Description
Please contact us for the availability of the used semiconductor equipment.The items are in Asia and are subject to prior sale without notice. The items are only for end users.
1 | AXCELIS | ES3 | ASHER | Plasma Asher |
2 | AMAT | REFLEXION | CMP | |
3 | AMAT | CENTURA Ultima_X | CVD | Ultima_X Rps Type / Nt Os |
4 | AMAT | CENTURA Ultima_X | CVD | Ultima_X Rps Type / Nt Os |
5 | AMAT | PRODUCER GT | CVD | CH_A_FOX / CH_B_eHARP |
6 | AMAT | PRODUCER GT | CVD | Harp Usg |
7 | AMAT | PRODUCER GT | CVD | Ht_Acl |
8 | AMAT | PRODUCER SE | CVD | CH_A_ACL / CH_B_PE-Sin / CH_C_PE-Teos |
9 | AMAT | PRODUCER SE | CVD | Ht_Sin |
10 | AMAT | PRODUCER SE | CVD | SILANE Server OS Type |
11 | AMAT | SILVIA | ETCHER | Tsv Etcher |
12 | AMAT | CENTRIS DPS Mesa | ETCHER | Twin 3chamber |
13 | AMAT | CENTURA DPS II | ETCHER | NT OS |
14 | AMAT | CENTURA DPS G5 | ETCHER | 1Process Chamber / 1Mesa Chamber |
15 | AMAT | CENTURA DPS G5 | ETCHER | Silvia Chamber 2ch / 1Axiom chamber |
16 | AMAT | CENTURA DPS Metal | ETCHER | ASP chamber only / Server OS |
17 | AMAT | CENTURA ENABLER | ETCHER | 3CH |
18 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server OS PC |
19 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server OS PC |
20 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server OS PC |
21 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server OS PC |
22 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server OS PC |
23 | AMAT | CENTURA ENABLER_E2 | ETCHER | Oxide Etcher /server OS PC |
24 | AMAT | CENTURA ENABLER_E2 | ETCHER | Oxide Etcher /server OS PC |
25 | AMAT | CENTURA ENABLER_E5 | ETCHER | Oxide Etcher /server OS PC |
26 | AMAT | DPS G5 | ETCHER | Poly Etch |
27 | AMAT | DPS G5 | ETCHER | Poly Etch |
28 | AMAT | DPS G5 | ETCHER | Poly Etch |
29 | AMAT | DPS G5 MESA | ETCHER | Poly Etch |
30 | AMAT | CENTURA MOCVD | LED | Nlighten Neon |
31 | AMAT | ENDURA CL | PVD | HT-Al 2ch / SIP-Ti 1ch |
32 | AMAT | ENDURA CL | PVD | |
33 | AMAT | ENDURA CL (XP robot) | PVD | CH-1_Ti/CH-2_AL/CH-3_AL/ |
34 | AMAT | VANTAGE RADIANCE | RTP | Rtp |
35 | AMAT | VANTAGE RADIANCE | RTP | Rtp |
36 | AMAT | RAIDER | ETC | |
37 | AMAT | RAIDER | ETC | |
38 | AMAT | ENDURA CL (XP robot) | PVD | CH-1_Ti/CH-2_AL/CH-3_AL/ CH-E&F_Degas |
39 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server Os Pc |
40 | AMAT | CENTURA ENABLER | ETCHER | Oxide Etcher /server Os Pc |
41 | ASML | XT760F | PHOTO | KrF |
42 | AUGUST | CV-9812 | MET | Wafer Carrier Inspection Tool |
43 | AXCELIS | INTEGRA | ASHER | ES Plasma Dry Strip System |
44 | AXCELIS | INTEGRA | ASHER | ES Plasma Dry Strip System |
45 | AXCELIS | INTEGRA | ASHER | ES Plasma Dry Strip System |
46 | DAITRON | CVP-320 | BACKEND | Wafer Edge Grinder |
47 | DNS | SS-3000-A | PHOTO | Bevel Scrubber (4F) |
48 | DNS | SS-3000-A | PHOTO | Bevel Scrubber (4F) |
49 | DNS | SS-3000-A | PHOTO | Wafer Scrubber (4Front) |
50 | DNS | SS-3000-A | PHOTO | Wafer Scrubber (4Front) |
51 | DNS | SS-3000-A | PHOTO | Wafer Scrubber (4Front) |
52 | DNS | SS-3000-A | PHOTO | Wafer Scrubber (4Front) |
53 | DNS | SS-3000-A | PHOTO | Wafer Scrubber (4Front) |
54 | DNS | SS-3000-AR | PHOTO | |
55 | DNS | SS-3000-AR | PHOTO | Bevel Scrubber (4B) |
