Description
Used Semiconductor Equipment Parts
These are subject to prior sale. These are only for end user. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
| 3 | A-B Lasers Inc. (Rofin) | Waferlase Compact | Laser Scribe |
| 4 | A-B Lasers Inc. (Rofin) | Waferlase | Laser Scribe |
| 5 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 6 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 7 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 8 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 9 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 10 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 11 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 12 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 13 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 14 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 15 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 16 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 17 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 18 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 19 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 20 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 21 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 22 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 23 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 24 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 25 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 26 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 27 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 28 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 29 | Accretech/TSK | UF300A | Production Wafer Prober |
| 30 | Accretech/TSK | UF3000EX | Production Wafer Prober |
| 31 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 32 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 33 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 34 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 35 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 36 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 37 | ADE Corporation | AFS-3220 | Wafer Characterization |
| 38 | ADE Corporation | Microsense 6033 | Wafer Characterization |
| 39 | Advanced Energy | ICP 20P | Power Supply |
| 40 | Advanced Technology Inc. | Cypress GEN2 | Lead Inspection Equipment |
| 41 | Advanced Technology Inc. | Cypress | Lead Inspection Equipment |
| 42 | Advanced Thermal Sciences (ATS) | DEX-20A | Chiller/Heat Exchanger |
| 43 | Advantest | T5585 | Memory Tester |
| 44 | Advantest | T5585 | Memory Tester |
| 45 | Advantest | T5585 | Memory Tester |
| 46 | Advantest | T5585 | Memory Tester |
| 47 | Advantest | R3768 | Network Analyzer |
| 48 | Air Control, Inc. | Microvoid FH-45D-S | Fume Hood Workstation |
| 49 | Alcatel | ADP 81 | Dry Pump |
| 50 | Alcatel | ADS 1802H | Dry Pump |
| 51 | Alcatel | ADS1802P | Dry Pump |
| 52 | Alcatel | A1803H | Dry Pump |
| 53 | Alum-a-Lift | A200-60 | General Purpose Lift |
| 54 | Amray, Inc. | 2030 | SEM – Defect Review (DR) |
| 55 | Amray, Inc. | 2030 | SEM – Defect Review (DR) |
| 56 | Amray, Inc. | 2030 | SEM – Defect Review (DR) |
| 57 | Amray, Inc. | 3800c | SEM – Defect Review (DR) |
| 58 | Anelva Corp. | FC-3100 | PVD (Physical Vapor Deposition) |
| 59 | Anelva Corp. | Cosmos I-1201 PVD Liner/Barrier | PVD (Physical Vapor Deposition) |
| 60 | Applied Materials (AMAT) | Centura ACP DPN Plus Gate Stack | Decoupled Plasma Nitride |
| 61 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 62 | Applied Materials (AMAT) | Producer SE SACVD | SACVD (Chemical Vapor Deposition) |
| 63 | Applied Materials (AMAT) | Raider | ECD (Electro Chemical Deposition) |
| 64 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
| 65 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 66 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 67 | Applied Materials (AMAT) | Producer GT BD/BLOk Low k Dielectric | PECVD (Chemical Vapor Deposition) |
| 68 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
| 69 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 70 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 71 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Minos Poly | Polysilicon Etch |
| 72 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 73 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 74 | Applied Materials (AMAT) | Reflexion LK Copper | Copper CMP |
| 75 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
| 76 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 77 | Applied Materials (AMAT) | Centura AP iSprint | Metal CVD (Chemical Vapor Deposition) |
| 78 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 79 | Applied Materials (AMAT) | Producer Etch XT Dielectric | Dielectric Etch |
| 80 | Applied Materials (AMAT) | Producer Etch XT Dielectric | Dielectric Etch |
| 81 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 82 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 83 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
| 84 | Applied Materials (AMAT) | Producer SE PECVD TEOS | PECVD (Chemical Vapor Deposition) |
| 85 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
| 86 | Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) |
| 87 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 88 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 89 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 90 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 91 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 92 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 93 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 94 | Applied Materials (AMAT) | Endura II Chamber: Ventura Cu | PVD (Physical Vapor Deposition) |
| 95 | Applied Materials (AMAT) | Endura II Chamber: Ventura Cu | PVD (Physical Vapor Deposition) |
| 96 | Applied Materials (AMAT) | Reflexion LK – Poly/STI | Poly/STI CMP |
| 97 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 98 | Applied Materials (AMAT) | Producer Etch eXT Poly | Polysilicon Etch |
| 99 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 100 | Applied Materials (AMAT) | Centura AdvantEdge Mesa2 | Polysilicon Etch |
| 101 | Applied Materials (AMAT) | Centris AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 102 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 103 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 104 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
| 105 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 106 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 107 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 108 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 109 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 110 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 111 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
| 112 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
| 113 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 114 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 115 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 116 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 117 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing |
| 118 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing |
| 119 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing |
| 120 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 121 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 122 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly – Chamber Only | Polysilicon Etch |
