Description
Please contact us if you are interested in the Nanotechnology Equipment . The Nanotechnology Equipment is only for end users and are subject to prior sale without notice. Appreciate your time.
- Suss MicroTec LabSpin 8 Bench Mounted Spin Coater – 100-200mm capable system in Class 10 mini environment
- Allwin21 AW-1008 Plasma Asher
- Suss MicroTec HP8 Bench Mounted Hotplate (*) – 100-200mm capable programmable, electropolished 250C hotplate for resist bake in Class 10 environment
- Specialty Coating Systems 6808P Spin Coater – pieces to 150mm capable system
- Allwin21 AW-B3000 Barrel Batch Plasma asher Descum
- Headway Research, Inc PWM32 Spin Coater – pieces to 150mm for thick/specialty resist
- Yield Engineering Systems (YES) LP-III Vapor Prime Oven – vacuum oven for HMDS priming
- EV Group (EVG) 620 Automated Mask Alignment System – double-side contact lithography and bond alignment for up to 100mm substrates
- Asylum Research Cypher+A29A6A1:A27A1:A3A1:A29
- Atomic Force Microscopes (AFM)
- Beckman XL-I Analytical Ultracentrifuge (AUC)
- Biacore T100 Surface Plasmon Resonance (Biacore)
- Bruker Dimension Icon-PT
- Confocal Microscop: Zeiss LSM 510NLO e
- Differential Scanning Calorimetry (DSC)
- Dimple Grinder: Fischione 200
- Dual Beam FIB/SEM: FEI XL830
- EKSPLA Picosecond Vibrational Sum Frequency Generation (SFG) Spectrometer
- Ellipsometer: Woollam M-2000
- Evolution 220 Dual Beam Spectrophotometer (Evo220 UV/vis)
- Glow Discharge Optical Emission Spectrometry: Horiba GD-Profiler 2
- Glow Discharge Optical Emission Spectrometry: Horiba GD-Profiler 2
- Kratos AXIS Ultra (with UPS and imaging capabilities)
- Microcal ITC-200 Isothermal Titration Calorimetry (ITC)
- Molecular Vista Photoinduced Force Microscope (PiFM)
- Plasma Cleaner: Gatan Solarus 950
- Profilometer: Bruker OM-DektakXT
- QCM-D Instrument
- Raman Microscope/Spectrometer: Renishaw InVia
- Raman Microscope/Spectrometer: Renishaw InVia
- Scanning Electron Microscope (SEM): FEI Sirion
- Surface Science Instruments S-Probe
- TEM Ion Mill: Fischione 1050
- Time of Flight Secondary Ion Mass Spectrometry: ION-TOF TOF.SIMS 5
- Transmission Electron Microscope (TEM): FEI Tecnai
- Ultrafast transient absorption and photoluminescence spectroscopy
- Ultramicrotome: Leica EM UC6
- Ultrasonic Disc Cutter: Fischione 170
- X-ray Absorption Near Edge Spectroscopy: CEI-XANES
- X-ray Diffractometer: Bruker D8 Discover microfocus source and lynxeye-XET (1D) and Pilatus (2D) detectors
- X-ray Photoelectron Spectroscopy (XPS/ESCA)
- EV Group (EVG) 501 Wafer Bonder – aligned covalent, thermo-compression, adhesive, and anodic bonding of up to 100mm substrates
- ABM Contact Aligner – manual contact aligner for up to 100mm substrates
- Heidelberg Direct Write µPG101 Laser Mask Writer – 3µm spot UV laser writer for contact plate and direct write applications
- Canon FPA-3000 i4 i-line stepper – 5X reduction projection lithography stepper for up to 200mm wafers with CDs down to 350nm
- WAFAB Immersion develop and solvent lift-off and resist strip baths
- WAFAB Piranha, RCA Clean, HF/BOE, KOH/TMAH micro-machining, and general purpose wet process stations
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