SensArray KLA 1840A-12-5008A 12inch Process Probe Instrumented Wafer RTD TC 300mm

Description

SensArray KLA 1840A-12-5008A 12inch Process Probe Instrumented Wafer RTD TC 300mm

Condition:New never used. Sealed

Part Number: 1840A-12-5008A

Accessories with the Process Probe:

• Datasheet, Clean-room Copy (not sealed)
  
• Configuration Installation Disk, Floppy 3 1/4″, Part Number: 4805-5000
  
• Calibration Information from 6/18/03

Configuration:

• 300 mm
  
• 2: 62-pin D-type HDS connectors
  
• 29 pt RTD SensorsFeatures:
  SensArray’s 1800 series of RTD (Resistance Temperature Detector) Process Probe temperature instrumented wafers and glass substrates are used as a substitute for production wafers or masks in characterizing and capturing temperature data.

  Applications:
  The Process Probe 1840A RTD instrumented wafer is designed for highly accurate wafer temperature measurements in semiconductor photoresist track systems, wafer probers, and many other types of semiconductor fabrication equipment. The very high measurement accuracy and stability result from the careful design integration of the Process Probe 1840A. The RTD sensors, bonding and encapsulation materials and the four-wire resistance measurement method are the key integrated elements. The 1840A operating temperature range is 0-250°C.

  SensArray’s 1800 series of RTD Process Probe wafers and glass substrates can be used by a fab or equipment manufacturer to solve and prevent many thermally related problems, including:

• Measuring and recording wafer temperature at every moment of the process cycle: loading, heat-up, steady state, cool-down, and unloading.
  
• Improving wafer temperature control and uniformity, maintaining narrower process temperature windows, and improving CD (critical dimensions) control in DUV processes.
  
• Managing production processes that have tight thermal performance specifications or providing inputs to SPC systems.
  
• Optimizing wafer processes during hardware or process development.
  
• Testing and benchmarking wafer fab equipment during final qualification, fab start-up, and requalification of repaired or upgraded systems.
  
• Reducing the time needed to develop, characterize, test, match, and maintain process equipment.

Specifications:

Temperature Range: 0°C to 250°C
Sensors Available: 29
Resistor Element: Thin Film Platinum
Element Resistance: 1000 Ω nominal at 0°C
ΔResistance vs. Temp: 0.00375 Ω/Ω/°C
Max. Measurement Current: 200 µA
Accuracy with Calibration Correction: ±0.1°C absolute accuracy, ±0.03°C sensor to sensor accuracy
Type of Connection: Four-wire resistance measurement with common current source return
Lead Materials: Polyimide coated copper
Cable Construction: Polyimide film flat cable section transitioning to a silicon rubber round flex cable. The flat portion can be used as a feedthrough under chamber seals.
Connection: D-type, high density, sub-miniature with 64 pins. (2 connectors for 18-34 sensors per wafer.)
Wafer Size: 300 mm

Valid Time: Subject to prior sale without notice.

SS162651437846