Description
Refurbished Oxford Plasmalab 100 RIE (FL) Reactive Ion Etcher
SemiStar Corp. offers one refurbished Oxford Plasmalab 100 RIE (FL) Reactive Ion Etcher configured for SiO2 plasma etching applications. The system is located in Nanjing, Jiangsu, China and is available in refurbished condition with OEM specifications, crating, warranty, and installation support if necessary.
The Oxford Plasmalab 100 RIE platform is designed for advanced semiconductor plasma etching applications including dielectric etching, silicon dioxide processing, MEMS process development, university research, and pilot production plasma processing environments.
Product photos are for reference only. Actual system configuration, accessories, utilities, installed options, software version, and cosmetic condition should be confirmed by SemiStar’s final quotation and inspection report.
Availability
| Equipment Model | Oxford Plasmalab 100 RIE (FL) |
| Equipment Type | Reactive Ion Etcher (RIE) |
| Category | RIE / Plasma Etcher / Dielectric Etch System |
| Manufacturer / OEM | Oxford Instruments Plasma Technology |
| Model Year | 2006 |
| Serial Number | 94-417795 |
| Condition | Refurbished with OEM specifications, crating, warranty, installation if necessary |
| Quantity | 1 system |
| Location | Nanjing, Jiangsu, China |
| Lead Time | 4 weeks after payment |
| Availability | Subject to prior sale without notice |
| Customer Responsibility | Customer responsible for chiller, pump, facility preparation, exhaust, utilities, and gas systems unless specifically included in quotation |
| Price | Contact SemiStar by filling out the inquiry form below |
System Description
The Oxford Plasmalab 100 RIE (FL) is a high-performance reactive ion etching platform configured for SiO2 and dielectric plasma etching applications. The system supports large substrate processing up to 300 mm wafers and includes turbo-pumped vacuum architecture, water-cooled electrode capability, and advanced RF plasma process control.
The system is suitable for semiconductor fabs, MEMS facilities, university cleanrooms, advanced R&D laboratories, and pilot production plasma processing applications.
Current Configuration
- Oxford Plasmalab 100 RIE (FL) Reactive Ion Etcher
- Supports wafer sizes up to 300 mm
- 330 mm platen configuration
- Configured for SiO2 plasma etching applications
- Advanced Energy RFX 600A RF Generator
- 600 W RF power
- 13.56 MHz RF plasma architecture
- Blue color PLC type control architecture
- Water-cooled electrode system
- Electrode temperature range: 10°C to 80°C
- Windows PC with user-friendly interface
- 6-line gas pod configuration
- Turbo-pumped chamber vacuum system
Installed Gas Configuration
| Gas | MFC Range |
|---|---|
| Argon (Ar) | 100 SCCM |
| Nitrogen (N2) | 200 SCCM |
| CHF3 | 200 SCCM |
| NF3 | 200 SCCM |
| Nitrous Oxide (N2O) | 200 SCCM |
The gas pod includes 6 gas lines with installed MFCs as listed above. Final gas assignment and unused gas line configuration should be confirmed during final inspection.
Vacuum System Configuration
- Chamber Turbo Pump: Alcatel ATH 400M
- Turbo Pump Controller: Alcatel ACT 600M
- High-vacuum plasma processing architecture
- Improved process repeatability and chamber cleanliness
RF Power and Process Information
- RF Generator: Advanced Energy RFX 600A
- RF Power: 600 W
- RF Frequency: 13.56 MHz
- Reactive Ion Etching (RIE) plasma architecture
- Water-cooled electrode system
- Electrode temperature range: 10°C to 80°C
- Suitable for SiO2 and dielectric plasma etching
Typical Applications
- SiO2 plasma etching
- Dielectric plasma etching
- MEMS process development
- Advanced semiconductor plasma processing
- Research and pilot production plasma etching
- Photoresist descum and plasma cleaning
- University and R&D cleanroom applications
- Advanced materials plasma processing
Wafer Capability
- Supports wafer sizes up to 300 mm
- 330 mm platen configuration
- Large substrate plasma processing capability
- Suitable for advanced semiconductor applications
Control System
- Windows PC controller
- User-friendly graphical interface
- Recipe management capability
- Process monitoring and control capability
- Blue PLC type control architecture
Facility Requirements
- Electrical power requirements to be confirmed during final configuration review
- Process gas cabinets and gas delivery systems required
- Vacuum pump and exhaust requirements to be reviewed
- Cooling water/chiller required
- Facility exhaust and scrubber compatibility required
- Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation
Refurbishment and Support
SemiStar can provide the equipment in refurbished condition with OEM specifications. Refurbishment scope, functional testing, crating, installation, training, utilities integration, and warranty scope will be confirmed based on the final purchase order and customer requirements.
Installation, startup assistance, and training support are available if necessary.
RFQ Information Requested
To help us recommend the best final configuration and support scope, please provide:
- Substrate size and material
- Target plasma etch application
- Required plasma chemistry
- Expected etch profile and process targets
- Facility readiness and utility information
- Required installation or startup support
- Expected purchase timeline and budget range
Important Notes
- Subject to prior sale without notice.
- Final specifications subject to SemiStar official quotation and inspection confirmation.
- All OEM names, trademarks, and model names belong to their respective owners.
- SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
- Final purchase specifications, refurbishment scope, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.
Contact SemiStar
SS7515-MSP-175-195