Description
Refurbished Plasma-Therm 790 Series Reactive Ion Etching / Plasma Enhanced System RIE
SemiStar Corp. offers one refurbished Plasma-Therm 790 Series Reactive Ion Etching / Plasma Enhanced System located at our Morgan Hill, California, USA facility. This system is available in refurbished condition with OEM specifications, subject to final inspection, configuration confirmation, and prior sale.
The Plasma-Therm 790 Series is a versatile plasma processing platform designed for semiconductor, MEMS, compound semiconductor, university, nanotechnology, and advanced materials applications. The system supports reactive ion etching (RIE), plasma processing, and plasma enhanced thin-film processing applications.
Product photos are for reference only. Actual system configuration, accessories, utilities, software, cosmetic condition, and installed options should be confirmed by SemiStar’s final quotation and inspection report.
Availability
| Equipment Model | Plasma-Therm 790 Series RIE / PE System |
| OEM Model Information | 790 10 RIE / PE MN Fr |
| Equipment Type | Reactive Ion Etching / Plasma Enhanced Processing System |
| Category | Etch / RIE / Plasma Processing |
| Manufacturer / OEM | Plasma-Therm |
| Condition | Refurbished, used good condition |
| Quantity | 1 set |
| Location | Morgan Hill, California, USA |
| Lead Time | Estimated 6–10 weeks depending on PO timing and final PO conditions |
| Warranty | 6 months after shipment, subject to final quotation terms |
| Installation / Training | Available if necessary; scope and cost to be confirmed |
| Price | Contact SemiStar by filling out the inquiry form below |
| Validity | Subject to prior sale without notice |
System Description
The Plasma-Therm 790 Series RIE / PE system is designed for reactive ion etching and plasma enhanced processing applications. The platform is widely used in semiconductor laboratories, universities, research institutes, MEMS facilities, and compound semiconductor process development environments.
The system supports plasma etching, surface treatment, dielectric processing, and related plasma-assisted semiconductor manufacturing applications. The 790 Series platform is known for flexible process capability and stable plasma processing performance for R&D and pilot production applications.
Current Configuration
- Plasma-Therm 790 Series RIE / PE system
- 11 inch chuck configuration
- Reactive ion etching process capability
- Plasma enhanced processing capability
- Manual loading configuration
- Industrial plasma processing platform
- Research and pilot production capability
Installed Gas Configuration
| Gas | Application |
|---|---|
| Argon (Ar) | Plasma processing / sputter assist / chamber conditioning |
| Sulfur Hexafluoride (SF6) | Silicon and fluorine-based plasma etching |
| Nitrogen (N2) | Purge and plasma process applications |
| Oxygen (O2) | Photoresist strip and plasma oxidation related processing |
Typical Applications
- Reactive ion etching (RIE)
- Silicon plasma etching
- MEMS plasma processing
- Photoresist strip and descum applications
- Compound semiconductor process development
- Plasma surface treatment
- University and research institute plasma research
- Advanced materials plasma processing
Chuck / Wafer Capability
- Approximate chuck size: 11 inch
- Suitable for research and development substrate processing
- Wafer size capability depends on installed hardware and process configuration
- Final substrate handling capability should be confirmed during quotation review
RF Power and Process Information
The Plasma-Therm 790 platform commonly uses 13.56 MHz RF plasma processing architecture for stable reactive ion etching and plasma enhanced process applications. Final installed RF generator configuration, matching network configuration, and power capability should be confirmed during final inspection and refurbishment review.
Facility Requirements
- Electrical power requirements to be confirmed during final configuration review
- Process gas cabinets and gas delivery systems required
- Vacuum pump and exhaust requirements to be reviewed
- Cooling water/chiller requirements to be confirmed
- Facility exhaust and scrubber compatibility required
- Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation
Refurbishment and Support
SemiStar can provide the equipment in refurbished condition with OEM specifications. Refurbishment scope, functional testing, installation, training, utilities integration, and warranty scope will be confirmed based on the final purchase order and customer requirements.
The standard offering includes a 6-month warranty after shipment unless otherwise stated in the official quotation. Installation and training can be quoted separately if required.
RFQ Information Requested
To help us recommend the best final configuration and support scope, please provide:
- Substrate size and material
- Target etch or plasma process
- Required process gases and chemistry
- Required RF power or plasma process requirements
- Expected process result targets
- Need for installation, startup, or training support
- Facility readiness and utility information
- Expected purchase timeline and budget range
Important Notes
- Subject to prior sale without notice.
- Final specifications subject to SemiStar official quotation and inspection confirmation.
- All OEM names, trademarks, and model names belong to their respective owners.
- SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
- Final purchase specifications, refurbishment scope, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.
Contact SemiStar
SS380-MSP-125
Other PlasmaTherm Equipment:
(1) ID-SS5319-S-3-1-1:
| Plasma-Therm I.P. Inc. | 7000 Series RIE Etch | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | 790 Etch | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | Versalock 700 | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | Versalock 700 | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | Versalock 700 | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | Versalock 700 | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | Versalock 700 | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | Versalock 700 | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | 7000 Series RIE Etch | Multi-Process Etch |
| Plasma-Therm I.P. Inc. | 7000 Series RIE Etch | Multi-Process Etch |
(2) ID SS5576-1-2-1-1-1:
| Plasma-Therm | Dual Chamber 790 PECVD (on side Low Freq. & other side 13.56Mhz) could be converted to both sides 13.56MHz |
| Plasma-Therm | 790 PECVD upper Electrode Low Freq. & Lower electrode High Freq. |
| Plasma-Therm | 790 RIE Parts tool |
| Plasma-Therm | 790 PECVD |
| Plasma-Therm | 790 PECVD |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | VLR VersaWorks Cluster tool- one chamber PECVD |
| Plasma-Therm | VLN (Versaline) ICP – single wafer manual load |
| Plasma-Therm | VLN (Versaline) ICP – two wafer Brooks handler – manual load |
| YESHMDS | Class 10 – all Stainless Steel |

