Description
Oxford Instruments Plasmalab 800 Plus PECVD Chemical Vapor Deposition System
A 460mm diameter electrode offers a capacity of up to twelve 4 in. wafers.
Ideally suited for batch PECVD processing where excellent across chamber uniformity of less than 2 percent is achieved for silicon nitride and silicon dioxide layers.
Last owner had set up for 2 in. wafers.
18.75 in. top electrode with shower head gas input.
Footprint is kept to a minimum by locating all electronics and vacuum components within the body of the tool, mass flow controllers are housed separately in a wall mounted gas pod.
Six MFC gas controllers, previously used gases He, N2, N2O, NH3, SIH4/N2, CF4.
PC controller provides intuitive user interaction with the system via advanced graphics and process recipe pages.
Includes vacuum pump and blower package.
OEM-Module-1 MSP-155000-195000