Description

 TC Wafer (Thermal couple)

Gain confidence in your process by measuring the right temperature inside your chamber.Is your temperature varying between multiple equipment sets?Do you need a Standard temperature measurement kit (with 3rd party certificate compliance) for better temperature varying control on the surface of your reaction chamber?Would you like to check your equipment health and find the root cause of your temperature deviation faster?

Thermocouple wafers will help you to monitor your ETCH, PVD, CVD, RTP, Hotplate, Oven, Reflow, etc. manufacturing equipment performance. Premtek Thermocouple wafers will improve the uptime of critical manufacturing equipment and show you process uniformity.The temperature sensor directly embedded, enables you to perform direct in-situ wafer temperature measurements. Reliable sensors, directly planted on measurement wafer, give you the actual temperature at the location, where the sensor is mounted. You will have a complete temperature profile of the wafer and continuous temperature changes monitoring to correlate with your process temperature profile.Moreover, Premtek Thermocouple Wafer can be completely customized according to your needs. You choose the wafer size, wafer substrate (different material), quantity and location of sensors, wire lengths, temperature range, and wire termination type.

TC wafer with Recorder	Dual TC wafer for higher pressures	TC sensors on glass carrier 354mm*460mm
Software Interface-Uniformity check	Temperature track during a longer period	Temperature map

Please help fill in the TC Wafer RFQ and email it back to us for an official quotation. Appreciate your time!

ID-SS5963

What is TC wafer and where it is used?
A TC wafer, in the context of wafer temperature measurement, typically refers to a “Thermocouple Wafer.” This is a specialized wafer equipped with thermocouples or other temperature sensors used to measure and monitor the temperature of wafers during semiconductor manufacturing processes, such as chemical vapor deposition (CVD), etching, and annealing.

Features of TC Wafers

1. Embedded Thermocouples:TC wafers have thermocouples embedded at various points to provide accurate and real-time temperature measurements across the wafer surface.
2. High-Temperature Range:These wafers can withstand and accurately measure a wide range of temperatures, which is critical for processes that involve high temperatures.
3. Uniformity Measurement:TC wafers help in assessing temperature uniformity across the wafer, which is crucial for ensuring consistent process results and high-quality semiconductor devices.
4. Real-Time Monitoring:They provide real-time temperature data, enabling process engineers to make immediate adjustments to maintain optimal conditions during manufacturing.
5. Calibration and Process Control:TC wafers are used for calibrating temperature settings in semiconductor equipment, ensuring that the actual temperatures match the setpoints.
6. Compatibility with Process Equipment:Designed to be compatible with standard semiconductor processing equipment, allowing for seamless integration into existing workflows.
7. Durability and Reusability: Made to be durable and reusable, TC wafers can undergo multiple cycles of high-temperature processes without significant degradation.

Applications of TC Wafers

1. Chemical Vapor Deposition (CVD): Ensuring uniform temperature distribution during the deposition of thin films.
2. Etching: Monitoring and controlling the temperature during plasma etching to achieve precise patterning.
3. Annealing: Measuring temperatures during annealing processes to ensure proper activation of dopants and stress relief in the wafer.
4. Rapid Thermal Processing (RTP): Providing accurate temperature profiles during rapid heating and cooling cycles.
5. Oxidation: Controlling the temperature during oxidation processes to form high-quality oxide layers on the wafer surface.
6. Epitaxy: Ensuring temperature consistency during the growth of epitaxial layers.

Benefits of Using TC Wafers

1. Improved Process Control: Enhanced ability to control and optimize semiconductor manufacturing processes by providing precise temperature data.
2. Higher Yield and Quality: By maintaining optimal temperatures, TC wafers help achieve higher yields and better-quality semiconductor devices.
3. Reduced Downtime: Early detection of temperature anomalies allows for quicker adjustments and reduces process downtime.
4. Process Development and Optimization: Facilitates the development and fine-tuning of new processes by providing detailed temperature profiles. TC wafers are essential tools in semiconductor manufacturing, providing critical temperature measurement and control capabilities that enhance process efficiency, quality, and reliability.

