Description
Used Semiconductor Equipment Parts
These are subject to prior sale. These are only for end user. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
Manufacturer | Model | Asset Type | Asset Location Country | Wafer Size |
A-B Lasers Inc. (Rofin) | Waferlase Compact | Laser Scribe | United States | 200mm |
A-B Lasers Inc. (Rofin) | Waferlase | Laser Scribe | United States | 200mm |
ADE Corporation | Microsense 6033 | Wafer Characterization | United States | |
Advanced Energy | ICP 20P | Power Supply | United States | N/A |
Advanced Technology Inc. | Cypress GEN2 | Lead Inspection Equipment | Taiwan | N/A |
Advanced Technology Inc. | Cypress | Lead Inspection Equipment | Taiwan | N/A |
Advanced Thermal Sciences (ATS) | DEX-20A | Chiller/Heat Exchanger | Taiwan | N/A |
Advantest | R3768 | Network Analyzer | Costa Rica | N/A |
Air Control, Inc. | Microvoid FH-45D-S | Fume Hood Workstation | United States | N/A |
Alcatel | ADP 81 | Dry Pump | United States | N/A |
Alcatel | ADS 1802H | Dry Pump | Taiwan | N/A |
Alcatel | ADS1802P | Dry Pump | Taiwan | N/A |
Alcatel | A1803H | Dry Pump | United States | N/A |
Alum-a-Lift | A200-60 | General Purpose Lift | United States | N/A |
Amray, Inc. | 2030 | SEM – Defect Review (DR) | United States | N/A |
Amray, Inc. | 2030 | SEM – Defect Review (DR) | United States | 200mm |
Amray, Inc. | 2030 | SEM – Defect Review (DR) | United States | N/A |
Amray, Inc. | 3800c | SEM – Defect Review (DR) | United States | 200mm |
Anelva Corp. | Cosmos I-1201 PVD – Tungsten PVD Chamber Only | PVD (Physical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch | Japan | |
Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | Japan | |
Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | Japan | |
Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) | Japan | |
Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | Japan | |
Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) | Japan | |
ASM International | Eagle XP4 | ALD (Atomic Layer Deposition) | Japan | |
ASM International | A600 LPCVD-OXIDE | Vertical Furnace | United States | 200mm |
BESI | Datacon 8800 Chameo | Flip Chip Bonder | Taiwan | N/A |
BOC Edwards | Spectra-N | Nitrogen Generator | United States | N/A |
Bold Technologies, Inc. | Bold Wet Bench | Batch Wafer Processing | United States | 200mm |
Boschman | BXXP\21 | Molding Equipment | United States | 200mm |
Chemwest | K232 | Quartz Tube Cleaner | United States | |
Chemwest | K232 | Quartz Tube Cleaner | United States | N/A |
Chroma ATE Inc. | 3380P | VLSI Tester | Taiwan | 200mm |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NY20 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NX16 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NX16 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NX16 | Test Handler | Costa Rica | N/A |
Cohu, Inc. | Ismeca NX16 | Test Handler | Costa Rica | N/A |
Control Laser Corporation. | FALIT | Package Auto Decap System | United States | |
Cooljag Thermal Solutions | SP3-D/SQ | CPU Cooling Fan | Taiwan | N/A |
Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | Japan | |
Dainippon Screen Mfg. Co. (DNS) | VM-3110 | Film Thickness Measurement System | Japan | |
Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | Japan | |
Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) | Taiwan | 200mm |
Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) | Taiwan | 200mm |
Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | United States | 200mm |
Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing | United States | 200mm |
Dainippon Screen Mfg. Co. (DNS) | EEW-622-B | Edge Exposure Tool | United States | 200mm |
Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | United States | 200mm |
Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | United States | 200mm |
Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing | United States | 200mm |
Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | United States | 200mm |
DAS | ESCAPE DUO | Chemical/Gas Treatment System | Taiwan | N/A |
