The “Signatone 1160 Signatone Checkmate 330L 12 inch Probe Station Prober Cascade Microtech RF Probe ” is only for end user. Please contact us if you have any questions. Subject to prior sale without notice. Appreciate your time!
ID-SS380EB
S
Metrology | Tester | Wafer Carriers
Main Refurbished Equipment
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RTA-4000,ULVAC RTA-6000,ULVAC RTA-8000,ULVAC RTA-12000, EasyTube® 3000EXT, CVD Equipment Corporation, Dr. Eberl MBE-Komponenten GmbH, AO 600,Rapid Thermal Annealing System,MBE Components,MBE Systems,OCTOPLUS 300,OCTOPLUS 400,OCTOPLUS 500,OCTOPLUS 500 EBV,OCTOPLUS 600,OCTOPLUS 600 EBV,OCTOPLUS-O 400,Thin Film Systems,Organic Deposition System,Rapid Thermal Annealing,MBE Components,Thin Film / CIGS / CZTS / CdTe,ECM, Annealsys AS-Premium, Annealsys Zenith-100, Annealsys AS-One, Annealsys AS-Master, Jipelec JetStar, Annealsys AS-Micro, Jipelec JetLight, Jipelec JetFirst 100, Jipelec JetFirst 200, Jipelec JetFirst 300, CreaTec Fischer & Co. 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RTP,Producer Pyra Anneal,radical oxidation,millisecond annealing,model-based controller,Vantage Vulcan RTP,SEMATECH Methodologies , 0.25 m Technology Thermal Applications,firstnano,EasyTube 2000,EasyTube 3000,EasyTube 3000EXT,EasyTube 101,EasyTube 6000, EasyTube 6308, Applied Materials Vantage RadiancePlus, AMAT Vantage RadiancePlus,Vantage RadiancePlus, 0.25 pm TECHNOLOGY,Lamp-based,Laser-based,Heater-based,irradiate the surface of the material,Veeco,Mattson Technology,Screen Holdings,AnnealSys,Applied Materials,Kokusai Electric,JTEKT Thermo Systems,Tokyo Electron,Centrotherm,Hitachi Kokusai Electric,Modular Process Technology,Shankar Muthukrishnan,Beyond the 100nm node, single-wafer RTP,single-wafer rapid thermal Processing, sub-100nm device design node,ultra-shallow junction activation and anneal,USJ, silicide contact formation, thermal oxidation STI formation, spike anneal ,spike annealing, within-wafer uniformity, wafer-to-wafer process uniformity, nickel silicide formation,radical-based oxidation process,rapid thermal processing spike anneal,300mm RTP spike anneal process,ramp-up methodologies, rampdown methodologies,Rapid thermal annealing apparatus,RTA furnace,Dai-ichi Kiden,Dai-ichi Kiden RSA, Combustion furnace, High vacuum heating system, Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system,CreaTec Fischer,Growth Systems,Mini MBE System,LT-STM/AFM,Evaporators,Centrotherm,centrotherm c.HORICOO 300 ,horizontal batch-type system,centrotherm c.HORICOO 200 , field-proven , ultra-versatile tube furnace system ,centrotherm c.VERTICOO , batch-type wafer processing , semiconductor device fabrication, atmospheric processes, LPCVD processes,centrotherm c.ACTIVATOR, high-temperature annealing, high-volume SiC device manufacturing, electrical activation , post implantation annealing ,SiC MOSFET , diode manufacturing,Cost-efficient dopant activation,Annealing of AlN seed layers , Annealing of AlN epitaxial layers,centrotherm c.OXIDATOR , high-temperature oxidation furnace , Rapid Thermal Processing system for silicon and compound semiconductors,c.RAPID 200,fully automatic loading system,centrotherm PECVD,c.PLASMA, c.DIFF,centrotherm highly versatile diffusion,wide band gap,c.CRYSCOO HTA,AP Systems,AP Systems Korea,KORONA RTP-12MP, KORONA RTP-12LPO , KORONA RTP-12LR/LPRR,Seebeck Coefficient / Electric Resistance Measurement System ZEM-3 series，Mini Lamp Annealer MILA-5050， Atmospheric Thermoelectric Module Evaluation System F-PEM，