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We are a leading manufacturer of Rapid Thermal Processing and Direct Liquid Injection Deposition systems. We are a top supplier for MEMS, sensors, optoelectronics, telecommunication, power and discrete device manufacturing. Labs worldwide use our machines for the development of semiconductor, photovoltaic and nano-technology components. Rapid Thermal Processing or Rapid Thermal Annealing (RTP/RTA) is a semiconductor manufacturing process which provides a way to rapidly heat samples to high temperatures to perform short processes on a timescale of a few minutes maximum. Such rapid heating rates are performed by high intensity lamps (e.g. near-infrared light sources – Tungsten-halogen lamps) controlled by pyrometer and thermocouples that measure the sample temperature. Cooling must also be perfectly controlled to prevent dislocations and sample breakage. Rapid Thermal Processing was originally developed for ion implant anneal but has broadened its application to oxidation, silicide formation, chemical vapor deposition, and advanced applications such as modifying the crystallographic phase of elements, compounds or alloys to enhance properties, lattice interface or stress relaxation. RTP is a flexible technology that provides fast heating and cooling to process temperatures of ~200-1300°C with ramp rates typically 20-200°C/sec, combined with excellent gas ambient control, allowing the creation of sophisticated multistage processes within one processing recipe. We are extensively used in semiconductor device manufacturing for changing electrical or physical properties of a material (conductivity, permittivity, densification, or contamination reduction). Soak, spike, or millisecond anneals and thermal-radical oxidation are applied to different applications. The choice of technology depends on several factors, including the tolerance of the device to withstand a certain temperature/time exposure at a particular point in the manufacturing sequence. BTC-700H Bonded wafer, data acquisition (TEDAQ) and temperature mapping software tools, Applied’s portfolio of lamp- , laser- and heater-based systems encompasses the full range of anneal technologies, offering extendible solutions to such advanced-node challenges as pattern loading, thermal budget reduction, current leakage, interface quality optimization, and high-productivity treatments.Tokyo Electron Limited Kokusai Electric ASM Naura Thermco Systems CETC48 JTEKT Thermo Systems Corporation Amtech Systems, Inc Ohkura Tystar Sunred ,Thermo Electric, Temperature Measurement, sensing solutions, demanding temperature measurement challenges,Industrial Temperature Sensors, sensitivity, fast response and consistent accuracy, innovative measurement solution, RTDs sensors, Instrumented Wafer RTD wafers, TEDAQ – Data Acquisition Wafers up to 350°C Wafers up to 700 °C Wafers up to 1,200°C Bonded Wafers RTD Wafer Spike & Profile TCs THERMOWAY INDUSTRIAL THERMOWAY TC Wafer, real-time process monitoring ,etching, photolithography, CVD, PVD, testing, front-end and back-end packaging, environmental temperature control, Measure the temperature stable time and temperature uniformity Calibrate the accuracy of temperature setting Assess the impact of load capacity Measure the temperature distribution of wafer Inspect the thermal stress from the center to the edge of the wafer, WaferBLE, TW-DC2301 , Bluetooth wireless communication, SensArray, in situ monitoring, TC wafers enable in situ monitoring of process tools’ environments and wafer handling conditions. With wired and wireless sensor wafers and reticles, an automation package and data analysis systems, TC wafers provide comprehensive information for a wide range of wafer and reticle processes including wafer temperature and light measurement. They also support characterization of wafer handling and spinning chucks. Semiconductor process equipment manufacturers, chip manufacturers and reticle manufacturers use SensArray data to visualize, diagnose and control process and wafer handling conditions.SensArray® Automation In Situ Temperature Measurement Automation Package. The SensArray® Automation in situ process management package provides a fast automated collection of process tool chamber temperature measurements while also providing semi-automated functionality to support fab startups. The SensArray Automation package includes the AS1000 automation base station, which is compatible with all 300mm wireless SensArray products, the overhead track (OHT) compatible FOUP, a system automation controller, and office PC software seat components. SensArray FOUPs can support two separate