- Gaertner Scientific L117
- Hewlett Packard 4061A
- HP 4062 and Testers
- Japan SANWA LC361C High Votage Probe
- Leitz Ergolux AMC Microscope
- MP2020 Wentworth Lab Probe
- Nanoline CD Measurement
- Nanometrics 210 Nanospec AFT
- Olympus BHM
- Olympus BX60 Microscope
- Prometrix Film Thickness Probe
- Prometrix SpectraMap SM-300
- Relay Tester With APC Smart-UPS , HP Compaq Pickering Interfaces 40-914-001
- Relay Tester With HP Compaq ,TDK Lambda
- Relay Tester With HP Compaq Pickering Interfaces 40-914-001
- Rudolph Research AutoEL SS291
- Ecopia Hall Effect Measurement System HMS-5500
- Filmetrics F40-UV Reflectometer
- Filmetrics F50-UV Mapping Reflectometer
- Four Point Probe: Four Dimension 280DI
- Mercury Probe
- Optical Profilometer: Sensofar
- Parametric Test Station: Keithley 4200 SCS
- Reflectometer: Nanometrics Nanospec
- Spectroscopic Ellipsometer: J.A. Woollam M-2000 DI
- Stereo Microscope: Nikon SMZ1500
- Stereo Microscope: Olympus SZH10
- Stress Measurement Tool: Toho Technology FLX-2320
- Ted Pella easiGlow Glow Discharge Cleaning System
- Leica EM GP Automatic Plunge Freezer
- NanoMill Ion Mill: Fischone Model 1040
- Cleaving Tool: Lattice Gear LatticAx
- Analytical Transmission Electron Microscope: FEI Titan 80-300
- Field Emission Scanning Electron Microscope: Zeiss Gemini 500
- Field Emission Scanning Electron Microscope: Zeiss Ultra 60
- Atomic Force Microscope: Bruker Dimension FastScan
- High Resolution Atomic Force Microscope: Asylum Cypher
- X-Ray Diffraction: Rigaku SmartLab
- Dual Beam Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB): FEI Helios NanoLab 660
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All the used equipment trademarks belongs to the O.E.M. , the original equipment manufacturer. All rights reserved.
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