Description
Refurbished STS / SPTS Multiplex ICP HRM Plasma Etcher
SemiStar Corp. offers a refurbished STS / SPTS Multiplex ICP HRM Plasma Etcher based on current inventory and original equipment configuration. Surface Technology Systems (STS), later associated with SPTS Technologies and the KLA SPTS product line, is widely recognized for MEMS fabrication, deep silicon etch, ICP plasma etch, semiconductor process development, and advanced semiconductor R&D applications.
The STS / SPTS Multiplex HRM platform is designed for high-rate ICP plasma etch applications including silicon etch, MEMS process development, deep silicon structures, dielectric etch, and semiconductor research applications. Available systems may be configured differently depending on original application, chamber configuration, RF setup, gas chemistry capability, and wafer handling configuration.
This available STS / SPTS Multiplex ICP HRM Plasma Etcher is a 2004 vintage system configured with fluorine-based process gas capability including SF6, C4F8, O2, Argon, and CHF3.
Refurbished systems are supplied based on current inventory and original equipment configuration. Installation, startup assistance, and warranty may be available depending on system condition, final configuration, and project scope.
Photo shown is for reference only. Actual system appearance and configuration may vary.
Available System Information
| Item | Configuration |
|---|---|
| System | STS / SPTS Multiplex ICP HRM Plasma Etcher |
| System Type | Multiplex ICP HRM |
| Vintage | 2004 |
| Process Gases | SF6, C4F8, O2, Argon, CHF3 |
Typical Applications
- MEMS fabrication
- ICP plasma etch process development
- High-rate silicon etch
- Deep silicon etch
- High aspect ratio silicon structures
- Dielectric and oxide etch
- Semiconductor R&D
- University and research institute plasma process development
Typical Process Capability
| Process Area | Typical Use |
|---|---|
| ICP Plasma Etch | Semiconductor plasma etch and process development |
| Deep Silicon Etch | MEMS trenches, cavities, silicon micromachining, and high aspect ratio structures |
| Dielectric Etch | Oxide and dielectric plasma etch applications |
| Research and Development | Universities, institutes, and semiconductor R&D laboratories |
Typical Configuration Items to Confirm
- Wafer size and substrate type
- Chuck configuration and cooling capability
- Gas chemistry and process requirements
- ICP source and RF generator configuration
- Vacuum pump and throttle valve configuration
- Facility exhaust and gas handling requirements
- Installation scope and warranty availability
Related STS / SPTS Inventory
SemiStar may also have other STS / SPTS Multiplex plasma etch systems available, including Bosch Process DRIE, AOE advanced oxide etch, standard ICP plasma etch, and M/PLEX metal etch configurations. Please contact SemiStar for current inventory and configuration details.
Important Notes
- Refurbished equipment availability is subject to prior sale.
- Refurbished systems are supplied based on current inventory and original equipment configuration.
- Actual configuration, process capability, installation scope, warranty, and delivery schedule must be confirmed by quotation.
- SemiStar does not provide spare parts or service support for STS systems not sold by SemiStar.
- All OEM names, trademarks, and model names belong to their respective owners.
- All website information is for reference only and is not a purchase specification. Final configuration, scope, price, and terms are based on SemiStar’s official quotation.
Request a Quote for STS / SPTS Multiplex ICP HRM Plasma Etcher
Please contact SemiStar with your target application and required configuration. Helpful information includes wafer size, substrate material, etch material, process gases, target application, facility limitations, budget, and expected purchase timeline.
Contact SemiStar
SS-STS-HRM-2004-OEM-29