SensArray products for flexible fab deployment and can be processed the same way as any production FOUP, with direct data porting to SPC charts. SensArray Automation provides productivity enhancements resulting in gains in the availability of process tools, more efficient use of engineering resources, and centralized data storage in the fab’s MES database. Applications Process development, Process qualification, Process tool monitoring, Process tool qualification, Chamber matching, Process tool matching Show Less EtchTemp Series In Situ Plasma Etch Wafer Temperature (20° to 140°C) Measurement Systems The EtchTemp series of in situ wafer temperature measurement systems, available in both 300mm and 200mm configurations, captures the effects of the plasma etch process environment on production wafers under real process conditions. The EtchTemp-HD measurement system includes high sensor density enabling across-wafer temperature monitoring that strongly correlates with CD uniformity control for conductor etch applications. By characterizing thermal conditions that closely represent product wafer conditions, the EtchTemp-HD wireless wafer assists process engineers with tuning the etch process conditions, and the qualification, matching and post-PM verification of front end of line plasma etch chambers. Show Details HighTemp-400 In Situ Wafer Temperature (20° to 400°C) Measurement System The HighTemp-400 in situ wafer temperature measurement system, available in both 300mm and 200mm configurations, is designed to optimize and monitor advanced film processes (FEOL and BEOL ALD, CVD and PVD) and other elevated temperature processes. The HighTemp-400 wireless wafer measures process tool thermal uniformity, providing a complete picture of temporal and spatial temperature data collected in real-time under actual production process conditions. By revealing thermal variations in applications such as plasma environments that can affect process windows and patterning performance, the HighTemp-400 helps IC manufacturers optimize the integration of new materials, transistor technologies and complex patterning techniques. Show Details CryoTemp™ In Situ Wafer Temperature (-40° to 30°C) Measurement System The CryoTemp™ in situ 300mm wafer temperature measurement system supports the characterization and monitoring of dry etch processes under actual vacuum process conditions*. Designed to calibrate, improve uniformity and match temperature profiles on electrostatic chucks (ESC), the CryoTemp wafer enables fast process characterization and control of plasma etch chambers. The CryoTemp has 21 sensors with an accuracy of 0.5°C and an operational range of -40°C to 30°C. The automation-ready CryoTemp helps to reduce chamber downtime, save valuable engineering resources, and improve tool performance and overall productivity. (* Note the CryoTemp wafer is not designed to be used with plasma on but can be chucked and de-chucked in the process chamber.) Show Details WetTemp Series In Situ Wet Processing Wafer Temperature (15° to 140°C) Measurement System The WetTemp in situ wafer temperature measurement system, available in both 300mm and 200mm configurations, supports monitoring of wet clean and other wet processes. The WetTemp series monitor wafers are compatible with most single wafer wet clean process systems to help engineers qualify wet clean tools, optimize wet clean processes and drive improvements in wet clean system performance. Show Details Smartwafer™ Wafer Handling Monitor The Smartwafer2™ handling monitor and in situ mechanical tester runs through process equipment and records vibrations and acceleration along its route. After completing the recording process, the data is downloaded to a PC via an external reading station. The in situ mechanical testing data is synchronized with the equipment sequence of events and compared to the historic good fingerprint. Any abnormal signals indicate and pinpoint bad mechanical components or alignments, which can cause particles, defects or scratches on the wafer. Standard 300mm silicon wafers are used to closely match the behavior of a standard process wafer, allowing it to run the same mechanical recipe through the wafer handling system. The electronic circuit is conformal coated with silicon adhesive, protecting and waterproofing the Smartwafer2. The Automation Loadport is designed for 300mm automated fabs and permits the utilization of the Smartwafer2 in production mode, like any other routine monitor. The Automation Loadport meets all SEMI standards, including E84 and other SEMI standards required for AMHS/OHV and host connectivity. Show Details EWG Wafer™ Wafer Handling Monitor