Description
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Universal X-RAY X-7900 Inspection System
The X-7900 X-ray Inspection System is a high-performance inspection solution designed for universities, research institutes, and compound semiconductor fabs requiring stronger penetration, higher magnification, and more advanced internal structure analysis. It is well suited for research, failure analysis, advanced packaging evaluation, and semiconductor-related inspection applications.
Key Features
- 130 kV enclosed micro-focus X-ray source for stronger penetration capability
- 3 μm spatial resolution for high-precision internal inspection
- Optical magnification up to 450X and system magnification up to 2000X
- Large 540 × 540 mm stage size for flexible sample handling
- 1536 × 1536 flat panel detector with 16-bit imaging capability
Strong Selling Points
- Designed for Advanced R&D and Semiconductor Inspection
Suitable for high-precision inspection of integrated circuit devices, advanced packages, and research samples requiring clearer internal imaging. - Higher Penetration with 130 kV X-ray Source
Provides stronger inspection capability than entry-level systems, making it more suitable for denser materials and more demanding analytical tasks. - High Magnification and Fine Resolution
With 3 μm spatial resolution, 450X optical magnification, and 2000X system magnification, the X-7900 supports detailed defect analysis and structure evaluation. - Flexible for Multiple Research Applications
Applicable to semiconductor devices, BGA, IGBT, flip chip, PCBA modules, LED, photovoltaic components, batteries, and other advanced materials inspection tasks. - Balanced Performance and Cost
Offers an attractive solution for customers who need stronger technical capability than an entry-level X-ray system without moving to a much higher capital cost platform.
Applications
- Semiconductor device and package inspection
- BGA, IGBT, flip chip, and PCBA welding analysis
- Compound semiconductor and advanced materials evaluation
- LED and photovoltaic component inspection
- Battery and electronic component internal defect analysis
- Research, development, and laboratory failure analysis
Positioning
The X-7900 is a mid-to-high level X-ray inspection system for research-focused users who require stronger penetration, finer resolution, and broader application capability than a basic entry-level platform.
Specifications
| Category | Item | Specification |
| X-ray Source | Model | X-7900 |
| Tube Type | Enclosed type | |
| Tube Voltage | 130 kV (optional 100 kV / 90 kV) | |
| Tube Current | 300 μA | |
| Imaging | Spatial Resolution | 3 μm |
| Optical Magnification | 450X | |
| System Magnification | 2000X | |
| Image Speed | 20 FPS | |
| Detector Rotation Angle | 60° | |
| Detector | Detector Type | Digital flat panel detector |
| Detector Resolution | 1536 × 1536 px | |
| Density Value | 16 bit | |
| Stage / Inspection | Stage Size | 540 × 540 mm |
| Sensing Range | 510 × 510 mm | |
| Load-bearing | ≤ 10 kg | |
| Examination Range | 0.02–45 cm² | |
| System | Machine Size | 1100 × 1360 × 1950 mm (L × W × H) |
| Machine Weight | 1050 kg | |
| Operating System | Windows 10 | |
| Power Supply | AC110–220V, 50–60Hz | |
| Power | 1200W | |
| Radiation Safety Test | < 1 μSv/h |
* Specifications are for reference only and may vary depending on configuration. Please contact SemiStar or the manufacturer for official specifications.
