AG Associates Heatpulse 8108 Utility Specification: The following table is a summary of the utility specifications for the Heatpulse 8108 system: UTILITY Flow Rate Pressure Tube Cooling CDA or Utility N2 35 SCFM 40 SCFM 45 SCFM 80 psi 90 psi 100 psi Valve Actuation CDA or Utility N2 <1 SCFM <1 SCFM <1 SCFM […]
A summary of the facility connections for the AG Associates Heatpulse 8108 Rapid Thermal Process,Rapid thermal processing,rapid thermal annealing systems
AG Associates Heatpulse 8108 Utility requirements include:
• Power
Standard Domestic: 208 VAC, 60 Hz; 125 A maximum;3-phase plus ground and neutral
European: 400 VAC, 50 Hz; 90 A maximum;3-phase plus ground and neutral
AG Associates Heatpulse 8108 Physical Dimensions: • Width Monitor-Fab-Wall configurations: 40 in. (102 cm) Monitor-Side-Panel configurations: 60 in. (152 cm) • Depth 42 in. (107 cm) • Height 82 in. (208 cm) • Weight Monitor-Fab-Wall configurations: 1800 lbs (816 kg); Monitor-Side-Panel configurations: 1840 lbs (835 kg) • Shipping weight Monitor-Fab-Wall configurations: 2000 lbs (907 kg); […]
The following are the operating specifications for the AG Associates Heatpulse 8108 Rapid Thermal Processor. • Wafer handling: automatic serial processing, using standard cassettes. • Throughput: Process dependent, approximately 80 wafers per hour (in a null cycle) without flat-finder. • Wafer sizes: 5 inches, 6 inches, and 8 inches (standard). • Ramp-up rate: Programmable, 1 […]
The AG Associates Heatpulse 8108 Rapid Thermal Processing System is a versatile tool which can be useful for many applications, such as (but not limited to): • Silicon dielectric growth • Implant annealing • Glass re-flow • Silicide formation and annealing • Nitridation of metals • Contact alloying • Oxygen donor annihilation The […]
AG Associates Heatpulse8108 Rapid Thermal Annealing System Options: Direct Thermocouple Control: Direct Thermocouple Control (ez-DTC) is a closed-loop thermocouple-based temperature control system which is much less sensitive to emissivity variations wafer to wafer than the pyrometer, thus increasing process repeatability. The DTC temperature probe is an R-type thermocouple sealed in a non-contaminating silicon carbide sheath. […]
The AG Associates Heatpulse 8108 rapid thermal annealing system contains many capabilities which provide significant advantages over conventional batch processing in the production of VLSI circuits. Cleanroom integrity, precise temperature control and measurement, software flexibility, and the physical structure of the system (designed for the production environment) are among these advantages.