The EWG Wafer™ handling monitor measures the eccentricity and the wobbling of wafers on spinning chucks, the only in situ method of making these measurements. The common method currently used for checking these parameters involves the time-consuming process of opening the tool chamber and using mechanical gauges. With one XY accelerometer positioned at the center of the wafer and Z accelerometers positioned at six points close to the edge of the wafer, the EWG Wafer avoids any tool opening, and can be fully automated with the compatible Automation Loadport. The Automation Loadport is designed for 300mm automated fabs and permits the utilization of the EWG Wafer in production mode, like any other routine monitor. The Automation Loadport meets all SEMI standards, including E84 and other SEMI standards required for AMHS/OHV and host connectivity. Show Details RH Wafer™ Wafer Handling Monitor The RH Wafer™ handling monitor travels throughout a process tool and measures relative humidity in multiple locations. The relative humidity sensor and Smartwafer2™ type circuit are mounted on a 300mm bare silicon wafer that is placed in a purged SmartFOUP™. The SmartFOUP is then placed on a process tool N2 purged load port and monitors the functionality of the N2 purging by measuring the relative humidity in the FOUP. The RH Wafer and purged SmartFOUP are fully compatible with the Automation Loadport and analysis software for fully automated monitoring. The Automation Loadport is designed for 300mm automated fabs and permits the utilization of the RH Wafer in production mode, like any other routine monitor. The Automation Loadport meets all SEMI standards, including E84 and other SEMI standards required for AMHS/OHV and host connectivity. The analysis software uses statistical process control (SPC) tools to detect relative humidity irregularities or trends. Show Details ScannerTemp In Situ Scanner Wafer Temperature (20° to 24°C) Measurement System The ScannerTemp in situ wafer temperature measurement system supports monitoring of dry, immersion and EUV lithography scanners. The ScannerTemp wireless wafer produces high accuracy temporal and spatial wafer temperature data that can help lithography engineers characterize and monitor scanner thermal variations that affect pattern overlay performance. With a flat, standard-thickness wafer format, ScannerTemp can be used to monitor lithography thermal uniformity and stability with high precision and low noise, enabling scanner qualification and matching. Show Details Integral Implant i3 In Situ Ion Implant Wafer Temperature (15° to 130°C) Measurement System The Integral Implant i3 in situ wafer temperature measurement system, available in both 300mm and 200mm configurations, supports monitoring of wafer temperature for ion implant processes. The Integral Implant i3 wireless wafer produces high accuracy temporal and spatial wafer temperature data that can help implant engineers characterize and monitor thermal variations that affect the ion implant dose and uniformity and improve implant process qualification and tool matching. Show Details Integrated Wafer™ In Situ Lithography Wafer Temperature (15° to 145°C) Measurement System The Integrated Wafer™ 2 in situ wafer temperature measurement system, available in both 300mm and 200mm configurations, gathers critical thermal data for monitoring and maintaining lithography processes. With a wireless, low-profile design, the Integrated Wafer 2 can be used with almost all lithography process equipment, providing highly accurate static and dynamic temperature measurements for critical production processes. The Integrated Wafer 2 uses 65 sensors to help lithography engineers characterize thermal dose uniformity and analyze segments of the thermal cycle, including transport, heating, cooling and steady-state operations. Integrated Wafer 2 supports applications such as measurement and monitoring of critical hot plate heating zone elements in advanced lithography processes (e.g., track post-exposure bake stations). Show Details UV Wafer In Situ Deposition and Anneal UV Light Measurement System The UV Wafer in situ ultraviolet (UV) light 300mm measurement system utilizes wireless sensor wafer technology to measure UV light dosage and intensity at the wafer surface within film deposition process tools. Enabling previously unavailable process optimization and monitoring, the UV Wafer provides temporal and spatial information on the intensity of light reaching the wafer surface from the UV lamp used to anneal or cure FCVD (flowable) oxides and low k dielectric films. The UV Wafer can also identify lamp age-induced drift or other changes