| 123 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 124 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 125 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 126 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 127 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 128 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
| 129 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 130 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
| 131 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
| 132 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 133 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 134 | Applied Materials (AMAT) | Endura SL Front-End Metallization | PVD (Physical Vapor Deposition) |
| 135 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 136 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 137 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 138 | Applied Materials (AMAT) | Producer GT | PECVD (Chemical Vapor Deposition) |
| 139 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 140 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly – Chamber Only | Polysilicon Etch |
| 141 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 142 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 143 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
| 144 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 145 | Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) |
| 146 | Applied Materials (AMAT) | Reflexion LK | Multi-Process CMP |
| 147 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 148 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
| 149 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
| 150 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
| 151 | Applied Materials (AMAT) | Reflexion LK | Multi-Process CMP |
| 152 | Applied Materials (AMAT) | Reflexion LK Copper | Copper CMP |
| 153 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) |
| 154 | Applied Materials (AMAT) | Centris SYM3 Poly | Polysilicon Etch |
| 155 | Applied Materials (AMAT) | Vantage Radiance RTP | Platform RTP Equipment |
| 156 | Applied Materials (AMAT) | Vantage RadiancePlus | Platform RTP Equipment |
| 157 | Applied Materials (AMAT) | VeritySEM 4i | SEM – Critical Dimension (CD) Measurement |
| 158 | Applied Materials (AMAT) | VeritySEM 4i | SEM – Critical Dimension (CD) Measurement |
| 159 | Applied Materials (AMAT) | VeritySEM 4i | SEM – Critical Dimension (CD) Measurement |
| 160 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
| 161 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
| 162 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 163 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 164 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 165 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 166 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 167 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
| 168 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
| 169 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 170 | Applied Materials (AMAT) | Centura AdvantEdge Mesa2 | Polysilicon Etch |
| 171 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 172 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 173 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 174 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 175 | Applied Materials (AMAT) | Raider | ECD (Electro Chemical Deposition) |
| 176 | Applied Materials (AMAT) | Raider | ECD (Electro Chemical Deposition) |
| 177 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 178 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 179 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 180 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 181 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 182 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 183 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 184 | Applied Materials (AMAT) | SEMVision G6 | SEM – Defect Review (DR) |
| 185 | Applied Materials (AMAT) | SEMVision G6 | SEM – Defect Review (DR) |
| 186 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch |
| 187 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 188 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 189 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) |
| 190 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 191 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 192 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 193 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 194 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 195 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 196 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 197 | Applied Materials (AMAT) | Producer GT PECVD TEOS | PECVD (Chemical Vapor Deposition) |
| 198 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP |
| 199 | Applied Materials (AMAT) | Reflexion LK Copper | Copper CMP |
| 200 | Applied Materials (AMAT) | Centura AP – Mainframe Only (Poly Etch) | Polysilicon Etch |
| 201 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch |
| 202 | Applied Materials (AMAT) | Raider | ECD (Electro Chemical Deposition) |
| 203 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal | Metal Etch |
| 204 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 205 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 206 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 207 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 208 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 209 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 210 | ASM International | Eagle XP EmerALD | ALD (Atomic Layer Deposition) |
| 211 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 212 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 213 | ASM International | A600 LPCVD-OXIDE | Vertical Furnace |
| 214 | ASM International | Eagle XP4 | ALD (Atomic Layer Deposition) |
| 215 | ASM International | Eagle XP8 | ALD (Atomic Layer Deposition) |
| 216 | ASM International | Eagle XP8 | ALD (Atomic Layer Deposition) |
| 217 | ASML | TWINSCAN XT:1250D | 193nm (ArF) Scanner |
| 218 | ASML | YieldStar S-200B | Overlay Measurement System |
| 219 | ASML | YieldStar S-100B | Overlay Measurement System |
| 220 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 221 | Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher |
| 222 | Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher |
| 223 | Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher |
| 224 | Axcelis Technologies Inc. | Radiantstrip 320 | Stripper/Asher |
| 225 | Axcelis Technologies Inc. | Fusion 200PCU | UV Cure System |
| 226 | BESI | Fico AMS-i 204 | Molding Equipment |
| 227 | BOC Edwards | Spectra-N | Nitrogen Generator |
| 228 | Bold Technologies, Inc. | Bold Wet Bench | Batch Wafer Processing |
| 229 | Boschman | BXXP\21 | Molding Equipment |
| 230 | CAMECA | EX-300 | Implant Dosing Measurement |
| 231 | Canon | Surpass 320 | Stripper/Asher |
| 232 | Canon | FPA-5500 iZa | i-Line Wide-Field Stepper |
| 233 | Canon | FPA-5500 iZa | i-Line Wide-Field Stepper |
| 234 | Canon | FPA-5500 iZa | i-Line Wide-Field Stepper |
| 235 | Canon | FPA-5500 iZa | i-Line Wide-Field Stepper |
| 236 | Carl Zeiss Group | Axiotron 300 | Microscope |
| 237 | Cascade | S300 | Engineering Wafer Prober |
| 238 | Chemwest | K232 | Quartz Tube Cleaner |
| 239 | Chemwest | K232 | Quartz Tube Cleaner |
| 240 | Chroma ATE Inc. | 3380P | VLSI Tester |
| 241 | Cohu, Inc. | Ismeca NX16 | Test Handler |
| 242 | Cohu, Inc. | Ismeca NX16 | Test Handler |
| 243 | Cohu, Inc. | Ismeca NX16 | Test Handler |
| 244 | Cohu, Inc. | Ismeca NX16 | Test Handler |