DAS | ESCAPE DUO | Chemical/Gas Treatment System | Taiwan | N/A |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | N/A |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | N/A |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | N/A |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | N/A |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | |
Daymarc Corporation | 3287 | Gravity Feed SOC Handler | United States | |
Delatech Inc. | 858 – V2 | Abatement – CDO Scrubber | United States | N/A |
Despatch Industries | LND 2-11 | Cure Oven | Taiwan | N/A |
E.A. Fischione | 1010 | Plasma Cleaner | Taiwan | |
Ebara | FREX300S Tungsten | Tungsten CMP | Japan | |
Ebara | FREX300S Tungsten | Tungsten CMP | Japan | |
Edwards | Atlas Etch | Abatement – Scrubber | Taiwan | N/A |
Edwards | iL70 | Dry Pump | United States | N/A |
Edwards | iH80 | Dry Pump | United States | N/A |
Edwards | iH1800SC | Dry Pump | United States | N/A |
Edwards | iH1000 | Dry Pump | United States | N/A |
Edwards | iH600 | Dry Pump | United States | N/A |
Electro Scientific Industries | 9850TPIR+ | Laser Repair System | Japan | |
Electro Scientific Industries | 9850TPIR+ | Laser Repair System | Japan | |
Electro Scientific Industries | 9850TPIR+ | Laser Repair System | Japan | |
Electro Scientific Industries | 9850TPIR+ | Laser Repair System | Japan | |
Electron Vision Corporation | ElectronCure 30X | UV Cure System | United States | 200mm |
Entegris | NU-J6101 | Batch Parts Clean (ultrasonic) | Taiwan | |
Entegris | KA198-80M | Wafer Cassette | United States | 200mm |
ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer | Taiwan | 200mm |
Espec | EGNU28-12CWL | Environmental Chamber | United States | N/A |
Espec | ESX-3CW | Environmental Chamber | United States | N/A |
Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-850 | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection | United States | 200mm |
Estek Automation SDN BHD | WIS-150 | Broadband Patterned Wafer Defect Inspection | United States | 150mm |
EVGA Corporation | Supernova 1300 G2 | PC Power Supplies | Taiwan | N/A |
EVGA Corporation | 850 GQ | PC Power Supplies | Taiwan | N/A |
FEI Company | Tecnai G2 F30 | TEM | Japan | N/A |
FSI International | Excalibur | Batch Wafer Processing | United States | 200mm |
FSI International | Excalibur | Batch Wafer Processing | United States | 200mm |
FTS Systems (SP Scientific) | RC311GLAM | Chiller/Heat Exchanger | United States | N/A |
Gatan | Model 691 PIPS | Specimen Preparation | Taiwan | N/A |
GCA Tropel | Autosort Mark II 150 | Flatness Measurement | United States | 150mm |
General Electric (GE) | Phoenix aminer | X-ray Inspection | United States | |
Genesis | 2020B | Vapor Prime Oven | United States | N/A |
GSI Lumonics | WaferMark 200HS | Laser Scribe | United States | 200mm |
Hitachi | RCF3550AZP1 | Chiller/Heat Exchanger | Japan | N/A |
Hitachi (Semiconductor) | HL-800D | E-beam Lithography System | United States | |
IPEC | AvantGaard 676 | Multi-Process CMP | United States | 200mm |
Ismeca | TMBZ SP | Taping | United States | |
Ismeca | TMBZ SP | Taping | United States | |
Jabil Chad Automation | WaferMate200 | Wafer and Substrate Handling | Costa Rica | 200mm |
Jabil Chad Automation | WaferMate200 | Wafer and Substrate Handling | Costa Rica | |
JEOL | JWS-7555 | SEM – Defect Review (DR) | Taiwan | 200mm |
JEOL | JFS-9855S | Focused Ion Beam System | Taiwan | 200mm |
JEOL | JWS-7855S | Mask Inspection & Repair System | United States | N/A |
JEOL | JEM-2010F | TEM | United States | |
JEOL | JSM-6400F | FE SEM | United States | |
JULABO GmbH | PRESTO W85 | Chiller/Heat Exchanger | United States | N/A |
Kaijo Corporation | SFT-300 | Batch Wafer Processing | Japan | |
Kaijo Corporation | SFT-300 | Batch Wafer Processing | Japan | |
Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester | Taiwan | N/A |
Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester | Taiwan | N/A |
Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester | Taiwan | N/A |