56 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
57 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
58 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
59 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
60 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
61 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
62 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
63 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
64 | DNS | SS-3000-AR | PHOTO | Wafer Scrubber (4Back) |
65 | DNS | FC3000 | WET | Pre Metal Cleaner |
66 | DNS | FC3000 | WET | Pre Metal Cleaner |
67 | DNS | SU-3000 | WET | Cleaner (MP Type) (2_AM1/2_DHF) (2LoadPort) |
68 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
69 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
70 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
71 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
72 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
73 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
74 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
75 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (2LoadPort) |
76 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (3LoadPort) (1R) |
77 | DNS | SU-3000 | WET | Cleaner (MP Type)(DHF) (3LoadPort) (2R) |
78 | DNS | SU-3000 | WET | Cleaner (SR Type)(SST) (3LoadPort) |
79 | DNS | SU-3000 | WET | Cleaner (SR Type)(SST) (3LoadPort) |
80 | DNS | SU-3000 | WET | Cleaner (SR Type)(SST) (3LoadPort) |
81 | ELECTROGLAS | EG5300 | PROBER | Prober |
82 | ELECTROGLAS | EG5300 | PROBER | Prober |
83 | ELECTROGLAS | EG5300 | PROBER | Prober |
84 | FSM | SYMPHONYMC | MET | |
85 | HIKE | DD1223VN | FURNACE | Pyro |
86 | HIKE | DJ1206VN | FURNACE | Sin |
87 | HIKE | DJ1223VN | FURNACE | Ald |
88 | HITACHI | I-6300 | MET | CD Sem |
89 | HITACHI | S4700-II | MET | Scanning Electron Microscope |
90 | HITACHI | S4700-II | MET | Scanning Electron Microscope |
91 | HITACHI | IS2700SE | MET | Dark Field inspection |
92 | HITACHI | LS-6800 | MET | Wafer Surface Inspection |
93 | HITACHI | S4700 | MET | FE Sem |
94 | HITACHI | S4700 | MET | FE Sem |
95 | HITACHI | S4700 | MET | FE Sem |
96 | HMI | EPOINTER | MET | |
97 | J.A Woollam | VUV-VASE (Gen II) | MET | Spectroscopic Ellipsometers |
98 | Jordan valley semiconductors | JVX 6200 | MET | X-ray metrology (X-Ray Reflectivity) |
99 | Jordan valley semiconductors | JVX 6200I | MET | X-ray metrology (X-Ray Reflectivity) |
100 | KLA_TENCOR | 2350 | MET | High-Resolution Imaging Inspection |
101 | KLA_TENCOR | ARCHER 10 AIM | MET | Overlay |
102 | KLA_TENCOR | ARCHER 10 XT | MET | Overlay |
103 | KLA_TENCOR | ARCHER 10 XT | MET | Overlay |
104 | KLA_TENCOR | ARCHER 10 XT | MET | Overlay |
105 | KLA_TENCOR | ARCHER 100 AIM | MET | Overlay |
106 | KLA_TENCOR | ARCHER AIM | MET | Overlay |
107 | KLA_TENCOR | ARCHER AIM | MET | Overlay |
108 | KLA_TENCOR | ARCHER XT+ | MET | Overlay |
109 | KLA_TENCOR | ARCHER XT+ | MET | Overlay |
110 | KLA_TENCOR | ARCHER XT+ | MET | Overlay |
111 | KLA_TENCOR | ALERIS 8330 | MET | FilmThickness Mesuarement |
112 | KLA_TENCOR | ALERIS CX | MET | FilmThickness Mesuarement |
113 | KLA_TENCOR | ALERIS HT | MET | FilmThickness Mesuarement |