| 245 | Control Laser Corporation. | FALIT | Package Auto Decap System |
| 246 | Cooljag Thermal Solutions | SP3-D/SQ | CPU Cooling Fan |
| 247 | Dainippon Screen Mfg. Co. (DNS) | SS-3000-AR | Wafer Scrubber |
| 248 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 249 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 250 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
| 251 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 252 | Dainippon Screen Mfg. Co. (DNS) | FC-3100 | Batch Wafer Processing |
| 253 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 254 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 255 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 256 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 257 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 258 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 259 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 260 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 261 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 262 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 263 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 264 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 265 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 266 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 267 | Dainippon Screen Mfg. Co. (DNS) | SS-3200 | Wafer Scrubber |
| 268 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
| 269 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing |
| 270 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 271 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 272 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 273 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 274 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) |
| 275 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
| 276 | Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing |
| 277 | Dainippon Screen Mfg. Co. (DNS) | EEW-622-B | Edge Exposure Tool |
| 278 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
| 279 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
| 280 | Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing |
| 281 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing |
| 282 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
| 283 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
| 284 | Dainippon Screen Mfg. Co. (DNS) | FC-3100 | Batch Wafer Processing |
| 285 | Dainippon Screen Mfg. Co. (DNS) | FC-3100 | Batch Wafer Processing |
| 286 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 287 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 288 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 289 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 290 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 291 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 292 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 293 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 294 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing |
| 295 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 296 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 297 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 298 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 299 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 300 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 301 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 302 | DAS | ESCAPE DUO | Chemical/Gas Treatment System |
| 303 | DAS | ESCAPE DUO | Chemical/Gas Treatment System |
| 304 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 305 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 306 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 307 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 308 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 309 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 310 | Daymarc Corporation | 3287 | Gravity Feed SOC Handler |
| 311 | Delatech Inc. | 858 – V2 | Abatement – CDO Scrubber |
| 312 | Despatch Industries | LND 2-11 | Cure Oven |
| 313 | E.A. Fischione | 1010 | Plasma Cleaner |
| 314 | Ebara | FREX300 Tungsten | Tungsten CMP |
| 315 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 316 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 317 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 318 | Ebara | FREX300 Tungsten | Tungsten CMP |
| 319 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 320 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 321 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 322 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 323 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 324 | Ebara | FREX300S Tungsten | Tungsten CMP |
| 325 | Ebara | FREX300S Poly/STI | Poly/STI CMP |
| 326 | Ebara | FREX300S Poly/STI | Poly/STI CMP |
| 327 | Ebara | FREX300S Dielectric | Dielectric CMP |
| 328 | Edwards | Atlas Etch | Abatement – Scrubber |
| 329 | Edwards | iL70 | Dry Pump |
| 330 | Edwards | iH80 | Dry Pump |
| 331 | Edwards | iH1800SC | Dry Pump |
| 332 | Edwards | iH1000 | Dry Pump |
| 333 | Edwards | iH600 | Dry Pump |
| 334 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System |
| 335 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System |
| 336 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System |
| 337 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System |
| 338 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System |
| 339 | Electron Vision Corporation | ElectronCure 30X | UV Cure System |
| 340 | Entegris | NU-J6101 | Batch Parts Clean (ultrasonic) |
| 341 | Entegris | KA198-80M | Wafer Cassette |
| 342 | Entegris | NU-J6101 | Batch Parts Clean (ultrasonic) |
| 343 | ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer |
| 344 | Espec | EGNU28-12CWL | Environmental Chamber |
| 345 | Espec | ESX-3CW | Environmental Chamber |
| 346 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
| 347 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
| 348 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
| 349 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
| 350 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection |
| 351 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
| 352 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection |
| 353 | Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection |
| 354 | Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection |
| 355 | Estek Automation SDN BHD | WIS-850 | Broadband Patterned Wafer Defect Inspection |
| 356 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection |
| 357 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection |
| 358 | Estek Automation SDN BHD | WIS-150 | Broadband Patterned Wafer Defect Inspection |
| 359 | EVGA Corporation | Supernova 1300 G2 | PC Power Supplies |
| 360 | EVGA Corporation | 850 GQ | PC Power Supplies |
| 361 | FEI Company | Helios NanoLab 450S | Focused Ion Beam (FIB) |
| 362 | FSI International | Zeta 300 G3 | Batch Wafer Processing |
| 363 | FSI International | Excalibur | Batch Wafer Processing |
| 364 | FSI International | Excalibur | Batch Wafer Processing |
| 365 | FSM | 900TC-VAC | Stress Measurement |
| 366 | FTS Systems (SP Scientific) | RC311GLAM | Chiller/Heat Exchanger |
| 367 | Gatan | Model 691 PIPS | Specimen Preparation |
| 368 | GCA Tropel | Autosort Mark II 150 | Flatness Measurement |
| 369 | General Electric (GE) | Phoenix aminer | X-ray Inspection |
| 370 | Genesis | 2020B | Vapor Prime Oven |
| 371 | GSI Lumonics | WaferMark 200HS | Laser Scribe |
