Description

PlasmaTherm LAPECVD 1130

Condition: Used

Vintage: 214

Location; Europe

OEM Name: Plasmatherm

Quantity: 1

Valid Time: Subject to prior sale without notice. Appreciate your time

Description from the Owner for your reference:

LAPECVD tool 1130 was used for silicon nitride (our TPN) as well as for silicon oxide depositions (our TPO and TSO_Q, the latter being basically an oxide with some fluor in it, which has not been released for production on that tool so far).
The size of the MFCs is to be found in the table enclosed. Some of the controllers can easily be reprogrammed to a smaller range or configured for use of different gases if needed.
Both chambers of the tool were used for the same depositions. They are basically identical, except the gas boxes, where PM3 has one MFC less than PM2.

	Gas	SiH4	NH3	He	N2O	SF6	SiF4	N2	Ar
1130-PM2	MFC physical range (sccm)	500	200	5000	5000	1000	1000	5000	5000
	MFC calibration gas	N2	NH3	N2	N2O	SF6	N2	N2	N2
	Gas configured at tool	SiH4	NH3	He	N2O	SF6	SiF4	N2	Ar
	MFC configured gas range (sccm)	300	200	6950	5000	1000	350	5000	6950
1130-PM3	MFC physical range (sccm)	500	200	5000	5000	1000	500	5000	empty
	MFC calibration gas	N2	NH3	N2	N2O	SF6	N2	N2	empty
	Gas configured at tool	SiH4	NH3	He	N2O	SF6	SiF4	N2	empty
	MFC configured gas range (sccm)	300	200	6950	5000	1000	175	5000	empty

Description from the OEM for your reference:

LAPECVD™

Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high-volume production in a wide range of applications.

The LAPECVD™ platform can be used to deposit a variety of thin-film materials with its parallel-plate plasma deposition system.

Hardware

Cassette-to-Cassette Handling
– Multi-substrate batch processing
Dual cassettes
Platen heating up to 350°C
Upper electrode RF power at 13.56 MHz with optional MFD
Up to 8 gas channels with digital MFCs
Thermally managed reactor design—up to 175°C for internal walls and shower head

Endpoint

Integrated multifunctional endpoint capability with EndpointWorks.
Unique OEI application for real-time film thickness and rate monitoring.
OES for optimized chamber clean.

Software

User friendly software
Comprehensive data logging
Automated cleaning program
Real-time process data display
Fully integrated endpoint system
Factory automation compatible (SECS/GEM)
Edit recipes during runs
Multiple user access levels
Alarm history

Process

- Stress control
- High uniformity
- Low damage
- Low particulates
- Tunable index
- Increased productivity with batch loading capability
- Low temperature

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