Refurbished Matrix 302 RF Downstream Plasma Etcher Semiconductor Equipment

SemiStar Corp. offers refurbished Matrix 302 RF downstream plasma etcher semiconductor equipment for qualified end-user customers. The Matrix 302 is a single-wafer dry etcher designed for etching materials such as nitride, oxide, polysilicon, silicon chrome, low-k materials, and BCB from silicon or other substrates.

The Matrix 302 uses 13.56 MHz RF plasma processing, robotic wafer handling, cassette handling, endpoint detection, and controlled gas plasma chemistry for semiconductor dry etch applications.

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

The Matrix 302 is an electromechanical production RF downstream plasma etcher semiconductor equipment used to etch thin films from the surface of silicon or other substrates. Each wafer is processed individually by a chemical reaction induced by gas plasma.

The system includes a process module, operator interface module, wafer transport module, card reader module, elevator module, microprocessor control module, RF generator, DC supply, AC distribution, gas distribution panel, and temperature / pressure control module.

The Matrix 302 supports single-wafer processing with robotic pick-and-place wafer handling, cassette handling, multi-step processing, endpoint detection, and controlled pressure / gas flow capability.

Configuration Capability

• Single-wafer dry etch processing
• 2 inch, 3 inch, 4 inch, 5 inch, and 6 inch wafer capability depending on configuration
• Cassette handling
• Robotic pick-and-place wafer handling
• 13.56 MHz RF plasma source
• RF generator with up to approximately 650 W power capability
• Monochromator endpoint detection
• Timed endpoint capability
• Temperature control up to approximately 160°C for process stability
• Butterfly-type pressure controller
• Phase magnitude tuner
• Pins up / down wafer heating capability
• Multi-step process control
• Modular design with programmable diagnostics
• Gas configuration typically including NF₃, O₂, and He depending on system configuration

Applications

• RF plasma dry etching
• Downstream plasma etching
• Nitride etch
• Oxide etch
• Polysilicon etch
• Silicon chrome etch
• Low-k material etch
• BCB etch
• Semiconductor wafer processing
• Research, pilot line, and semiconductor fab applications

Typical Process Capability

Typical Matrix 302 process capability may include RF plasma etching, controlled process gas flow, controlled chamber pressure, endpoint detection, and temperature-controlled wafer processing.

• RF Frequency: 13.56 MHz
• RF Power: Up to approximately 650 W
• Standard Gas Configuration: NF₃, O₂, and He depending on configuration
• Endpoint: Monochromator endpoint detection or timed endpoint
• Temperature Control: Up to approximately 160°C
• System Size: Approximately 25 inch W x 28 inch D x 58 inch H

Actual performance depends on final system configuration, wafer type, film material, process recipe, etch target, refurbishment scope, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact system configuration. Typical facility items may include:

• Power: 190–240 VAC, single phase, 50/60 Hz, approximately 30 A; 208 VAC standard
• Vacuum: Vacuum pump capability required
• Cooling: Water temperature controller or cooling water may be required depending on configuration
• Process Gases: NF₃, O₂, He, N₂, and other gases depending on process configuration
• Exhaust: Chamber exhaust, gas delivery exhaust, upper assembly exhaust, cabinet exhaust, and vacuum pump exhaust may be required depending on final configuration
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or water temperature controllers if applicable, process gas supply, exhaust, CDA / N₂, power connection, and related facility support items unless otherwise specified in quotation.

PC Controller Upgrade Service

In addition to offering refurbished Matrix 302 systems, SemiStar may review PC controller upgrade or control system support requests for customer-owned working systems on a case-by-case basis. Upgrade feasibility depends on system condition, documentation, software status, parts availability, and project scope.

RFQ Information Required

To help us recommend the correct configuration and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Wafer size
• Wafer material
• Film materials to be etched
• Required process gases
• Etch process specifications and target results
• Throughput requirement
• Temperature requirement
• Endpoint detection requirement
• Have you used Matrix 302 or similar plasma etcher equipment before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-175