| 372 | Hitachi | RCF3550AZP1 | Chiller/Heat Exchanger |
| 373 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 374 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 375 | Hitachi (Semiconductor) | HL-800D | E-beam Lithography System |
| 376 | Hitachi (Semiconductor) | CG4000 | SEM |
| 377 | Hitachi (Semiconductor) | CG4000 | SEM |
| 378 | Hitachi Kokusai Electric Inc. (HiKE / KSEC) | Aldinna | ALD (Atomic Layer Deposition) |
| 379 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
| 380 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
| 381 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
| 382 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
| 383 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System |
| 384 | IPEC | AvantGaard 676 | Multi-Process CMP |
| 385 | Ismeca | TMBZ SP | Taping |
| 386 | Ismeca | TMBZ SP | Taping |
| 387 | Jabil Chad Automation | WaferMate200 | Wafer and Substrate Handling |
| 388 | Jabil Chad Automation | WaferMate200 | Wafer and Substrate Handling |
| 389 | JEOL | JWS-7555 | SEM – Defect Review (DR) |
| 390 | JEOL | JFS-9855S | Focused Ion Beam System |
| 391 | JEOL | JWS-7855S | Mask Inspection & Repair System |
| 392 | JEOL | JEM-2010F | TEM |
| 393 | JEOL | JSM-6400F | FE SEM |
| 394 | Jordan Valley Semiconductors LTD | JVX 7200 | X-ray Fluorescence Spectrometer |
| 395 | Jordan Valley Semiconductors LTD | JVX 6200 | X-ray Fluorescence Spectrometer |
| 396 | JULABO GmbH | PRESTO W85 | Chiller/Heat Exchanger |
| 397 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
| 398 | Keysight / Agilent / Hewlett-Packard (HP) | 41000 | Parametric Tester |
| 399 | Keysight / Agilent / Hewlett-Packard (HP) | 4284A | LCR & Resistance Meter |
| 400 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
| 401 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
| 402 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester |
| 403 | KLA-Tencor Corp / ICOS | ICOS T830 | Lead Inspection Equipment |
| 404 | KLA-Tencor Corp. | Puma 9120 | Darkfield Inspection |
| 405 | KLA-Tencor Corp. | eS20XP | E-beam Inspection |
| 406 | KLA-Tencor Corp. | ASET-F5x | Film Thickness Measurement System |
| 407 | KLA-Tencor Corp. | eS37 | E-beam Inspection |
| 408 | KLA-Tencor Corp. | AIT UV | Darkfield Inspection |
| 409 | KLA-Tencor Corp. | AIT UV | Darkfield Inspection |
| 410 | KLA-Tencor Corp. | WaferSight | Wafer Characterization |
| 411 | KLA-Tencor Corp. | eS805 | E-beam Inspection |
| 412 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) |
| 413 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) |
| 414 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) |
| 415 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) |
| 416 | KLA-Tencor Corp. | Ultrapointe 1000 | Optical Review System |
| 417 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
| 418 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
| 419 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
| 420 | KLA-Tencor Corp. | 2111 | Brightfield Inspection |
| 421 | KLA-Tencor Corp. | CRS-1200 | Optical Review System |
| 422 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 423 | KLA-Tencor Corp. | Archer 500 | Overlay Measurement System |
| 424 | KLA-Tencor Corp. | Archer 500 | Overlay Measurement System |
| 425 | KLA-Tencor Corp. | Archer 500 | Overlay Measurement System |
| 426 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 427 | KLA-Tencor Corp. | KLA-TENCOR DUAL OPEN HANDLER | Parts/Options |
| 428 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 429 | Kokusai | Quixace II Nitride | Vertical Furnace |
| 430 | Kokusai | Quixace II ALD Oxide | Vertical Furnace |
| 431 | Kokusai | Quixace II Anneal | Vertical Furnace |
| 432 | Kokusai | Quixace Nitride | Vertical Furnace |
| 433 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 434 | Kokusai | Quixace II Nitride | Vertical Furnace |
| 435 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 436 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 437 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 438 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 439 | Kokusai | Zestone-III: DD-1223V | Vertical Furnace |
| 440 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 441 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 442 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 443 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 444 | Kokusai | Zestone III Alloy | Vertical Furnace |
| 445 | Kokusai | Quixace II Nitride | Vertical Furnace |
| 446 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 447 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
| 448 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
| 449 | Kokusai | Quixace II ALD Nitride | Vertical Furnace |
| 450 | Kokusai | Quixace II CURE | Vertical Furnace |
| 451 | Kokusai | Quixace Nitride | Vertical Furnace |
| 452 | Kokusai | Quixace II Poly | Vertical Furnace |
| 453 | Kokusai | Quixace II Poly | Vertical Furnace |
| 454 | Kokusai | Quixace II Poly | Vertical Furnace |
| 455 | Kokusai | Quixace II Poly | Vertical Furnace |
| 456 | Kokusai | Quixace II Poly | Vertical Furnace |
| 457 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 458 | Kokusai | Quixace II CURE | Vertical Furnace |
| 459 | Kokusai | Quixace II Poly | Vertical Furnace |
| 460 | Kokusai | Quixace II Poly | Vertical Furnace |
| 461 | Kokusai | Quixace II Nitride | Vertical Furnace |
| 462 | Kokusai | Quixace II Nitride | Vertical Furnace |
| 463 | Kokusai | Quixace II Poly | Vertical Furnace |
| 464 | Kokusai | Quixace II Poly | Vertical Furnace |
| 465 | Kokusai | Quixace II Poly | Vertical Furnace |
| 466 | Kokusai | Quixace II Poly | Vertical Furnace |
| 467 | Kokusai | Quixace II Poly | Vertical Furnace |
| 468 | Kokusai | Quixace II Poly | Vertical Furnace |
| 469 | Kokusai | Quixace II Poly | Vertical Furnace |
| 470 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace |
| 471 | Kokusai | Quixace II Poly | Vertical Furnace |
| 472 | Kokusai | Zestone III Alloy | Vertical Furnace |
| 473 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 474 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 475 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 476 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 477 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
| 478 | Kokusai | Quixace II Poly | Vertical Furnace |
| 479 | Kokusai | Quixace Ultimate ALD SiO2 | Vertical Furnace |
| 480 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
| 481 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
| 482 | Kokusai | Quixace II Doped Poly | Vertical Furnace |
| 483 | Kokusai | Quixace II Nitride | Vertical Furnace |
| 484 | Kokusai | Quixace Nitride | Vertical Furnace |
| 485 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 486 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
| 487 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
| 488 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
| 489 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
| 490 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
| 491 | Kokusai Electric Co., Ltd. | Lambda | Stripper/Asher |
| 492 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 493 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 494 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 495 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 496 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 497 | LAM Research | 2300 Versys KIYO 45 | Polysilicon Etch |
| 498 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch |
| 499 | LAM Research | 2300 Exelan Flex 45 | Dielectric Etch |