KLA-Tencor Corp / ICOS | ICOS T830 | Lead Inspection Equipment | Taiwan | N/A |
KLA-Tencor Corp. | eS20XP | E-beam Inspection | Taiwan | 200mm |
KLA-Tencor Corp. | AIT I | Darkfield Inspection | Taiwan | 200mm |
KLA-Tencor Corp. | AIT I | Darkfield Inspection | Taiwan | 200mm |
KLA-Tencor Corp. | Ultrapointe 1000 | Optical Review System | United States | 200mm |
KLA-Tencor Corp. | 2111 | Brightfield Inspection | United States | 200mm |
KLA-Tencor Corp. | 2111 | Brightfield Inspection | United States | 200mm |
KLA-Tencor Corp. | 2111 | Brightfield Inspection | United States | 200mm |
KLA-Tencor Corp. | 2111 | Brightfield Inspection | United States | 200mm |
KLA-Tencor Corp. | CRS-1200 | Optical Review System | United States | 200mm |
KLA-Tencor Corp. | KLA-TENCOR DUAL OPEN HANDLER | Parts/Options | United States | 200mm |
LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma | Japan | |
LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch | Japan | |
LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch | Japan | |
LAM Research | 2300e5 Exelan Flex EX | Dielectric Etch | Japan | |
LAM Research | Alliance (A6) Exelan HP – Spare Parts | Dielectric Etch | United States | 200mm |
Leica Inc. | INS10 | Microscope | Taiwan | 200mm |
Micromanipulator | P300J | Engineering Wafer Prober | Taiwan | 200mm |
MicroTure Machine Tool Corp. | 4 Sigma Wafer Polisher | Wafer Polisher | United States | 200mm |
miscellaneous furniture | Office Tables and Chairs | Office | United States | N/A |
Mitsubishi | DWC-90 | Wire EDM (Electrical Discharge Machine) | United States | N/A |
MSI | N210-MD1G/D3 | Graphics Cards | Taiwan | N/A |
MSI | GT 710-1GD3H LP | Graphics Cards | Taiwan | N/A |
MTI Instruments, Inc. | PROFORMA 300 | Flatness Measurement | United States | 200mm |
Nikon | OPTIPHOT 200C | Microscope | Taiwan | 200mm |
Nikon | OPTIPHOT 200C | Microscope | Taiwan | 200mm |
Nikon | OPTISTATION 3A | Optical Review System | Taiwan | 200mm |
Nikon | ECLIPSE L300 | Microscope | Japan | |
Nikon | ECLIPSE L300 | Microscope | Japan | |
Nikon | ECLIPSE L300 | Microscope | Japan | |
Nikon | ECLIPSE L300 | Microscope | Japan | |
Nikon | ECLIPSE L300 | Microscope | Japan | |
Nikon | MICROSCOPE | Microscope | United States | |
Nikon | UM-2 | Microscope | United States | |
Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
Nikon | OPTISTATION V | Optical Review System | Taiwan | 200mm |
Nisso engineering co. ltd / NISON | 1800S-55C | Batch Wafer Processing | United States | N/A |
Nordson Asymtek | S2-930 | Adhesive Dispenser | Taiwan | N/A |
Nordson Asymtek | S2-930 | Adhesive Dispenser | Taiwan | N/A |
Oxford Instruments | X-Strata980 | X-ray Fluorescence Spectrometer | Taiwan | N/A |
PCI Ozone and Controls Systems Inc. | G-7 | Ozone Generator | United States | N/A |
Pfeiffer Vacuum GmbH | Various | Dry Pump | United States | N/A |
Plasma-Therm I.P. Inc. | BatchTop VII PECVD | PECVD (Chemical Vapor Deposition) | United States | 150mm |
Poly-Flow Engineering | S-422 | Quartz Tube Cleaner | United States | 200mm |
PS System | FPS 6000 | Trim From Combo | United States | |
PVA TePla America, Inc. | M4L | Plasma Cleaner | United States | N/A |
R. Howard Strasbaugh | Fine Polisher | Wafer Polisher | United States | 200mm |
Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger | Taiwan | N/A |
Rogers Machinery | DUAL COMPRESSOR | Air Compressors | United States | N/A |
Rudolph Technologies, Inc. | NSX 105 – Spare Parts | Macro-Defect | United States | 200mm |
SCREEN PRINTING ENTERPRISES, INC. | LPEH1-30/10 | Bake Oven | United States | |
Semiconductor Equipment Corp.(SEC) | Model 860 Eagle | Flip Chip Bonder | United States | |
Semitool Inc. | 270-ST | Spin Rinse / Dryer (SRD) | United States | 150mm |
Semitool Inc. | Storm II | Carrier Cleaner | Taiwan | 200mm |
SEZ Group | SP203 | Single Wafer Processing | Taiwan | 200mm |
SEZ Group | SP203 | Single Wafer Processing | Taiwan | 200mm |
SilverStone Technology Co | SST-ST45SF | PC Power Supplies | Taiwan | N/A |