114 | KLA_TENCOR | ALERIS HT | MET | FilmThickness Mesuarement |
115 | KLA_TENCOR | F5X | MET | Thickness |
116 | KLA_TENCOR | TENCOR SP3 | MET | Unpatterned Wafer Inspection |
117 | KLA_TENCOR | PUMA 9130 | MET | Dark Field |
118 | KLA_TENCOR | PUMA 9000S | MET | |
119 | KOKUSAI | QUIXACE2 | FURNACE | Ald Tin |
120 | KOKUSAI | ZESTON-lll DD-1223V | FURNACE | |
121 | KORNIC | KORONARTP1200+ | RTP | Rtp |
122 | LAM | EXELAN 2300 | ETCHER | Oxide Etch |
123 | LAM | FLEX_GX_E6 | ETCHER | Oxide Etch |
124 | LAM | FLEX_GX_E6 | ETCHER | Oxide Etch |
125 | MATTSON | PARADIGME_SI | ASHER | Dry Strip |
126 | MATTSON | SUPREMA_IM | ASHER | Dry Strip |
127 | MATTSON | SUPREMA_IM | ASHER | Dry Strip |
128 | MATTSON | SUPREMA_IM | ASHER | Dry Strip |
129 | MATTSON | SUPREMA_IM | ASHER | Dry Strip |
130 | MATTSON | PARADIGME_SI | ETCHER | Poly Etch |
131 | MATTSON | HELIOS | RTP | Rtp |
132 | MATTSON | HELIOS | RTP | Rtp |
133 | MATTSON | HELIOS | RTP | Rtp |
134 | MATTSON | HELIOS | RTP | Rtp |
135 | MATTSON | HELIOS | RTP | Rtp |
136 | MATTSON | HELIOS | RTP | Rtp |
137 | MATTSON | HELIOS | RTP | Rtp |
138 | MATTSON | HELIOS | RTP | Rtp |
139 | MATTSON | HELIOS | RTP | Rtp |
140 | MATTSON | SUPREMA_IM | STRIP | Dry Strip |
141 | MATTSON | SUPREMA_IM | STRIP | Dry Strip |
142 | NANOMETRICS | CALIPER_MOSAIC | MET | Overlay |
143 | NANOMETRICS | CALIPER_MOSAIC | MET | Overlay |
144 | NANOMETRICS | CALIPER_MOSAIC | MET | Overlay |
145 | NANOMETRICS | CALIPER_ULTRA | MET | Mask & Wafer Inspection |
146 | NANOMETRICS | CALIPER_ULTRA | MET | Mask & Wafer Inspection |
147 | NANOMETRICS | CALIPER_ULTRA | MET | Mask & Wafer Inspection |
148 | NANOMETRICS | CALIPER_ELAN | PHOTO | Overlay |
149 | NGR | 2150 | MET | CD Sem |
150 | NIKON | S620D | PHOTO | Excimer laser (Laser Exclude) |
151 | NOVELLUS | GAMMA_EXPRESS | ASHER | PR Strip |
152 | NOVELLUS | CONCEPT 3 GAMMA 2130 | CVD | |
153 | NOVELLUS | CONCEPT 3 GAMMA 2130 | CVD | |
154 | NOVELLUS | CONCEPT 3 SPEED | CVD | NEXT |
155 | NOVELLUS | CONCEPT 3 SPEED | CVD | NEXT |
156 | NOVELLUS | CONCEPT 3 SPEED | CVD | NEXT |
157 | NOVELLUS | CONCEPT 3 SPEED | CVD | NEXT |
158 | NOVELLUS | CONCEPT 3 SPEED | CVD | NEXT |
159 | NOVELLUS | CONCEPT 3 SPEED | CVD | NEXT |
160 | NOVELLUS | VECTOR | CVD | PECVD |
161 | NOVELLUS | VECTOR EXPRESS | CVD | PECVD |
162 | NOVELLUS | CONCEPT 3 INOVA | PVD | NEXT |
163 | PSK | SUPRA3 | ASHER | Dry Strip |
164 | PSK | SUPRA3 | ASHER | Dry Strip |
165 | PSK | TERA21 | ASHER | PR Ashing |
166 | PSK | TERA21 | ASHER | PR Ashing |
167 | PSK | TERA21 | ASHER | PR Ashing |
168 | PSK | TERA21 | ASHER | PR Ashing |
169 | RORZE | RSC242 | ETC | Wafer Sorter / 4Foup type |
170 | RORZE | RSC242 | ETC | Wafer Sorter / 4Foup type |
171 | RORZE | RASS300F | ETC | Wafer Sorter / 4Foup type |
172 | RUDOLPH | AXI-S | MET | Macro Inspection System |
173 | RUDOLPH | AXL_S | MET | Macro Inspection System |
174 | RUDOLPH | AXL_S | MET | Macro Inspection System |
175 | RUDOLPH | AXL_S | MET | Macro Inspection System |
176 | RUDOLPH | AXL_S | MET | Macro Inspection System |
177 | RUDOLPH | MP1-300 | MET | Film Thickness Measurement |
178 | RUDOLPH | MP1-300 | MET | Film Thickness Measurement |
179 | RUDOLPH | MP1-300 | MET | Film Thickness Measurement |