| 500 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 501 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 502 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch |
| 503 | LAM Research | 2300 Exelan Flex EX+ – Chamber Only | Dielectric Etch |
| 504 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch |
| 505 | LAM Research | 2300e4 Exelan Flex DX | Dielectric Etch |
| 506 | LAM Research | 2300 Exelan | Dielectric Etch |
| 507 | LAM Research | 2300 Exelan Flex 45 | Dielectric Etch |
| 508 | Lam Research | EOS | Single Wafer Processing |
| 509 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
| 510 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch |
| 511 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch |
| 512 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch |
| 513 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch |
| 514 | LAM Research | 2300e5 Exelan Flex EX | Dielectric Etch |
| 515 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
| 516 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma |
| 517 | LAM Research | 2300e5 KIYO EX | Polysilicon Etch |
| 518 | LAM Research | 2300e5 KIYO EX | Polysilicon Etch |
| 519 | LAM Research | 2300e6 KIYO EX | Polysilicon Etch |
| 520 | LAM Research | 2300 KIYO FXE | Polysilicon Etch |
| 521 | LAM Research | 2300 KIYO FX | Polysilicon Etch |
| 522 | LAM Research | 2300 KIYO FXE | Polysilicon Etch |
| 523 | Lam Research | EOS – Parts | Single Wafer Processing |
| 524 | LAM Research | Alliance (A6) Exelan HP – Spare Parts | Dielectric Etch |
| 525 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 526 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 527 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 528 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 529 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 530 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 531 | LAM Research | 2300 Exelan Flex 45 | Parts/Chamber Modules |
| 532 | LAM Research | 2300 Exelan Flex 45 | Parts/Chamber Modules |
| 533 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch |
| 534 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch |
| 535 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch |
| 536 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 537 | LAM Research | 2300 Versys Metal | Metal Etch |
| 538 | LAM Research | 2300 Versys Metal | Metal Etch |
| 539 | LAM Research | 2300 Versys Metal | Metal Etch |
| 540 | LAM Research | 2300 Versys Metal | Metal Etch |
| 541 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 542 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 543 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 544 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 545 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 546 | LAM Research | 2300 Versys KIYO 45 | Polysilicon Etch |
| 547 | Lam Research | EOS | Single Wafer Processing |
| 548 | Lam Research | EOS | Single Wafer Processing |
| 549 | LAM Research | 2300 KIYO | Multi-Process Etch |
| 550 | LAM Research | 2300 KIYO | Multi-Process Etch |
| 551 | LAM Research | 2300 KIYO EX | Polysilicon Etch |
| 552 | Leica Inc. | INS10 | Microscope |
| 553 | Mattson Technology, Inc. | Helios | Standalone RTP Equipment |
| 554 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
| 555 | Mattson Technology, Inc. | Aspen III ICP | Stripper/Asher |
| 556 | Mattson Technology, Inc. | Aspen III ICP | Stripper/Asher |
| 557 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
| 558 | Mattson Technology, Inc. | Aspen III ICPHT | Stripper/Asher |
| 559 | Micromanipulator | P300J | Engineering Wafer Prober |
| 560 | MicroTure Machine Tool Corp. | 4 Sigma Wafer Polisher | Wafer Polisher |
| 561 | miscellaneous furniture | Office Tables and Chairs | Office |
| 562 | Mitsubishi | DWC-90 | Wire EDM (Electrical Discharge Machine) |
| 563 | MKS Instruments | AX8575-10 | Ozone Generator |
| 564 | MSI | N210-MD1G/D3 | Graphics Cards |
| 565 | MSI | GT 710-1GD3H LP | Graphics Cards |
| 566 | MTI Instruments, Inc. | PROFORMA 300 | Flatness Measurement |
| 567 | Muratec Murata Machinery, Ltd. | SRC330 | Wafer Stocker |
| 568 | Muratec Murata Machinery, Ltd. | SRC330 | Wafer Stocker |
| 569 | Nicolet | ECO 3000 | FT-IR |
| 570 | Nikon | OPTIPHOT 200C | Microscope |
| 571 | Nikon | OPTIPHOT 200C | Microscope |
| 572 | Nikon | ECLIPSE L300 | Microscope |
| 573 | Nikon | ECLIPSE L300 | Microscope |
| 574 | Nikon | ECLIPSE L300 | Microscope |
| 575 | Nikon | ECLIPSE L300 | Microscope |
| 576 | Nikon | ECLIPSE L300 | Microscope |
| 577 | Nikon | MICROSCOPE | Microscope |
| 578 | Nikon | UM-2 | Microscope |
| 579 | Nikon | OPTISTATION V | Optical Review System |
| 580 | Nikon | OPTISTATION V | Optical Review System |
| 581 | Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter |
| 582 | Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter |
| 583 | Nissin Electric Co., Ltd. | EXCEED 3000AH | Mid Current Implanter |
| 584 | Nisso engineering co. ltd / NISON | 1800S-55C | Batch Wafer Processing |
| 585 | Nordson Asymtek | S2-930 | Adhesive Dispenser |
| 586 | Nordson Asymtek | S2-930 | Adhesive Dispenser |
| 587 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
| 588 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
| 589 | Nova Measuring Instruments, Inc. | NovaScan 3090 Next SA | Critical Dimension (CD) Measurement (non SEM) |
| 590 | Nova Measuring Instruments, Inc. (Brook) | V2600 | Integrated CMP Endpoint / Film Measurement |
| 591 | Novellus Systems Inc. | VECTOR Express – AHM | PECVD (Chemical Vapor Deposition) |
| 592 | Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) |
| 593 | Novellus Systems Inc. | VECTOR Express – PECVD TEOS | PECVD (Chemical Vapor Deposition) |
| 594 | Novellus Systems Inc. | Concept Three Speed MAX | HDP CVD (Chemical Vapor Deposition) |
| 595 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 596 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 597 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 598 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 599 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 600 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 601 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 602 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) |
| 603 | Novellus Systems Inc. | SABRE | ECD (Electro Chemical Deposition) |
| 604 | Novellus Systems Inc. | VECTOR Express – PECVD TEOS | PECVD (Chemical Vapor Deposition) |
| 605 | Novellus Systems Inc. | Concept Three Speed | HDP CVD (Chemical Vapor Deposition) |
| 606 | Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) |
| 607 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 608 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) |
| 609 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 610 | Novellus Systems Inc. | Concept Three Speed MAX | HDP CVD (Chemical Vapor Deposition) |
| 611 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 612 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 613 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 614 | Novellus Systems Inc. | Concept Three Speed MAX | HDP CVD (Chemical Vapor Deposition) |
| 615 | Novellus Systems Inc. | VECTOR Extreme | PECVD (Chemical Vapor Deposition) |
| 616 | Novellus Systems Inc. | VECTOR Extreme | PECVD (Chemical Vapor Deposition) |
| 617 | Oxford Instruments | X-Strata980 | X-ray Fluorescence Spectrometer |
| 618 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 619 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 620 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 621 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 622 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 623 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 624 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 625 | P.S.K. Tech Inc. | FUTAS | Stripper/Asher |
