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Plasma-Therm 790 RIE 11″

Description

Refurbished Plasma-Therm 790 Series Reactive Ion Etching / Plasma Enhanced System RIE

SemiStar Corp. offers one refurbished Plasma-Therm 790 Series Reactive Ion Etching / Plasma Enhanced System located at our Morgan Hill, California, USA facility. This system is available in refurbished condition with OEM specifications, subject to final inspection, configuration confirmation, and prior sale.

The Plasma-Therm 790 Series is a versatile plasma processing platform designed for semiconductor, MEMS, compound semiconductor, university, nanotechnology, and advanced materials applications. The system supports reactive ion etching (RIE), plasma processing, and plasma enhanced thin-film processing applications.

Product photos are for reference only. Actual system configuration, accessories, utilities, software, cosmetic condition, and installed options should be confirmed by SemiStar’s final quotation and inspection report.

Availability

Equipment Model Plasma-Therm 790 Series RIE / PE System
OEM Model Information 790 10 RIE / PE MN Fr
Equipment Type Reactive Ion Etching / Plasma Enhanced Processing System
Category Etch / RIE / Plasma Processing
Manufacturer / OEM Plasma-Therm
Condition Refurbished, used good condition
Quantity 1 set
Location Morgan Hill, California, USA
Lead Time Estimated 6–10 weeks depending on PO timing and final PO conditions
Warranty 6 months after shipment, subject to final quotation terms
Installation / Training Available if necessary; scope and cost to be confirmed
Price Contact SemiStar by filling out the inquiry form below
Validity Subject to prior sale without notice

System Description

The Plasma-Therm 790 Series RIE / PE system is designed for reactive ion etching and plasma enhanced processing applications. The platform is widely used in semiconductor laboratories, universities, research institutes, MEMS facilities, and compound semiconductor process development environments.

The system supports plasma etching, surface treatment, dielectric processing, and related plasma-assisted semiconductor manufacturing applications. The 790 Series platform is known for flexible process capability and stable plasma processing performance for R&D and pilot production applications.

Current Configuration

  • Plasma-Therm 790 Series RIE / PE system
  • 11 inch chuck configuration
  • Reactive ion etching process capability
  • Plasma enhanced processing capability
  • Manual loading configuration
  • Industrial plasma processing platform
  • Research and pilot production capability

Installed Gas Configuration

Gas Application
Argon (Ar) Plasma processing / sputter assist / chamber conditioning
Sulfur Hexafluoride (SF6) Silicon and fluorine-based plasma etching
Nitrogen (N2) Purge and plasma process applications
Oxygen (O2) Photoresist strip and plasma oxidation related processing

Typical Applications

  • Reactive ion etching (RIE)
  • Silicon plasma etching
  • MEMS plasma processing
  • Photoresist strip and descum applications
  • Compound semiconductor process development
  • Plasma surface treatment
  • University and research institute plasma research
  • Advanced materials plasma processing

Chuck / Wafer Capability

  • Approximate chuck size: 11 inch
  • Suitable for research and development substrate processing
  • Wafer size capability depends on installed hardware and process configuration
  • Final substrate handling capability should be confirmed during quotation review

RF Power and Process Information

The Plasma-Therm 790 platform commonly uses 13.56 MHz RF plasma processing architecture for stable reactive ion etching and plasma enhanced process applications. Final installed RF generator configuration, matching network configuration, and power capability should be confirmed during final inspection and refurbishment review.

Facility Requirements

  • Electrical power requirements to be confirmed during final configuration review
  • Process gas cabinets and gas delivery systems required
  • Vacuum pump and exhaust requirements to be reviewed
  • Cooling water/chiller requirements to be confirmed
  • Facility exhaust and scrubber compatibility required
  • Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation

Refurbishment and Support

SemiStar can provide the equipment in refurbished condition with OEM specifications. Refurbishment scope, functional testing, installation, training, utilities integration, and warranty scope will be confirmed based on the final purchase order and customer requirements.

The standard offering includes a 6-month warranty after shipment unless otherwise stated in the official quotation. Installation and training can be quoted separately if required.

RFQ Information Requested

To help us recommend the best final configuration and support scope, please provide:

  • Substrate size and material
  • Target etch or plasma process
  • Required process gases and chemistry
  • Required RF power or plasma process requirements
  • Expected process result targets
  • Need for installation, startup, or training support
  • Facility readiness and utility information
  • Expected purchase timeline and budget range

Important Notes

  • Subject to prior sale without notice.
  • Final specifications subject to SemiStar official quotation and inspection confirmation.
  • All OEM names, trademarks, and model names belong to their respective owners.
  • SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
  • Final purchase specifications, refurbishment scope, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.

Contact SemiStar

Please contact us for more information on the product:

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SS380-MSP-125

Other PlasmaTherm Equipment:

(1) ID-SS5319-S-3-1-1:

Plasma-Therm I.P. Inc. 7000 Series RIE Etch Multi-Process Etch
Plasma-Therm I.P. Inc. 790 Etch Multi-Process Etch
Plasma-Therm I.P. Inc. Versalock 700 Multi-Process Etch
Plasma-Therm I.P. Inc. Versalock 700 Multi-Process Etch
Plasma-Therm I.P. Inc. Versalock 700 Multi-Process Etch
Plasma-Therm I.P. Inc. Versalock 700 Multi-Process Etch
Plasma-Therm I.P. Inc. Versalock 700 Multi-Process Etch
Plasma-Therm I.P. Inc. Versalock 700 Multi-Process Etch
Plasma-Therm I.P. Inc. 7000 Series RIE Etch Multi-Process Etch
Plasma-Therm I.P. Inc. 7000 Series RIE Etch Multi-Process Etch

(2) ID SS5576-1-2-1-1-1:

Plasma-Therm Dual Chamber 790 PECVD (on side Low Freq. & other side 13.56Mhz) could be converted to both sides 13.56MHz
Plasma-Therm 790 PECVD upper Electrode Low Freq. &  Lower electrode High Freq.
Plasma-Therm 790 RIE Parts tool
Plasma-Therm 790 PECVD
Plasma-Therm 790 PECVD
Plasma-Therm SLR 720 RIE
Plasma-Therm SLR 720 RIE
Plasma-Therm SLR 720 RIE
Plasma-Therm SLR 720 RIE
Plasma-Therm SLR 720 RIE
Plasma-Therm VLR VersaWorks Cluster tool- one chamber PECVD
Plasma-Therm VLN (Versaline) ICP – single wafer manual load
Plasma-Therm VLN (Versaline) ICP – two wafer Brooks handler – manual load
YESHMDS Class 10 – all Stainless Steel

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