Description
Refurbished STS / SPTS Multiplex ICP HRM Etcher for MEMS-CMOS Deep Silicon Etch
SemiStar Corp. offers a refurbished STS / SPTS Multiplex ICP HRM Etcher based on current inventory and original equipment configuration. The STS Multiplex HRM platform, also associated with SPTS Technologies and the KLA / KLA-Tencor SPTS product line, is widely used for MEMS-CMOS process development, deep silicon etch, SOI wafer processing, and high aspect ratio silicon etch applications.
This available STS / SPTS Multiplex ICP HRM Etcher is configured for MEMS-CMOS applications with electrostatic chuck capability, helium backside cooling, and RF power configuration suitable for high-rate silicon etch processes. Actual process performance depends on wafer type, mask material, recipe, facility condition, and final system configuration.
Refurbished systems are supplied based on current inventory and original equipment configuration. Installation, startup assistance, and warranty may be available depending on system condition, final configuration, and project scope.
Photo shown is for reference only. Actual system appearance and configuration may vary.
Available HRM System Configuration
| Item | Configuration |
|---|---|
| System | STS / SPTS Multiplex ICP HRM Etcher |
| Process | MEMS-CMOS |
| Substrate | Small piece |
| Materials Used | Si, SOI wafers |
| Mask Materials | SiO2, SiNx / SiNy |
| Temperature Range | -20°C to 100°C |
| Process Pressure | 5–80 mTorr |
| Process Gases | SF6, C4F8, Ar, O2, C2 |
| Chuck / Cooling | HBC with ESC |
| ICP Coil Power | 3000 W, 13.56 MHz, Advanced Energy |
| HF Bias Power | 500 W, 13.56 MHz, ENI |
| LF Bias Power | 500 W, 380 kHz, Advanced Energy LF-5 |
Typical Applications
- MEMS-CMOS process development
- High-rate deep silicon etch
- High aspect ratio silicon structures
- SOI wafer etch
- Silicon micromachining
- MEMS trenches and cavities
- Small-piece silicon etch research
- University, institute, and semiconductor R&D applications
Process and Application Notes
The STS / SPTS Multiplex HRM configuration is intended for silicon and SOI wafer etch applications using fluorine-based etch chemistry and passivation gases. The listed configuration includes SF6, C4F8, Ar, O2, and C2 gas capability, making it suitable for MEMS-CMOS related silicon etch development where process requirements match the available hardware configuration.
Because STS / SPTS Multiplex systems were built with application-specific configurations, final suitability must be reviewed based on the customer’s wafer size, substrate format, material stack, mask material, target etch depth, aspect ratio, and facility requirements.
Related STS / SPTS Inventory
SemiStar may also have other STS / SPTS Multiplex plasma etch systems available, including Bosch Process DRIE, ICP RIE, and M/PLEX metal etch configurations. Please contact SemiStar for current inventory and configuration details.
Important Notes
- Refurbished equipment availability is subject to prior sale.
- Refurbished systems are supplied based on current inventory and original equipment configuration.
- Actual configuration, process capability, installation scope, warranty, and delivery schedule must be confirmed by quotation.
- SemiStar does not provide spare parts or service support for STS systems not sold by SemiStar.
- All OEM names, trademarks, and model names belong to their respective owners.
- All website information is for reference only and is not a purchase specification. Final configuration, scope, price, and terms are based on SemiStar’s official quotation.
Request a Quote for STS / SPTS HRM Etcher
Please contact SemiStar with your target application and required configuration. Helpful information includes wafer size, substrate type, small-piece carrier requirements, etch material, target etch depth, mask material, required aspect ratio, process gases, facility limitations, budget, and expected purchase timeline.
Contact SemiStar
SS380-MSP-325