| 626 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 627 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 628 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 629 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 630 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 631 | PCI Ozone and Controls Systems Inc. | G-7 | Ozone Generator |
| 632 | Pfeiffer Vacuum GmbH | Various | Dry Pump |
| 633 | Philips / Technos | TREX 632 | X-ray Fluorescence Spectrometer |
| 634 | Plasma-Therm I.P. Inc. | BatchTop VII PECVD | PECVD (Chemical Vapor Deposition) |
| 635 | Poly-Flow Engineering | S-422 | Quartz Tube Cleaner |
| 636 | PS System | FPS 6000 | Trim From Combo |
| 637 | PVA TePla America, Inc. | M4L | Plasma Cleaner |
| 638 | R. Howard Strasbaugh | Fine Polisher | Wafer Polisher |
| 639 | Raytex Corporation | RXW-1227 EdgeScan | Edge Defect |
| 640 | ReVera | RVX1000 | Film Thickness Measurement System |
| 641 | ReVera | RVX1000 | Film Thickness Measurement System |
| 642 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger |
| 643 | Rogers Machinery | DUAL COMPRESSOR | Air Compressors |
| 644 | Rudolph Technologies, Inc. | Axi 935 | Macro-Defect |
| 645 | Rudolph Technologies, Inc. | ultra-II | Ellipsometer |
| 646 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 647 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 648 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 649 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 650 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 651 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 652 | Rudolph Technologies, Inc. | Matrix S-300 | Ellipsometer |
| 653 | Rudolph Technologies, Inc. | NSX 105 – Spare Parts | Macro-Defect |
| 654 | S.E.S. CO., LTD. | BW3000X | Batch Wafer Processing |
| 655 | S.E.S. CO., LTD. | BW3000X | Batch Wafer Processing |
| 656 | SCREEN PRINTING ENTERPRISES, INC. | LPEH1-30/10 | Bake Oven |
| 657 | Semiconductor Equipment Corp.(SEC) | Model 860 Eagle | Flip Chip Bonder |
| 658 | Semitool Inc. | Raider ECD310 | ECD (Electro Chemical Deposition) |
| 659 | Semitool Inc. | 270-ST | Spin Rinse / Dryer (SRD) |
| 660 | SEZ Group | SP304 | Single Wafer Processing |
| 661 | SEZ Group | SP4300 | Single Wafer Processing |
| 662 | SEZ Group | SP203 | Single Wafer Processing |
| 663 | SEZ Group | SP203 | Single Wafer Processing |
| 664 | SEZ Group | DV-34 | Single Wafer Processing |
| 665 | SEZ Group | DV-34 | Single Wafer Processing |
| 666 | Shibaura Engineering Works Ltd. | CDE-300 | Metal Etch |
| 667 | SilverStone Technology Co | SST-ST45SF | PC Power Supplies |
| 668 | Sokudo Co., Ltd. | RF-300A | Multi Block (Resist Coater/Developer) |
| 669 | Standard Research Systems | SR560 — Low-noise voltage preamplifier | Parts/Peripherals |
| 670 | Steag Industrie AG | Marangoni IPA Dryer | Batch Wafer Processing |
| 671 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 672 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 673 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 674 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 675 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 676 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 677 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 678 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 679 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 680 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 681 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 682 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 683 | Strasbaugh | 6DS-SP | Multi-Process CMP |
| 684 | Struers | Hexamatic | Semi-Automatic Specimen Polisher |
| 685 | Sumitomo Precision Products Co., Ltd. | SGRC Series | Ozone Generator |
| 686 | Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter |
| 687 | Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter |
| 688 | Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter |
| 689 | TDK | AFM-1501 | Flip Chip Bonder |
| 690 | TDK | AFM-1501 | Flip Chip Bonder |
| 691 | TDK | AFM-1501 | Flip Chip Bonder |
| 692 | TDK | AFM-1501 | Flip Chip Bonder |
| 693 | TDK | AFM-1503 | Flip Chip Bonder |
| 694 | TDK | AFM-1503 | Flip Chip Bonder |
| 695 | TDK | AFM-1503 | Flip Chip Bonder |
| 696 | TDK | AFM-1503 | Flip Chip Bonder |
| 697 | Technos | TVD-900 ICP-MS | Spectrometry |
| 698 | Tektronix | 177 | Curve Tracer |
| 699 | Teradyne, Inc. | J993 | Memory Tester |
| 700 | Texas INstruments | LIS 4000ER | Lead Inspection Equipment |
| 701 | Thermaltake Technology | Toughpower 750W Gold | PC Power Supplies |
| 702 | Therma-Wave Inc. | Therma-Probe 300 | Implant Dosing Measurement |
| 703 | Thermo (Fisher) Scientific | MK.4TE | ESD Simulator / Gun |
| 704 | Thermo (Fisher) Scientific | Orion2 | ESD Simulator / Gun |
| 705 | Thermo Electron Corporation | Napco 8100-TD | Test Chamber |
| 706 | Thermo Fisher Scientific (Electron) | Theta 300 MKII | Wafer Characterization |
| 707 | Thermo Scientific | UFP5030A | Freezers |
| 708 | Thermo Scientific | PlasmaQuad XS | Spectrometry |
| 709 | Tokyo Electron Limited. | Fargo CP | Chiller for Cold Temp Prober |
| 710 | Tokyo Electron Limited. | Fargo CP | Chiller for Cold Temp Prober |
| 711 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
| 712 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch |
| 713 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 714 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 715 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 716 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 717 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 718 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch |
| 719 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch |
| 720 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 721 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 722 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 723 | Tokyo Electron Ltd. (TEL) | Tactras Vigus | Dielectric Etch |
| 724 | Tokyo Electron Ltd. (TEL) | Tactras Vigus | Dielectric Etch |
| 725 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 726 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch |
| 727 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 728 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 729 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 730 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 731 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 732 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 733 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 734 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 735 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 736 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 737 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 738 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 739 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
| 740 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
| 741 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 742 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 743 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 744 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 745 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 746 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace |
