Description
The STS Multiplex PECVD is only for end user. Please contact us if you have any questions. Subject to prior sale without notice. Appreciate your time!
STS Multiplex Plasma Enhanced Chemical Vapor Deposition (PECVD) system
Gas box (Process gases):
SiH4-Ar (Silane-Ar), 100 sccm
NH3 (Ammonia), 500 sccm
N2O, 5000 sccm
N2, 5000 sccm
CF4, 1000 sccm
O2, 500 sccm
Ar, 1000 sccm
C2H2, 1000 sccm
(2) Purge lines: Silane / CH43.
Dual frequency:
High frequency PECVD
Low frequency PECVD
Vacuum load-lock: Manual
Load-lock / Process chamber: Automatic transfer
Loader substrates: Up to 200 mm diameter
Chuck: 100 mm diameter
Load lock: MK4 Single wafer load lock
RF Generator: 187.5 kHz, 375kHz
Remote gas box
Computer
Monitor
Keyboard
Operating system: Windows 2000
Affinity chiller
EDWARDS IH600 Vacuum pump: Chamber
VARIAN SH-100 Vacuum pump: Load lock
Operation manuals
Electrical drawings
Auxiliary equipment manuals
Deposit silicon dioxide (SiO2)
Silicon nitride (Si3N4)
Silicon carbide (SiC)
ID-OEM-PECVD-1