180 | RUDOLPH | MP1-300 | MET | Film Thickness Measurement |
181 | RUDOLPH | MP1-300 | MET | Film Thickness Measurement |
182 | RUDOLPH | MP1-300 | MET | Film Thickness Measurement |
183 | RUDOLPH | MP2-300XCU | MET | Film Thickness Measurement |
184 | RUDOLPH | MP3-300XCU | MET | Film Thickness Measurement |
185 | RUDOLPH | MP3-300CMP | MET | Metal Thickness Measurement |
186 | RUDOLPH | S3000A | MET | FBE(focused beam laser ellipsometry) |
187 | RUDOLPH | S3000A | MET | FBE(focused beam laser ellipsometry) |
188 | RUDOLPH | WS3840 | MET | 3D Bump Metrology |
189 | RUDOLPH | WV320 MACRO | MET | |
190 | RUDOLPH | WV320 MACRO | MET | |
191 | SECRON | IP 300 | PROBER | Prober |
192 | SIGMAMELTEC | SFG3000 | ETC | Photomask |
193 | TEL | TELIUS SCCM Jin | ETCHER | Dry Etcher |
194 | TEL | VIGUS_MASK | ETCHER | Etch |
195 | TEL | VIGUS_MASK | ETCHER | Etch |
196 | TEL | VIGUS_MASK | ETCHER | Etch |
197 | TEL | VIGUS_MASK | ETCHER | Oxide |
198 | TEL | VIGUS_RK2 | ETCHER | Oxide |
199 | TEL | 30X | FURNACE | K Type / Poly |
200 | TEL | ALPHA-303i | FURNACE | H type / Poly |
201 | TEL | ALPHA-303i | FURNACE | H type / Poly |
202 | TEL | ALPHA-303i | FURNACE | K type / Mto |
203 | TEL | ALPHA-303i | FURNACE | K type / Mto |
204 | TEL | ALPHA-303i | FURNACE | K type / Mto |
205 | TEL | ALPHA-303i | FURNACE | K type / Mto |
206 | TEL | ALPHA-303i | FURNACE | K type / Mto |
207 | TEL | ALPHA-303i | FURNACE | K type / Mto |
208 | TEL | ALPHA-303i | FURNACE | K type / Mto |
209 | TEL | ALPHA-303i | FURNACE | K Type / Poly |
210 | TEL | ALPHA-303i | FURNACE | K Type / Poly |
211 | TEL | ALPHA-303i | FURNACE | K Type / Poly |
212 | TEL | FORMULA | FURNACE | DCS SiN |
213 | TEL | FORMULA | FURNACE | DCS SiN |
214 | TEL | FORMULA | FURNACE | Nitrde |
215 | TEL | FORMULA(ver.0) | FURNACE | Optimal Thermal Processing |
216 | TEL | INDY | FURNACE | Poly |
217 | TEL | INDY | FURNACE | ALD Sin |
218 | TEL | INDY | FURNACE | ALD Sin |
219 | TEL | INDY | FURNACE | ALD Sin |
220 | TEL | INDY | FURNACE | |
221 | TEL | INDY ALD HIGH K | FURNACE | High-K AlO/ZrO |
222 | TEL | INDY ALD HIGH K | FURNACE | High-K AlO/ZrO |
223 | TEL | INDY DOPED POLY | FURNACE | Ph3 Doped Poly |
224 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
225 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
226 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
227 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
228 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
229 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
230 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
231 | TEL | Clean Track Mark 5 Vz | Clean Track Mark 5 Vz | |
232 | TEL | FORMULA | FURNACE | Ald High-K Vertical Lpcvd |
233 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
234 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
235 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
236 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
237 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
238 | TEL | LITHIUS | PHOTO | High Reliability and Productivity Coater Developer |
239 | Toray | SP-500w | MET | Bump Height Measurement |
The items are subject to prior sale without notice.
SS5588