| 747 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 748 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 749 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 750 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 751 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 752 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 753 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 754 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 755 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 756 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 757 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 758 | Tokyo Electron Ltd. (TEL) | TELINDY Nitride | Vertical Furnace |
| 759 | Tokyo Electron Ltd. (TEL) | TELINDY Nitride | Vertical Furnace |
| 760 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 761 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace |
| 762 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 763 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 764 | Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch |
| 765 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 766 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 767 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 768 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 769 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 770 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 771 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 772 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 773 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 774 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 775 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 776 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 777 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
| 778 | Tokyo Electron Ltd. (TEL) | TELINDY Plus IRAD Oxide | Vertical Furnace |
| 779 | Tokyo Electron Ltd. (TEL) | UW300Z | Batch Wafer Processing |
| 780 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 781 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 782 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
| 783 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 784 | Tokyo Electron Ltd. (TEL) | Tactras Vigus RK3 – Chamber Only | Dielectric Etch |
| 785 | Tokyo Electron Ltd. (TEL) | Trias W – Chamber Only | Metal CVD (Chemical Vapor Deposition) |
| 786 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 787 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
| 788 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 789 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 790 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 791 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
| 792 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 793 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Multi Block (Resist Coater/Developer) |
| 794 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Multi Block (Resist Coater/Developer) |
| 795 | Tokyo Electron Ltd. (TEL) | TELINDY Nitride | Vertical Furnace |
| 796 | Tokyo Electron Ltd. (TEL) | Tactras Vesta NV3 | Polysilicon Etch |
| 797 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 798 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
| 799 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
| 800 | Tokyo Electron Ltd. (TEL) | TELINDY ALD High-K | Vertical Furnace |
| 801 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 802 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 803 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 804 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 805 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch |
| 806 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 807 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 808 | Tokyo Electron Ltd. (TEL) | ALPHA-303i process TBD | Vertical Furnace |
| 809 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 810 | Tokyo Electron Ltd. (TEL) | ALPHA-303i process TBD | Vertical Furnace |
| 811 | Tokyo Electron Ltd. (TEL) | Tactras Vigus – Chamber Only | Dielectric Etch |
| 812 | Tokyo Electron Ltd. (TEL) | Unity Me 85 SCCM | Dielectric Etch |
| 813 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Multi Block (Resist Coater/Developer) |
| 814 | Tokyo Electron Ltd. (TEL) | Telius SP 305 DRM | Dielectric Etch |
| 815 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 816 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 817 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch |
| 818 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 819 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 820 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 821 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 822 | Tokyo Electron Ltd. (TEL) | TELINDY-B | Vertical Furnace |
| 823 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 824 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 825 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 826 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Single Block (Coat/Develop) |
| 827 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Single Block (Coat/Develop) |
| 828 | Tokyo Electron Ltd. (TEL) | TELFORMULA Anneal | Vertical Furnace |
| 829 | Tokyo Electron Ltd. (TEL) | TELFORMULA Anneal | Vertical Furnace |
| 830 | Tokyo Electron Ltd. (TEL) | TELFORMULA LPRO | Vertical Furnace |
| 831 | Tokyo Electron Ltd. (TEL) | TELFORMULA LPRO | Vertical Furnace |
| 832 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Single Block (Coat/Develop) |
| 833 | Tokyo Electron Ltd. (TEL) | P-12XLn+ | Production Wafer Prober |
| 834 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 835 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 836 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 837 | Tokyo Electron Ltd. (TEL) | P-12XLn+ | Production Wafer Prober |
| 838 | Tokyo Electron Ltd. (TEL) | P-12XLn+ | Production Wafer Prober |
| 839 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 840 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch |
| 841 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 842 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 843 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 844 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 845 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 846 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch |
| 847 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 848 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 849 | Tokyo Electron Ltd. (TEL) | Triase+ SFD-W | MOCVD |
| 850 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 851 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 852 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 853 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 854 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 855 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 856 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 857 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 858 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 859 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 860 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 861 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Oxide | Vertical Furnace |
| 862 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 863 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 864 | Tokyo Electron Ltd. (TEL) | TELINDY Plus process TBD | Vertical Furnace |
