MUHLBAUER TAL500 DIE BONDER WITH THE TTS 300

MUHLBAUER TAL500 DIE BONDER WITH THE TTS 300

The TAL 500 FLip Chip Lab Bonder is the ideal semiautomatic system for process and material evaluation, rapid protoytyping and sample production in low volumes. This machine supports your first step into RFID inlay  manufacturing as well as your continuous product development work in an ideal way, as all process know how of the high volume machines is intergrated into it, and yet for a minimal investment. The TAL500 Machine is used to produce RFID Products. The machine is basically using the method of picking up chips on wafer and bonds it directly on the substrate. The continuous process is done by the TTS 300 which is installed on this machine.