in the lamp intensity that result in non-uniform film properties. By highlighting optics system issues within the UV lamp subsystem, the UV Wafer helps engineers drive process tool improvements that result in optimal curing processes. Show Details PlasmaSuite Plasma Data Analytics System PlasmaView The PlasmaView process analysis viewing system provides an intuitive interface for viewing detailed plasma etch process analyses. Using data collected from EtchTemp and EtchTemp-SE. PlasmaView displays the plasma process data versus time and space (2D or 3D). Movie view allows process engineers to visualize critical transient responses, which can be used for fault investigations. PlasmaControl The PlasmaControl analysis engine helps monitor and control day-to-day operations and chamber-to-chamber matching. It distills complicated plasma etch processes down to a few critical components and compares them to control specifications, providing a simple ‘Go’ or ‘No Go’ result for each run. PlasmaControl provides engineers with the ability to view trends, detect and investigate excursions, and compare plasma etch process chambers. Show Details LithoSuite Lithography Data Analytics System LithoView The LithoView process analysis user interface provides standardized data viewing capability, including 2D and 3D temporal views of data. LithoView provides engineers with full mission control capability, such as full SensorWafer™ communications, mission operations and data downloading. LithoView also includes a database and browser for complete tracking of data history. AutoCal TrackTune Application The AutoCal TrackTune advanced software application is used for calibrating and optimizing advanced track hotplates. The application leverages the accuracy of the data collected with the SensArray® Integrated Wafer to capture the temperature profile of the photoresist processing zone. By combining detailed thermal profile data with an OEM plate-specific thermal modeling engine, it generates optimized hotplate control system input parameter settings. These optimized settings dramatically improve within plate uniformity and synchronize plate-to-plate thermal profiles. Show Details Process Probe™ 1530/1535 In Situ Wafer Temperature Monitoring System The Process Probe™ 1530 and 1535 instrumented wafers are used to monitor in situ temperatures for a wide range of processes, including cold wall, RTP, sputtering, CVD, plasma strippers and epitaxial reactors. The Process Probe 1530 and 1535 provide direct, real-time measurement of wafer temperature during each critical step of the process cycle. With this comprehensive temperature data, process engineers can characterize and fine tune process conditions, driving improved process equipment performance, wafer quality and yield. Applications Process development, Process qualification, Process tool qualification, Process tool matching Cold wall thin film process chambers (1530), Hot wall thin film process chambers (1535) | 0-1100°C Show Less Process Probe™ 1630 In Situ Wafer Temperature Monitoring System The Process Probe™ 1630 instrumented wafers enable precise in situ characterization of wafer temperature profiles for front end atmospheric and belt CVD systems and back end wafer solder bumping reflow ovens. With the Process Probe 1630, process engineers can determine edge-to-center temperature profiles to adjust heater zone set points, and measure drift in deposition temperature to adjust for heat transfer changes from oxide build-up on the heaters and belts. Show Details Process Probe™ 1730 In Situ Wafer Temperature Monitoring System The Process Probe™ 1730 instrumented wafers enable precise in situ characterization of wafer temperature profiles in photoresist track systems, temperature controlled wafer chuck systems, oven applications, and resist bake, polyimide, and SOG applications. The Process Probe 1730 helps engineers characterize and fine tune process conditions to improve process equipment performance for higher yield. Show Details Process Probe™ 1840/1850 In Situ Wafer Temperature Monitoring System The Process Probe™ 1840 and 1850 instrumented wafers provide high accuracy, real-time hot plate temperature measurements, supporting processes such as photoresist track systems and wafer probers. The Process Probe 1840 and 1850 allow direct measurement of wafer temperature stability and uniformity without dependence on imprecise process monitors or contact temperature sensors. With the Process Probe 1840 and 1850, lithography engineers can characterize and fine tune the photoresist bake temperature uniformity, ensuring that advanced lithography processes meet the temperature accuracy