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Temescal FC-1800 E-Beam

Description

Refurbished Temescal FC-1800 Loadlock Electron Beam Evaporator System

SemiStar Corp. offers refurbished Temescal FC-1800 loadlock electron beam evaporator systems for semiconductor, optical coating, compound semiconductor, university, research institute, and advanced materials thin film deposition applications.

We currently have 4 sets of Temescal FC-1800 systems in stock. These systems are offered in refurbished condition with OEM specifications, warranty, and installation support if applicable.

The Temescal FC-1800 is a production-proven fast-cycle loadlock evaporation system designed for high-throughput vacuum deposition, improved reproducibility, and reduced contamination by keeping the evaporation chamber under vacuum while substrates are loaded and unloaded through an isolated chamber. :contentReference[oaicite:0]{index=0}

Photos shown are for reference only. Actual configuration, options, condition, and installed accessories may vary. Final specifications are subject to formal quotation.

Refurbished Temescal FC-1800 Electron Beam Evaporator System


Availability

  • Temescal FC-1800 Loadlock E-Beam Evaporator Systems
  • Quantity: 4 sets in stock
  • Refurbished condition
  • Refurbished with OEM specifications
  • Warranty included
  • Installation and startup support available if applicable
  • Subject to prior sale

Current Available Configuration

  • Temescal FC-1800 Evaporator System
  • Temescal CV-14 Electron Beam Power Supply
  • CTI Cryopump 8
  • CTI-Cryogenics Compressor Model SC
  • Varian Vacuum Pump Model EXPPTS06003
  • Electron beam source assembly
  • Vacuum chamber and loadlock system
  • Vacuum gauges and vacuum controls
  • System control cabinet and accessories

System Description

The Temescal FC-1800 is a compact fast-cycle loadlock coating system designed for production-scale vacuum deposition. The system uses an isolated load/unload chamber concept to keep the evaporation chamber under vacuum during operation, helping improve reproducibility and reduce contamination.

The compact 20-inch diameter by 11-inch deep deposition chamber provides fast pumpdown and flexible deposition capability. The FC-1800 can support canted-dome or angle-of-incidence planetary fixtures, electron beam sources, shutters, rate and thickness monitoring, and optional substrate heating depending on final configuration.


Key Features

  • Fast-cycle loadlock electron beam evaporation system
  • High-throughput evaporation design
  • Improved reproducibility due to continuous vacuum source chamber design
  • Reduced source and substrate heater contamination through isolated lower chamber
  • Low-profile construction for convenient cleanroom or laminar-flow hood operation
  • 20-inch diameter deposition chamber
  • 18-inch diameter source chamber
  • Automatic valve sequencing for pumpdown and venting
  • Manual, semi-automatic, or fully automatic operation depending on configuration
  • Optional canted-dome planetary fixturing
  • Optional substrate heaters
  • Optional rate and thickness monitor system
  • Optional multi-crucible or second electron beam source
  • Optional wire feeders, shutters, and process automation modules

Electron Beam Source and Power Supply

  • Temescal 270-degree deflection electron beam source capability
  • Single or multiple-crucible source configurations available depending on system setup
  • Single, sequential, or graded deposition capability depending on configuration
  • Temescal CV-14 electron beam power supply available
  • 14 kW / 10 kV class electron beam power supply capability
  • Optional NE-6 switching power supply available depending on configuration

Vacuum and Pumping System

  • Loadlock deposition chamber with fast pumpdown capability
  • High-vacuum source chamber maintained under vacuum
  • CTI Cryopump 8 configuration available
  • CTI-Cryogenics compressor system
  • Varian mechanical vacuum pump
  • High-vacuum gate valve
  • Roughing valve, vent valve, foreline valve, and high-vacuum gate valve sequence
  • Gate valve also functions as a shutter before substrate heating and deposition

Typical Process Capability

  • Metal thin film deposition
  • Dielectric evaporation depending on source and process configuration
  • Optical coating research
  • Semiconductor thin film deposition
  • Lift-off process applications
  • Compound semiconductor research
  • University and R&D laboratory deposition
  • Sequential or multi-material deposition depending on configuration

Reference Specifications

Cycle Time 10 to 15 minutes for 1 µm aluminum
Coating Uniformity ±7% with high-speed planetary substrate fixture
Deposition Chamber 20 in. diameter x 11 in. high
Source Chamber 18 in. diameter
Source Tray 19 in. diameter blank flat plate
Construction Polished 304 stainless steel internal surfaces
Loadlock Pumpdown Less than 2 minutes
Typical Operating Vacuum Mid 10-6 to mid 10-7 torr range with standard pumping system
Ultimate Operating Vacuum 10-8 torr with standard pumping system
Instrument Weight Less than 1800 lb. / 818 kg

Facility Requirements

  • Electrical power: 208 V, 3-phase, 70 A, 50/60 Hz, 5-wire with active neutral and equipment ground, unless otherwise configured
  • Cooling water required
  • Filtered compressed air required
  • Vacuum pump exhaust connection required
  • Ambient temperature and humidity control recommended
  • Customer is responsible for facility preparation, utilities, exhaust, rigging, and local code compliance unless otherwise specified in quotation

Refurbishment and Service

  • System inspection and refurbishment
  • Vacuum chamber cleaning and leak check
  • Pump and cryopump inspection/refurbishment as required
  • Power supply inspection and test
  • Electron beam source inspection and refurbishment
  • Safety interlock verification
  • Final functional test before shipment
  • Installation and startup support if applicable
  • Warranty provided under formal quotation terms

RFQ Information Requested

To recommend the correct configuration and refurbishment scope, please provide:

  • Substrate size and material
  • Deposition materials
  • Film thickness and uniformity requirements
  • Required process temperature or substrate heating needs
  • Preferred power supply configuration
  • Required vacuum level
  • Facility location and available utilities
  • Installation and training requirements
  • Expected purchase timeline

Important Notes

  • All configurations and specifications are subject to final inspection and formal quotation.
  • Actual available system configuration may vary by inventory unit.
  • Some options may require additional refurbishment, upgrade, or replacement cost.
  • All OEM names and trademarks belong to their respective owners.
  • Website information is for reference only and is not final purchase specification.

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