Standard Research Systems | SR560 — Low-noise voltage preamplifier | Parts/Peripherals | Taiwan | N/A |
Steag Industrie AG | Marangoni IPA Dryer | Batch Wafer Processing | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Strasbaugh | 6DS-SP | Multi-Process CMP | United States | 200mm |
Struers | Hexamatic | Semi-Automatic Specimen Polisher | United States | |
Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter | Taiwan | N/A |
Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter | Taiwan | N/A |
Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter | Taiwan | N/A |
TDK | AFM-1501 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1501 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1501 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1501 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1503 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1503 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1503 | Flip Chip Bonder | Costa Rica | N/A |
TDK | AFM-1503 | Flip Chip Bonder | Costa Rica | N/A |
Technos | TVD-900 ICP-MS | Spectrometry | Japan | |
Tektronix | 177 | Curve Tracer | United States | N/A |
Teradyne, Inc. | J993 | Memory Tester | United States | N/A |
Texas INstruments | LIS 4000ER | Lead Inspection Equipment | United States | |
Thermaltake Technology | Toughpower 750W Gold | PC Power Supplies | Taiwan | N/A |
Therma-Wave Inc. | Therma-Probe 300 | Implant Dosing Measurement | United States | 200mm |
Thermo (Fisher) Scientific | MK.4TE | ESD Simulator / Gun | United States | N/A |
Thermo (Fisher) Scientific | Orion2 | ESD Simulator / Gun | United States | N/A |
Thermo Electron Corporation | Napco 8100-TD | Test Chamber | United States | N/A |
Thermo Scientific | UFP5030A | Freezers | United States | |
Thermo Scientific | PlasmaQuad XS | Spectrometry | United States | |
Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing | Taiwan | |
Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | Japan | |
Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing | Japan | |
Tokyo Electron Ltd. (TEL) | Unity Me 85 SCCM | Dielectric Etch | Taiwan | 200mm |
Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | Japan | |
Tokyo Electron Ltd. (TEL) | Triase+ SFD-W | MOCVD | Japan | |
Toyoko Kagaku | Toyoko Kagaku Fume Hood | Fume Hood Workstation | Japan | N/A |
Toyota Industries Corporation | T100L | Dry Pump | United States | N/A |
Unisem | UN-2002A-PG | Abatement – Scrubber | Taiwan | N/A |
Varian Semiconductor Equipment Associates (VSEA) | E220 | Mid Current Implanter | United States | 100mm |
Various | Various | Dry Pump | United States | N/A |
VARIOUS | 1.25″ SILICON WAFER | Wafers | United States | |
VARIOUS | 1.5″ SILICON WAFER | Wafers | United States | |
VARIOUS | 1.875″ SILICON WAFER | Wafers | United States | |
VARIOUS | 2″ SILICON WAFER | Wafers | United States | |
VARIOUS | 2.25″ SILICON WAFER | Wafers | United States | |
VARIOUS | 2.5″ SILICON WAFER | Wafers | United States | |
VARIOUS | 2.875″ SILICON WAFER | Wafers | United States | |
VARIOUS | 3″ SILICON WAFER | Wafers | United States | |
VARIOUS | 3.25″ SILICON WAFER | Wafers | United States | |
VARIOUS | 200MM SILICON WAFER | Wafers | United States | 200mm |
VARIOUS | SILICON INGOT | SILICON INGOT | United States | |
VARIOUS | 100MM SILICON WAFER | Wafers | United States | 100mm |
VARIOUS | 125MM SILICON WAFER | Wafers | United States | 125mm |
VARIOUS | 150MM SILICON WAFER | Wafers | United States | 150mm |
Various | Various | Computer Components | Taiwan | N/A |
Various | Various | Parts/Peripherals | Taiwan | N/A |
Veeco Instruments Inc. | Dimension 7000 | Atomic Force Microscope (AFM) | Taiwan | 200mm |
VERSA CONN CORP. | WB-302 Triple+ | Semi Automated High Force Wafer Bonder | Taiwan | 150mm |
Versum Materials / Merck | Variuos | Chemical Mix & Distribution | Taiwan | N/A |
Zeiss | UMSP 80 | Spectrophotometer | United States | |
Zen Voce Corporation | BM388 | Solder Ball Mount | Taiwan | N/A |
Zygo Corp. | NewView 7300 | Profilometer | United States | 150mm |
SS5319-13-1-1