Description
Refurbished SpeedFam IPEC Avanti 472 CMP Chemical Mechanical Polishing System – 150mm, 200mm
SemiStar Corp. offers the refurbished SpeedFam IPEC Avanti 472 Chemical Mechanical Planarization (CMP) System for semiconductor wafer polishing and planarization applications.
The IPEC Avanti 472 is a fully automatic, single-wafer chemical mechanical polishing system featuring automatic cassette-to-cassette wafer handling and two-step polishing capability.
This refurbished system is configured for 150mm (6-inch) or 200mm (8-inch) wafers with one polishing head and two polishing platens. The equipment will undergo comprehensive refurbishment, mechanical testing, and system verification before delivery.
Equipment Overview
- Manufacturer: SpeedFam / IPEC
- Model: Avanti 472
- Equipment Type: Chemical Mechanical Polishing / Planarization (CMP)
- Condition: Fully Refurbished
- Configured Wafer Size: 150mm (6-inch) or 200mm (8-inch)
- Wafer Handling: Fully Automatic, Cassette-to-Cassette
- Polishing Configuration: One Head, Two Platens
- Wafer Carrier: One Standard Wafer Carrier Head
- Pad Conditioner: APP-1000 on Primary Platen
- Slurry System: Four Slurry Pumps, Two Per Platen
- Slurry Inputs: Four Separate Slurry Inputs
- Platen Temperature Control: Integrated Platen Heat Exchangers
- Installation: Available
- Warranty: 6 Months Parts Warranty
- Estimated Lead Time: 8–10 Weeks, Subject to Confirmation
- Availability: Subject to Prior Sale
Refurbishment Scope
The refurbished IPEC 472 CMP system includes comprehensive mechanical refurbishment and replacement of major wear components.
- Complete equipment teardown and cleaning
- Polishing spindle refurbishment
- Platen bearing replacement
- Load and unload station rebuilding with new parts
- Slurry line replacement
- Slurry pump replacement
- Replacement of chemical lines
- Replacement of belts, hoses, O-rings, and seals
- Replacement of worn solenoids and valves as required
- Replacement of worn bearings as required
- Cleaning and sealing of polishing tubs
- Mechanical testing and system verification
The refurbishment program includes a 500-wafer marathon mechanical acceptance test before shipment and an additional test following installation, subject to the agreed acceptance procedure.
System Configuration
Wafer Handling and Polishing
- 150mm or 200mm wafer configuration
- Automatic cassette-to-cassette wafer handling
- Single wafer processing
- One polishing head
- Two polishing platens
- One standard wafer carrier head
- Primary and final polishing capability
- Wafer carrier vacuum handling
- Wafer and carrier cleaning stations
Slurry Delivery System
- Four slurry pumps
- Two slurry pumps per platen
- Four separate slurry inputs
- Slurry delivery rate: 0–1000 mL/min per pump
- Slurry flow control
- Slurry pH operating range: 3–11
Pad Conditioning
- APP-1000 pad conditioner on primary platen
- Adjustable conditioning down-force
- Adjustable pad conditioner rotation speed
- Programmable conditioning cycle
Platen Temperature Control
- Integrated platen heat exchangers
- Platen temperature control
- Platen temperature operating range: 65–150°F
Original IPEC 472 Technical Specifications
The following specifications are based on the original IPEC Avanti 472 equipment documentation. Actual operating performance depends on the installed configuration, process conditions, consumables, and final equipment qualification.
| Parameter | Original Equipment Specification |
|---|---|
| Platform Wafer Size Capability | 100mm, 125mm, 150mm, 200mm |
| Offered System Configuration | 150mm or 200mm |
| Wafer Processing | Automatic Single Wafer |
| Polishing Configuration | One Head, Two Platens |
| Polishing Pressure | 0–15 psi |
| Platen Rotation Speed | 10–175 RPM |
| Carrier Rotation Speed | 10–125 RPM |
| Platen Temperature | 65–150°F |
| Slurry Delivery Rate | 0–1000 mL/min |
| Carrier Oscillation Speed | 0–152 mm/sec |
| APP-1000 Rotation Speed | 5–80 RPM |
| APP-1000 Down-Force | 0.1–10 lb |
| Polishing Cycle Duration | 0–99 Minutes, 59 Seconds |
| Slurry pH Range | 3–11 |
| Standard Equipment Width | 66.62 inches (1692mm) |
| Standard Equipment Depth | 96.77 inches (2458mm) |
| Standard Equipment Height | 92 inches (2337mm) |
| Approximate Equipment Weight | 7,500 lb |
CMP Process Applications
The IPEC 472 CMP platform is designed for semiconductor wafer planarization and material removal applications.
The original equipment specifications include process information for:
- Thermal Oxide (TOX) CMP
- TEOS Oxide CMP
- BPSG CMP
- CVD Tungsten CMP
- PVD/CVD Titanium Nitride CMP
- PVD Titanium CMP
Process performance and removal rates depend on polishing pads, slurry chemistry, wafer characteristics, and operating conditions. Specific customer processes require qualification.
Original Equipment Process Performance Reference
The following values are reference specifications from the original IPEC 472 documentation and are not guaranteed acceptance specifications for the offered refurbished system.
| Material | Original Removal Rate Specification |
|---|---|
| Thermal Oxide (TOX) | ≥ 1700 Å/min |
| TEOS | ≥ 2000 Å/min |
| BPSG | ≥ 3000 Å/min |
| CVD Tungsten | ≥ 4000 Å/min |
| PVD/CVD TiN | ≥ 3000 Å/min |
| PVD Titanium | ≥ 600 Å/min |
Original Throughput Reference: Greater than 18 wafers per hour under the specified SEMATECH standard two-minute process conditions. Actual throughput depends on process requirements.
Facility Requirements
The following facility information is based on the original equipment specifications. Final utility requirements should be verified before installation.
| Facility | Requirement |
|---|---|
| Electrical Power | 208 VAC, 4-Wire, 50/60 Hz |
| Operating Current at 208 VAC | 50 A |
| Compressed Air | 100–120 PSIG, 6 SCFM Peak |
| Nitrogen | 80 PSIG, 10 SCFM Peak |
| DI Water | 40–60 PSIG, 12 GPM Peak |
| Chilled Water | 30–80 PSIG, 5 GPM Peak |
| Slurry Connections | Four Inputs |
| Main Drain | 3-Inch Connection |
| Tub Exhaust | 100 CFM |
| Air Exhaust | 250 CFM |
Installation and Warranty
Installation is available for the refurbished SpeedFam IPEC 472 CMP system.
- Estimated installation duration: Approximately one week
- Customer facility preparation and utility connections are required before installation
- One basic consumables set included
- Additional consumables packages available upon request
- Six-month parts warranty, subject to quotation terms
Request a Quotation
For pricing, availability, detailed configuration, refurbishment information, installation, and delivery schedule, please contact SemiStar Corp.
Please provide your company information, wafer size, polishing materials, and process requirements when submitting an inquiry.
Note: Equipment specifications, configuration, delivery schedule, installation scope, warranty, and availability are subject to confirmation in the final SemiStar quotation. Equipment is subject to prior sale and is only for end users. Photos here are only for your reference.
SS9597-S-1