Description
P&TECH Semiconductor Furnaces & LPCVD Systems
Mini research furnaces, horizontal and vertical production furnaces, atmospheric processing, LPCVD, low-pressure annealing, and ultra-high-temperature SiC systems. For inquiries in the United States and Canada, please use the SemiStar inquiry form below.
About P&TECH
Founded in 2002 in South Korea, P&TECH (People & Technology) manufactures thermal processing equipment for semiconductor and solar-cell applications. Its company profile (PDF) describes equipment projects for semiconductor manufacturers, wafer suppliers, universities, and research organizations in Asia and Europe.
Equipment Portfolio
Mini Atmospheric Furnaces
4–12 in. portfolio | 100–1200°C (published mini-furnace range)
Compact horizontal or vertical systems for oxidation, annealing, and drive-in. The manufacturer’s technical profile lists approximately 10–50 wafers per tube, depending on configuration.
Mini LPCVD Furnaces
4–12 in. portfolio | Single-tube options
Compact systems for nitride, polysilicon, TEOS, and HTO processes. LTO is also listed in the technical profile. Process gases, pumping, and process-specific capability require confirmation.
Horizontal Atmospheric Furnaces
4–12 in. portfolio | Selected multi-tube options
Oxidation, annealing, and drive-in systems for research and production. The preliminary commercial schedule includes 6-, 8-, and 12-inch models with selected one- to four-tube arrangements.
Horizontal LPCVD Furnaces
Selected 6-, 8-, and 12-in. configurations
Horizontal furnace systems for nitride, polysilicon, TEOS, and HTO processes. Tube count, vacuum pumping, process kit, and automation are selected for the application.
Vertical Atmospheric Furnaces
6 / 8 / 12 in. | Automated configurations
Furnaces for N₂ annealing, H₂ annealing, dry/wet oxidation, and drive-in. The manufacturer describes PLC/PC controls and automated wafer handling on selected production systems.
Vertical LPCVD Furnaces
6 / 8 / 12 in. | Process-specific configurations
Vertical systems for nitride, POLY, D-POLY, TEOS, and HTO. Final process chemistry, pumping, loading, and facilities are established by the quotation.
Ultra-High-Temperature Oxidation
PF-UHTO61 | 6 in. baseline
Published process range: 800–1500°C; maximum equipment temperature: 1600°C. SiC tube and boat, with automated loading. Potential 8-inch adaptation requires manufacturer confirmation.
Ultra-High-Temperature Annealing
PF-UHTA61 | 6 in. baseline
Published process range: 800–2100°C; maximum equipment temperature: 2200°C. Graphite process components, N₂/Ar processing, and optional H₂. Potential 8-inch adaptation requires confirmation.
Low-Pressure Anneal & Custom Furnaces
Configuration by application
Horizontal low-pressure anneal, high-temperature horizontal furnaces, and specialized systems. P&TECH also lists solar-cell LPCVD, diffusion, activation, and PECVD products; inquire about project fit.
Selected Configuration Overview
| Equipment family | Wafer sizes | Processes | Configuration |
|---|---|---|---|
| Mini atmospheric | 4–12 in. portfolio | Oxidation, anneal, drive-in | Compact horizontal / vertical |
| Mini LPCVD | 4–12 in. portfolio | Nitride, poly, TEOS, HTO; LTO subject to confirmation | R&D; single-tube options |
| Horizontal atmospheric / LPCVD | 4–12 in. portfolio | Oxidation, anneal, LPCVD | Selected single- / multi-tube models |
| Vertical atmospheric / LPCVD | 6, 8, 12 in. | Oxidation, anneal, nitride, poly, TEOS, HTO | Automated production configurations |
| Ultra-high-temperature SiC | 6 in. baseline; possible 8 in. adaptation | Oxidation / anneal | PF-UHTO61 / PF-UHTA61 |
Wafer size availability, capacity, chemistry, temperature performance, automation, and process guarantees are configuration-dependent. Specifications are subject to manufacturer confirmation.
Quotations, Lead Time & Support
Each furnace is quoted according to wafer diameter, process, tube count, automation, pumping, and facility requirements. P&TECH has indicated a typical lead time of approximately five months and a standard warranty period of one year. Lead time, warranty coverage, installation, and commissioning terms are confirmed in each quotation and purchase order.
SemiStar can coordinate North American sales inquiries, installation planning, commissioning, training, and after-sales service with P&TECH. The exact support scope is established for each project.
Request a P&TECH Furnace Quote
For North American inquiries, please complete the SemiStar contact form below.
Please provide wafer diameter and material, process (oxidation / anneal / LPCVD), target temperature, process gases, wafer quantity per batch, preferred furnace type, installation location, and desired delivery date.
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