required for achieving high yield. Show Details Thermal MAP® 4 Wireless Data Acquisition and Data Analytics The Thermal MAP® 4 data acquisition and analysis system supports in situ wafer temperature measurements. The Thermal MAP 4 system combines the wireless ISIS 5 (Intelligent Sensor Interface System) data acquisition unit with powerful, graphical software for visualization and analysis of data collected by any SensArray® instrumented wafer. This sophisticated wafer temperature data acquisition and analysis system provides outstanding accuracy, precision and resolution for both transient and steady-state measurements. By delivering concise, informative graphic representations of temperature ramp-up, steady state and ramp-down, Thermal MAP 4 supports rapid process optimization with the following tools: Contour and surface maps to aid correlation to film thickness and resistivity maps Animations for rapid viewing of temperature profile changes during the process Run-to-run and within-run analyses Show Details Thermal TRACK™ 6 Wireless Data Acquisition The Thermal TRACK™ 6 data acquisition system supports in situ wafer temperature measurements from the wired SensArray® Process Probe™ instrumented wafer products. The Thermal TRACK 6 system combines the wireless ISIS 5 (Intelligent Sensor Interface System) data acquisition unit with a portable tablet for real-time visualization and logging of data for the characterization of temperature profiles. By providing informative graphical representations of wafer temperature during ramp up, steady state and cool down, Thermal TRACK 6 provides a quick and cost-effective method for managing most processes. This portable system provides high accuracy, precision and resolution of both transient and steady-state measurements, delivering critical data for fab engineers to calibrate and check temperature setpoints and run predefined preventive maintenance checks. Thermal TRACK 6 comes with a 10.5” tablet providing the same functionality as the previous generation but now includes an optimized user interface and enhanced user experience, while also eliminating the need for an external PC. Show Details KLA’s SensArray products also support wafer manufacturing, reticle manufacturing, advanced packaging manufacturing and semiconductor equipment manufacturing. Phase IV Engineering Wireless Wafer Temperature Sensor – RTD Sensors Leap wireless sensor Silicon wafer processing Temperature chuck testing/verification Scientific experiments Paint and coatings curing Temperature profiling over a surface Suzhou Rsuwei TC Wafer TC Wafer is a temperature sensor that uses a special processing technology to embed high-temperature resistant sensors (thermocouples) at specific locations on the wafer surface, thus realizing real-time temperature measurement of the wafer surface. RTD Wafer (Wired) RTD Wafer is a temperature sensor that uses a special processing technology to embed temperature sensors (RTDs) at specific locations on the wafer surface, thus realizing real-time temperature measurement of the wafer surface. On Wafer The Wireless On-Wafer Temperature Measurement System is a complete measurement system embedded in a wafer that can measure and record the impact of the etch process environment on production wafers under real process conditions, without the need for wired connections. RTD Wafer (Wireless) With wireless sensor attaches to the top of a silicon wafer, the wireless TC wafer is used to monitor and measure temperature condition during such wafer processing: 1. Front Track Systems 2. SC Hot Plates 3. Cold Plates 4. HMDS Chambers 5. Coating/Developing. ATS Wafer The ATS Wafer is a special processing technology that combines a circuit board with image capturing capabilities with a carbon fiber chassis, which can be used to locate objects by capturing images of their location and obtain offset data (X, Y) to quickly calibrate wafer transfer positions. AMS Wafer The AMS Wafer is a unique tool that integrates multiple sensor modules onto a single circuit board. This allows it to quickly measure vibration, acceleration, level, and humidity, making it a versatile and efficient solution for semiconductor equipment debugging. PFK Instrument TC wafer is specialized for the semiconductor industry. We have bonding technology so the thermocouple sending junction can be stuck on a silicon wafer and it doesn’t come off. Not only silicon wafer but also other material substrates can be available if the customer wants to measure the real temperature of the surface, contact PFK, and PFK will provide a solution. UVFAB Systems Wireless Wafer Temperature Sensors for the Semiconductor Industry