AG Associates Heatpulse8108 Rapid Thermal Annealing System Options:
- Direct Thermocouple Control: Direct Thermocouple Control (ez-DTC) is a closed-loop thermocouple-based temperature control system which is much less sensitive to emissivity variations wafer to wafer than the pyrometer, thus increasing process repeatability. The DTC temperature probe is an R-type thermocouple sealed in a non-contaminating silicon carbide sheath.
- Ceramic Shield :The Ceramic Shield is semiconductor grade material installed beneath the wafer. When combined with the ez-DTC option, it provides emissivity independent operation to Heatpulse systems.
- Slip-Free/ Wafer Aligner : This hardware and software option dramatically reduces slip for high-temperature processing. It includes slip-free rings, the ez-DTC quartz tray, and Wafer-Aligner. The Wafer-Aligner, or Flat-Finder, finds the flat edge of the wafer prior to loading it into the process chamber.
The AG Associates Heatpulse 8108 system is a single-wafer, cassette-to-cassette rapid thermal processor, capable of processing in inert or corrosive ambients. The AG Associates Heatpulse 8108 Rapid Thermal Annealing System is built for the production environment. It is installed stand-alone (which can also be housed in a compact, through-the-wall frame , if desired).
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