| 865 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 866 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 867 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 868 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 869 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 870 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 871 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 872 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
| 873 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
| 874 | Tokyo Electron Ltd. (TEL) | Certas WING | Single Wafer Processing |
| 875 | Tokyo Electron Ltd. (TEL) | Certas WING | Single Wafer Processing |
| 876 | Tokyo Electron Ltd. (TEL) | Certas WING | Single Wafer Processing |
| 877 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 878 | Tokyo Electron Ltd. (TEL) | TELINDY OXIDE | Vertical Furnace |
| 879 | Tokyo Electron Ltd. (TEL) | TELINDY OXIDE | Vertical Furnace |
| 880 | Tokyo Electron Ltd. (TEL) | TELINDY Nitride | Vertical Furnace |
| 881 | Tokyo Electron Ltd. (TEL) | TELINDY OXIDE | Vertical Furnace |
| 882 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 883 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 884 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 885 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 886 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 887 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 888 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Oxide | Vertical Furnace |
| 889 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 890 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Oxide | Vertical Furnace |
| 891 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Oxide | Vertical Furnace |
| 892 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 893 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 894 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 895 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 896 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 897 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 898 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) |
| 899 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 900 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 901 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch |
| 902 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
| 903 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
| 904 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 905 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 906 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 907 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 908 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 909 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 910 | Tokyo Electron Ltd. (TEL) | Tactras Vigus | Dielectric Etch |
| 911 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 912 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 913 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 914 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 915 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 916 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 917 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 918 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace |
| 919 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing |
| 920 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 921 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 922 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 923 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 924 | Tokyo Electron Ltd. (TEL) | TELFORMULA Anneal | Vertical Furnace |
| 925 | Tokyo Electron Ltd. (TEL) | TELFORMULA Anneal | Vertical Furnace |
| 926 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 927 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber |
| 928 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 929 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 930 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 931 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 932 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 933 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Anneal | Vertical Furnace |
| 934 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Anneal | Vertical Furnace |
| 935 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 936 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 937 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace |
| 938 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Anneal | Vertical Furnace |
| 939 | TOWA (OMRON) Laser Front Inc. | SL473G | Laser Scribe |
| 940 | TOWA (OMRON) Laser Front Inc. | SL473G | Laser Scribe |
| 941 | Toyota Industries Corporation | T100L | Dry Pump |
| 942 | Ultratech | CGS-300 | Stress Measurement |
| 943 | Ulvac Corporation | Entron-EX W300 | PVD (Physical Vapor Deposition) |
| 944 | Ulvac Corporation | Entron-EX: Front-End Metallization | PVD (Physical Vapor Deposition) |
| 945 | Unisem | UN-2002A-PG | Abatement – Scrubber |
| 946 | Ushio | UMA-2003 | UV Cure System |
| 947 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 948 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 949 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 950 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 951 | Varian Semiconductor Equipment Associates (VSEA) | VIISta 810 | Mid Current Implanter |
| 952 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 953 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 954 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 955 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 956 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 957 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 958 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 959 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 960 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 961 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter |
| 962 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HCS | High Current Implanter |
| 963 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HCS | High Current Implanter |
| 964 | Varian Semiconductor Equipment Associates (VSEA) | VIISta P2LAD | Low/Ultra Low Energy Implanter |
| 965 | Varian Semiconductor Equipment Associates (VSEA) | VIISta 810XP | Mid Current Implanter |
| 966 | Various | Various | Dry Pump |
| 967 | VARIOUS | 1.25″ SILICON WAFER | Wafers |
| 968 | VARIOUS | 1.5″ SILICON WAFER | Wafers |
| 969 | VARIOUS | 1.875″ SILICON WAFER | Wafers |
| 970 | VARIOUS | 2″ SILICON WAFER | Wafers |
| 971 | VARIOUS | 2.25″ SILICON WAFER | Wafers |
| 972 | VARIOUS | 2.5″ SILICON WAFER | Wafers |
| 973 | VARIOUS | 2.875″ SILICON WAFER | Wafers |
| 974 | VARIOUS | 3″ SILICON WAFER | Wafers |
| 975 | VARIOUS | 3.25″ SILICON WAFER | Wafers |
| 976 | VARIOUS | 200MM SILICON WAFER | Wafers |
| 977 | VARIOUS | SILICON INGOT | SILICON INGOT |
| 978 | VARIOUS | 100MM SILICON WAFER | Wafers |
| 979 | VARIOUS | 125MM SILICON WAFER | Wafers |
| 980 | VARIOUS | 150MM SILICON WAFER | Wafers |
| 981 | Various | Various | Computer Components |
| 982 | Various | Various | Parts/Peripherals |
| 983 | Veeco Instruments Inc. | Dimension 7000 | Atomic Force Microscope (AFM) |
| 984 | Veeco Instruments Inc. | Dimension X3D | Atomic Force Microscope (AFM) |
| 985 | VERSA CONN CORP. | WB-302 Triple+ | Semi Automated High Force Wafer Bonder |
| 986 | Versum Materials / Merck | Variuos | Chemical Mix & Distribution |
| 987 | X-Tek | Orbita 160Xi | X-Ray Inspection System |
| 988 | Zeiss | UMSP 80 | Spectrophotometer |
| 989 | Zen Voce Corporation | BM388 | Solder Ball Mount |
| 990 | Zygo Corp. | NewView 7300 | Profilometer |
SS5319-0-14-1-1
